Single stroke high efficiency wafer workpiece table chucking device

Abstract

This utility model discloses a single-stroke high-efficiency wafer workpiece stage clamping device, which includes a base, a clamping mechanism, and a drive assembly. The two clamping arms of the clamping mechanism are symmetrically mounted on the worktable via slide rails. The drive assembly utilizes a drive motor, a lead screw, and a transmission rod to achieve synchronous movement of the clamping arms. The transmission rod employs a reverse thread design to ensure that the clamping arms complete clamping in a single linear motion. The worktable surface is equipped with vacuum suction holes and flexible clamping pads for double fixation. The drive motor is equipped with an encoder, and the clamping arms are equipped with pressure sensors for automated monitoring and control. The bottom of the base is equipped with shock-absorbing pads to improve stability. This device significantly improves clamping efficiency and accuracy, providing an efficient and reliable solution for wafer processing.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a single-stroke high-efficiency wafer stage clamping device. Background Technology

[0002] In semiconductor manufacturing, wafer clamping and fixation are crucial steps to ensure processing accuracy. For high-precision lithography or inspection equipment, the performance of the clamping device is particularly critical, as it not only needs to complete the clamping action quickly but also needs to ensure the wafer remains stable during processing to avoid quality problems caused by minute displacements.

[0003] Because wafer fabrication demands high efficiency and precision, existing clamping devices typically employ multi-stroke designs for gradual clamping. However, this approach leads to extended operation time, impacting overall production efficiency. Furthermore, in practical applications, multi-stroke clamping can reduce positioning accuracy due to accumulated errors, negatively affecting processing quality. Therefore, improving efficiency while ensuring effective clamping has become a pressing technical challenge. Utility Model Content

[0004] The purpose of this utility model is to provide a single-stroke high-efficiency wafer stage clamping device, which solves the problems mentioned in the background art.

[0005] This invention is implemented as follows: a single-stroke high-efficiency wafer stage clamping device includes a base, a clamping mechanism, and a drive assembly. The base is a rectangular frame structure with a horizontal worktable on its top. The clamping mechanism includes two symmetrically arranged clamping arms, which are slidably connected to the worktable. The drive assembly is located inside the base and is drive-connected to the clamping arms, enabling synchronous movement of the clamping arms through a single linear motion.

[0006] Specifically, the clamping arm includes a fixed end and a movable end. The fixed end is slidably connected to the worktable surface via a slide rail, which extends along the moving direction of the clamping arm. Limit blocks are provided at both ends of the slide rail, and the limit blocks are fixed to the worktable surface with screws. A flexible clamping pad is provided on the inner side of the movable end, and the flexible clamping pad is fixed to the inner surface of the movable end by adhesive bonding. The flexible clamping pad is made of polyurethane and is used to protect the wafer surface from damage during clamping.

[0007] The drive assembly includes a drive motor, a lead screw, and a transmission rod. The drive motor is fixedly mounted on one side inside the base, and its output shaft is connected to one end of the lead screw via a coupling. The other end of the lead screw is fixed to the other side inside the base via a bearing seat. The transmission rod is a double-threaded rod structure, with its two ends threadedly connected to the fixed ends of the two clamping arms, respectively. The middle part of the transmission rod meshes with the lead screw via a gear pair. When the drive motor starts, the lead screw rotates, driving the transmission rod to rotate, which in turn causes the two clamping arms to move in opposite directions along the slide rail, completing the clamping or releasing action of the wafer.

[0008] Preferably, the transmission rod has reverse threaded sections at both ends, with the same pitch, and the fixed ends of the two clamping arms respectively engage with the reverse threaded sections at both ends of the transmission rod. This reverse thread design allows the transmission rod to simultaneously drive the two clamping arms to move in opposite directions along the slide rail when rotating, thereby achieving synchronous clamping or releasing actions.

[0009] Preferably, the worktable surface is provided with a positioning groove located between two clamping arms for placing the wafer. A vacuum adsorption hole is provided at the bottom of the positioning groove, and the vacuum adsorption hole is connected to an external vacuum pump via a pipe for auxiliary fixing of the wafer during clamping. The distribution density of the vacuum adsorption holes is uniformly set according to the size of the wafer to ensure uniform adsorption force distribution.

[0010] Preferably, a protective cover is provided on the top of the base, which is connected to the base via a hinge. This cover covers the worktable and clamping arms to prevent external dust from entering the clamping device. A transparent observation window, made of tempered glass, is provided on the inner side of the protective cover, allowing the operator to observe the clamping process in real time.

