Housings and electronic devices
By setting patterned grooves and embedding patterned structures on the paint layer of the shell, the problem of logo detachment is solved, the reliability and production efficiency of the shell are improved, and diversified logo designs are realized.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI WINGTECH ELECTRONICS TECH
- Filing Date
- 2025-07-29
- Publication Date
- 2026-07-03
AI Technical Summary
The markings on the casing are prone to detaching from the substrate, affecting reliability and production efficiency.
Patterned grooves are set on the paint layer of the shell and a patterned structure is embedded. The opening of the patterned groove is located on the side of the protective layer away from the substrate. A matte groove is formed by laser engraving to enhance adhesion, and ink is filled in the groove to form a patterned structure.
It improves the adhesion of the logo, reduces the risk of detachment, increases production yield and efficiency, and enables diversified logo designs to meet different needs.
Smart Images
Figure CN224460215U_ABST
Abstract
Description
Technical Field
[0001] Embodiments of this application relate to the technical field of housings, and more particularly to a housing and an electronic device. Background Technology
[0002] The housing may include a substrate and a logo, which can be printed onto the substrate. During use, the logo is prone to detaching from the substrate, affecting the reliability of the housing. Utility Model Content
[0003] Embodiments of this application provide housings and electronic devices that reduce the risk of the mark falling off the housing and improve the reliability of the housing in use.
[0004] On one hand, embodiments of this application provide a housing. The housing includes a substrate, a paint layer assembly, and a pattern structure. The paint layer assembly is disposed on the surface of the substrate. The paint layer assembly includes a first adhesion layer, a color providing layer, and a protective layer stacked together, with the first adhesion layer, the color providing layer, and the protective layer sequentially away from the substrate. A pattern groove is formed on the paint layer assembly, the opening of the pattern groove being located on the surface of the protective layer away from the substrate, and the pattern groove extending along the stacking direction of the first adhesion layer, the color providing layer, and the protective layer. The pattern structure is embedded in the pattern groove.
[0005] In some possible implementations, along the stacking direction of the first adhesion layer, the color providing layer, and the protective layer, a portion of the paint layer assembly is located between the pattern structure and the substrate.
[0006] In some possible implementations, a portion of the first adhesive layer is located between the pattern structure and the substrate, along the stacking direction of the first adhesive layer, the color providing layer, and the protective layer.
[0007] In some possible implementations, the thickness of the first adhesion layer located between the pattern structure and the substrate is greater than 0.01 mm along the stacking direction of the first adhesion layer, the color providing layer and the protective layer.
[0008] In some possible implementations, the surface of the pattern structure away from the substrate is flush with the surface of the protective layer away from the substrate.
[0009] In some possible implementations, the patterned structure is on the surface away from the substrate, while the protective layer is closer to the substrate than the surface away from the substrate.
[0010] In some possible implementations, there are multiple pattern structures, and these multiple pattern structures are set at intervals.
[0011] In some possible implementations, the distance between any two adjacent pattern structures is greater than or equal to 0.18 mm.
[0012] In some possible implementations, the material for the patterned structure includes ink.
[0013] On the other hand, embodiments of this application provide an electronic device. The electronic device includes a housing as described above.
[0014] In summary, the embodiments of this application have at least the following beneficial effects:
[0015] In the embodiments of this application, the pattern structure is embedded in the pattern groove, and the opening of the pattern groove is located on the surface of the protective layer away from the substrate. The user can observe the side of the pattern structure away from the substrate through the opening of the pattern groove, so that the pattern structure can serve as a mark and achieve the effect of fusion between the mark and the paint layer.
[0016] The paint layer protects the pattern structure, reducing the risk of it detaching from the substrate, which in turn reduces the risk of the logo falling off, thus improving the reliability of the casing. Furthermore, after laser engraving creates the pattern grooves, the inner surface of the grooves is typically matte. The matte surface has strong adhesion to the pattern structure, further reducing the risk of the pattern structure detaching from the substrate.
