Device support, light-emitting device, and light-emitting apparatus

Abstract

A device support, a light-emitting device, and a light-emitting apparatus. The device support (10) comprises a housing (1) and a lead frame (2), wherein the housing (1) comprises a cup-shaped portion (11) and a base portion (12); a side surface of the housing (1) in a first direction (S1) comprises a first side surface (141), a second side surface (142), and a third side surface (143); a first step surface (144) is formed between the second side surface (142) and the first side surface (141); a second step surface (145) is formed between the second side surface (142) and the third side surface (143); the second side surface (142) is provided with retaining slots (1420); an edge of a side of the third side surface (143) away from the cup-shaped portion (11) comprises at least two chamfered sections (1430) and two inclined sections (1431), wherein a portion of each inclined section (1431) closer to the connected chamfered section (1430) is located farther from the cup-shaped portion (11); the lead frame (2) comprises a plurality of pins (21), and the pins (21) extend from a side of the housing (1) in a second direction (S2).

Description

Device brackets, light-emitting devices and light-emitting apparatus Technical Field

[0001] This application relates to the field of electronic components technology, such as a device bracket, a light-emitting device, and a light-emitting apparatus. Background Technology

[0002] Light-emitting devices in related technologies often suffer from poor performance stability. Research has shown that the reasons for this poor performance stability typically fall into the following three categories:

[0003] When encapsulating light-emitting devices onto a substrate, potting compound is typically used to fill the injection groove at the bottom of the device support and cover the exposed pins of the device support to encapsulate and protect the light-emitting device. However, the surface of the device support in related technologies is usually quite smooth, resulting in poor adhesion stability between the potting compound and the device support surface. Furthermore, it is difficult to control the rise of the potting compound on the sides of the device support, leading to poor encapsulation and protection of the device support, and consequently, poor performance stability of the light-emitting device.

[0004] In the manufacturing process of device brackets, a shell needs to be injection molded onto the straight leads to form a housing. Then, the leads are cut and bent to obtain the finished device bracket. Since the surface of the device bracket is usually relatively flat, it is difficult to fix multiple device brackets as a whole when cutting the leads. This makes it difficult to ensure the accuracy of the lead cutting position, resulting in poor lead shape consistency and poor performance stability of the light-emitting device.

[0005] In addition, the bending stability of the pins of the device bracket in the related technology is poor. When the light-emitting device is transported, the bending angle of the pins can easily change due to friction with other external structures, which can cause the solder pads to detach from the housing, affecting the performance of the light-emitting device and resulting in poor stability. Summary of the Invention

[0006] This application provides a device bracket that facilitates control over the climbing height of the potting compound on the side of the device bracket, thereby improving the encapsulation and protection of the device bracket by the potting compound, and also enhancing the structural consistency of the pins and the stability of the bending posture.

[0007] This application provides a light-emitting device, which can improve the stability of the light-emitting device's performance by using the aforementioned device bracket.

[0008] This application provides a light-emitting device, which improves the overall stability of the light-emitting device by using the aforementioned light-emitting device.

[0009] In a first aspect, a device support is provided, comprising:

[0010] A housing, comprising a cup-shaped portion and a base portion, the cup-shaped portion being disposed on one side of the base portion and having a cup-shaped space with an opening facing away from the base portion; the side surface of the housing along a first direction includes a first side surface, a second side surface, and a third side surface arranged sequentially from the cup-shaped portion towards the base portion; the second side surface protrudes outward from the housing along the first direction relative to the first and third side surfaces; a first stepped surface is formed between the second side surface and the first side surface; a second stepped surface is formed between the second side surface and the third side surface; the second side surface has a slot; and the edge of the third side surface away from the cup-shaped portion includes at least two chamfered segments and two inclined segments; the two chamfered segments are respectively located on two opposite sides of the third side surface along a second direction; the two inclined segments are respectively connected to the two chamfered segments; and the portion of the inclined segment closer to the connected chamfered segment is further away from the cup-shaped portion; and...

[0011] A lead frame includes multiple pins, each pin including a pad portion, a body portion, and a solder foot portion connected in sequence. At least a portion of the pad portion is located within the cup-shaped space. The body portion extends from one side of the housing along a second direction and is bent so that the solder foot portion abuts against the base portion on the side away from the cup-shaped portion. The body portion extends from both opposite sides of the housing along the second direction, and the first direction is perpendicular to the second direction.

[0012] In a second aspect, a light-emitting device is provided, comprising a light-emitting chip, an encapsulating adhesive, and a device support as described in the first aspect above, wherein the light-emitting chip is disposed within a cup-shaped space of the light-emitting chip and is fixedly connected and electrically connected to a pad portion of the light-emitting chip, and the encapsulating adhesive covers the light-emitting chip and the pad portion.

[0013] Thirdly, a light-emitting device is provided, comprising a substrate, a potting compound, and at least one light-emitting device as described in the second aspect above, wherein the substrate has a control circuit, the solder pads of the light-emitting device are fixedly connected to and electrically connected to the control circuit, and the potting compound is disposed on the substrate, connected to the base portion of the light-emitting device, and covers the portion of the pins exposed to the outside of the light-emitting device. Attached Figure Description

[0014] The present application will now be described with reference to the accompanying drawings and embodiments.