[0011] Preferably, an encoder is installed on the output shaft of the drive motor. The encoder is connected to an external control system via a signal line to monitor the rotation angle and speed of the drive motor in real time. The signal output terminal of the encoder is electrically connected to the input terminal of the control system. The control system adjusts the operating state of the drive motor according to the signal fed back from the encoder to ensure the accuracy and stability of the clamping action.

[0012] Preferably, a pressure sensor is provided at the movable end of the clamping arm. The pressure sensor is fixed to the inner side of the movable end by bolts and is used to detect the pressure value applied by the clamping arm to the wafer. The signal output terminal of the pressure sensor is electrically connected to the input terminal of the control system. The control system determines whether the clamping state has reached a preset value based on the signal fed back by the pressure sensor, and automatically stops the operation of the drive motor when the preset value is reached.

[0013] Preferably, the bottom of the base is provided with shock-absorbing pads, which are fixed to the four corners of the base by adhesive bonding. These pads absorb vibrations generated during clamping and improve the stability of the clamping device. The shock-absorbing pads are made of silicone rubber, which has good elasticity and wear resistance.

[0014] This utility model provides a single-stroke high-efficiency wafer stage clamping device. Its advantages include achieving single-stroke linear motion clamping of the clamping arm through the cooperation of a drive motor, lead screw, and transmission rod. Compared to traditional multi-stroke clamping methods, this device can complete wafer clamping in a single operation, significantly improving clamping efficiency and reducing operation time.

[0015] The reverse threaded sections at both ends of the transmission rod allow the two clamping arms to move synchronously, avoiding clamping deviations caused by asynchrony and improving clamping accuracy.

[0016] The vacuum adsorption holes on the worktable are combined with the flexible clamping pads of the clamping arms to provide double fixation for the wafer during the clamping process. This ensures the stability of the clamping and avoids damage to the wafer surface, thereby improving the processing quality.

[0017] The encoder on the drive motor and the pressure sensor on the clamping arm work in conjunction with the control system to achieve automated monitoring and control of the clamping process, further improving the accuracy and reliability of the clamping action.

[0018] The shock-absorbing pad design at the bottom of the base effectively reduces the vibration generated during clamping, improves the overall stability of the device, and provides a guarantee for high-precision machining.

[0019] In summary, this invention solves the problems of low efficiency and poor precision of traditional clamping devices through reasonable mechanical structure design and automated control, providing an efficient and reliable solution for wafer clamping in semiconductor manufacturing. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the present invention, showing the overall layout of the clamping device, including a base, clamping arms, drive components and protective cover.

[0021] Figure 2 This is a top view of the worktable surface of this utility model, which focuses on showing the sliding connection method of the clamping arm, the distribution of the positioning groove and the vacuum adsorption hole.

[0022] Figure 3 This is a partial sectional view of the drive assembly of this utility model, which shows in detail the fit between the drive motor, lead screw, transmission rod and their reverse threaded sections.

[0023] The attached diagram is labeled as follows: 1. Base; 2. Clamping arm; 3. Drive motor; 4. Lead screw; 5. Transmission rod; 6. Flexible clamping pad; 7. Positioning groove; 8. Vacuum adsorption hole; 9. Protective cover; 10. Shock-absorbing pad. Detailed Implementation

[0024] This utility model provides a single-stroke high-efficiency wafer stage clamping device, the specific structure and operating principle of which are as follows (in conjunction with the attached diagram). Figure 1 To be continued Figure 3 Please provide a detailed explanation. For example... Figure 1 As shown, the clamping device of this utility model includes a base 1, a clamping arm 2, a drive assembly, and a protective cover 9. The base 1 is a rectangular frame structure with a horizontal worktable on its top for supporting the wafer and performing clamping operations. The clamping arm 2 is symmetrically arranged on the worktable and engages with it via a sliding connection. The drive assembly is located inside the base 1 and is connected to the clamping arm 2 for synchronous movement of the clamping arm 2 through a single linear motion.

[0025] The specific structure of clamping arm 2 is as follows Figure 1 and Figure 2 As shown, it includes a fixed end and a movable end. The fixed end is slidably connected to the worktable via a slide rail, which extends along the moving direction of the clamping arm 2. Limit blocks are provided at both ends of the slide rail, and these limit blocks are fixed to the worktable with screws to limit the range of movement of the clamping arm 2. A flexible clamping pad 6 is provided on the inner side of the movable end, and is fixed to the inner surface of the movable end by adhesive bonding. The flexible clamping pad 6 is designed to protect the wafer surface from damage during clamping. The sliding connection of the clamping arms 2 allows the two clamping arms 2 to move in opposite directions along the slide rail under the action of the drive assembly, thereby realizing the clamping or releasing action of the wafer.