[0017] During the process of forming the pattern structure within the patterned grooves, the paint layer assembly (such as the color-providing layer) is less susceptible to impacts, scratches, and contamination, thus improving the production yield of the casing and eliminating the need for repeated casing transfers, thereby increasing production efficiency. Furthermore, the influence between the pattern structure and the protective layer is minimal. The protective layer can be flexibly selected with a glossy or matte finish, and can also include an anti-fingerprint coating. The pattern structure can be flexibly chosen in different colors, enabling diverse pattern structures to meet various needs. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 Schematic diagrams of the structure of electronic devices provided in some embodiments of this application;
[0020] Figure 2 Schematic diagrams of the housing structure provided for some embodiments of this application;
[0021] Figure 3 Schematic diagrams of the housing structure provided for other embodiments of this application;
[0022] Figure 4Schematic diagrams of the housing structure provided for some embodiments of this application;
[0023] Figure 5 Schematic diagrams of the housing structure provided for some embodiments of this application;
[0024] Figure 6 Schematic diagrams of the housing structure provided for some embodiments of this application;
[0025] Figure 7 This is a schematic diagram of the structure of the housing provided for some embodiments of this application.
[0026] Explanation of reference numerals in the attached figures:
[0027] 200 - Electronic device, 210 - Display panel, 100 - Housing, 110 - Substrate, 120 - Coating layer group, 121 - First adhesion layer, 122 - Color providing layer, 123 - Protective layer, P - Pattern groove, P1 - Opening, 130 - Pattern structure, Z - Stacking direction of the first adhesion layer 121, the color providing layer 122 and the protective layer 123, H1 - Thickness of the first adhesion layer 121, H2 - Thickness of the color providing layer 122, H3 - Thickness of the protective layer 123, H4 - Height of the pattern groove P, H5 - Thickness of the first adhesion layer 121 located between the pattern structure 130 and the substrate 110. Detailed Implementation
[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0029] In this application, the terms "upper," "left," "right," "front," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.
[0030] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.
[0031] Furthermore, the terms "installation," "setup," "equipped with," and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.
[0032] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.
[0033] Figure 1 The diagram illustrates the structure of an electronic device provided in some embodiments of this application. For example... Figure 1 As shown, an embodiment of this application provides an electronic device 200. For example, the electronic device 200 can be an electronic device with communication functions, such as a mobile phone, laptop, or tablet computer; or, the electronic device 200 can be a smart wearable device, such as a smartwatch or smart bracelet. Alternatively, the electronic device 200 can also be other devices besides those described above, such as a server or home appliance. The embodiments of this application do not further limit the specific form of the electronic device 200.
[0034] like Figure 1 As shown, the electronic device 200 may include a housing 100, which can enclose a receiving space. The electronic device 200 may include electronic components such as processors and circuit boards, which can be disposed within the receiving space enclosed by the housing 100, so that the housing 100 can protect the electronic components.
[0035] Continue to refer to Figure 1 The electronic device 200 may also include a display panel 210, which can be connected to the housing 100 and is used to display image information.
[0036] The embodiments of this application do not further limit other components of the electronic device 200; the housing 100 is described below as an example.
[0037] Figure 2 The diagram illustrates the structure of the housing provided in some embodiments of this application. In some examples, such as... Figure 2 As shown, the housing 100 includes a substrate 110 and a paint layer assembly 120, the paint layer assembly 120 being disposed on the surface of the substrate 110.
[0038] The substrate 110 may include a metal, such as at least one of copper, aluminum, and titanium. Alternatively, the substrate 110 may also include a non-metal, such as at least one of glass and plastic. The embodiments of this application do not further limit the material of the substrate 110.
[0039] For example, the paint layer group 120 may be disposed on one side surface of the substrate 110, or the paint layer group 120 may be disposed on both sides or above the sides surface of the substrate 110.
[0040] Continue to refer to Figure 2 In some examples, the paint layer assembly 120 includes a first adhesion layer 121, a color providing layer 122, and a protective layer 123 stacked together, the first adhesion layer 121, the color providing layer 122, and the protective layer 123 being sequentially located away from the substrate 110.
[0041] The first adhesion layer 121 is located between the color providing layer 122 and the substrate 110, and serves to attach the color providing layer 122 to the surface of the substrate 110, thereby reducing the risk of the color providing layer 122 and the protective layer 123 falling off the substrate 110, and also reducing the impact of defects on the surface of the substrate 110 on the color providing layer 122 and the protective layer 123.
