A mobile phone mainboard upper cover assembly with heat dissipation assistance

By designing a mobile phone motherboard top cover assembly that is easy to disassemble, the problem of inconvenient disassembly and assembly of the motherboard top cover is solved, enhancing practicality and heat dissipation. The linkage structure of the limiting plate and the moving plate simplifies the disassembly process.

CN224459842UActive Publication Date: 2026-07-03DONGGUAN ZHOUHUANG PLASTIC HARDWARE PROD CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN ZHOUHUANG PLASTIC HARDWARE PROD CO LTD
Filing Date
2025-06-23
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

The existing mobile phone motherboard cover is inconvenient to disassemble and assemble, and the fastening screws are easily lost, resulting in unstable fixation and lack of practicality.

Method used

A mobile phone motherboard top cover assembly for auxiliary heat dissipation was designed. It adopts a disassembly component and a linkage component. Through the cooperation of a limiting plate, a moving plate and a spring, it can be easily disassembled and installed, and heat dissipation is combined with heat dissipation fins.

Benefits of technology

It enables convenient disassembly and assembly of the motherboard cover, improving ease of operation and practicality, and enhances the stability and heat dissipation of the device through linkage components.

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Abstract

This utility model relates to the field of mobile phone accessory technology and discloses a mobile phone motherboard top cover assembly for auxiliary heat dissipation, including a main body assembly; the main body assembly includes a mounting base with a motherboard body disposed on its top; a top cover body disposed on the mounting base; and multiple heat dissipation fins fixedly connected to the top of the top cover body; symmetrically arranged disassembly components on the mounting base, each disassembly component including a plate fixedly connected to the top of the mounting base; this utility model has the advantage of facilitating the disassembly and assembly of the motherboard top cover. When the top cover body needs to be disassembled, the operator pulls the movable plates on both sides of the plates, causing the movable plates to move the limiting plates on both sides simultaneously. When the limiting plates move, they compress multiple springs, thereby completely removing the limiting plates from the top of the mounting plate, canceling the limiting fixation of the mounting plates on both sides, and thus allowing the top cover body to be removed, solving the problem of the motherboard top cover being inconvenient to disassemble and assemble.
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Description

Technical Field

[0001] This utility model relates to the field of mobile phone accessory technology, specifically to a mobile phone motherboard cover assembly for auxiliary heat dissipation. Background Technology

[0002] The motherboard is one of the main components of a mobile phone. Due to its intricate structure, it is very easy to be damaged. Therefore, a motherboard cover is usually installed after the motherboard is installed to provide some protection.

[0003] Currently, existing mobile phone motherboard covers are usually fixed with multiple fastening screws. These screws are relatively small, and when the mobile phone motherboard needs to be repaired, the disassembly and reassembly of the motherboard cover is not only inconvenient, but also prone to failure if the fastening screws are accidentally lost during repair, resulting in the motherboard cover not being securely fixed and thus lacking practicality. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides a mobile phone motherboard cover assembly for auxiliary heat dissipation, which has the advantage of facilitating the disassembly and assembly of the motherboard cover, thus solving the problem of the motherboard cover being inconvenient to disassemble and assemble.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: a mobile phone motherboard top cover assembly for auxiliary heat dissipation, comprising a main body assembly; the main body assembly includes a mounting base with a motherboard body disposed on its top; a top cover body disposed on the mounting base; heat dissipation fins fixedly connected to the top of the top cover body, and multiple fins thereon; a disassembly assembly symmetrically disposed on the mounting base, the disassembly assembly comprising: a plate fixedly connected to the top of the mounting base; a placement groove formed on the top of the plate; a limiting plate slidably connected to the inside of the plate; a spring disposed on the limiting plate, and multiple springs thereon; a moving plate fixedly connected to the front surface of the limiting plate; and a mounting plate fixedly connected to the outer side wall of the top cover body.

[0008] Preferably, the limiting plate is provided with a damper, and the two ends of the damper are respectively fixedly connected to the outer wall of the limiting plate and the inside of the plate body.

[0009] Preferably, one side of the limiting plate is set as an inclined surface.