[0026] The drive component is one of the core components of this utility model, and its specific structure is as follows: Figure 3As shown, the system includes a drive motor 3, a lead screw 4, and a transmission rod 5. The drive motor 3 is fixedly installed on one side inside the base 1, and its output shaft is connected to one end of the lead screw 4 via a coupling. The other end of the lead screw 4 is fixed to the other side inside the base 1 via a bearing seat. The transmission rod 5 is a double-threaded rod structure, with its two ends threadedly connected to the fixed ends of the two clamping arms 2 respectively. The middle part of the transmission rod 5 meshes with the lead screw 4 via a gear pair. When the drive motor 3 starts, the lead screw 4 rotates, driving the transmission rod 5 to rotate, thereby causing the two clamping arms 2 to move in opposite directions along the slide rail, completing the clamping or releasing action of the wafer. Both ends of the transmission rod 5 are provided with reverse thread sections, the pitch of which is the same, and the fixed ends of the two clamping arms 2 respectively engage with the reverse thread sections at both ends of the transmission rod 5. Through the design of the reverse threads, the transmission rod 5 can simultaneously drive the two clamping arms 2 to move in opposite directions along the slide rail when rotating, thereby achieving synchronous clamping or releasing action.

[0027] A positioning groove 7 is provided on the worktable, located between the two clamping arms 2, for placing the wafer. A vacuum adsorption hole 8 is provided at the bottom of the positioning groove 7, which is connected to an external vacuum pump via a pipe to assist in fixing the wafer during clamping. The distribution density of the vacuum adsorption holes 8 is uniformly set according to the size of the wafer to ensure uniform adsorption force distribution. The design of the positioning groove 7 and the cooperation of the vacuum adsorption holes 8 effectively improve the stability of the wafer during clamping, avoiding wafer displacement or damage caused by uneven clamping force.

[0028] The protective cover 9 is connected to the base 1 via a hinge and is used to cover the worktable and clamping arm 2 to prevent external dust from entering the clamping device. A transparent observation window made of tempered glass is provided on the inner side of the protective cover 9, allowing the operator to observe the clamping process in real time. The design of the protective cover 9 not only protects the internal mechanical components of the clamping device from external environmental influences but also facilitates operator monitoring of the clamping process.

[0029] An encoder is mounted on the output shaft of drive motor 3. The encoder is connected to an external control system via a signal line to monitor the rotation angle and speed of drive motor 3 in real time. The encoder's signal output is electrically connected to the input of the control system. The control system adjusts the operating state of drive motor 3 based on the signal feedback from the encoder to ensure the accuracy and stability of the clamping action. A pressure sensor is mounted on the movable end of clamping arm 2. The pressure sensor is bolted to the inside of the movable end and detects the pressure applied by clamping arm 2 to the wafer. The pressure sensor's signal output is electrically connected to the input of the control system. The control system determines whether the clamping state has reached a preset value based on the signal feedback from the pressure sensor and automatically stops drive motor 3 when the preset value is reached. Through the cooperation of the encoder and pressure sensor, the control system can monitor key parameters during the clamping process in real time, thereby achieving automated monitoring and control.

[0030] A shock-absorbing pad 10 is installed at the bottom of the base 1. The shock-absorbing pad 10 is fixed to the four corners of the base 1 by adhesive bonding. It is used to absorb the vibration generated during the clamping process and improve the stability of the clamping device. The shock-absorbing pad 10 is made of silicone rubber, which has good elasticity and wear resistance. The design of the shock-absorbing pad 10 can effectively reduce the vibration generated during the clamping process, thereby improving the overall stability of the clamping device and providing a guarantee for high-precision machining.

[0031] The specific operation process of this utility model is as follows: First, the wafer to be processed is placed in the positioning groove 7 of the worktable, with the bottom of the wafer in contact with the vacuum adsorption hole 8. The external vacuum pump is started, and the vacuum adsorption hole 8 generates adsorption force, initially fixing the wafer in the positioning groove 7. Then, the drive motor 3 is started, and the output shaft of the drive motor 3 drives the lead screw 4 to rotate through a coupling. The lead screw 4 transmits the rotational motion to the transmission rod 5 through a gear pair. During the rotation of the transmission rod 5, the reverse threaded sections at both ends engage with the fixed ends of the two clamping arms 2, causing the two clamping arms 2 to move towards each other along the slide rail, gradually approaching the wafer. After the flexible clamping pad 6 on the inner side of the movable end of the clamping arm 2 contacts the wafer surface, it continues to apply clamping force until the pressure sensor detects that the clamping force has reached a preset value. At this time, the control system automatically stops the operation of the drive motor 3 based on the feedback signal from the pressure sensor, completing the wafer clamping operation. During the clamping process, the encoder monitors the rotation angle and speed of the drive motor 3 in real time and feeds the signal back to the control system to ensure the accuracy and stability of the clamping action. After processing is complete, the drive motor 3 reverses, and the transmission rod 5 drives the two clamping arms 2 to move in opposite directions along the slide rail, releasing the wafer. The vacuum pump is then turned off, and the wafer is removed, completing the entire operation.