[0042] For example, the first adhesion layer 121 may be referred to as a primer. The primer material may include at least one of epoxy resin, polyurethane and acrylic, or the primer may include other materials besides those mentioned above. The embodiments of this application do not further limit the material of the primer.
[0043] like Figure 2 As shown, the thickness H1 of the first adhesion layer 121 can range from 8 micrometers (μm) to 12 μm. For example, the thickness H1 of the first adhesion layer 121 can be 9 μm, 10 μm, or 11 μm, etc. The embodiments of this application do not further limit the value of the thickness H1 of the first adhesion layer 121.
[0044] The color providing layer 122 is used to provide color. It is understood that the color providing layer 122 may provide one color, or the color providing layer 122 may provide multiple colors, and the embodiments of this application do not further limit this.
[0045] For example, the color-providing layer 122 may be referred to as a mid-coat. The material of the mid-coat may include at least one of epoxy resin, polyurethane, and acrylic, or the mid-coat may also include other materials besides those mentioned above. The embodiments of this application do not further limit the material of the mid-coat.
[0046] like Figure 2As shown, the thickness H2 of the color providing layer 122 can range from 4μm to 8μm. For example, the thickness H2 of the color providing layer 122 can be 5μm, 6μm, or 7μm. The embodiments of this application do not further limit the value of the thickness H2 of the color providing layer 122.
[0047] The protective layer 123 protects the first adhesion layer 121 and the color providing layer 122, reducing the risk of scratches to these layers. The protective layer 123 typically includes a transparent material to minimize obstruction of the color of the color providing layer 122, allowing the user to observe the color of the color providing layer 122.
[0048] For example, the protective layer 123 may be referred to as including a topcoat. The topcoat may be an ultraviolet (UV) cured topcoat, or it may be a polyurethane topcoat, which is not further limited in the embodiments of this application.
[0049] like Figure 2 As shown, the thickness H3 of the protective layer 123 can range from 18 μm to 25 μm. For example, the thickness H3 of the protective layer 123 can be 19 μm, 20 μm, or 23 μm. The embodiments of this application do not further limit the value of the thickness H3 of the protective layer 123.
[0050] For example, a three-coat, three-bake process can be used to form a paint layer assembly 120 on the surface of the substrate 110. That is, after spraying a first adhesion layer 121 onto the surface of the substrate 110, the first adhesion layer 121 can be baked to cure it. Then, a color-providing layer 122 is sprayed onto the side of the first adhesion layer 121 away from the substrate 110, and the color-providing layer 122 is baked to cure it. A protective layer 123 is sprayed onto the side of the color-providing layer 122 away from the substrate 110, and then the protective layer 123 is baked to cure it. In this way, the first adhesion layer 121, the color-providing layer 122, and the protective layer 123 can be stacked on the surface of the substrate 110, and sequentially away from the substrate 110.
[0051] Alternatively, other processes can be used to form the paint layer group 120 on the surface of the substrate 110. The embodiments of this application do not further limit the process for forming the paint layer group 120.
[0052] For example, paint layer assembly 120 may also include a second adhesion layer (not shown) located between the first adhesion layer 121 and the substrate 110 to improve the adhesion between the substrate 110 and the first adhesion layer 121 and reduce the risk of the first adhesion layer 121, color providing layer 122 and protective layer 123 detaching from the substrate 110.
[0053] For example, the surface of the substrate 110 can be treated to form a second adhesion layer, or the second adhesion layer can be coated on the surface of the substrate 110, and then the second adhesion layer can be cured to form a first adhesion layer 121, a color providing layer 122 and a protective layer 123 in sequence, and the paint layer group 120 can be formed by a "four-coat four-bake" process.
[0054] For example, the thickness of the second adhesion layer can range from 8 μm to 14 μm, such as 9 μm, 11 μm, or 13 μm. It is understood that the embodiments of this application do not further limit the thickness of the second adhesion layer, the process for forming the second adhesion layer, or the materials contained in the second adhesion layer.
[0055] Typically, a pattern shape needs to be printed on the paint layer 120 to form the designated logo.
