A solar cell and related electrical equipment

Abstract

This invention provides a solar cell and related electrical equipment that solves the problem of microcracks or localized peeling of the electrode layer in existing solar cells. The solar cell includes a solar cell body, an elastic encapsulation layer, an anti-adhesion layer, and a cover plate stacked sequentially. The solar cell body includes a first electrode layer, and the anti-adhesion layer is disposed on the side of the elastic encapsulation layer opposite to the first electrode layer and directly opposite it. By providing an anti-adhesion layer between the elastic encapsulation layer and the cover plate, and by placing the anti-adhesion layer on the side of the elastic encapsulation layer opposite to the electrode layer and directly opposite it, the elastic encapsulation layer can preferentially detach from the cover plate under all-directional stress when it cools and contracts. This helps to improve or avoid the problem of microcracks or localized peeling of the electrode layer under all-directional stress.

Description

Technical Field

[0001] This application belongs to the field of solar cell technology, and in particular relates to a solar cell and related electrical equipment. Background Technology

[0002] Solar cells, as a novel, inexpensive, and highly efficient photovoltaic technology, have attracted much attention in recent years. Perovskite possesses excellent properties such as long exciton lifetime, low defect concentration, high absorbance in the visible light region, and readily available raw materials, allowing it to be stacked with crystalline silicon cells to form tandem cells. Furthermore, with the widening of the perovskite bandgap, it has become possible to achieve thin films with varying degrees of transparency, giving wide-bandgap solar cells an unparalleled advantage in building-integrated photovoltaics (BIPV).

[0003] However, the stability of solar cells has always been a constraint on the commercial production of perovskite solar cells. The perovskite material used in the absorber layer of perovskite solar cells is extremely sensitive to moisture, making its structure unstable and prone to irreversible degradation. Therefore, isolating moisture is crucial for cell fabrication, and a good encapsulation method can effectively protect the solar cell and increase its lifespan.

[0004] Existing encapsulation technologies for solar cells use a laminator to press solar cells, polyolefin elastomer (POE) film, and tempered cover glass into a rigid assembly under high temperature and vacuum conditions. The specific process involves placing the pre-assembled module into the laminator and applying pressure and temperature; after lamination, the panel is removed. POE undergoes high-temperature (>100℃) lamination followed by cooling and curing, but this can easily lead to microcracks or localized delamination in the electrode layer, resulting in increased device resistance, efficiency degradation, and unsatisfactory stability. To address this issue, related technologies typically involve modifying the POE material, optimizing the electrode structure, or implementing gradient cooling control; however, these methods suffer from high costs or reduced production efficiency. Utility Model Content

[0005] This invention provides a solar cell and related electrical equipment, aiming to solve the technical problem of existing solar cells having microcracks or local peeling of the electrode layer.

[0006] In a first aspect, embodiments of the present invention provide a solar cell, comprising: a solar cell body, an elastic encapsulation layer, an anti-adhesion layer, and a cover plate stacked sequentially; wherein, the solar cell body includes a first electrode layer, and the anti-adhesion layer is disposed on the side of the elastic encapsulation layer opposite to the first electrode layer and is disposed directly opposite to the first electrode layer.

[0007] In some embodiments of this application, the elastic encapsulation layer includes a first surface facing the cover plate, and a region on the first surface corresponding to the first electrode layer is defined as a de-adhesion region. The de-adhesion layer covers the de-adhesion region, and the de-adhesion region is located near the middle of the first surface.

[0008] In some embodiments of this application, the solar cell further includes a side seal for sealing the side of the solar cell body, and the average distance D between the edge of the anti-adhesion area and the inner surface of the side seal is 0.9cm-2cm.

[0009] In some embodiments of this application, the thickness of the anti-adhesion layer is 5nm-200nm;

[0010] And / or, the anti-tack layer includes a release agent layer.

[0011] In some embodiments of this application, the first electrode layer includes a transparent oxide electrode layer and a metal electrode layer stacked together, wherein the metal electrode layer has a grid structure.

[0012] In some embodiments of this application, the solar cell body includes at least one of a perovskite cell and a silicon cell, wherein the perovskite cell or the silicon cell includes the first electrode layer.

[0013] In some embodiments of this application, the solar cell body includes a perovskite cell and a silicon cell, which are stacked and connected in series.

[0014] In some embodiments of this application, the perovskite solar cell includes a second electrode layer, a hole transport layer, a perovskite absorption layer, an electron transport layer, and a first electrode layer, which are stacked sequentially.