[0032] This invention achieves single-stroke linear motion clamping of wafers through a reasonable mechanical structure design and automated control, solving the problems of low efficiency and poor accuracy in traditional multi-stroke clamping methods. The cooperation of the drive motor 3, lead screw 4, and transmission rod 5 enables the clamping arm 2 to complete wafer clamping in a single operation, significantly improving clamping efficiency. The reverse threaded sections at both ends of the transmission rod 5 ensure that the two clamping arms 2 move synchronously, avoiding clamping deviations caused by asynchrony. The vacuum suction hole 8 on the worktable, combined with the flexible clamping pad 6 of the clamping arm 2, provides double fixation for the wafer during clamping, ensuring clamping stability and preventing damage to the wafer surface. The encoder on the drive motor 3 and the pressure sensor on the clamping arm 2, working in conjunction with the control system, achieve automated monitoring and control of the clamping process, further improving the accuracy and reliability of the clamping action. The shock-absorbing pad 10 at the bottom of the base 1 effectively reduces vibrations generated during clamping, improving the overall stability of the device and ensuring high-precision machining.

[0033] To enable those skilled in the art to fully understand and implement this utility model, the specific implementation principle of this utility model is further explained below in conjunction with a specific application scenario.

[0034] In semiconductor manufacturing, wafer clamping is a crucial step in ensuring processing accuracy. Taking high-precision lithography equipment as an example, this equipment requires multiple exposures and development processes on the wafer, thus demanding that the clamping device can secure the wafer quickly and stably throughout the entire processing. This invention's single-stroke, high-efficiency wafer stage clamping device meets this requirement.

[0035] First, the wafer to be processed is placed in the positioning groove 7 on the worktable. The design of the positioning groove 7 matches the outer dimensions of the wafer, which can initially restrict the position of the wafer and prevent it from shifting due to external forces. Then, an external vacuum pump is started, which is connected to the vacuum adsorption holes 8 at the bottom of the positioning groove 7 through a pipeline to generate a uniformly distributed adsorption force. The distribution density of the vacuum adsorption holes 8 is optimized according to the size of the wafer to ensure that the adsorption force covers the entire bottom surface of the wafer, keeping it stable in the initial fixing stage. This step provides a basic guarantee for the subsequent clamping operation.

[0036] Next, the drive motor 3 is started, and the output shaft of the drive motor 3 drives the lead screw 4 to rotate via a coupling. The rotational motion of the lead screw 4 is transmitted to the transmission rod 5 through a gear pair, causing the transmission rod 5 to start rotating. The transmission rod 5 has reverse threaded sections at both ends, and the fixed ends of the two clamping arms 2 respectively engage with the reverse threaded sections at both ends of the transmission rod 5. When the transmission rod 5 rotates, the two clamping arms 2 move towards each other along the slide rail, gradually approaching the wafer. Because the reverse threaded sections have the same pitch, and the fixed ends of the two clamping arms 2 engage with them respectively, the two clamping arms 2 can maintain synchronous movement, avoiding clamping deviation caused by asynchrony. This mechanical structure design ensures the accuracy of the clamping action.

[0037] Inside the movable end of the clamping arm 2, the flexible clamping pad 6 continues to apply clamping force after contacting the wafer surface. The flexible clamping pad 6 is made of polyurethane, which has good elasticity and wear resistance, protecting the wafer surface from damage during clamping. Simultaneously, a pressure sensor is installed at the movable end of the clamping arm 2 to detect the magnitude of the clamping force in real time. When the pressure sensor detects that the clamping force has reached a preset value, the control system automatically stops the drive motor 3 based on the feedback signal, completing the wafer clamping operation. This automated monitoring and control mechanism significantly improves the reliability of the clamping process.