[0015] Figure 1 is a front view schematic diagram of the structure of a device support according to the embodiment;

[0016] Figure 2 is an enlarged schematic diagram of point L in Figure 1;

[0017] Figure 3 is a cross-sectional view of the device support shown in Figure 1;

[0018] Figure 4 is an enlarged schematic diagram of point M in Figure 3;

[0019] Figure 5 is a side view of the structure of the device support shown in Figure 1;

[0020] Figure 6 is an enlarged schematic diagram of point N in Figure 5;

[0021] Figure 7 is a bottom view of the structure of the device support shown in Figure 1;

[0022] Figure 8 is a cross-sectional schematic diagram of another device support structure described in the embodiment;

[0023] Figure 9 is an enlarged schematic diagram of point O in Figure 8;

[0024] Figure 10 is a bottom view of the structure of the device support shown in Figure 8;

[0025] Figure 11 is a bottom view of the structure of another device support described in the embodiment;

[0026] Figure 12 is a schematic diagram of the structure of the light-emitting device described in the embodiment;

[0027] Figure 13 is a schematic diagram of the structure of the light-emitting device described in the embodiment.

[0028] In the diagram: 100, Light-emitting device; 200, Substrate; 300, Encapsulating resin; 10, Device support; 1, Housing; 11, Cup-shaped portion; 110, Cup-shaped space; 12, Base portion; 120, Inclined surface; 121. Glue injection groove; 1210, intermediate sub-surface; 1211, annular sub-surface; 122, substrate; 123, boss; 1230, intermediate part; 1231, partition; 1232, groove; 1232a, first groove; 1232b, second groove; 1232c, marking structure; 13, waterproof step; 130, fourth step surface; 131, fifth step surface; 141, first side surface; 142, second side surface; 1420, slot; 1420a, groove wall surface; 143, third side surface; 1430, chamfered section; 1431, inclined section; 144, first step surface; 145, second step surface; 151, fourth side surface; 152, fifth side surface; 153, third step surface; 1530, clearance groove; 2. Lead frame; 21. Pin; 211. Pad; 212. Main body; 213. Solder foot; 20. Light-emitting chip; 30. Encapsulating adhesive. Detailed Implementation

[0029] The embodiments of this application will now be described with reference to the accompanying drawings. These described embodiments are some examples related to this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0030] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the meaning of the above terms in this application as appropriate.

[0031] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or indicating that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or indicating that the first feature is at a lower horizontal level than the second feature.

[0032] As shown in Figures 1 to 5, this application provides a device support 10, including a housing 1 and a lead frame 2. The housing 1 includes a cup-shaped portion 11 and a base portion 12. The cup-shaped portion 11 is disposed on one side of the base portion 12 and has a cup-shaped space 110 with an opening facing away from the base portion 12. The side surface of the housing 1 along the first direction S1 includes a first side surface 141, a second side surface 142, and a third side surface 143 arranged sequentially from the cup-shaped portion 11 to the base portion 12. The second side surface 142 protrudes outward from the housing 1 along the first direction S1 relative to the first side surface 141 and the third side surface 143, and the second side surface 142 and the first side surface 141 are... A first stepped surface 144 is formed between the second side surface 142 and the third side surface 143, and a second stepped surface 145 is formed between them. The lead frame 2 includes a plurality of pins 21. Each pin 21 includes a pad portion 211, a main body portion 212 and a solder foot portion 213 connected in sequence. At least a portion of the pad portion 211 is located in the cup-shaped space 110. The main body portion 212 extends from one side of the housing 1 along the second direction S2 and is bent so that the solder foot portion 213 abuts against the side of the base portion 12 away from the cup-shaped portion 11. The main body portion 212 extends from both opposite sides of the housing 1 along the second direction S2, and the first direction S1 is perpendicular to the second direction S2.

[0033] By forming a second stepped surface 145 on one side of the housing 1 along the first direction S1, the potting compound 300 (see FIG. 13) that climbs along the outer periphery of the base portion 12 of the device support 10 can be blocked by the second stepped surface 145, and the potting compound 300 can be provided with an attachment object so that the potting compound 300 can be easily maintained at the height of the second stepped surface 145. This makes it easy to control the climbing height of the potting compound 300 on the side of the device support 10, so that the potting compound 300 can better encapsulate and protect the device support 10.

[0034] A first step surface 144 is formed on the side of the housing 1 along the first direction S1. This can also provide a certain adhesion space for the potting compound 300 after the potting compound 300 climbs to a height higher than the second step surface 145 along the outer periphery of the base portion 12 of the device support 10 when the amount of potting compound 300 is large. This makes it easier for the potting compound 300 to be maintained at the height of the first step surface 144. Thus, the height of the potting compound 300 climbing to the outer periphery of the base portion 12 of the device support 10 can be controlled more flexibly according to the usage requirements.