[0015] In some embodiments of this application, the hole transport layer includes a first hole transport layer and a second hole transport layer stacked together; and / or

[0016] The perovskite solar cell further includes a passivation layer disposed between the electron transport layer and the perovskite absorber layer; and / or

[0017] The perovskite solar cell further includes a sputter damage protection layer disposed between the first electrode and the electron transport layer.

[0018] A second aspect of this application provides an electrical device, the electrical device including the aforementioned solar cell.

[0019] The beneficial effects of the embodiments of the present invention are as follows:

[0020] In this embodiment, an anti-adhesion layer is provided between the elastic encapsulation layer and the cover plate, and is located on the side of the elastic encapsulation layer away from the electrode layer and directly opposite the electrode layer. Thus, when the elastic encapsulation layer cools and shrinks, it can preferentially detach from the cover plate under all-directional stress. This helps to improve or avoid microcracks or localized peeling of the electrode layer under all-directional stress, thereby improving or avoiding the problems of increased device resistance, efficiency degradation, and unsatisfactory stability caused by microcracks or localized peeling of the electrode layer. Compared with related prior art, the technical solution in this application has a simple structure while improving the microcrack or localized peeling of the electrode layer, and has almost no impact on the efficiency, cost, and production efficiency of the solar cell. Attached Figure Description

[0021] To more clearly illustrate the solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the structure of one embodiment of the solar cell provided in this application.

[0023] Figure label:

[0024] 10. Cover plate; 20. Flexible encapsulation layer; 30. Anti-adhesion layer; 41. Hole transport layer; 411. First hole transport layer; 412. Second hole transport layer; 42. Perovskite absorption layer; 43. Passivation layer; 44. Electron transport layer; 45. Sputter damage protection layer; 46. First electrode layer; 461. Transparent oxide electrode layer; 462. Metal electrode layer; 463. Light-transmitting hole; 47. Second electrode layer; 50. Side seal; 60. Silicon cell. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present invention and are not intended to limit the present invention. In the present invention, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0026] Solar cells, as a novel, inexpensive, and highly efficient photovoltaic technology, have attracted much attention in recent years. Perovskite possesses excellent properties such as long exciton lifetime, low defect concentration, high absorbance in the visible light region, and readily available raw materials, allowing it to be stacked with crystalline silicon cells to form tandem cells. Furthermore, with the widening of the perovskite bandgap, it has become possible to achieve thin films with varying degrees of transparency, giving wide-bandgap solar cells an unparalleled advantage in building-integrated photovoltaics (BIPV).

[0027] However, the stability of solar cells has always been a constraint on the commercial production of perovskite solar cells. The perovskite material used in the absorber layer of perovskite solar cells is extremely sensitive to moisture, making its structure unstable and prone to irreversible degradation. Therefore, isolating moisture is crucial for cell fabrication, and a good encapsulation method can effectively protect the solar cell and increase its lifespan.

[0028] Existing encapsulation technologies for solar cells use a laminator to press solar cells, POE (polyolefin elastomer) film, and tempered cover glass into a rigid assembly under high temperature and vacuum conditions. Specifically, the pre-assembled module is placed in the laminator and subjected to pressure and temperature; after lamination, the solar panel (also called a solar cell) is removed. POE undergoes high-temperature (>100℃) lamination followed by cooling and curing, but this can easily lead to microcracks or localized delamination in the electrode layer, resulting in increased device resistance, efficiency degradation, and unsatisfactory stability. To address this issue, related technologies typically involve modifying the POE material, optimizing the electrode structure, or implementing gradient cooling control; however, these methods suffer from high costs or reduced production efficiency.

[0029] The inventors discovered through research that the main reason for microcracks or localized peeling of the electrode layer caused by the aforementioned encapsulation process is likely due to the significantly higher coefficient of thermal expansion (CTE) of the elastic encapsulation material (e.g., POE CTE≈300ppm / ℃) compared to the cover plate (e.g., tempered cover glass CTE≈9ppm / ℃) and the coefficient of thermal expansion of the electrode layer material (e.g., silver electrode CTE≈19ppm / ℃). During cooling and contraction, the solar panel generates anisotropic stress, which is transmitted to the POE film layer and the electrode layer in contact with it, leading to microcracks or localized peeling. To address this technical problem, related technologies generally involve developing new materials (e.g., modifying POE material) to better match the coefficients of thermal expansion of the encapsulation material, cover plate, and electrode materials, or reducing stress during the solar panel cooling process through stepped cooling. However, these methods may result in reduced device efficiency, higher costs, or reduced production efficiency.