[0056] In some possible implementations, the logo can be printed on the side of the color providing layer 122 away from the first adhesion layer 121 after the color providing layer 122 has cured, and then the protective layer 123 can be formed. The protective layer 123 is typically a transparent material, allowing the logo printed on the color providing layer 122 to be visible to the user.
[0057] However, using the above implementation method, after the color providing layer 122 is cured, the housing 100 needs to be removed from the fixture forming the paint layer assembly 120 and moved to the fixture for printing the mark. After the mark printing is completed, the housing 100 is moved back to the fixture forming the paint layer assembly 120.
[0058] The process of transferring the casing 100 can easily cause bumps and scratches to the color providing layer 122, and the process of printing logos can easily cause contamination of the color providing layer 122, affecting the production yield of the casing 100. Furthermore, the transfer process of the casing 100 can also affect production efficiency.
[0059] In some other possible implementations, the mark can be printed on the surface of the protective layer 123 away from the substrate 110 after the protective layer 123 has cured.
[0060] However, if the surface of the protective layer 123 away from the substrate 110 is a high-gloss surface, such as a high-gloss surface formed by a nonconductive vacuum metallization (NCVM) process, the adhesion between the logo and the protective layer 123 will not meet the requirements, and the logo will easily peel off relative to the protective layer 123. If the protective layer 123 includes an anti-fingerprint coating, the adhesion between the logo and the protective layer 123 will be even weaker, making it difficult to print the logo on the protective layer 123.
[0061] Furthermore, even if the surface of the protective layer 123 away from the substrate 110 is matte, the logo is easily worn off during use because it protrudes from the protective layer 123. For example, when the surface of the protective layer 123 away from the substrate 110 is matte and the logo is printed on the protective layer 123, the vibration abrasion resistance test of the logo can only be maintained at around 0.5 hours (unit: H), which does not meet the requirements.
[0062] In some other possible implementations, a portion of the protective layer 123 on the XY plane can be removed after the protective layer 123 is formed. Understandably, the protective layer 123 that has not been removed on the XY plane can serve as a marker, while the remaining portion of the protective layer 123 can provide protection for the color-providing layer 122 and the first adhesion layer 121.
[0063] The XY plane is perpendicular or approximately perpendicular to the stacking direction Z of the first attachment layer 121, the color providing layer 122, and the protective layer 123. That is, the angle between the XY plane and the stacking direction Z of the first attachment layer 121, the color providing layer 122, and the protective layer 123 can be 90°, 88°, or 89°, etc.
[0064] In the above implementation, the mark is obtained from the protective layer 123. The only difference between the mark and the protective layer 123 is the gloss. For example, the surface of the mark away from the substrate 110 can be glossy, and the surface of the protective layer 123 away from the substrate 110 can be matte. It is not possible to achieve color diversity of the mark.
[0065] Furthermore, the mark protrudes from the protective layer 123, making it prone to wear and tear during use, which can cause the mark to detach from the protective layer 123. For example, in the above implementation, the vibration abrasion resistance test of the mark can only be stabilized at around 0.5 hours (unit: H), which does not meet the requirements.
[0066] Figure 3 The diagram shows the structure of the housing provided for other embodiments of this application. Figure 4 This is a schematic diagram of the structure of the housing provided for some embodiments of this application. Figure 5This is a schematic diagram of the structure of the housing provided for some embodiments of this application.
[0067] In some examples, such as Figure 3 , Figure 4 and Figure 5 As shown, a patterned groove P is formed on the paint layer assembly 120. The opening P1 of the patterned groove P is located on the surface of the protective layer 123 away from the substrate 110, and the patterned groove P extends along the stacking direction Z of the first adhesion layer 121, the color providing layer 122 and the protective layer 123.
[0068] For example, a patterned groove P can be formed on the surface of the protective layer 123 away from the substrate 110 using a laser engraving process, such that the opening P1 of the patterned groove P can be located on the surface of the protective layer 123 away from the substrate 110, and the patterned groove P can extend along the stacking direction Z of the first adhesion layer 121, the color providing layer 122 and the protective layer 123.
[0069] Alternatively, other processes may be used to form patterned grooves P on the surface of the protective layer 123 on the side away from the substrate 110, and the embodiments of this application do not further limit this.