[0035] Optionally, the second side 142 is provided with a slot 1420, so that the protrusion of the external fixing frame can be engaged with the slot 1420 to restrict the posture of the housing 1 from the two opposite sides along the first direction S1. When the pins 21 of the device support 10 are cut, the external fixing frame can fix multiple device supports 10 respectively, thereby improving the accuracy of the cutting position of the pins 21 and improving the structural consistency of the pins 21.

[0036] Optionally, the external fixing frame can also be connected to the pins 21 before cutting, so that the position of multiple pins 21 can be fixed by the external fixing frame during the injection molding of the housing 1 and during the cutting of the pins 21, so that the relative position accuracy between the housing 1 and the pins 21 can be higher.

[0037] By providing a slot 1420 on the second side 142 that protrudes from the first side 141 and the third side 143, the second side 142 can provide more space for the slot 1420, so that the slot 1420 can have a deeper groove without affecting other internal structures of the housing 1, so that it can be more securely engaged with the protrusion of the external fixing frame.

[0038] Referring to Figure 6, optionally, along the first direction S1, the slot 1420 has a depth d1, and the first step surface 144 has a width d2, where d1 > d2. This allows the slot 1420 to be recessed relative to the first side surface 141, so that the depth d1 is greater, thereby improving the engagement stability between the outer fixing frame's protrusion and the slot 1420. For ease of observation, the bottom position of the slot 1420, which is obscured by the solid structure of the housing 1, is shown by dashed lines in Figures 5 and 6.

[0039] To ensure a stable engagement between the external fixing frame's protrusion and the slot 1420, and thus to improve the limiting effect of the external fixing frame on the housing 1, the depth d1 can be relatively large. However, an excessively large depth d1 can cause the slot 1420 to affect the internal structure of the housing 1, for example, it may expose the pad portion 211 of the pin 21. Therefore, the depth d1 cannot be too large. Based on this, the depth d1 can optionally satisfy: 0.1 mm ≤ d1 ≤ 0.3 mm. For example, the depth d1 can be 0.1 mm, 0.12 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.18 mm, 0.2 mm, 0.22 mm, 0.24 mm, 0.25 mm, 0.26 mm, 0.28 mm, or 0.3 mm, etc.

[0040] Optionally, a plurality of slots 1420 are provided on a second side 142, and the plurality of slots 1420 are arranged along the second direction S2, thereby increasing the number of positions at which the external fixing frame applies a limiting force to the housing 1, thereby improving the limiting effect of the external fixing frame on the housing 1.

[0041] The minimum distance between two adjacent slots 1420 along the second direction S2 is h1. Since the dimensions of the second side 142 along the second direction S2 are limited, the distance h1 cannot be too large. In order to avoid the two slots 1420 from affecting each other and causing a decrease in the snap-fit ​​stability between the external fixing frame and the slot 1420, the distance h1 cannot be less than 0 (that is, the parts of the two adjacent slots 1420, except for the edges, cannot overlap). Based on this, the distance h1 can optionally satisfy: 0mm≤h1≤2mm. For example, the distance h1 can be 0mm, 0.02mm, 0.04mm, 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.2mm, 0.3mm, 0.5mm, 0.7mm, 1mm, 1.2mm, 1.4mm, 1.5mm, 1.7mm or 2mm, etc.

[0042] Optionally, the slot 1420 has a groove wall surface 1420a that is concave along the first direction S1. The groove wall surface 1420a is an arc surface, so that the protrusion of the outer fixing frame can be a fan-shaped thin sheet whose shape is adapted to the shape of the slot 1420. During the process of pressing the housing 1 relative to the outer fixing frame along the third direction S3 to detach it from the outer fixing frame, the edge of the protrusion that contacts the housing 1 is an arc edge. Therefore, the protrusion does not have a sharp corner part where the pressure is concentrated. During the process of the protrusion detaching from the housing 1, there are fewer debris generated by the scraping of the housing 1, and the shape of the housing 1 is less affected. The third direction S3 is perpendicular to the first direction S1 and the second direction S2.

[0043] Optionally, the edge of the third side 143 away from the cup-shaped portion 11 includes at least two chamfered segments 1430 and two inclined segments 1431. The two chamfered segments 1430 are located on two opposite sides of the third side 143 along the second direction S2. The two inclined segments 1431 are connected to the two chamfered segments 1430, and the closer the inclined segments 1431 are to the connected chamfered segments 1430, the further away from the cup-shaped portion 11 they are.

[0044] By including at least two chamfered segments 1430 and two inclined segments 1431 on the edge of the third side 143 away from the cup-shaped portion 11, the chamfered segments 1430 are located on two opposite sides of the third side 143 along the second direction S2, and the two inclined segments 1431 are connected to the two chamfered segments 1430 respectively. The closer the inclined segments 1431 are to the connected chamfered segments 1430, the further away they are from the cup-shaped portion 11. Thus, on the one hand, the base portion 12 of the housing 1 can form a chamfer at the bend of the main body portion 212. Since some material will bend when the main body portion 212 is bent, The inner side forms an accumulation, so this arrangement allows the base portion 12 to avoid the bend of the main body portion 212, which is beneficial for bending the main body portion 212 to an ideal angle. On the other hand, the surface of the base portion 12 away from the cup-shaped portion 11 includes two opposing inclined surfaces 120 along the second direction S2, so that the pin 21 can be bent to a greater extent along the inclined surfaces 120, so that the bend of the pin 21 can form a bend angle of less than 90 degrees. At this time, the bending stability of the pin 21 is greater than the bending stability of the pin 21 when the bend angle is equal to or greater than 90 degrees.

