An optical coupler lead frame

Abstract

This utility model relates to an optocoupler lead frame, comprising: an IR bracket, the IR bracket including two parallel IR side rails, a plurality of IR connecting ribs arranged side-by-side between the two IR side rails, a plurality of IR pin assemblies arranged on the IR connecting ribs, and an IR base island for mounting an IR chip on the IR pin assembly; and a PT bracket, the PT bracket including two parallel PT side rails, a plurality of PT connecting ribs arranged side-by-side on the PT side rails, a plurality of PT pin assemblies arranged on the PT connecting ribs, a PT base island arranged on the PT pin assembly, a first mounting part for mounting a PT chip on the PT base island, and a second mounting part connected to the first mounting part on the PT base island; the IR bracket and the PT bracket are stacked on top of each other, with the first mounting part facing the IR base island, solving the technical problem that currently several series of optocoupler products require optocoupler brackets with specific structures, resulting in high total mold costs and high costs for individual optocoupler brackets.

Description

Technical Field

[0001] This utility model relates to the field of optocoupler lead frame technology, and in particular to an optocoupler lead frame. Background Technology

[0002] Currently, the production of several optocoupler models, including the Schmitt trigger optocoupler H11L1, transistor optocoupler 4N35 / 4N25, transistor optocoupler CNY17-F, high-voltage transistor optocoupler H11D1, high-voltage Darlington optocoupler H11G1, Darlington optocoupler 4N33, thyristor output relay HWRX223 / HWRX213, and thyristor optocoupler HW30XX, requires the use of corresponding molds during production. Therefore, eight sets of molds need to be developed for the production of optocoupler brackets, with each set costing approximately 1 million RMB. This results in relatively high overall mold costs. Furthermore, when suppliers provide optocoupler brackets produced from four sets of molds, the larger the quantity of brackets in a single order corresponding to the same type of bracket, the greater the discount offered by the supplier. However, since the production volume of a single series of products is often relatively small, the quantity of brackets in a single order is also relatively small, leading to a relatively high cost per bracket in each batch of orders. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides an optocoupler lead frame, which solves the technical problem that several series of optocoupler products currently require optocoupler brackets with specific structures, resulting in high total mold costs and high costs for individual optocoupler brackets.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an optocoupler lead frame, comprising:

[0005] An IR bracket includes two parallel IR side rails, a plurality of IR connecting ribs are arranged side by side between the two IR side rails, a plurality of IR pin assemblies are arranged on the IR connecting ribs, and IR base islands for mounting IR chips are arranged on the IR pin assemblies.

[0006] The PT bracket includes two parallel PT side rails, several PT connecting ribs are arranged side by side on the PT side rails, several PT pin assemblies are arranged on the PT connecting ribs, PT base islands are arranged on the PT pin assemblies, a first mounting part for mounting PT chips is arranged on the PT base islands, and a second mounting part connected to the first mounting part is also arranged on the PT base islands.

[0007] The IR bracket and the PT bracket are stacked on top of each other, and the first mounting part is positioned directly opposite the IR base island.

[0008] Preferably, the vertical projection of the IR chip onto the plane where the PT base island is located is on the PT chip.

[0009] Preferably, there is a height difference between the upper edge of the first mounting part and the upper edge of the second mounting part, and a height difference between the lower edge of the first mounting part and the lower edge of the second mounting part.

[0010] Preferably, the IR pin assembly includes a second pin with an IR base island, and a first pin and a third pin parallel to its extension direction are respectively disposed on both sides of the second pin.

[0011] Preferably, the PT pin assembly includes a fifth pin with a PT base island, and a fourth pin and a sixth pin parallel to its extension direction are respectively provided on both sides of the fifth pin.