[0070] For example, such as Figure 3 As shown, the patterned groove P can extend to the protective layer 123, or, as... Figure 4 As shown, the patterned groove P can also extend to the color-providing layer 122, or, as... Figure 5 As shown, the patterned groove P can also extend to the first adhesion layer 121. Alternatively, the patterned groove P can also penetrate through the paint layer group 120.
[0071] Along the stacking direction Z of the first adhesion layer 121, the color providing layer 122, and the protective layer 123, the height H4 of the pattern groove P can range from 0.02 mm to 0.04 mm. For example, along the stacking direction Z of the first adhesion layer 121, the color providing layer 122, and the protective layer 123, the height H4 of the pattern groove P can be 0.025 mm, 0.03 mm, or 0.035 mm, etc. The embodiments of this application do not further limit the value of the height H4 of the pattern groove P.
[0072] Figure 6 This is a schematic diagram of the structure of the housing provided for some embodiments of this application. Figure 7 This is a schematic diagram of the structure of the housing provided for some embodiments of this application.
[0073] In some examples, such as Figure 6 and Figure 7 As shown, the housing 100 also includes a pattern structure 130, which is embedded in the pattern groove P.
[0074] Understandably, the surface of the pattern structure 130 away from the substrate 110 has a set pattern shape. The set pattern shape can be Chinese characters or other characters, or regular or irregular geometric shapes. The embodiments of this application do not further limit this.
[0075] The pattern structure 130 is embedded in the pattern groove P. The opening P1 of the pattern groove P is located on the surface of the protective layer 123 away from the substrate 110. The user can observe the side of the pattern structure 130 away from the substrate 110 through the opening P1 of the pattern groove P, so that the pattern structure 130 can serve as a mark and achieve the effect of fusion between the mark and the paint layer 120.
[0076] The paint layer 120 protects the pattern structure 130, reducing the risk of the pattern structure 130 detaching from the substrate 110, which in turn reduces the risk of the mark detaching from the substrate 110 and improves the reliability of the housing 100. Furthermore, after the pattern groove P is formed by laser engraving, the inner surface of the pattern groove P is typically matte. The matte surface has strong adhesion to the pattern structure 130, further reducing the risk of the pattern structure 130 detaching from the substrate 110.
[0077] During the formation of the pattern structure 130 within the patterned groove P, the paint layer assembly 120 (e.g., the color-providing layer 122) is less susceptible to impacts, scratches, and contamination, thus improving the production yield of the housing 100. Furthermore, the housing 100 does not require repeated transfers, increasing its production efficiency. In addition, the influence between the pattern structure 130 and the protective layer 123 is minimal. The protective layer 123 can be flexibly selected for a glossy or matte finish, and may also include an anti-fingerprint coating. The pattern structure 130 can be flexibly selected for different colors, enabling a diverse range of colors to meet various needs.
[0078] For example, by using the above settings, the vibration abrasion resistance test of the pattern structure 130 can stably reach about 2H, reducing the risk of the pattern structure 130 falling off the substrate 110 and improving the reliability of the housing 100.
[0079] In some examples, the material of the pattern structure 130 includes ink.
[0080] For example, after forming the patterned groove P, ink can be filled into the patterned groove P and the ink can be cured to form the patterned structure 130. For example, the ink can be cured by at least one of baking and ultraviolet irradiation. The baking temperature can be 80°C ± 5°C, and the baking time can be 2 hours. Alternatively, the baking temperature and time can be other values, which are not further limited by the embodiments of this application.
[0081] The material used for the pattern structure 130 includes ink, making the material readily available and reducing the cost of the housing 100. Furthermore, by changing the color of the ink, the pattern structure 130 can be made more colorful, thus enabling the logo to be more diverse and meeting different needs.
[0082] In some examples, there are multiple pattern structures 130, and the multiple pattern structures 130 are set at intervals.
[0083] For example, the number of pattern structures 130 can be two, three, four, or more, and the embodiments of this application do not further limit the number of pattern structures 130. The shapes, sizes, fonts, etc. of the multiple pattern structures 130 can be the same or different. Along the stacking direction Z of the first attachment layer 121, the color providing layer 122, and the protective layer 123, the heights of the multiple pattern structures 130 can be the same or different.
