Semiconductor narrow channel cooling disc

Abstract

The utility model relates to a technical field of semiconductor cooling disc device, concretely relates to a semiconductor narrow channel cooling disc, including bottom disc and placing disc, the bottom disc includes bottom ring and through disc, and the through disc is fixed in the bottom end of bottom ring through the lateral plate of outside, the middle part of bottom ring is fixed with the spoiler assembly, the spoiler assembly includes the fixed ring and the spoiler plate fixed in the inside and outside of fixed ring, the inside of spoiler assembly is fixed with multiple groups of vertical board, the top end of bottom ring is fixed with multiple groups of horizontal plate, the top end of bottom ring is fixed with placing disc, and the placing disc includes the erection ring and the buckle ring fixed to its top end, the middle part of erection ring is equipped with the thread groove, improves the temperature uniformity of coolant, and the fixed ring and spoiler plate are impacted when the cooling medium flows in the bottom disc, so this can disturb the flow in the cooling medium, avoids certain cooling medium in it stationary phenomenon, thereby can improve the temperature uniformity of cooling medium, improves the uniformity of low temperature test wafer temperature, improves the cooling effect.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor cooling plate devices, and specifically to a semiconductor narrow channel cooling plate. Background Technology

[0002] During wafer epitaxial growth, the wafer reaches a high temperature after the epitaxial process, necessitating cooling before output. Currently, there are two methods for cooling wafers: air cooling and water cooling. The cooling process involves placing the wafer on a cooling pad, where heat is removed from the wafer surface through heat exchange. Both air and water cooling utilize channels pre-installed in the cooling pad for heat exchange. With increasing demands for uniformity and heat transfer efficiency in the cooling pads, the channels have become increasingly narrow and dense, placing higher requirements on the manufacturing of these cooling pads.

[0003] Currently, in the industry, vacuum brazing of narrow channels with a width of 3mm or less often results in solder buildup and blockage of the channels, leading to poor cooling and requiring rework. However, rework in narrow channels is difficult and the results are often unsatisfactory. Therefore, a new technical solution is urgently needed to address at least one of these problems. Utility Model Content

[0004] Technical problems to be solved

[0005] In view of the above-mentioned shortcomings of the prior art, the present invention provides a semiconductor narrow channel cooling plate, which can effectively solve the problems in the prior art.

[0006] Technical solution

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] This utility model provides a semiconductor narrow channel cooling tray, including a base and a placement tray. The base includes a bottom ring and a through plate. The through plate is fixed to the bottom end of the bottom ring by an outer side plate. A baffle assembly is fixed in the middle of the bottom ring. The baffle assembly includes a fixing ring and baffle plates fixed inside and outside the fixing ring. Multiple sets of vertical plates are fixed inside the baffle assembly. Multiple sets of horizontal plates are fixed at the top of the bottom ring. The placement tray is fixed at the top of the bottom ring. The placement tray includes a support ring and a buckle fixed at its top. A threaded groove is formed in the middle of the support ring, and a groove is formed on the inner side of the bottom end of the support ring.

[0009] Furthermore, two sets of grooves are symmetrically opened in the middle of the inner side of the fixing ring, and the fixing ring is a semi-circular ring structure. The fixing ring is fixed in one side of the groove, and the cross-section of the spoiler is "S" shaped.

[0010] Furthermore, a positioning groove is formed on the outer side of the bottom ring, and a positioning hole is formed through the middle of the positioning groove. A pin is fixed at the bottom end of the mounting ring, and the pin is inserted and fixed in the positioning hole.

[0011] Furthermore, the side plates are fixed in an equidistant array on the outside of the through ring, and each group of side plates is a right-angled trapezoidal structure with a smaller top and a larger bottom, and the cross-section of the threaded groove is a trapezoidal structure with a smaller top and a larger bottom.

[0012] Furthermore, the buckle has an L-shaped cross-section with its top end bent towards the center.