[0010] Preferably, the mounting base is provided with a linkage component, the linkage component including: a housing, fixedly connected to the top of the mounting base, and both movable plates are inserted into the housing; a linkage plate, inserted into the front surface of the housing and slidably connected to the housing; and connecting rods, with connecting rods hinged to the opposite surfaces of the two movable plates, and both connecting rods hinged to the top of the linkage plate.

[0011] Preferably, each of the movable plates and the linkage plates is provided with a guide rail cover.

[0012] Preferably, springs are symmetrically arranged inside the plate.

[0013] (III) Beneficial Effects

[0014] Compared with the prior art, this utility model provides a mobile phone motherboard top cover assembly for auxiliary heat dissipation, which has the following beneficial effects:

[0015] This utility model has the advantage of facilitating the disassembly and assembly of the motherboard top cover. When it is necessary to disassemble the top cover body, the operator pulls the movable plates on both sides of the plate, causing the movable plates on both sides to move simultaneously with the limiting plates on both sides. When the limiting plates on both sides move, they squeeze multiple springs, thereby causing the limiting plates on both sides to be completely removed from the top of the mounting plate, eliminating the limiting and fixing of the mounting plates in the mounting slots on both sides, thus allowing the top cover body to be removed, solving the problem of the motherboard top cover being inconvenient to disassemble and assemble. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the internal structure of the upper cover body in this utility model;

[0018] Figure 3 This is a cross-sectional structural diagram of the plate body in this utility model;

[0019] Figure 4 This is a cross-sectional structural diagram of the box body in this utility model.

[0020] In the picture:

[0021] 1. Main body components; 11. Mounting bracket; 12. Motherboard body; 13. Top cover body; 14. Heat sink fins;

[0022] 2. Disassembly of components; 21. Panel; 22. Placement slot; 23. Limiting plate; 24. Spring 1; 25. Moving plate; 26. Mounting plate;

[0023] 3. Linkage components; 31. Housing; 32. Linkage plate; 33. Connecting rod;

[0024] 4. Guide rail cover; 5. Damper; 6. Spring 2. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Example 1

[0027] See Figure 1-4 A mobile phone motherboard top cover assembly for auxiliary heat dissipation includes a main body assembly 1; the main body assembly 1 includes a mounting base 11, on which a motherboard body 12 is disposed; a top cover body 13 is disposed on the mounting base 11; heat dissipation fins 14 are fixedly connected to the top of the top cover body 13, and multiple fins are disposed thereon; a disassembly assembly 2 is symmetrically disposed on the mounting base 11, the disassembly assembly 2 includes: a plate 21, fixedly connected to the top of the mounting base 11; a placement groove 22, formed on the top of the plate 21; a limiting plate 23, slidably connected to the inside of the plate 21; multiple springs 24 are disposed on the limiting plate 23; a moving plate 25 is fixedly connected to the front surface of the limiting plate 23; a mounting plate 26 is fixedly connected to the outer wall of the top cover body 13; a damper 5 is disposed on the limiting plate 23, and the two ends of the damper 5 are respectively fixedly connected to the outer wall of the limiting plate 23 and the inside of the plate 21; one side of the limiting plate 23 is set as an inclined surface.

[0028] When ready for use, the operator installs the mounting base 11 in the designated position. The mainboard body 12 is protected by the upper cover body 13, and the heat dissipation fins 14 dissipate heat from the upper cover body 13, thereby indirectly dissipating heat from the mainboard body 12. When it is necessary to disassemble the upper cover body 13, the operator pulls the movable plates 25 on the two side plates 21, causing the two side movable plates 25 to move the two side limiting plates 23 simultaneously. When the two side limiting plates 23 move, they compress multiple springs 24, thereby causing the two side limiting plates 23 to completely move out of the top of the mounting plate 26, canceling the limiting fixation of the mounting plate 26 in the two side placement slots 22, thus allowing the upper cover body 13 to be removed. The operation is simple and improves the practicality of the device. When the device is subjected to When the vibration causes the limiting plate 23 to vibrate simultaneously under the action of the spring 24, the damper 5 reciprocates with the vibration structure through the damping rod, driving the piston to move in the cylinder filled with hydraulic oil. The small holes or gaps on the piston force the hydraulic oil to pass through, generating viscous resistance and internal friction between fluid molecules, converting the vibration kinetic energy into heat energy for dissipation, thereby ensuring the stability of the limiting plate 23 in limiting the mounting plate 26. When the operator installs the upper cover body 13, the upper cover body 13 drives the mounting plates 26 on both sides to move simultaneously, so that the mounting plates 26 on both sides press the inclined surfaces on the limiting plates 23 on both sides respectively, so that the limiting plates 23 on both sides automatically move into the plate body 21 without the operator having to pull the moving plate 25 first, thereby improving the convenience of device installation.