[0038] During the clamping process, an encoder mounted on the output shaft of the drive motor 3 monitors its rotation angle and speed in real time and feeds the signal back to the control system. The control system adjusts the operating state of the drive motor 3 based on the encoder feedback signal to ensure the accuracy and stability of the clamping action. This dual monitoring mechanism not only improves clamping efficiency but also effectively avoids the problem of decreased positioning accuracy due to accumulated errors.

[0039] After processing is complete, the drive motor 3 reverses, and the transmission rod 5 drives the two clamping arms 2 to move in opposite directions along the slide rail, releasing the wafer. At this point, the vacuum pump is turned off, and the wafer is removed, completing the entire operation. The design of the protective cover 9 plays a crucial role in this process. It is connected to the base 1 via a hinge, covering the worktable and clamping arms 2 to prevent external dust from entering the clamping device. The transparent observation window inside the protective cover 9 allows the operator to monitor the clamping process in real time, ensuring smooth operation.

[0040] In addition, the shock-absorbing pads 10 at the bottom of the base 1 are fixed to the four corners of the base 1 by adhesive bonding to absorb vibrations generated during clamping. The shock-absorbing pads 10 are made of silicone rubber, which has good elasticity and wear resistance, effectively reducing vibrations generated during clamping and improving the overall stability of the clamping device. This design provides an important guarantee for high-precision machining.

[0041] In summary, this invention, through reasonable mechanical structure design and automated control methods, achieves single-stroke linear motion clamping of wafers in practical applications. From initial wafer fixation to final clamping, and then to release after processing, each step has been carefully designed and optimized to ensure the efficiency, accuracy, and reliability of the clamping process. This device not only solves the problems of low efficiency and poor accuracy of traditional multi-stroke clamping methods, but also provides an efficient and reliable solution for wafer clamping in semiconductor manufacturing.

[0042] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A single stroke high efficiency wafer workpiece chucking device comprising a base (1) characterized in that, Also includes: Clamping arms (2), two clamping arms (2) are symmetrically arranged and mounted on the worktable on top of the base (1) by a sliding connection; The drive assembly is located inside the base (1) and is connected to the clamping arm (2) for synchronous movement of the clamping arm (2) through a single linear motion; The clamping arm (2) includes a fixed end and a movable end. The fixed end is slidably connected to the worktable surface via a slide rail. A flexible clamping pad (6) is provided on the inner side of the movable end. The flexible clamping pad (6) is made of polyurethane. The driving assembly includes a drive motor (3), a lead screw (4), and a transmission rod (5). The drive motor (3) is fixedly installed on one side inside the base (1). Its output shaft is connected to one end of the lead screw (4) via a coupling. The other end of the lead screw (4) is fixed to the other side inside the base (1) via a bearing seat. The transmission rod (5) is a double-threaded rod structure. Its two ends are respectively connected to the fixed ends of the two clamping arms (2) via threads. The middle part of the transmission rod (5) meshes with the lead screw (4) via a gear pair.

2. The single-stroke high-efficiency wafer workpiece chucking device of claim 1, wherein, The transmission rod (5) has reverse threaded sections at both ends, with the same pitch, and the fixed ends of the two clamping arms (2) respectively cooperate with the reverse threaded sections at both ends of the transmission rod (5).

3. The single stroke high efficiency wafer workpiece chucking device of claim 1, wherein, The workbench is provided with a positioning groove (7) located between two clamping arms (2). The bottom of the positioning groove (7) is provided with a vacuum adsorption hole (8), which is connected to an external vacuum pump through a pipe.

4. The single-stroke high-efficiency wafer workpiece chucking device of claim 1, wherein, The base (1) is provided with a protective cover (9) on its top. The protective cover (9) is connected to the base (1) by a hinge. A transparent observation window is provided on the inner side of the protective cover (9). The transparent observation window is made of tempered glass.

5. The single-stroke high-efficiency wafer stage clamping device according to claim 1, characterized in that, An encoder is provided on the output shaft of the drive motor (3). The encoder is connected to an external control system via a signal line and is used to monitor the rotation angle and speed of the drive motor (3) in real time.

6. The single-stroke high-efficiency wafer workpiece chucking device of claim 1, wherein, The movable end of the clamping arm (2) is equipped with a pressure sensor, which is fixed to the inside of the movable end by bolts and is used to detect the pressure value applied by the clamping arm (2) to the wafer.

7. The single-stroke high-efficiency wafer workpiece chucking device of claim 1, wherein, The bottom of the base (1) is provided with a shock-absorbing pad (10), which is fixed to the four corners of the base (1) by adhesive. The material of the shock-absorbing pad (10) is silicone rubber.

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