[0030] In view of this, this application innovatively proposes a novel solar cell structure that reduces the stress generated during the cooling process of the solar cell by reducing the stress transfer to the electrode layer, thereby improving or avoiding the problem of microcracks or local detachment of the electrode layer during the cooling and shrinkage of the solar cell.

[0031] Specifically, please refer to Figure 1 , Figure 1 This is a schematic diagram of a solar cell according to an embodiment of the present application. The solar cell includes a solar cell, an elastic encapsulation layer 20, an anti-adhesion layer 30 and a cover plate 10 stacked in sequence. The solar cell includes an electrode layer, and the anti-adhesion layer 30 is disposed on the side of the elastic encapsulation layer 20 away from the electrode layer and is disposed opposite to the electrode layer.

[0032] It should be noted that, in this application, the anti-adhesion layer 30 and the electrode layer are positioned opposite each other, meaning that the orthographic projection of the electrode layer on the cover plate 10 and the orthographic projection of the anti-adhesion layer 30 on the cover plate 10 at least partially overlap.

[0033] The solar cell in this application is mainly used to convert solar energy into electrical energy. The specific structure of the solar cell is not a major improvement of this application and is not limited here. For example, the solar cell includes a bottom electrode layer, a hole transport layer 41, a perovskite absorber layer 42, an electron transport layer 44 and a top electrode layer stacked in sequence.

[0034] The anti-adhesion layer 30 in this application is used to reduce the adhesion force at the interface between the elastic encapsulation layer 20 and the cover plate 10. The material and preparation process of the anti-adhesion layer 30 are described in detail later. The anti-adhesion layer 30 is disposed on the side of the elastic encapsulation layer 20 away from the electrode layer and is positioned directly opposite the electrode layer. That is, the electrode layer, the elastic encapsulation layer 20, the anti-adhesion layer 30, and the cover plate 10 are stacked sequentially. In this way, by providing the anti-adhesion layer 30 between the elastic encapsulation layer 20 and the cover plate 10, the adhesion force between the elastic encapsulation layer 20 and the cover plate 10 is reduced. This allows the elastic encapsulation layer 20 to preferentially detach from the cover plate 10 during the cooling and shrinking of the solar cell after high-temperature lamination and encapsulation, thereby improving or preventing the generation of microcracks or local detachment of the electrode layer during the cooling and shrinking process of the elastic encapsulation layer 20.

[0035] The cover plate 10 in this application is used to encapsulate and protect the solar cell therein. The specific structure of the cover plate 10 is not a major improvement of this application and is not limited thereto. For example, the cover plate 10 can be a tempered glass plate, which is not limited thereto.

[0036] In this embodiment, an anti-adhesion layer 30 is provided between the elastic encapsulation layer 20 and the cover plate 10, and is disposed on the side of the elastic encapsulation layer 20 away from the electrode layer and directly opposite the electrode layer. Thus, when the elastic encapsulation layer 20 cools and shrinks, it can preferentially detach from the cover plate 10 under all-directional stress. This helps to improve or avoid the formation of microcracks or localized peeling of the electrode layer under all-directional stress, thereby improving or avoiding the problems of increased device resistance, efficiency degradation, and unsatisfactory stability caused by microcracks or localized peeling of the electrode layer. Compared with related prior art, the technical solution in this application has a simple structure while improving the microcrack or localized peeling of the electrode layer, and has almost no impact on the efficiency, cost, and production efficiency of the solar cell.

[0037] In some embodiments of this application, the elastic encapsulation layer 20 includes a first surface facing the cover plate 10. A region on the first surface corresponding to the first electrode layer 46 is defined as a de-adhesion region. The de-adhesion layer 30 covers the de-adhesion region, which is located near the center of the first surface. Exemplarily, the de-adhesion layer 30 is located within or slightly larger than the de-adhesion region. Areas on the first surface not covered by the de-adhesion layer 30 are sealed to the cover plate 10. Alternatively, the de-adhesion layer 30 can be understood as avoiding areas on the first surface other than the de-adhesion region. Of course, in other embodiments of this application, the area covered by the de-adhesion layer 30 may be slightly smaller than the area of ​​the de-adhesion region, which is not limited here.

