An embedded heat dissipation aluminum plate structure for electronic devices
By adjusting the design of the distribution components and the thermal paste distribution components, the problems of poor adhesion and uneven grease application caused by the thickness difference between the electronic device and the heat sink aluminum plate were solved, achieving uniform distribution of thermal paste and efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHANGJIAGANG RUNSHENG SCI & TECH MATERIAL
- Filing Date
- 2025-08-08
- Publication Date
- 2026-07-03
AI Technical Summary
In the existing technology, due to the thickness differences of different electronic devices, it is difficult to accurately fill the gap between the electronic device and the heat sink aluminum plate, resulting in an air gap at the contact surface, which hinders heat transfer and affects heat dissipation efficiency.
An adjustment and distribution component and a silicone grease distribution component were designed. The height of the adjustment plate is adjusted by the cooperation of the guide groove and the conical teeth. Combined with the design of the guide plate and the sliding baffle, the silicone grease is evenly distributed, avoiding local accumulation and air gaps, and ensuring good contact.
It enables flexible adjustment based on device thickness, ensuring uniform distribution of thermal grease, improving heat dissipation efficiency, and solving problems such as poor adhesion and uneven grease application caused by differences in device thickness, ensuring full contact at the heat dissipation interface.
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Figure CN224460372U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation aluminum plate technology, specifically to an embedded heat dissipation aluminum plate structure for electronic devices. Background Technology
[0002] Embedded heat dissipation aluminum plate structure for electronic devices usually involves embedding an aluminum plate into the device casing or interior. Its high thermal conductivity allows it to quickly absorb and conduct heat generated by heat sources such as chips. The surface of the aluminum plate can be designed with heat sinks or combined with structures such as heat dissipation holes and through holes to enhance air convection, further improve heat dissipation efficiency, and ensure that the device operates stably at a safe temperature.
[0003] In the field of heat dissipation for electronic devices, embedded heat sink aluminum plate structures are widely used due to their high heat conduction capabilities. In the existing technology, in order to achieve good heat transfer between electronic devices and ring-shaped heat sink aluminum plates, sufficient thermal grease is usually applied to the contact area between the two. The core purpose is to fill the tiny gaps on the contact surface with the grease, enhance the fit, and thus improve the heat dissipation efficiency.
[0004] However, in practical applications, due to the differences in thickness between different electronic devices, it is difficult to accurately fill the gaps between the electronic devices and the heat sink aluminum plate caused by the thickness difference when using ordinary thermal grease injection. This directly leads to the formation of air gaps in the contact surface. Since the thermal conductivity of air is much lower than that of thermal grease and metal, these air chambers will seriously hinder the transfer of heat, making it difficult to maximize the heat dissipation efficiency.
[0005] Therefore, an embedded heat dissipation aluminum plate structure for electronic devices is proposed to address the above problems. Utility Model Content
[0006] The purpose of this invention is to provide an embedded heat dissipation aluminum plate structure for electronic devices to solve the problems mentioned in the background art.
[0007] To achieve the above objectives, this utility model provides the following technical solution:
[0008] An embedded heat dissipation aluminum plate structure for electronic devices includes a main aluminum plate. Multiple heat dissipation fins arranged in a circular array are fixed inside the main aluminum plate. Heat pipes are fixed inside the heat dissipation fins. The inner wall of the heat pipes has guide grooves and linearly arranged filling grooves. Multiple linearly arranged conical teeth are fixed inside the guide grooves. An adjustment and distribution assembly is installed inside the heat pipes. The adjustment and distribution assembly includes an adjustment plate. A guide slider is fixed to the outer wall of the adjustment plate. A one-way locking tooth is fixed to the front end of the guide slider. A grease injection channel and a main delivery channel are formed on the lower surface of the adjustment plate. A silicone grease distribution assembly is fixed to the inner side of the adjustment plate.
[0009] As a further optimization of this utility model, the position of the guide slider corresponds to the position of the guide groove, the guide slider extends into the interior of the guide groove, and the one-way locking tooth engages between two adjacent conical teeth.
[0010] As a further optimization of this utility model, the following features are provided: the silicone grease dispensing assembly includes a base, which is fixedly disposed at the bottom of the inner side of the grease injection channel. A grease injection connector is fixed at the center of the upper surface of the base. A one-way valve is fixed on the inner side of the grease injection connector. The grease injection connector extends above the adjusting pressure plate. A diversion hole is provided at the bottom of the grease injection connector. A guide plate is fixed on the outer side of the base. The guide plate is fixedly disposed at the bottom of the inner side of the main delivery channel. Multiple left-right symmetrical limiting blocks are fixed at the front end of the upper surface of the guide plate. A sliding baffle is slidably connected to the inner side of the guide plate. A trigger block is fixed at the front end of the sliding baffle.