[0045] For example, the surface of the substrate 122 away from the cup-shaped portion 11 includes two inclined surfaces 120, which are opposite each other along the second direction S2. The portion of the inclined surface 120 that is closer to the outer periphery of the substrate 122 along the second direction S2 is further away from the cup-shaped portion 11. The solder foot portion 213 abuts against the inclined surface 120.

[0046] The inclined segment 1431 forms an angle θ1 with the second direction S2. The larger the angle θ1, the smaller the angle that the pin 21 can bend, and the better the stability of the bending state of the pin 21. However, if the angle θ1 is too large, the end of the solder foot 213 will be more recessed into the base part 12, which will easily lead to a decrease in the effective welding area between the solder foot 213 and the external structure. Therefore, the angle θ1 should not be too large. Based on this, the angle θ1 can optionally satisfy: 0 degrees < θ1 ≤ 10 degrees. For example, the angle θ1 can be 0.5 degrees, 1 degree, 2 degrees, 3 degrees, 4 degrees, 5 degrees, 6 degrees, 7 degrees, 8 degrees, 9 degrees or 10 degrees, etc.

[0047] Optionally, the solder foot portion 213 abuts against the side of the base portion 12 away from the cup-shaped portion 11 and has two inclined surfaces 120. The two inclined surfaces 120 are opposite each other along the second direction S2. The portion of the inclined surface 120 that is closer to the outer periphery of the base portion 12 along the second direction S2 is further away from the cup-shaped portion 11. The solder foot portion 213 abuts against the inclined surface 120, so that the pin 21 is bent to a greater extent along the inclined surface 120, so that the bending point of the pin 21 can form a bend angle of less than 90 degrees. At this time, the bending stability of the pin 21 is greater than the bending stability of the pin 21 when the bend angle is equal to or greater than 90 degrees.

[0048] Optionally, the first side 141 is inclined, and the two first side 141 are closer together the further away from the base portion 12. This reduces the area of ​​the first side 141 that can be scratched by the outer fixing frame during the process of the locking protrusion detaching from the housing 1, thereby reducing the debris generated by the scratching of the housing 1 and reducing the impact of the locking protrusion scratching on the first side 141. On the other hand, it facilitates demolding of the housing 1 after injection molding.

[0049] The first side 141 forms an angle θ2 with the third direction S3. The larger the angle θ2, the smaller the area of ​​the first side 141 that can be scratched by the clip protrusion of the outer fixing frame during the process of the clip protrusion detaching from the housing 1, and the easier it is to demold the housing 1. However, the closer the ends of the two first sides 141 that are away from the base part 12 are, the smaller the opening size of the cup-shaped space 110 will be, which will result in a smaller light emission angle of the light-emitting device 100. Therefore, the angle θ2 should not be too large. Based on this, the angle θ2 can optionally satisfy: 5 degrees ≤ θ2 ≤ 30 degrees. For example, the angle θ2 can be 5 degrees, 6 degrees, 8 degrees, 10 degrees, 12 degrees, 15 degrees, 17 degrees, 20 degrees, 22 degrees, 25 degrees, 27 degrees or 30 degrees, etc.

[0050] Along a direction perpendicular to both the first direction S1 and the second direction S2 (i.e., along the third direction S3), the second side surface 142 has a height h2. The height h2 can be selected based on the required height difference between two different climbing heights of the potting compound 300 on the side of the device support 10, thus selecting the height difference between the first step surface 144 and the second step surface 145. In practical designs, the height difference between the two different climbing heights of the potting compound 300 on the side of the device support 10 is typically in the range of 0.3mm to 1.5mm. Therefore, optionally, the height h2 can satisfy: 0.3mm ≤ h2 ≤ 1.5mm. For example, the height h2 can be 0.3mm, 0.5mm, 0.7mm, 0.9mm, 1mm, 1.1mm, 1.3mm, or 1.5mm, etc.

[0051] Along the first direction S1, the first step surface 144 has a width d2. The larger the width d2, the greater the restriction effect on the height of the potting compound 300, and the larger the setting space that the second side surface 142 can provide for the slot 1420. However, this will result in a larger size of the device bracket 10. Therefore, the width d2 cannot be too large. Based on this, the width d2 can optionally satisfy: 0.1mm≤d2≤0.3mm. For example, the width d2 can be 0.1mm, 0.12mm, 0.14mm, 0.15mm, 0.16mm, 0.18mm, 0.2mm, 0.22mm, 0.24mm, 0.25mm, 0.26mm, 0.28mm or 0.3mm, etc.