[0084] The number of pattern structures 130 can be multiple, enabling various logo designs to be implemented and meeting the needs of different situations. Multiple pattern structures 130 can be embedded in different pattern grooves P, allowing them to be spaced apart to reduce mutual interference between them.
[0085] In some examples, the distance between any two adjacent pattern structures 130 is greater than or equal to 0.18 millimeters (mm).
[0086] This configuration avoids excessively small distances (e.g., less than 0.18 mm) between any two adjacent pattern structures 130, reducing mutual interference between multiple pattern structures 130 and improving the reliability of the housing 100. Understandably, the distances between multiple pattern structures 130 can be the same or different.
[0087] For example, the width of any pattern structure 130 in the XY plane is greater than or equal to 0.15 mm. Understandably, the width of different pattern structures 130 in the XY plane can be the same or different.
[0088] In some examples, such as Figure 6 and Figure 7 As shown, along the stacking direction Z of the first adhesion layer 121, the color providing layer 122 and the protective layer 123, a portion of the paint layer group 120 is located between the pattern structure 130 and the substrate 110.
[0089] Understandably, along the stacking direction Z of the first adhesion layer 121, the color providing layer 122 and the protective layer 123, the height of the pattern groove P is less than the thickness of the paint layer group 120, and the pattern structure 130 is embedded in the pattern groove P, so that part of the paint layer group 120 can be located between the pattern structure 130 and the substrate 110.
[0090] The partial paint layer group 120 located between the pattern structure 130 and the substrate 110 can serve to attach the pattern structure 130 to the substrate 110, reduce the risk of the pattern structure 130 falling off the substrate 110, that is, reduce the risk of the mark falling off the substrate 110, and improve the reliability of the housing 100.
[0091] Continue to refer to Figure 6 and Figure 7 In some examples, along the stacking direction Z of the first adhesion layer 121, the color providing layer 122, and the protective layer 123, a portion of the first adhesion layer 121 is located between the pattern structure 130 and the substrate 110.
[0092] Understandably, along the stacking direction Z of the first adhesion layer 121, the color providing layer 122, and the protective layer 123, the pattern groove P extends to the first adhesion layer 121, and the pattern structure 130 is embedded in the pattern groove P, so that a portion of the first adhesion layer 121 can be located between the pattern structure 130 and the substrate 110.
[0093] The first adhesion layer 121 located between the pattern structure 130 and the substrate 110 can attach the pattern structure 130 to the substrate 110, reduce the risk of the pattern structure 130 falling off the substrate 110, that is, reduce the risk of the mark falling off the substrate 110, and improve the reliability of the housing 100.
[0094] Continue to refer to Figure 6 and Figure 7 In some examples, along the stacking direction Z of the first adhesion layer 121, the color providing layer 122, and the protective layer 123, the thickness H5 of the first adhesion layer 121 located between the pattern structure 130 and the substrate 110 is greater than 0.01 mm.
[0095] This configuration avoids the thickness H5 of the first adhesion layer 121 located between the pattern structure 130 and the substrate 110 being too small (e.g., less than or equal to 0.01 mm), ensuring the adhesion of the first adhesion layer 121 between the pattern structure 130 and the substrate 110 to the pattern structure 130 and reducing the risk of the pattern structure 130 falling off the substrate 110.
[0096] In other examples, along the stacking direction Z of the first attachment layer 121, the color providing layer 122, and the protective layer 123, the patterned groove P extends to the color providing layer 122, and the patterned structure 130 is embedded in the patterned groove P, such that the first attachment layer 121 and part of the color providing layer 122 can be located between the patterned structure 130 and the substrate 110.
[0097] In some other examples, along the stacking direction Z of the first adhesion layer 121, the color providing layer 122, and the protective layer 123, the patterned groove P extends to the protective layer 123, and the patterned structure 130 is embedded in the patterned groove P, such that the first adhesion layer 121, the color providing layer 122, and part of the protective layer 123 can be located between the patterned structure 130 and the substrate 110.
[0098] For example, along the stacking direction Z of the first attachment layer 121, the color providing layer 122, and the protective layer 123, the height of the pattern groove P and the thickness of the pattern structure 130 can be the same or different.
[0099] In some examples, such as Figure 6 As shown, the surface of the pattern structure 130 away from the substrate 110 is flush with the surface of the protective layer 123 away from the substrate 110.