[0013] Furthermore, there are gaps between the multiple sets of horizontal plates, and the size of these gaps is the same as that between the vertical plates.

[0014] Beneficial effects

[0015] The technical solution provided by this utility model has the following advantages compared with the known public technology:

[0016] This invention utilizes a chassis structure, including a bottom ring and a through-plate structure. Users can connect these two components via bottom side plates, and then assemble the vertical and horizontal plates. When the cooling medium enters from the bottom, it is first diverted through the channels between the horizontal plates, and then vertically diverted through the top vertical plate structure. The baffles on both sides are fixedly connected via fixing rings. The baffle structure, with its S-shaped design, enhances the turbulence effect and improves the temperature uniformity of the coolant. As the cooling medium flows within the chassis, it impacts the fixing rings and baffles, thus disturbing its flow and preventing some coolant from remaining stationary. This improves the temperature uniformity of the cooling medium, enhances the temperature uniformity of the wafer during low-temperature testing, and improves the cooling effect.

[0017] In this device, the buckle structure can be fixed to the bottom ring by the mounting ring, and the pin structure can be fixed and locked with the positioning groove to achieve fixation. The spiral threaded groove structure opened in the mounting ring, through its specific structure of small top and large bottom, accelerates the cooling medium from the bottom, increases the contact force with the wafer at the top, and thus expands the bottom area covering the wafer. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is an exploded view of the structure of this utility model;

[0021] Figure 3 This is an exploded view of the structure of this utility model;

[0022] Figure 4 This is an exploded view of the bottom ring and the disc of this utility model.

[0023] Figure 5 for Figure 4 A schematic diagram of the structure at point A in the middle.

[0024] The labels in the diagram represent: 1. Chassis; 11. Bottom ring; 111. Positioning groove; 112. Positioning hole; 12. Through plate; 121. Through ring; 122. Side plate; 13. Horizontal plate; 14. Vertical plate; 2. Placement plate; 21. Erection ring; 211. Pin; 22. Buckle; 23. Threaded groove; 3. Spoiler assembly; 31. Fixing ring; 32. Spoiler plate. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0026] The present invention will be further described below with reference to the embodiments.

[0027] Example: A semiconductor narrow-channel cooling pad, see attached figure. Figure 1 - Appendix Figure 5 The device includes a chassis 1 and a placement tray 2. The chassis 1 includes a bottom ring 11 and a through plate 12. The through plate 12 is fixed to the bottom end of the bottom ring 11 by an outer side plate 122. A turbulence component 3 is fixed in the middle of the bottom ring 11. The turbulence component 3 includes a fixing ring 31 and turbulence plates 32 fixed inside and outside the fixing ring 31. Multiple sets of vertical plates 14 are fixed inside the turbulence component 3. Multiple sets of horizontal plates 13 are fixed at the top of the bottom ring 11. The placement tray 2 is fixed at the top of the bottom ring 11. The placement tray 2 includes a support ring 21 and a buckle 22 fixed at its top. A threaded groove 23 is opened in the middle of the support ring 21. A groove is opened on the inner side of the bottom end of the support ring 21.

[0028] The fixing ring 31 has two sets of grooves symmetrically opened in the middle of its inner side, and the fixing ring 31 has a semi-circular ring structure. The fixing ring 31 is fixed in one side of the groove, and the cross-section of the baffle 32 is "S" shaped.