[0052] Along the first direction S1, the second step surface 145 has a width d3. The larger the width d3, the greater the restriction effect on the height of the potting compound 300, and the larger the setting space that the second side surface 142 can provide for the slot 1420. However, this will result in a smaller size of the base portion 12. Therefore, the width d3 cannot be too large. Based on this, the width d3 can optionally satisfy: 1mm≤d3≤3mm. For example, the width d3 can be 1mm, 1.2mm, 1.4mm, 1.5mm, 1.6mm, 1.8mm, 2mm, 2.2mm, 2.4mm, 2.5mm, 2.6mm, 2.8mm, or 3mm, etc.

[0053] Along the direction perpendicular to the first direction S1 and the second direction S2, the third side 143 has a height h3. The larger the height h3, the larger the height of the base portion 12. However, the smaller the height h3, the smaller the space that the pin 21 can be set along the outer periphery of the base portion 12, and the smaller the solderable surface area of ​​the pin 21 exposed to the outside. Therefore, the height h3 cannot be too small. Based on this, the height h3 can optionally satisfy: 0.3mm≤h3≤1.5mm. For example, the height h3 can be 0.3mm, 0.5mm, 0.7mm, 0.9mm, 1mm, 1.1mm, 1.3mm or 1.5mm, etc.

[0054] Optionally, the side surface of the housing 1 along the second direction S2 includes a fourth side surface 151 and a fifth side surface 152 arranged sequentially from the cup-shaped portion 11 to the base portion 12. The fourth side surface 151 is inclined, and the portions of the two fourth side surfaces 151 that are further away from the base portion 12 are closer together, thereby facilitating demolding of the housing 1 after injection molding.

[0055] The fourth side 151 forms an angle θ3 with the third direction S3. The larger the angle θ3, the easier it is to demold the shell 1. However, the closer the ends of the two fourth side 151 that are away from the base part 12 are, the smaller the opening size of the cup-shaped space 110 will be, which in turn will result in a smaller light emission angle of the light-emitting device 100. Therefore, the angle θ3 should not be too large. Optionally, the angle θ3 can satisfy: 5 degrees ≤ θ3 ≤ 30 degrees. For example, the angle θ3 can be 5 degrees, 6 degrees, 8 degrees, 10 degrees, 12 degrees, 15 degrees, 17 degrees, 20 degrees, 22 degrees, 25 degrees, 27 degrees or 30 degrees, etc.

[0056] Optionally, the angle θ3 formed by the fourth side 151 and the third direction S3 and the angle θ2 formed by the first side 141 and the third direction S3 satisfy: θ3 < θ2, thereby making the demolding of the shell 1 easier and ensuring that the opening size of the cup-shaped space 110 meets the usage requirements, while better reducing the area that the protrusion of the outer fixing frame can scratch the first side 141 during the process of the protrusion of the outer fixing frame detaching from the shell 1.

[0057] Optionally, the fifth side 152 is inclined, and the portions of the two fifth side 152 that are further away from the cup-shaped portion 11 are closer together, thereby facilitating demolding of the housing 1 after injection molding.

[0058] Optionally, the fourth side 151 protrudes relative to the fifth side 152 along the second direction S2, and a third step surface 153 is formed between the fifth side 152 and the fourth side 151. This allows the potting compound 300 that climbs along the outer periphery of the base portion 12 of the device support 10 to be blocked by the third step surface 153, and also provides an attachment object for the potting compound 300, so that the potting compound 300 can be easily maintained at the height of the third step surface 153, thereby making it easy to control the climbing height of the potting compound 300 on the side of the device support 10.

[0059] Referring to Figure 9, along the second direction S2, the third step surface 153 has a width d4. Optionally, the width d3 of the second step surface 145 and the width d4 of the third step surface 153 can satisfy: d3 < d4. This helps to allow more potting compound 300 to cover the protruding side of the pin 21 of the housing 1, so that the potting compound 300 can better encapsulate and protect the pin 21.

[0060] The larger the width d4, the greater the restriction on the height of the potting compound 300, but the smaller the size of the base part 12 will be. Therefore, the width d4 cannot be too large. Based on this, the width d4 can optionally satisfy: 0.3mm≤d4≤1mm, for example, the width d4 can be 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, etc.

[0061] Optionally, the third step surface 153 is provided with a clearance groove 1530 corresponding to the main body 212, and the main body 212 is partially located in the clearance groove 1530. This allows the main body 212 to be cleared by the clearance groove 1530, which helps to make the structure of the device support 10 more compact. In addition, this arrangement can also form a small gap between the groove wall of the clearance groove 1530 and the part of the main body 212 that just protrudes from the housing 1. This allows the potting compound 300 to spread along the gap between the groove wall of the clearance groove 1530 and the main body 212 under capillary action, making it easier for the potting compound 300 to cover the surface of the part of the main body 212 that protrudes from the housing 1. As a result, the potting compound 300 provides better encapsulation and protection for the pins 21.

[0062] Along the direction S3 perpendicular to the third direction, the clearance groove 1530 has a depth h7. The greater the depth h7 of the clearance groove 1530, the greater the clearance effect on the main body 212. However, the size of the pin 21 is limited. Therefore, when the depth h7 is too large, the clearance effect of the clearance groove 1530 will not be improved. So the depth h7 cannot be too large. Based on this, the depth h7 of the clearance groove 1530 can optionally satisfy: 0.3mm≤h7≤1.3mm. For example, the depth h7 of the clearance groove 1530 can be 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm or 1.3mm, etc.