[0038] It should be noted that the area on the first surface corresponding to the first electrode layer 46 can be understood as the area on the first surface projected orthogonally onto the first electrode layer 46. In this embodiment, the anti-adhesion area is covered by an anti-adhesion layer 30. The anti-adhesion layer 30 is located within or slightly larger than the anti-adhesion area, and the anti-adhesion area is positioned near the center of the first surface. This helps to further reduce the stress transmitted to the electrode layer during the cooling process of the solar cell. Simultaneously, the anti-adhesion area is positioned near the center of the first surface, and the area on the first surface not covered by the anti-adhesion layer 30 is sealed to the cover plate 10. That is, the area on the first surface of the elastic encapsulation layer 20 not covered by the anti-adhesion layer 30 is sealed to the cover plate 10. This ensures that the elastic encapsulation layer 20 (e.g., POE adhesive layer) and the cover plate 10 in the non-active area at the edge of the solar cell have strong adhesion, enabling the solar cell to simultaneously exhibit good sealing and stress release performance, thereby improving the stability and damp heat stability of the solar cell.

[0039] For example, a mask plate can be provided on the first surface to define the position of the de-adhesion layer 30, so that the area covered by the de-adhesion layer 30 avoids the non-electrode area, thereby ensuring strong adhesion between the elastic encapsulation layer 20 (e.g., POE adhesive layer) and the cover plate 10 in the inactive area at the edge of the solar cell, so that the solar cell has better sealing performance and stress relief performance, thereby improving the stability and damp heat stability of the solar cell.

[0040] In some embodiments of this application, the solar cell further includes a side seal 50, which is used to seal the side of the solar cell body. The average distance D between the edge of the anti-adhesion region and the inner surface of the side seal 50 is 0.9cm-2cm. Further, the distance between any point on the edge of the anti-adhesion region and the inner surface of the side seal 50 is 0.9cm-2cm.

[0041] For example, the average distance D between the edge of the anti-adhesion area and the inner surface of the side seal 50 is 0.9cm, 1.0cm, 1.2cm, 1.4cm, 1.6cm, 1.8cm, 2cm, and any two of the above values.

[0042] For example, the side seal 50 is a sealing strip, such as a butyl rubber strip.

[0043] Understandably, if the average distance D between the edge of the anti-adhesion area and the inner surface of the side seal 50 is less than 0.9 cm, it can easily lead to a narrow seal width at the edge, making the edge prone to cracking and causing the solar cell to be corroded by water and oxygen. If the average distance D between the edge of the anti-adhesion area and the inner surface of the side seal 50 is greater than 2.0 cm, it can easily lead to a larger solar cell size, a less compact structure, and higher material costs.

[0044] In some embodiments of this application, the thickness of the anti-adhesion layer 30 is 5 nm-200 nm. It should be noted that the thickness of the anti-adhesion layer 30 refers to its dimension in the solar cell stacking direction. Exemplarily, the thickness of the anti-adhesion layer 30 can be measured using an ellipsometry or a profilometer.

[0045] For example, the thickness of the anti-adhesion layer 30 is 5nm, 10nm, 50nm, 100nm, 150nm, 200nm, or any two of the above values.

[0046] In some embodiments of this application, the anti-adhesion layer 30 includes a release agent layer. Exemplarily, a release agent layer can be formed by spraying a release agent onto the anti-adhesion area. In this embodiment, the release agent is directly sprayed onto the inner surface of the laminated cover plate 10 (the side in contact with the elastic encapsulation layer 20). By covering the anti-adhesion area of ​​the elastic encapsulation layer 20 with the release agent layer, the adhesion force of the elastic encapsulation layer 20 at the interface between the anti-adhesion area and the cover plate 10 is reduced. When the elastic encapsulation layer 20 cools and shrinks, it preferentially undergoes microscopic slippage at the interface of the cover plate 10 in the anti-adhesion area, blocking the transmission of stress to the electrode layer, thereby improving or preventing the generation of microcracks or localized peeling of the electrode layer under anisotropic stress.

[0047] Specifically, in the fabrication of the solar cell in this application, taking the cover plate 10 as a glass cover plate 10 as an example, the release agent is placed on the glass cover plate 10 at the position corresponding to the anti-adhesion layer 30. For example, the release agent is applied to the glass cover plate 10 by spraying. The light transmittance of the glass cover plate 10 with the release agent is greater than 88%. Spraying the release agent on the glass cover plate 10 hardly affects the light transmittance of the glass cover plate 10, and can make the elastic encapsulation layer 20 preferentially detach from the cover plate 10 under the action of anisotropic stress during the cooling process of the solar cell, thereby improving or avoiding the problem of microcracks or local detachment of the electrode layer, which is beneficial to improving the stability of the device and the encapsulation yield. In addition, this solution does not require changes to the lamination equipment and related processes, which is beneficial to reducing the fabrication cost.