[0012] By employing the above technical solution, this utility model provides an optocoupler lead frame, which has at least the following beneficial effects:

[0013] 1. This utility model designs a new optocoupler bracket structure, enabling a single mold to be compatible with the production of eight major product series: Schmitt trigger optocoupler H11L1, transistor optocoupler 4N35 / 4N25, CNY17-F, high-voltage transistor optocoupler H11D1, high-voltage Darlington optocoupler H11G1, Darlington optocoupler 4N33, thyristor output relay HWRX223 / HWRX213, and thyristor optocoupler HW30XX. Compared to the traditional solution where each series requires independent mold development, this design only requires one mold to cover all models, directly reducing mold development costs and reducing indirect costs such as mold maintenance, storage, and production switching.

[0014] 2. This utility model is based on the mass production mode of universal optocoupler brackets, which allows different series of optocoupler brackets to be purchased in the same order. By integrating the total bracket demand of eight major products, the size of a single order is expanded to 5-8 times that of a traditional single model. This effectively activates the supplier's quantity discount mechanism and greatly reduces the unit cost of the lead frame. In addition, the unified lead frame can reduce the frequency of production line switching and improve production efficiency.

[0015] 3. Due to the precise alignment of the first mounting part of the IR base island and the PT base island, the light propagation distance is greatly shortened to reduce light attenuation. The staggered design of the two mounting parts in the PT base island ensures the accuracy of the chip mounting position. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0017] Figure 1 This is a schematic diagram of the IR bracket of this utility model;

[0018] Figure 2 This utility model Figure 1 Enlarged view of point A in the middle;

[0019] Figure 3 This is a schematic diagram of the PT bracket of this utility model;

[0020] Figure 4 This utility model Figure 3 Enlarged view of point B in the middle;

[0021] Figure 5 This is a schematic diagram of the bonding wires of the Schmitt trigger optocoupler H11L1 of this utility model;

[0022] Figure 6 This is a schematic diagram of the bonding wires for the 4N35 / 4N25 transistor optocoupler of this utility model;

[0023] Figure 7 This is a schematic diagram of the bonding wires for the CNY17-F transistor optocoupler of this utility model;

[0024] Figure 8 This is a schematic diagram of the bonding wires for the high-voltage transistor optocoupler H11D1 of this utility model;

[0025] Figure 9 This is a schematic diagram of the bonding wires for the high-voltage Darlington optocoupler H11G1 of this utility model;

[0026] Figure 10 This is a schematic diagram of the bonding wires of the Darlington optocoupler 4N33 of this utility model;

[0027] Figure 11 This is a schematic diagram of the soldering wires for the thyristor output relay HWRX223 / HWRX213 of this utility model;

[0028] Figure 12 This is a schematic diagram of the bonding wires of the HW30XX thyristor optocoupler of this utility model.

[0029] In the diagram: 1. IR bracket; 11. IR side rail; 12. IR connecting rib; 13. IR pin assembly; 131. First pin; 132. Second pin; 133. Third pin; 14. IR base island; 2. PT bracket; 21. PT side rail; 22. PT connecting rib; 23. PT pin assembly; 231. Fourth pin; 232. Fifth pin; 233. Sixth pin; 24. PT base island; 241. First mounting part; 242. Second mounting part. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] To address the current technical problem that several series of optocoupler products require specific optocoupler bracket structures, and each bracket requires a corresponding mold for production, resulting in high total mold costs and high costs per bracket, this invention provides an optocoupler lead frame. By studying the structures of several series of optocouplers, including Schmitt trigger optocoupler H11L1, transistor optocoupler 4N35 / 4N25, transistor optocoupler CNY17-F, high-voltage transistor optocoupler H11D1, high-voltage Darlington optocoupler H11G1, Darlington optocoupler 4N33, thyristor output relay HWRX223 / HWRX213, and thyristor optocoupler HW30XX, a new optocoupler lead frame has been developed. This new lead frame can simultaneously meet the usage requirements of the above eight series of optocouplers, thus requiring only one set of molds to develop, significantly reducing mold development costs. Furthermore, each order can specify the number of optocoupler brackets needed to produce for all eight series of optocouplers. Figure 1 - Figure 4 As shown, the optocoupler lead frame includes:

[0032] IR bracket 1 includes two parallel IR side rails 11, and several IR connecting ribs 12 are arranged side by side between the two IR side rails 11. Several IR pin assemblies 13 are arranged on the IR connecting ribs 12. IR pin assemblies 13 are provided with IR base islands 14 for mounting IR chips. Combining the characteristics of the eight series optocoupler brackets, here, the IR pin assembly 13 includes a second pin 132 with an IR base island 14. A first pin 131 and a third pin 133 parallel to its extension direction are respectively arranged on both sides of the second pin 132.

