A heat dissipation-strength integrated assembly structure of a power module

Abstract

The utility model discloses a heat dissipation-strength integrated assembly structure of power module, including surface metallization package's power module and metal bottom plate. Surface metallization package's power module contains top, bottom surface, the metallization heat dissipation surface of side and the metallization pasting pin of side. The through hole is equipped with on power module, and the riveting column is equipped with on metal bottom plate, and power module and metal bottom plate realize high accuracy assembly through through hole, riveting column, adopt tin soldering connection between surface metallization package's power module and metal bottom plate, and the heat conduction efficiency and structural strength are greatly improved. The metal bottom plate is equipped with plastic insulation part, and the metallization pasting pin of power module is isolated with metal bottom plate to ensure insulation safety, and the metal bottom plate bottom surface has the flat plate or heat dissipation fin structure, and the heat dissipation performance is strengthened. The high accuracy assembly, high -efficient heat conduction, high structural strength, insulation protection and high heat dissipation design of this structure can improve the reliability of electronic product in the use process greatly while satisfying the high -power density product high -performance heat dissipation.

Description

Technical Field

[0001] This utility model belongs to the field of packaging technology, and in particular to an integrated heat dissipation and strength assembly structure for a power module. Background Technology

[0002] Existing baseplate-reinforced plastic-encapsulated power modules suffer from low thermal conductivity: the use of thermally conductive adhesive to connect the module to the baseplate results in high thermal resistance, making it difficult to meet the heat dissipation requirements of high-power modules; furthermore, insufficient assembly strength: the adhesive bonding cannot guarantee the assembly strength between the module and the baseplate, resulting in limited structural strength and an inability to withstand complex operating conditions such as vibration and impact. Heat dissipation design: the baseplate's heat dissipation structure is singular, preventing the power module from fully utilizing the advantages of multi-faceted heat dissipation, thus affecting module stability. Utility Model Content

[0003] The purpose of this utility model is to address the problems existing in the prior art by providing an integrated heat dissipation and strength assembly structure for a power module, which has the advantages of high-precision assembly, efficient heat conduction, high structural strength, insulation protection and high heat dissipation.

[0004] The technical solution to achieve the purpose of this utility model is as follows: a heat dissipation-strength integrated assembly structure for a power module, including a metal base plate, on which the power module is mounted; the power module is a surface-mount metallized packaged power module, including heat dissipation metallized plating layers on the top surface, bottom surface, and sides, as well as metallized mounting pins on the sides; the metal base plate is provided with a plastic insulating part for isolating the metallized mounting pins from the metal base plate.

[0005] Furthermore, the heat dissipation metallization coating includes a copper layer, a nickel layer, and a gold layer arranged sequentially.

[0006] Furthermore, the metal base plate has a flat plate structure.

[0007] Furthermore, the power module is installed with the metal base plate by riveting. The power module has a through hole, and the metal base plate has a riveting post that mates with the through hole.

[0008] Furthermore, the metal base plate is mounted on the back plate.

[0009] Furthermore, the power module and the metal base plate are assembled onto the back plate by riveting. The riveting post is a hollow post, and the rivets pass through the through holes in sequence, and the riveting post is installed on the back plate.

[0010] Furthermore, the bottom of the metal base plate has a heat dissipation fin structure, and the power module is mounted on the back plate.

[0011] Furthermore, the power module is connected to the metal base plate by soldering, and the soldering area accounts for 85%-95% of the bottom area of ​​the power module.

[0012] Furthermore, the metallized mounting pins of the power module are horizontally mounted and soldered to the input PCB and output PCB.

[0013] Furthermore, the plastic insulation part is fixed together with the metal base plate by ultrasonic heat fusion.

[0014] Compared with the prior art, the significant advantages of this utility model are:

[0015] (1) High-precision strong structure assembly: Through the fit between the riveting column and the through hole, especially the interference fit and anti-slip texture design, high-precision assembly is achieved, which significantly improves the structural strength and enhances the resistance to vibration and impact.

[0016] (2) High efficiency heat conduction: The use of tin soldering instead of traditional thermal conductive adhesive expands the heat conduction contact area, greatly improves the heat conduction efficiency, and meets the heat dissipation requirements of high power modules.

[0017] (3) Insulation safety and reliability: The plastic insulation part (insulation sleeve or coating) effectively isolates the module pins from the metal base plate, avoids electrical short circuits, and ensures safety in use.

[0018] (4) Optimize heat dissipation performance: The heat dissipation fin structure of the metal base plate is designed in an array to increase the heat dissipation area, enhance the multi-faceted heat dissipation effect, and improve the stability of the module.

[0019] The present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the assembly process of the power module and the metal base plate in an implementation case.

[0021] Figure 2 This is a schematic diagram of the integrated heat dissipation and strength structure of the power module and its assembly with the backplate in an implementation case.

[0022] Figure 3 This is a schematic diagram of the horizontal mounting and soldering of the power module to the input and output PCBs in an implementation case.

[0023] Figure 4 This is a schematic diagram of the integrated heat dissipation and strength (heat dissipation fins) structure of the power module in an implementation case.

[0024] Figure 5 This is a schematic diagram of the integrated heat dissipation and strength (heat dissipation fins) structure of the power module and its assembly with the backplate in an implementation case. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0026] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0027] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0028] In one embodiment, combined Figures 1 to 5 A heat dissipation-strength integrated assembly structure for a power module is provided, including a metal base plate 2, on which a power module 1 is mounted; the power module 1 is a surface-mount metallized packaged power module, including heat dissipation metallized plating layers on the top, bottom, and sides, and metallized mounting pins 1.2 on the sides; the metal base plate 2 is provided with a plastic insulating part 2.2 for isolating the metallized mounting pins 1.2 from the metal base plate 2.