[0048] For example, the mold release agent layer can be at least one of oil-based mold release machines, silicone mold release machines, fluororesins, fluorosilanes, etc. Taking fluororesins as an example, the material used to prepare the mold release agent layer can be at least one of polytetrafluoroethylene, polychlorotrifluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, perfluoroalkoxy fluorinated resin, polyvinylidene fluoride, ethylene-tetrafluoroethylene copolymer, ethylene-chlorotrifluoroethylene copolymer, polyvinylidene fluoride, etc.

[0049] In some other embodiments of this application, the anti-adhesion layer 30 may also be a boron nitride coating, which is not limited here.

[0050] In some embodiments of this application, the first electrode layer 46 includes a transparent oxide electrode layer 461 and a metal electrode layer 462 stacked together. The metal electrode layer 462 has a grid structure, that is, it includes light-transmitting holes 463. In this way, the first electrode layer 46 can have a low sheet resistance and a high light transmittance.

[0051] Understandably, a single transparent oxide electrode layer 461 has a large sheet resistance, hindering carrier transport. A single metal electrode has high light reflectivity and poor light transmittance, preventing light from reaching the light absorption layer and generating electrons. In this application, a composite electrode is prepared using a transparent oxide electrode layer 461 and a metal electrode layer 462, which allows the first electrode layer 46 to have a lower sheet resistance. Simultaneously, the metal electrode layer 462 has a grid structure, which helps increase light transmittance. Therefore, the first electrode layer 46 in this application simultaneously has both low sheet resistance and high light transmittance.

[0052] For example, the material of the transparent oxide electrode layer 461 includes at least one of indium tin oxide (ITO) and indium zinc oxide (IZO).

[0053] In some embodiments of this application, the solar cell body includes at least one of a perovskite cell and a silicon cell 60, wherein the perovskite cell or the silicon cell 60 includes a first electrode layer 46. For example, the solar cell body may only include a perovskite cell. Alternatively, the solar cell body may only include a silicon cell 60. Yet another example is a solar cell body that includes both perovskite and silicon cells 60. Of course, the solar cell body in this application may also include other cells capable of photoelectric conversion, which are not limited here.

[0054] In some embodiments of this application, the solar cell body includes a perovskite cell and a silicon cell 60, which are stacked and connected in series. In this example, the perovskite cell and the silicon cell 60 are stacked and connected in series to prepare a perovskite-crystalline silicon tandem cell. Through the synergistic absorption of the spectra of the perovskite cell (e.g., located on top) and the silicon cell 60, a theoretical efficiency of over 40% can be achieved.

[0055] For example, the perovskite solar cell and the silicon solar cell 60 are electrically connected through an intermediate interconnect layer. For instance, the intermediate interconnect layer can be a transparent oxide conductive layer. Further, the transparent oxide conductive layer can be made of one or a combination of indium tin oxide (ITO) and indium zinc oxide (IZO).

[0056] For example, perovskite solar cells can be integrally formed onto silicon solar cells 60 using an in-situ vapor deposition wet coating process.

[0057] In some embodiments of this application, the perovskite solar cell includes a second electrode layer 47, a hole transport layer 41, a perovskite absorber layer 42, an electron transport layer 44, and a first electrode layer 46, which are sequentially stacked. This simplifies the structure of the solar cell, making the solar cell in this application simpler and more compact. It should be noted that the specific structural configuration of the perovskite solar cell is not a major improvement of this application and is not limited thereto.

[0058] Specifically, a transparent oxide electrode layer 461 is deposited on the N-side microcrystalline silicon (i.e., the negative electrode side of the silicon cell 60) of the silicon cell 60 substrate as a second electrode layer 47 (also called an intermediate connection layer). For example, the thickness of the second electrode layer 47 is 10nm-50nm. For example, the second electrode layer 47 is an ITO layer, or an IZO layer, or an ITO / IZO composite layer.

[0059] In some embodiments of this application, the hole transport layer 41 includes a first hole transport layer 411 and a second hole transport layer 412 stacked together. This is beneficial for improving the energy level matching between the hole transport layer 41 and the perovskite layer, thereby increasing the photoelectric conversion efficiency. It should be noted that the structure and fabrication materials of the first hole transport layer 411 and the second hole transport layer 412 are not the main improvements of this application and are not limited thereto.