[0011] As a further optimization of this utility model, the upper surface of the guide plate is flush with the upper surface of the sliding baffle. The middle of the inner side of the guide plate is provided with top grease injection holes arranged in a linear pattern. The middle of the inner side of the sliding baffle is provided with through holes arranged in a linear pattern. The number of through holes is the same as the number of top grease injection holes.
[0012] As a further optimization of this utility model, the front end of the limiting block extends into the interior of the guide groove, and the upper surface of the limiting block is in contact with the top of the inner side of the main conveying channel.
[0013] As a further optimization of this utility model, the upper surface of the trigger block is flush with the upper surface of the limit block, and the trigger block is engaged at the rear end of the two limit blocks.
[0014] As a further optimization of this utility model, the top and bottom of the outer wall of the main aluminum plate are fixed with multiple mounting seats arranged in a circular array, and the mounting seats have countersunk holes in the middle.
[0015] Compared with the prior art, the beneficial effects of this utility model are:
[0016] In this invention, the adjustable distribution component works in conjunction with the heat pipe to flexibly adjust the height of the pressure plate according to the thickness of the electronic device and maintain a stable fit. The grease distribution component can achieve uniform distribution of heat dissipation grease, and multi-directional filling avoids local accumulation and air gaps. This solves the problems of poor fit and uneven grease injection caused by differences in device thickness, ensuring full contact of the heat dissipation interface and effectively improving heat dissipation efficiency. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0018] Figure 2 This is a schematic diagram of the overall structure of this utility model;
[0019] Figure 3 This is an exploded structural diagram of the entire utility model;
[0020] Figure 4 This is an exploded view of the regulating and distributing component of this utility model;
[0021] Figure 5 This is a schematic diagram of the structure of the silicone grease dispensing assembly of this utility model;
[0022] Figure 6 This is an exploded structural diagram of the guide plate of this utility model.
[0023] In the diagram: 1. Main aluminum plate; 2. Heat dissipation fins; 3. Heat pipes; 4. Guide grooves; 5. Filler grooves; 6. Conical teeth;
[0024] 7. Adjustment and distribution components; 71. Adjustment pressure plate; 72. Guide slider; 73. One-way locking teeth; 74. Grease injection channel; 75. Main conveying channel;
[0025] 76. Thermal grease dispensing assembly; 761. Base; 762. Grease injection pipe; 763. Diverter hole; 764. Guide plate; 765. Limiting block; 766. Sliding baffle; 767. Trigger block; 768. Top grease injection hole; 769. Through hole;
[0026] 8. Mounting bracket. Detailed Implementation
[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0028] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0029] Please see Figures 1-6 This utility model provides a technical solution:
[0030] An embedded heat dissipation aluminum plate structure for electronic devices includes a main aluminum plate 1, the vertical projection of which is circular. Multiple heat dissipation fins 2 arranged in a circular array are fixed inside the main aluminum plate 1. Heat conduction pipes 3 are fixed inside the heat dissipation fins 2. The inner wall of the heat conduction pipes 3 has guide grooves 4 and linearly arranged filling grooves 5. Multiple linearly arranged conical teeth 6 are fixed inside the guide grooves 4. An adjustment and distribution assembly 7 is installed inside the heat conduction pipes 3. Multiple mounting seats 8 arranged in a circular array are fixed at the top and bottom of the outer wall of the main aluminum plate 1. A countersunk hole is provided in the center of each mounting seat 8. The adjustment and distribution assembly 7 includes an adjustment pressure plate 71. A guide slider 72 is fixed to the outer wall of the adjustment pressure plate 71. A one-way locking tooth 73 is fixed to the front end of the guide slider 72. A grease injection channel 74 and a main delivery channel 75 are provided on the lower surface of the adjustment pressure plate 71. A silicone grease distribution assembly 76 is fixed to the inner side of the adjustment pressure plate 71.
[0031] Specifically, by adjusting the cooperation between the adjusting plate 71, guide slider 72, and one-way locking teeth 73 in the distribution component 7 and the guide groove 4 and conical teeth 6 on the inner wall of the heat pipe 3, the height position of the adjusting plate 71 can be flexibly adjusted according to the different thicknesses of the electronic device, ensuring that it fits tightly with the upper surface of the electronic device. This flexible adaptability solves the problem that traditional heat dissipation structures are difficult to fit well due to differences in the thickness of electronic devices, and greatly improves the versatility of the structure.