[0033] The PT bracket 2 includes two parallel PT side rails 21. Several PT connecting ribs 22 are arranged side-by-side on the PT side rails 21, and several PT pin assemblies 23 are arranged on the PT connecting ribs 22. A PT base island 24 is arranged on the PT pin assembly 23. To maximize the shortening of the light propagation path and maximize the reception of light emitted by the IR chip, the vertical projection of the IR chip on the plane of the PT base island 24 can be further positioned on the PT chip to improve light transmission efficiency. A first mounting part 241 for mounting the PT chip is provided on the PT base island 24, and a second mounting part 242 connected to the first mounting part 241 is also provided on the PT base island 24. This design incorporates the features of eight series optical coupler brackets. The PT pin assembly 23 includes a fifth pin 232 on which the PT base island 24 is disposed. A fourth pin 231 and a sixth pin 233, parallel to the extending direction of the fifth pin 232, are respectively disposed on both sides of the fifth pin 232. Furthermore, to further strictly distinguish the positions of the first mounting portion 241 and the second mounting portion 242 on the PT base island 24, a height difference is made between the upper edge of the first mounting portion 241 and the upper edge of the second mounting portion 242, and a height difference is also made between the lower edge of the first mounting portion 241 and the lower edge of the second mounting portion 242. This allows for clear identification of the chip's mounting position when installing chips on the PT base island 24, especially in cases where different chips need to be installed, thus avoiding installation errors. Figure 11 As shown, the mounting positions of the two chips are clearly visible on PT base island 24.

[0034] The IR bracket 1 and PT bracket 2 are stacked on top of each other, with the first mounting part 241 facing the IR base island 14. The resulting optocoupler is a opposed optocoupler. Figure 5 - Figure 12 The diagram shown illustrates the installation and wire bonding of eight series of products on the optocoupler lead frame provided by this utility model.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An optocoupler leadframe, comprising: include: An IR bracket (1) includes two parallel IR side rails (11), a plurality of IR connecting ribs (12) are arranged side by side between the two IR side rails (11), a plurality of IR pin assemblies (13) are arranged on the IR connecting ribs (12), and an IR base island (14) for mounting IR chips is arranged on the IR pin assembly (13). PT bracket (2), the PT bracket (2) includes two parallel PT side rails (21), a plurality of PT connecting ribs (22) are arranged side by side on the PT side rails (21), a plurality of PT pin assemblies (23) are arranged on the PT connecting ribs (22), a PT base island (24) is arranged on the PT pin assembly (23), a first mounting part (241) for mounting PT chips is arranged on the PT base island (24), and a second mounting part (242) connected to the first mounting part (241) is also arranged on the PT base island (24). The IR bracket (1) and the PT bracket (2) are stacked on top of each other, and the first mounting part (241) is positioned opposite the IR base island (14).

2. The optocoupler lead frame according to claim 1, characterized in that, The vertical projection of the IR chip onto the plane of the PT base island (24) is located on the PT chip.

3. An optical coupling leadframe according to claim 1, wherein, There is a height difference between the upper edge of the first mounting part (241) and the upper edge of the second mounting part (242), and there is a height difference between the lower edge of the first mounting part (241) and the lower edge of the second mounting part (242).

4. An optical coupling leadframe according to claim 1, wherein, The IR pin assembly (13) includes a second pin (132) with an IR base island (14) and a first pin (131) and a third pin (133) parallel to its extension direction on both sides of the second pin (132).

5. An optical coupling leadframe according to claim 1, wherein, The PT pin assembly (23) includes a fifth pin (232) on which a PT base island (24) is provided, and a fourth pin (231) and a sixth pin (233) parallel to its extension direction are respectively provided on both sides of the fifth pin (232).

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