[0063] Optionally, the main body 212 extends out of the housing 1 from the fourth side 151, and the third step surface 153 is located on the side of the main body 212 extending from the fourth side 151 near the base 12. This allows for more comprehensive coverage of the part of the main body 212 that just extends out of the housing 1 by means of the side wall of the clearance groove 1530. On the one hand, this makes it easier to cover the outer peripheral surface of the part of the main body 212 that extends out of the housing 1 with potting compound 300. On the other hand, it makes the structure of the device support 10 more compact.

[0064] The fifth side 152, connected to the edge of the third step surface 153, has a distance h8 between it and the end face of the base portion 12 furthest from the cup-shaped portion 11. The larger the distance h8, the farther the fourth side 151 is from the end face furthest from the cup-shaped portion 11, and the worse the structural compactness of the housing 1. However, the smaller the distance h8, the closer the fourth side 151 is to the end face furthest from the cup-shaped portion 11, and the smaller the space available for the fifth side 152. Therefore, the distance h8 cannot be too large or too small. Based on this, optionally, the distance h8 between the edge of the fifth side 152 connected to the third step surface 153 and the end face of the base portion 12 furthest from the cup-shaped portion 11 can satisfy: 0.3mm≤h8≤1.3mm. For example, the distance h8 can be 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, or 1.3mm, etc.

[0065] The fifth side 152, the edge furthest from the third step surface 153, and the base portion 12, the end face furthest from the cup-shaped portion 11, have a distance h9 between them. The smaller the distance h9, the more compact the structure of the housing 1, but the more difficult it is to set other structures (such as the boss 123 mentioned later) on the base portion 12. Based on this, the distance h9 between the fifth side 152, the edge furthest from the third step surface 153, and the end face of the base portion 12, the end face furthest from the cup-shaped portion 11, can satisfy: 0.05mm ≤ h9 ≤ 0.35mm. For example, the distance h9 can be 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, or 0.35mm, etc.

[0066] When the fifth side 152 simultaneously satisfies 0.3mm≤h8≤1.3mm and 0.05mm≤h9≤0.35mm, the structure of the fifth side 152 is more reasonable, which can make the structure of the shell 1 more compact while better meeting other design requirements.

[0067] Optionally, the fourth side 151 is provided with a waterproof step 13 protruding along the second direction S2, thereby extending the path of water vapor to the pin 21 through the waterproof step 13, which helps to prevent water vapor from entering the interior of the housing 1 or even the cup-shaped space 110 along the pin 21.

[0068] Along the direction perpendicular to the first direction S1 and the second direction S2 (i.e., along the third direction S3), the waterproof step 13 has a height h4. The larger the height h4, the better the structural strength of the waterproof step 13, and the less likely it is to be damaged by bumps during transportation and use. Therefore, it is easier to maintain a more stable waterproof effect. However, if the height h4 is too large, it will result in a larger volume of the device support 10. Therefore, the height h4 should not be too large or too small. Based on this, the height h4 can optionally satisfy: 0.3mm≤h4≤1mm. For example, the height h4 can be 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, etc.

[0069] Optionally, along a direction perpendicular to the third direction S3, the waterproof step 13 has a fourth step surface 130 and a fifth step surface 131, the fourth step surface 130 being connected to the fourth side surface 151 and the fifth step surface 131 being connected to the third step surface 153.

[0070] Along the second direction S2, the fourth step surface 130 has a width d5. The larger the width d5, the greater the effect of extending the path of the waterproof step 13 to the pin 21. However, if the width d5 ​​is too large, it will result in a larger volume of the device support 10. Therefore, the width d5 ​​cannot be too large or too small. Optionally, the width d5 ​​can satisfy: 0.1mm≤d5≤0.5mm. For example, the width d5 ​​can be 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm or 0.5mm, etc.

[0071] Optionally, the fifth step surface 131 is flush with the third step surface 153, thus the structure of the device support 10 is simpler and easier to manufacture.

[0072] When the third step surface 153 is provided with a relief groove 1530 corresponding to the main body 212 as described in the foregoing embodiments, the relief groove 1530 may optionally extend to the fifth step surface 131 to avoid the pin 21 before the pin 21 is bent.

[0073] Please refer to Figures 1, 3, 4 and 7. Optionally, the base portion 12 is provided with a glue injection groove 121 on the surface opposite to the cup-shaped portion 11. The bottom surface of the glue injection groove 121 includes an intermediate sub-surface 1210 and an annular sub-surface 1211 surrounding the intermediate sub-surface 1210. The roughness of the intermediate sub-surface 1210 is greater than that of the annular sub-surface 1211. This arrangement allows for a larger effective connection area between the annular sub-surface 1211 and the potting compound 300, resulting in better connection stability between the annular sub-surface 1211 and the potting compound 300, thereby improving the bonding stability between the potting compound 300 and the device support 10.

[0074] In some embodiments, the injection groove 121 is a structure formed by the injection port on the mold when the shell 1 is formed by injection molding.