[0032] As a further implementation of this solution, the position of the guide slider 72 corresponds to the position of the guide groove 4, the guide slider 72 extends into the interior of the guide groove 4, and the one-way locking tooth 73 engages between two adjacent conical teeth 6.
[0033] Specifically, the one-way limiting effect of the unidirectional locking teeth 73 and the conical teeth 6 ensures that the adjusting plate 71 will not move upward after the position is adjusted, and always maintains a stable fit with the electronic equipment.
[0034] As a further implementation of this solution, the silicone grease dispensing assembly 76 includes a base 761, which is fixedly disposed at the bottom of the inner side of the grease injection channel 74. A grease injection connector 762 is fixedly disposed at the center of the upper surface of the base 761. A one-way valve is fixedly disposed on the inner side of the grease injection connector 762. The grease injection connector 762 extends above the regulating pressure plate 71. A diversion hole 763 is opened at the bottom of the grease injection connector 762. A guide plate 764 is fixedly disposed on the outer side of the base 761. The guide plate 764 is fixedly disposed at the bottom of the inner side of the main delivery channel 75, guiding the flow... Multiple symmetrically positioned limiting blocks 765 are fixed to the front end of the upper surface of plate 764. The front end of the limiting blocks 765 extends into the interior of the guide groove 4. The upper surface of the limiting blocks 765 is in contact with the top of the inner side of the main conveying channel 75 to ensure smooth flow of silicone grease. A sliding baffle 766 is slidably connected to the inner side of the guide plate 764. A trigger block 767 is fixed to the front end of the sliding baffle 766. The upper surface of the trigger block 767 is flush with the upper surface of the limiting blocks 765. The trigger block 767 is locked at the rear end of the two limiting blocks 765.
[0035] Specifically, the thermal grease distribution component 76 is designed to achieve uniform distribution of thermal grease. The main delivery channel 75 first temporarily stores the thermal grease. When the pressure reaches a certain level, the trigger block 767 is released from the constraint of the limit block 765, which drives the sliding baffle 766 to move. This allows the thermal grease to be delivered to the filling groove 5 through the guide groove 4, and to fill the contact area between the top of the electronic device and the regulating pressure plate 71 through the aligned top injection hole 768 and through hole 769. This multi-directional filling method effectively avoids the local accumulation and air gap problems that are easy to occur in traditional grease injection methods, allowing the thermal grease to fully cover the contact area between the electronic device and the heat dissipation structure, and significantly improving the uniformity of filling.
[0036] As a further implementation of this solution, the upper surface of the guide plate 764 is flush with the upper surface of the sliding baffle 766. The middle of the inner side of the guide plate 764 is provided with linearly arranged top grease injection holes 768, and the middle of the inner side of the sliding baffle 766 is provided with linearly arranged through holes 769. The number of through holes 769 is the same as the number of top grease injection holes 768. This design ensures that the two fit tightly, avoids the accumulation of silicone grease in the gap, and the same number of holes can be precisely aligned to ensure that the silicone grease is efficiently delivered to the top contact part of the electronic device.
[0037] Workflow: The electronic device is inserted into the internal cavity of the heat pipe 3 from the bottom, so that the outer wall of the electronic device initially contacts the inner wall of the heat pipe 3. The operator pushes the adjusting plate 71 in the adjusting and distributing assembly 7 downward. During this process, the guide slider 72 on the outer wall of the adjusting plate 71 slides along the guide groove 4 on the inner wall of the heat pipe 3 to ensure the stability of the movement. The one-way locking teeth 73 at the front end of the guide slider 72 engages and slides with the conical teeth 6 arranged linearly on the inner side of the guide groove 4. By utilizing the one-way limiting characteristics of the two, it is ensured that the adjusting plate 71 can only move downward until the lower surface of the adjusting plate 71 is completely in contact with the upper surface of the electronic device.
[0038] Using a syringe filled with thermal grease, connect the grease injection tube 762 in the grease dispensing assembly 76 to inject grease into the body. The grease flows through the one-way valve inside the grease injection tube 762, through the diversion hole 763 at the bottom of the grease injection tube 762 into the grease injection channel 74 on the lower surface of the regulating plate 71, and then enters the main delivery channel 75.