[0029] Example 2

[0030] See Figure 1-4 Based on the first embodiment, a linkage function has been added;

[0031] The mounting base 11 is provided with a linkage component 3, which includes: a housing 31, fixedly connected to the top of the mounting base 11, with both movable plates 25 inserted into the housing 31; a linkage plate 32, inserted into the front surface of the housing 31 and slidably connected to the housing 31; a connecting rod 33, with each of the two movable plates 25 hinged to the opposite side, and both connecting rods 33 hinged to the top of the linkage plate 32; a guide rail cover 4 is provided on each movable plate 25 and the linkage plate 32; and springs 6 are symmetrically arranged inside the plate 21.

[0032] During disassembly, the operator pulls the linkage plate 32 on the housing 31 upwards, causing the linkage plate 32 to move the connecting rods 33 on both sides simultaneously. As the connecting rods 33 rotate, they move the moving plates 25 on both sides away from each other, thereby moving the limiting plates 23 on both sides through the moving plates 25. This eliminates the need for the operator to pull the moving plates 25 separately, improving the convenience of the device. When the moving plates 25 and the linkage plate 32 move, they cause the guide rail cover 4 on them to fold or unfold simultaneously. This prevents dust and other debris from entering the plate 21 or housing 31 through the slide groove, thus preventing blockage and improving the stability of the device. When the mounting plate 26 is fully placed in the placement slot 22, the mounting plate 26 compresses the two springs 6 on the same side. When the device releases the limiting effect on the mounting plate 26, the springs 6 on both sides can spring up the mounting plates 26, thereby springing up the top cover body 13, facilitating the disassembly of the top cover body 13 and further improving the disassembly efficiency.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A mobile phone motherboard top cover assembly for auxiliary heat dissipation, comprising a main body assembly (1); the main body assembly (1) includes... Mounting bracket (11), with motherboard body (12) mounted on top of it; The upper cover body (13) is disposed on the mounting base (11); Heat dissipation fins (14) are fixedly connected to the top of the upper cover body (13), and multiple fins are provided; characterized in that The mounting base (11) is symmetrically provided with disassembly components (2), the disassembly components (2) including: The plate (21) is fixedly connected to the top of the mounting base (11); A placement slot (22) is provided on the top of the plate (21); The limiting plate (23) is slidably connected inside the plate body (21); Spring 1 (24) is disposed on the limiting plate (23), and multiple springs are disposed thereon; The movable plate (25) is fixedly connected to the front surface of the limiting plate (23); Mounting plate (26) is fixedly connected to the outer wall of the upper cover body (13).

2. The mobile phone main board cover assembly of claim 1, wherein: The limiting plate (23) is provided with a damper (5), and the two ends of the damper (5) are respectively fixedly connected to the outer wall of the limiting plate (23) and the inside of the plate body (21).

3. The mobile phone main board cover assembly of claim 2, wherein: The limiting plate (23) has one side set as an inclined surface.

4. The mobile phone main board cover assembly of claim 1, wherein: The mounting base (11) is provided with a linkage component (3), the linkage component (3) including: The housing (31) is fixedly connected to the top of the mounting base (11), and both of the movable plates (25) are inserted into the housing (31); The linkage plate (32) is inserted into the front surface of the box (31) and is slidably connected to the box (31); Connecting rod (33), both of the two moving plates (25) are hinged to each other, and both connecting rods (33) are hinged to the top of the linkage plate (32).

5. The mobile phone main board cover assembly of claim 4, wherein: Each of the moving plate (25) and the linkage plate (32) is provided with a guide rail cover (4).

6. The mobile phone main board cover assembly of claim 1, wherein: Springs 2 (6) are symmetrically arranged inside the plate (21).