[0060] For example, nickel oxide is sputtered onto the second electrode layer 47 using magnetron sputtering to form a first hole transport layer 411. Further, the thickness of the first hole transport layer 411 is 10 nm-20 nm.

[0061] For example, a second hole transport layer 412 is prepared on a first hole transport layer 411 by spin coating. The material selected for the second hole transport layer 412 is one or a combination of (4-(7H-dibenzo[C,G]carbazole-7-yl)butyl)phosphonic acid (4PADCB), [2-(dimethoxy-9-9-yl)ethyl]phosphonic acid (MeO-2PACz), and (2-(9H-carbazole-9-yl)ethyl)phosphonic acid (2PACz). The solvent is isopropanol, the concentration of the solution is 0.5 mg / ml-2 mg / ml, the spin coater speed is set to 4000 rpm, the spin coating time is 30 s, and a second hole transport layer 412 with a thickness of 2 nm-10 nm is obtained by spin coating.

[0062] For example, a perovskite light-absorbing layer is prepared on the hole transport layer 41 by spin coating. First, a perovskite precursor solution is prepared. Specifically, the raw materials for the perovskite absorber layer 42, such as cesium iodide (CsI), formamidine iodide (FAI), lead iodide (PbI2), and lead bromide (PbBr2), are prepared in a molar ratio. A mixed solvent of N,N-dimethylformamide (DMF) and dimethyl sulfoxide (DMSO) in a volume ratio of 4:1 is added. Then, the mixture is placed on a magnetic stirrer and stirred for 3-5 hours to completely dissolve the perovskite precursor solution.

[0063] For example, the spin coater is set to a speed of 3500 rpm and a spin coating time of 38 s. The completely dissolved perovskite solution is spin-coated onto the hole transport layer 41. After spin coating, it is placed in a vacuum flash evaporation box and evacuated to 4 Pa-6 Pa within 3 s and held for 10 s-25 s. Then it is placed on a hot stage at 100°C and heated for 15 min-25 min for annealing and crystallization, with a thickness of 500 nm-600 nm.

[0064] In some embodiments of this application, the perovskite solar cell further includes a passivation layer 43, which is disposed between the electron transport layer 44 and the perovskite absorber layer 42. In this embodiment, by providing a passivation layer 43 between the electron transport layer 44 and the perovskite absorber layer 42, the passivation layer 43 can passivate defects in the perovskite absorber layer 42, which is beneficial for improving the photoelectric conversion efficiency of the perovskite solar cell. It should be noted that the structure and materials used to prepare the passivation layer 43 are not the main improvements of this application and are not limited thereto.

[0065] For example, a passivation layer 43 is prepared on a perovskite light-absorbing layer by spin coating. For instance, the passivation layer 43 is a mixture of phenylethylamine iodide (PEAI) and ethylenediamine dihydroiodide (EDAI2) as the material, isopropanol as the solvent, and the solution concentration is 0.5 mg / ml-2.5 mg / ml. The spin coater is set to a speed of 4000 rpm and the spin coating time is 30 s, resulting in a passivation layer 43 with a thickness of 2 nm-10 nm.

[0066] For example, an electron transport layer 44 with a thickness of 10nm-20nm is prepared on the passivation layer 43 by organic vapor deposition, and the material of the electron transport layer 44 is fullerene C60.

[0067] In some embodiments of this application, the perovskite solar cell further includes a sputter damage protection layer 45, which is disposed between the first electrode and the electron transport layer 44. This helps protect the perovskite absorber layer 42 from high-energy particle sputtering damage and chemical corrosion, contributing to improved cell stability and durability, and also optimizing its photoelectric conversion efficiency to some extent. It should be noted that the structure and materials used to prepare the sputter damage protection layer 45 are not considered major improvements in this application and are not limited thereto.

[0068] For example, using atomic deposition technology, a tin oxide film with a thickness of 15nm-20nm is deposited on the electron transport layer 44 as a sputter damage protection layer 45.

[0069] In some embodiments of this application, the first electrode layer 46 includes a transparent oxide electrode layer 461 and a metal electrode layer 462 stacked together. Specifically, a transparent oxide electrode layer 461 is sputtered onto the surface of the anti-sputtering damage layer 45 by magnetron sputtering. The transparent oxide electrode layer 461 is any one of ITO, IZO, or an ITO / IZO composite layer. Further, the thickness of the transparent oxide electrode layer 461 is 60nm-120nm. A layer of silver grid lines with a thickness of 100nm-200nm is deposited on the surface of the transparent oxide electrode by vapor deposition as the metal electrode layer 462, thus obtaining a perovskite-crystalline silicon tandem solar cell.