[0075] To ensure good bonding stability between the intermediate sub-surface 1210 and the potting compound 300, and to facilitate the manufacture of the intermediate sub-surface 1210, the surface roughness Sa of the intermediate sub-surface 1210 may optionally satisfy: 5 micrometers (um) ≤ Sa ≤ 20 micrometers (um). For example, the surface roughness Sa of the intermediate sub-surface 1210 may be 5um, 6um, 8um, 10um, 12um, 14um, 15um, 16um, 18um, or 20um, etc.

[0076] The annular sub-surface 1211 has a width d6. The smaller the width d6, the larger the area occupied by the middle sub-surface 1210 on the bottom surface of the potting groove 121, and the better the bonding stability between the potting compound 300 and the device support 10. Therefore, it is necessary to make the width d6 smaller. Based on this, the width d6 can optionally satisfy: 150um≤d6≤600um. For example, the width d6 can be 150um, 200um, 250um, 300um, 350um, 400um, 450um, 500um, 550um or 600um, etc.

[0077] Optionally, the injection groove 121 is located in the middle of the surface of the base portion 12 away from the cup-shaped portion 11, so that the diffusion uniformity of the injection molding material is better during the injection molding of the housing 1, thereby improving the yield of the housing 1.

[0078] In some embodiments, the shape and structure of the dispensing port can be selected according to usage and design needs, so that the outline formed by the dispensing groove 121 on the surface of the base portion 12 can be of different shapes. Optionally, the outline formed by the dispensing groove 121 on the surface of the base portion 12 may include a circle, a polygon, an ellipse, or an irregular shape. In addition, when the outline formed by the dispensing groove 121 on the surface of the base portion 12 is a polygon, the connection between adjacent sides of the polygon may also be rounded.

[0079] Referring to Figures 8 and 9, optionally, the base portion 12 includes a base 122 and a boss 123. The base 122 is connected to the cup-shaped portion 11, and the solder foot portion 213 abuts against the base 122. The boss 123 is located on the side of the base 122 away from the cup-shaped portion 11. The boss 123 and the solder foot portion 213 are spaced apart. The glue injection groove 121 is located on the boss 123, so that the solder foot portion 213 can be partially shielded by the boss 123, thereby reducing the protrusion height of the solder foot portion 213 protruding from the base portion 12 in the third direction S3, which helps to reduce the warping caused by scratches during the transportation of the device bracket 10. In addition, this arrangement allows for a smaller gap between the solder foot 213 and the boss 123, making it easier for the potting compound 300 to diffuse along the gap between the solder foot 213 and the boss 123 under capillary action. This makes it easier for the potting compound 300 to cover the surface of the solder foot 213, resulting in better encapsulation and protection of the solder foot 213 by the potting compound 300.

[0080] Optionally, along the first direction S1, the size of the boss 123 is equal to the size of the base 122, so that the boss 123 can provide more comprehensive shielding of the weld foot 213 along the first direction S1.

[0081] Optionally, the protrusion height h5 of the boss 123 protruding from the base 122 can satisfy: 0.05mm≤h5≤0.5mm. For example, the protrusion height h5 can be 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm or 0.5mm, etc., so that the boss 123 can provide a better shielding effect for the solder foot 213, and the boss 123 will not be too high, which would cause the device support 10 to be too large in the third direction S3.

[0082] To avoid interference between the weld foot 213 and the boss 123 after the main body 212 is bent, which would prevent the main body 212 from bending into place, a redundant spacing needs to be designed for the weld foot 213 and the boss 123. Therefore, an actual spacing d7 will be formed between the weld foot 213 and the boss 123. This spacing d7 may be small, close to 0.01mm, or it may be larger than the designed redundant spacing, resulting in a larger spacing d7. Based on this, optionally, the distance d7 between the weld foot 213 and the boss 123 can satisfy: 0.01mm≤d7≤0.5mm. For example, the distance d7 can be 0.01mm, 0.02mm, 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm or 0.5mm, etc.

[0083] Optionally, the boss 123 includes a middle portion 1230 and a partition 1231. The middle portion 1230 is located between weld feet 213 spaced along the second direction S2. The first end of the partition 1231 is connected to the middle portion 1230, and the second end of the partition 1231 extends to one side of the weld foot 213 along the first direction S1. The glue injection groove 121 is provided in the middle portion 1230, so that the middle portion 1230 can block one side of the weld foot 213 along the second direction S2, and the partition 1231 can block one side of the weld foot 213 along the first direction S1. In addition, the middle portion 1230 and the partition 1231 can separate adjacent weld feet 213, so as to reduce the possibility of solder overflow when the weld feet 213 are welded to the external structure, causing short circuits between different weld feet 213.

[0084] Optionally, the connection between the partition 1231 and the middle part 1230 is rounded, which makes the transition between the partition 1231 and the middle part 1230 smoother. This helps to reduce the possibility of excessive shrinkage and other defects at the connection between the partition 1231 and the middle part 1230 after injection molding, and can improve the performance stability of the shell 1.