[0039] In the initial state, the sliding baffle 766 on the guide plate 764 inside the main delivery channel 75 is engaged with the limiting block 765 on the front end of the upper surface of the guide plate 764 via the trigger block 767 at the front end. At this time, the through hole 769 on the sliding baffle 766 is misaligned with the top grease injection hole 768 on the guide plate 764, and the top grease injection hole 768 is blocked, so the silicone grease accumulates in the main delivery channel 75. When the main delivery channel 75 is completely filled with silicone grease, the pressure increases, and the trigger block 767 disengages from the limiting block 765. The constraint of 65 pushes forward, causing the sliding baffle 766 to slide along the inner side of the guide plate 764. After the trigger block 767 and the limit block 765 are misaligned, the silicone grease flows into the guide groove 4 through the gap between them and is transported to the filling groove 5 along the guide groove 4, covering the contact area between the outer side of the electronic device and the heat pipe 3. At the same time, the sliding baffle 766 slides to align the through hole 769 with the top grease injection hole 768, and the silicone grease fills the contact area between the top of the electronic device and the adjusting pressure plate 71 through these holes.
[0040] The heat generated by the electronic device is transferred to the heat pipe 3 via thermal grease, and then conducted to the heat dissipation fins 2 to dissipate. The mounting base 8 on the top of the main aluminum plate 1 is used to connect and fix the external cooling fan to enhance heat dissipation. The mounting base 8 at the bottom of the main aluminum plate 1 is used to connect and fix to the surface of the external support frame. A certain gap must be maintained during installation to allow space for airflow, thereby achieving a stable installation of the entire structure.
[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An electronic device embedded heat dissipation aluminum plate structure, comprising a main body aluminum plate (1), characterized in that: The main aluminum plate (1) has multiple heat dissipation fins (2) arranged in a circular array fixed inside. The heat dissipation fins (2) have heat pipes (3) fixed inside. The inner wall of the heat pipes (3) has guide grooves (4) and filling grooves (5) arranged in a linear pattern. The inner side of the guide grooves (4) has multiple conical teeth (6) arranged in a linear pattern. The heat pipes (3) have adjustment and distribution components (7) installed inside. The adjustment and distribution assembly (7) includes an adjustment plate (71), a guide slider (72) is fixed on the outer wall of the adjustment plate (71), a one-way locking tooth (73) is fixed at the front end of the guide slider (72), a grease injection channel (74) and a main delivery channel (75) are opened on the lower surface of the adjustment plate (71), and a silicone grease distribution assembly (76) is fixed on the inner side of the adjustment plate (71).
2. The electronic device embedded heat dissipation aluminum plate structure according to claim 1, characterized in that: The position of the guide slider (72) corresponds to the position of the guide groove (4), the guide slider (72) extends into the interior of the guide groove (4), and the one-way locking tooth (73) engages between two adjacent conical teeth (6).
3. The electronic device embedded heat dissipation aluminum plate structure of claim 1, wherein: The silicone grease dispensing assembly (76) includes a base (761), which is fixedly disposed at the bottom of the inner side of the grease injection channel (74). A grease injection connector (762) is fixed at the center of the upper surface of the base (761). A one-way valve is fixed on the inner side of the grease injection connector (762). The grease injection connector (762) extends above the regulating pressure plate (71). A diversion hole (763) is opened at the bottom of the grease injection connector (762). A guide plate (764) is fixed on the outer side of the base (761). The guide plate (764) is fixedly disposed at the bottom of the inner side of the main delivery channel (75). A plurality of left-right symmetrical limit blocks (765) are fixed at the front end of the upper surface of the guide plate (764). A sliding baffle (766) is slidably connected to the inner side of the guide plate (764). A trigger block (767) is fixed at the front end of the sliding baffle (766).
4. The embedded heat dissipation aluminum plate structure for electronic devices according to claim 3, characterized in that: The upper surface of the guide plate (764) is flush with the upper surface of the sliding baffle (766). The middle of the inner side of the guide plate (764) is provided with top grease injection holes (768) arranged in a linear pattern. The middle of the inner side of the sliding baffle (766) is provided with through holes (769) arranged in a linear pattern. The number of through holes (769) is the same as the number of top grease injection holes (768).
5. The embedded heat dissipation aluminum plate structure for electronic devices according to claim 3, characterized in that: The front end of the limiting block (765) extends into the interior of the guide groove (4), and the upper surface of the limiting block (765) is in contact with the top of the inner side of the main conveying channel (75).
6. The embedded heat dissipation aluminum plate structure for electronic devices according to claim 3, characterized in that: The upper surface of the trigger block (767) is flush with the upper surface of the limiting block (765), and the trigger block (767) is engaged at the rear end of the two limiting blocks (765).
7. The embedded heat dissipation aluminum plate structure for electronic devices according to claim 1, characterized in that: The top and bottom of the outer wall of the main aluminum plate (1) are fixed with multiple mounting seats (8) arranged in a circular array, and the mounting seats (8) have countersunk holes in the middle.