[0070] In some embodiments of this application, the cover plate 10 is any one of a glass cover plate 10, a fiberglass board, a copper-coated ceramic (CPC), and polyvinylidene fluoride (PVDF). Exemplarily, the thickness of the cover plate 10 is 2mm-3mm.

[0071] Specifically, the cover plate 10 is treated with ultraviolet ozone before encapsulation, and the ozone treatment time is 10-20 minutes.

[0072] The second aspect of this application also provides a method for preparing a solar cell, which is described below. Figure 1 The method for fabricating a solar cell is shown. It should be noted that this method is only an example and should not be construed as [a complete or generalized approach]. Figure 1 The method shown is the only one for preparing solar cells.

[0073] Specifically, the preparation method includes the following steps:

[0074] S1 provides a silicon solar cell 60, and then deposits a transparent oxide conductive electrode as a second electrode layer 47 on the N-side microcrystalline silicon (i.e., the side where the negative electrode of the silicon solar cell 60 is located) as a second electrode layer 47 (which can also be understood as an intermediate connection layer, realizing the electrical connection between the silicon solar cell 60 and the perovskite solar cell on it). The transparent oxide conductive electrode is at least one of indium tin oxide (ITO) and indium zinc oxide (IZO). It should be noted that the specific structure of the silicon solar cell 60 is not a major improvement of this application and will not be described again.

[0075] For example, the transparent oxide conductive electrode is indium tin oxide (ITO). Another example is indium zinc oxide (IZO). Yet another example is a combination of indium tin oxide (ITO) and indium zinc oxide (IZO).

[0076] S2 prepares a hole transport layer 41 on the second electrode. Exemplarily, the hole transport layer 41 includes a first hole transport layer 411 and a second hole transport layer 412. Specifically, a layer of nickel oxide (NiOx) is sputtered onto the intermediate interconnect layer using magnetron sputtering as the first hole transport layer 411. The second hole transport layer 412 is then prepared on the first hole transport layer 411. Exemplarily, a material containing a phosphate group structure is spin-coated onto the first hole transport layer 411, and then annealed and crystallized to form the second hole transport layer 412.

[0077] S3. A perovskite absorber layer 42 is prepared on the hole transport layer 41. Exemplarily, after coating the hole transport layer 41 to form a perovskite absorber layer, the solvent is removed by flash evaporation, and the film is annealed to crystallize and form the perovskite absorber layer 42. It should be noted that the material of the perovskite absorber layer 42 is not a major improvement of this application and is not limited thereto.

[0078] S4 prepares a passivation layer 43 on the perovskite absorber layer 42. Exemplarily, a material containing amine groups and benzene ring structures is spin-coated onto the perovskite film to form the passivation layer 43.

[0079] S5. An electron transport layer 44 is prepared on the passivation layer 43. Exemplarily, the electron transport layer 44 is prepared on the passivation layer 43 by organic vapor deposition.

[0080] S6. A sputter damage resistant layer 45 is prepared on the electron transport layer 44. Exemplarily, the magnetron sputter damage resistant layer is prepared on the electron transport layer 44 by atomic deposition (ALD).

[0081] S7. A first electrode layer 46 is fabricated on the anti-sputtering damage layer 45. Exemplarily, a transparent oxide electrode layer 461 is fabricated on the anti-magnetron sputtering damage layer by magnetron sputtering technology, and then a metal conductive electrode is fabricated on the transparent oxide electrode layer 461 by vapor deposition. The electrode is designed as a metal grid line to obtain a perovskite-silicon tandem battery.

[0082] S8 employs a lamination encapsulation process to package a perovskite-silicon tandem solar cell. Specifically, the surface of the glass cover plate 10 is cleaned with ultraviolet ozone, a release agent is sprayed onto a predetermined area on the surface of the glass cover plate 10 and cured by annealing to form a uniform film layer, and then the cells are stacked in the following order: glass cover plate 10 (also called front cover plate 10, with the release agent side facing the POE film or the first electrode layer 46 of the perovskite cell) → POE film → perovskite-crystalline silicon tandem solar cell → POE film → glass cover plate 10 (also called back cover plate 10, with the release agent side facing the first electrode layer 46 of the silicon cell 60), and butyl rubber (i.e., side seal 50) is filled into the pre-reserved gaps at the edges. The stacked devices are then vacuum-laminated using a laminator, and after cooling and stress release, the solar cell of this application is obtained.