[0029] A positioning groove 111 is formed on the outer side of the bottom ring 11, and a positioning hole 112 is formed through the center of the positioning groove 111. A pin 211 is fixed to the bottom end of the mounting ring 21, and the pin 211 is inserted and fixed in the positioning hole 112. Through the set chassis 1 structure, in which the bottom ring 11 and the through plate 12 structure are set, the user can combine and connect the two through the bottom side plate 122, and set up the vertical plate 14 and the horizontal plate 13. Therefore, when the cooling medium enters from the bottom, it can first be diverted through the groove between the horizontal plates 13. The flow is then vertically divided by the top vertical plate 14 structure. The baffles 32 on both sides can be fixedly connected by the fixing rings 31. The baffle 32 structure has an S-shaped structure, which can improve the turbulence effect and improve the temperature uniformity of the coolant. When the coolant flows in the chassis 1, it hits the fixing rings 31 and the baffles 32, which can disturb the flow of the coolant and prevent some coolant from remaining stationary. This can improve the temperature uniformity of the coolant, improve the temperature uniformity of the low-temperature test wafer, and improve the cooling effect.

[0030] The side plates 122 are fixed in an equidistant array on the outside of the through ring 121, and each set of side plates 122 is a right trapezoidal structure with a smaller top and a larger bottom. The cross-section of the threaded groove 23 is a trapezoidal structure with a smaller top and a larger bottom. The cross-section of the buckle 22 is an L-shaped structure with its top end bent towards the middle. There are gaps between multiple sets of horizontal plates 13, and the size is the same as the gap between the vertical plates 14. In this device, the buckle 22 structure can be fixed to the bottom ring 11 by the mounting ring 21, and the pin 211 structure can be fixed and locked with the positioning groove 111 to achieve fixation. The spiral threaded groove 23 structure opened in the mounting ring 21 accelerates the cooling medium from the bottom through its specific structure of a smaller top and a larger bottom, increases the contact force with the wafer at the top, and thus expands the bottom area covering the wafer.

[0031] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of this utility model.

Claims

1. A semiconductor narrow channel cooling disc, characterized by, The device includes a chassis (1) and a placement tray (2). The chassis (1) includes a bottom ring (11) and a through plate (12). The through plate (12) is fixed to the bottom end of the bottom ring (11) by an outer side plate (122). A turbulence assembly (3) is fixed in the middle of the bottom ring (11). The turbulence assembly (3) includes a fixing ring (31) and turbulence plates (32) fixed inside and outside the fixing ring (31). Multiple sets of vertical plates (14) are fixed inside the turbulence assembly (3). Multiple sets of horizontal plates (13) are fixed at the top of the bottom ring (11). The placement tray (2) is fixed at the top of the bottom ring (11). The placement tray (2) includes a support ring (21) and a buckle (22) fixed at its top. A spiral groove (23) is opened in the middle of the support ring (21). A groove is opened on the inner side of the bottom end of the support ring (21).

2. A semiconductor narrow channel cooling disc according to claim 1, wherein, The fixing ring (31) has two sets of grooves symmetrically opened in the middle of its inner side, and the fixing ring (31) is a semi-circular ring structure. The fixing ring (31) is fixed in one side of the groove, and the cross-section of the baffle plate (32) is "S" shaped.

3. A semiconductor narrow channel cooling disc according to claim 1, wherein, A positioning groove (111) is provided on the outer side of the bottom ring (11), and a positioning hole (112) is provided through the middle of the positioning groove (111). A pin (211) is fixed at the bottom end of the mounting ring (21), and the pin (211) is inserted and fixed in the positioning hole (112).

4. The semiconductor narrow channel cooling disc of claim 1, wherein, The side plates (122) are fixed in an equidistant array on the outside of the through ring (121), and each set of the side plates (122) is a right trapezoidal structure with a smaller top and a larger bottom, and the cross section of the threaded groove (23) is a trapezoidal structure with a smaller top and a larger bottom.

5. A semiconductor narrow channel cooling disc according to claim 4, wherein, The buckle (22) has an L-shaped cross-section with its top end bent toward the middle.

6. A semiconductor narrow channel cooling disc according to claim 1, wherein, There are gaps between the multiple sets of horizontal plates (13), and the size is the same as the gap between the vertical plates (14), and the horizontal plates (13) and the vertical plates (14) are perpendicular to each other.

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