[0100] Understandably, along the stacking direction Z of the first adhesion layer 121, the color providing layer 122, and the protective layer 123, the height of the pattern groove P and the thickness of the pattern structure 130 are the same. The pattern structure 130 is embedded in the pattern groove P, so that the surface of the pattern structure 130 away from the substrate 110 and the surface of the protective layer 123 away from the substrate 110 can be flush or nearly flush, thereby improving the structural regularity of the housing 100 and reducing the risk of residual impurities on the side of the pattern structure 130 away from the substrate 110.
[0101] In other examples, such as Figure 7 As shown, the surface of the pattern structure 130 away from the substrate 110 is closer to the substrate 110 than the surface of the protective layer 123 away from the substrate 110.
[0102] Understandably, along the stacking direction Z of the first adhesion layer 121, the color providing layer 122, and the protective layer 123, the height of the pattern groove P is greater than the thickness of the pattern structure 130. The pattern structure 130 is embedded in the pattern groove P, so that the surface of the pattern structure 130 away from the substrate 110 can be closer to the substrate 110 relative to the surface of the protective layer 123 away from the substrate 110. That is, the pattern structure 130 can be recessed relative to the paint layer group 120, which improves the protective effect of the paint layer group 120 on the pattern structure 130, reduces the risk of the pattern structure 130 being worn or scratched by other parts, thereby reducing the risk of the pattern structure 130 falling off the substrate 110 and improving the reliability of the housing 100.
[0103] In some other examples, the surface of the pattern structure 130 away from the substrate 110 may be further away from the substrate 110 than the surface of the protective layer 123 away from the substrate 110.
[0104] Understandably, along the stacking direction Z of the first adhesion layer 121, the color providing layer 122, and the protective layer 123, the height of the pattern groove P is less than the thickness of the pattern structure 130, so that the surface of the pattern structure 130 away from the substrate 110 is further away from the substrate 110 than the surface of the protective layer 123 away from the substrate 110. In other words, the pattern structure 130 can protrude from the paint layer group 120 to meet the usage requirements under different conditions.
[0105] Understandably, the method of embedding the pattern structure 130 into the paint layer group 120 to form a mark provided by the embodiments of this application can be used not only for the housing 100 of the electronic device 200, but also for the surface of the metal anode of the battery, the surface of the coating formed by electrophoresis, etc.
[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A housing characterized by, include: Substrate; A paint layer assembly is disposed on the surface of the substrate; the paint layer assembly includes a first adhesion layer, a color providing layer, and a protective layer stacked together, wherein the first adhesion layer, the color providing layer, and the protective layer are sequentially located away from the substrate; a patterned groove is formed on the paint layer assembly, the opening of the patterned groove is located on the surface of the protective layer away from the substrate, and the patterned groove extends along the stacking direction of the first adhesion layer, the color providing layer, and the protective layer; as well as, The pattern structure is embedded in the patterned groove.
2. The housing of claim 1, wherein Along the stacking direction of the first adhesion layer, the color providing layer and the protective layer, a portion of the paint layer group is located between the pattern structure and the substrate.
3. The housing of claim 2, wherein, Along the stacking direction of the first adhesion layer, the color providing layer and the protective layer, a portion of the first adhesion layer is located between the pattern structure and the substrate.
4. The housing of claim 3, wherein, Along the stacking direction of the first adhesion layer, the color providing layer and the protective layer, the thickness of the first adhesion layer located between the pattern structure and the substrate is greater than 0.01 mm.
5. The case according to claim 1, characterized by The surface of the pattern structure away from the substrate is flush with the surface of the protective layer away from the substrate.
6. The case of claim 1, wherein, The surface of the pattern structure away from the substrate is closer to the substrate than the surface of the protective layer away from the substrate.
7. The case of claim 1, wherein, The number of pattern structures is multiple, and the multiple pattern structures are arranged at intervals.
8. The case according to claim 7, characterized in that The distance between any two adjacent pattern structures is greater than or equal to 0.18 mm.
9. The case according to any one of claims 1 to 8, characterized in that The material of the pattern structure includes ink.
10. An electronic device, comprising: Includes the housing as described in any one of claims 1 to 9.