[0083] Specifically, before the devices are stacked, the cover plate 10 (including the front cover plate 10 and the back cover plate 10) is treated with ultraviolet ozone for 10-20 minutes.

[0084] Specifically, a mask with cutouts in the electrode active area is placed on the front and rear cover plates 10, and a release agent is sprayed on it. The material of the release agent layer can be any high-temperature resistant release material, such as fluororesin, fluorosilane, boron nitride coating, etc. After spraying, it is placed on a hot plate at 100℃-150℃ for curing to obtain a release agent layer with a thickness of 5nm-200nm. The thickness of the release agent layer can be measured by an ellipsometry or a step meter.

[0085] Specifically, a POE film is pasted onto the back cover plate 10 (containing a release agent), and the thickness of the POE film is 0.3mm-2.5mm.

[0086] Specifically, butyl rubber strips with a width of 0.1cm-0.5cm are pasted on the edge of the back cover plate 10 (containing release agent).

[0087] Specifically, a perovskite-silicon tandem solar cell is placed on a back cover plate 10 (containing a release agent) with a POE film adhered to it. Another POE film is then adhered to this back cover plate, and a front cover plate 10 (containing a release agent) is placed over the POE film. The solar cell is then vacuum-laminated at a temperature of 90℃-150℃, a lamination pressure of 0.05MPa-0.1MPa, and a lamination time of 10min-30min. After lamination, a gradient cooling process is performed: cooling to room temperature at a rate of 3℃ / min-10℃ / min to reduce thermal stress.

[0088] A third aspect of this application also provides an electrical device, which includes a solar cell. Exemplarily, the electrical device includes a photovoltaic power generation system, a solar water heater, a solar street light, a rooftop photovoltaic system, a surveillance camera, a remote control, etc. It is understood that since the electrical device in this application includes the aforementioned solar cell, it should also have the relevant beneficial effects of the aforementioned solar cell, which will not be elaborated upon here.

[0089] The embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A solar cell, characterized by, include: A solar cell body, an elastic encapsulation layer, an anti-adhesion layer, and a cover plate are stacked in sequence; wherein, the solar cell body includes a first electrode layer, and the anti-adhesion layer is disposed on the side of the elastic encapsulation layer opposite to the first electrode layer and is disposed directly opposite to the first electrode layer.

2. The solar cell of claim 1, wherein, The elastic encapsulation layer includes a first surface facing the cover plate, and a region on the first surface corresponding to the first electrode layer is defined as a non-adhesive region. The non-adhesive layer covers the non-adhesive region, and the non-adhesive region is located near the middle of the first surface.

3. The solar cell of claim 2, wherein the first and second doped regions are formed by implanting dopants into the first and second surfaces of the substrate. The solar cell also includes a side seal for sealing the side of the solar cell body, and the average distance D between the edge of the anti-adhesion area and the inner surface of the side seal is 0.9cm-2cm.

4. The solar cell of claim 1, wherein the first and second electrodes are formed of a material selected from the group consisting of silver, aluminum, gold, copper, and combinations thereof. The thickness of the anti-adhesion layer is 5nm-200nm; And / or, the anti-tack layer includes a release agent layer.

5. The solar cell as described in claim 1, characterized in that, The first electrode layer includes a transparent oxide electrode layer and a metal electrode layer stacked together, wherein the metal electrode layer has a grid structure.

6. The solar cell according to any one of claims 1 to 5, characterized in that, The solar cell body includes at least one of perovskite cell and silicon cell, wherein the perovskite cell or the silicon cell includes the first electrode layer.

7. The solar cell according to claim 6, characterized in that, The solar cell body includes a perovskite cell and a silicon cell, which are stacked and connected in series.

8. The solar cell of claim 6, wherein, The perovskite solar cell includes a second electrode layer, a hole transport layer, a perovskite absorption layer, an electron transport layer, and a first electrode layer, which are stacked sequentially.

9. The solar cell of claim 8, wherein the first and second doped regions are formed by implanting dopants into the first and second surfaces of the substrate. The hole transport layer includes a first hole transport layer and a second hole transport layer stacked together; and / or The perovskite solar cell further includes a passivation layer, which is disposed between the electron transport layer and the perovskite absorption layer; and / or The perovskite solar cell further includes a sputter damage protection layer disposed between the first electrode and the electron transport layer.

10. An electrical device, comprising: The electrical equipment includes the solar cell as described in any one of claims 1 to 9.

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