[0029] Furthermore, in one embodiment, the heat-dissipating metallization coating includes a copper layer 1.3.1, a nickel layer 1.3.2, and a gold layer 1.3.3 disposed sequentially.

[0030] Preferably, in some embodiments, the thickness of the first copper layer is 0.1mm-0.15mm, the thickness of the second nickel layer is 2.5um, and the thickness of the second gold layer is 0.05um.

[0031] Furthermore, in one embodiment, the metal base plate 2 is a flat plate structure.

[0032] Preferably, in some embodiments, the power module 1 and the metal base plate 2 are installed by riveting, the power module 1 is provided with a through hole 1.1, and the metal base plate 2 is provided with a riveting post 2.1 that cooperates with the through hole 1.1.

[0033] Preferably, the through hole 1.1 is formed by machining, and the machining method is drill bit scooping.

[0034] Preferably, in some embodiments, the metal base plate 2 is mounted on the back plate 4.

[0035] Here, preferably, in combination Figure 3 The power module 1 and the metal base plate 2 are assembled on the back plate 4 by riveting. The riveting post 2.1 is a hollow post. The rivets 5 are installed on the back plate 4 by passing through the through hole 1.1 and the riveting post 2.1 in sequence, so as to achieve high structural strength assembly and high performance heat dissipation.

[0036] Preferably, the riveting post 2.1 and the through hole 1.1 are interference fits to enhance the accuracy and structural stability after riveting assembly.

[0037] Furthermore, in one embodiment, combined with Figure 4 The bottom of the metal base plate 2 has a heat dissipation fin structure 2.3, at which time the power module 1 is assembled on the back plate 4 as follows. Figure 5 As shown.

[0038] Preferably, in some embodiments, the heat dissipation fin structure 2.3 is arranged in an array.

[0039] Preferably, in some embodiments, the fin thickness is 0.5mm-2mm, the spacing between adjacent fins is 10mm-15mm, and the fin height is 4-6 times the thickness of the metal base plate 2, in order to enhance heat dissipation performance.

[0040] Furthermore, the power module 1 and the metal base plate 2 are connected by soldering, and the soldering area accounts for 85%-95% of the bottom area of ​​the power module 1. Soldering replaces traditional thermal conductive adhesive, which greatly improves the heat conduction efficiency.

[0041] Furthermore, in one embodiment, combined with Figure 2 The metallized mounting pins 1.2 of the power module 1 are horizontally mounted and soldered to the input PCB 3.1 and the output PCB 3.2 to achieve electrical connection.

[0042] Here, the mounting pins 1.2 of the power module 1 are horizontally mounted and soldered to the input PCB 3.1 and output PCB 3.2 using customized tooling fixtures to ensure that the power module 1 is at the same horizontal level as the input PCB 3.1 and output PCB 3.2.

[0043] Furthermore, in one embodiment, the plastic insulation part 2.2 is fixed together with the metal base plate 2 by ultrasonic heat fusion.

[0044] In summary, this utility model features high-precision assembly, efficient heat conduction, high structural strength, insulation protection, and high heat dissipation design. While meeting the high-performance heat dissipation requirements of high-power-density products, it greatly improves the reliability of electronic products during use.

[0045] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A heat dissipation and strength integrated assembly structure for a power module, characterized in that, The device includes a metal base plate (2) and a power module (1) mounted on the metal base plate (2). The power module (1) is a surface-mount metallized packaged power module, including a heat dissipation metallized coating on the top, bottom, and sides, and metallized mounting pins (1.2) on the sides. The metal base plate (2) is provided with a plastic insulating part (2.2) to isolate the metallized mounting pins (1.2) from the metal base plate (2).

2. The heat dissipation-strength integrated assembly structure of a power module according to Claim 1, wherein The heat dissipation metallization coating includes a copper layer (1.3.1), a nickel layer (1.3.2), and a gold layer (1.3.3) arranged sequentially.

3. The heat dissipation-strength integrated assembly structure of a power module according to Claim 1, wherein The metal base plate (2) is a flat plate structure.

4. The heat dissipation-strength integrated assembly structure of the power module according to Claim 3, wherein The power module (1) is installed with the metal base plate (2) by riveting. The power module (1) is provided with a through hole (1.1) and the metal base plate (2) is provided with a riveting post (2.1) that cooperates with the through hole (1.1).

5. The heat dissipation-strength integrated assembly structure of the power module according to Claim 4, wherein The metal base plate (2) is mounted on the back plate (4).

6. The heat dissipation-strength integrated assembly structure of the power module according to Claim 5, wherein The power module (1) and the metal base plate (2) are assembled on the back plate (4) by riveting. The riveting post (2.1) is a hollow post. The rivet (5) passes through the through hole (1.1) and the riveting post (2.1) in sequence and is installed on the back plate (4).

7. The integrated heat dissipation and strength assembly structure of the power module according to claim 1, characterized in that, The bottom of the metal base plate (2) is a heat dissipation fin structure (2.3), and the power module (1) is mounted on the back plate (4).

8. The heat dissipation-strength integrated assembly structure of a power module according to Claim 1, wherein The power module (1) is connected to the metal base plate (2) by soldering, and the soldering area accounts for 85%-95% of the bottom area of ​​the power module (1).

9. The heat dissipation-strength integrated assembly structure of a power module according to Claim 1, wherein The metallized mounting pins (1.2) of the power module (1) are horizontally mounted and soldered to the input PCB (3.1) and output PCB (3.2).

10. The heat dissipation-strength integrated assembly structure of the power module according to Claim 1, wherein The plastic insulation part (2.2) and the metal base plate (2) are fixed together by ultrasonic heat fusion.

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