[0085] Optionally, at least a portion of the edges of the partition 1231 are rounded, which on the one hand makes the transition at the edge of the partition 1231 smooth, which helps to reduce the possibility of excessive shrinkage and other defects at the edge of the partition 1231 and improves the performance stability of the housing 1. On the other hand, when the main body 212 is bent and the weld foot 213 interferes with the rounded portion of the partition 1231, the rounded portion of the partition 1231 can be used to guide the weld foot 213 to move along the surface of the rounded corner, so that the weld foot 213 is located on one side of the partition 1231 along the first direction S1 as the main body 212 is bent.

[0086] Optionally, the device support 10 includes a plurality of solder feet 213, and the substrate 122 abuts against the same side of the substrate along the second direction S2. The plurality of solder feet 213 are spaced apart along the first direction S1. Thus, on the one hand, the plurality of solder feet 213 can be electrically connected to the external circuit to achieve more complex circuit control. On the other hand, the effective welding area between the device support 10 and the external structure can be larger, thereby improving the welding stability between the device support 10 and the external structure.

[0087] Optionally, a partition 1231 is provided between two adjacent weld feet 213 along the first direction S1. This partition 1231 can simultaneously shield the weld feet 213 on both sides along the first direction S1, thereby improving the shielding effect of the weld feet 213. On the other hand, it can prevent the possibility of solder overflow from the weld feet 213 to the external structure, which could cause the two adjacent weld feet 213 along the first direction S1 to short-circuit.

[0088] Optionally, for any solder foot 213, a partition 1231 is provided on both sides of the solder foot 213 along the first direction S1, so that the partition 1231 can block both sides of the solder foot 213 along the first direction S1, thereby improving the blocking and protection effect of the solder foot 213, and making the solder foot 213 less prone to warping or deformation due to scratches during the transportation of the device bracket 10.

[0089] The partition 1231 has a width d8 along the first direction S1. The larger the width d8, the better the structural strength of the partition 1231. However, the larger the installation space occupied by the partition 1231, the closer the distance between the partition 1231 and the weld foot 213 becomes. Therefore, in order to avoid interference between the partition 1231 and the weld foot 213, the width d8 cannot be too large. Based on this, the width d8 of the partition 1231 along the first direction S1 can optionally satisfy: 0.05mm≤d8≤1mm. For example, the width d8 can be 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm, 0.8mm, 0.85mm, 0.9mm, 0.95mm or 1mm, etc.

[0090] Optionally, the partition 1231 and the middle part 1230 protrude from the base 122 at the same height, so that there is no height difference between the partition 1231 and the middle part 1230, which makes the structure of the base part 12 simple and easy to form.

[0091] Optionally, the boss 123 is provided with at least one groove 1232, which is spaced apart from the potting groove 121. The groove 1232 is used to fill the potting compound 300, thereby increasing the connection surface area between the boss 123 and the potting compound 300, improving the bonding stability between the potting compound 300 and the device support 10, and reducing the weight and material cost of the housing 1. In addition, by providing the groove 1232, a certain overflow space can be provided for the solder when the solder feet 213 are soldered to the external structure, thereby reducing the possibility of short circuits between the spaced solder feet 213.

[0092] Optionally, the groove 1232 can also extend along its groove depth direction to the substrate 122, that is, the bottom surface of the groove 1232 can be located on the substrate 122, thereby increasing the connection surface area between the boss 123 and the potting compound 300, so as to improve the bonding stability between the potting compound 300 and the device support 10, and reduce the weight and material cost of the housing 1. The groove 1232 has a groove depth h6. The larger the groove depth h6, the larger the connectable surface area between the boss 123 and the potting compound 300, and the lower the weight and material cost of the housing 1. However, if the groove depth h6 is too large, the potting compound 300 has limited ability to climb along the groove wall of the groove 1232, which may result in spaces in the groove 1232 that cannot be filled by the potting compound 300, thus reducing the bonding stability between the potting compound 300 and the housing 1. Therefore, the groove depth h6 should not be too large. Based on this, the groove depth h6 of the groove 1232 can optionally satisfy: 0.1mm≤h6≤0.5mm, for example, the groove depth h6 can be 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm or 0.5mm, etc.

[0093] Referring to Figures 10 and 11, optionally, a first groove 1232a is provided between the opposite solder feet 213 along the second direction S2, thereby improving the bonding stability between the potting compound 300 and the device support 10, reducing the weight and material cost of the housing 1, and reducing the possibility of short circuits between the opposite solder feet 213 along the second direction S2.

[0094] The larger the length c1 of the contour shape formed by the first groove 1232a on the surface of the boss 123, the better the effect of increasing the connection surface area between the boss 123 and the potting compound 300, and the greater the effect of reducing the weight and material cost of the housing 1. However, it will lead to a poorer structural strength of the boss 123. Therefore, the length c1 should not be too large. Based on this, the length c1 of the contour shape formed by the first groove 1232a on the surface of the boss 123 can optionally satisfy: 0.1mm≤c1≤2.5mm. For example, the length c1 can be: 0.1mm, 0.2mm, 0.3mm, 0.5mm, 0.7mm, 1mm, 1.2mm, 1.4mm, 1.5mm, 1.7mm, 2mm, 2.2mm or 2.5mm, etc.

[0095] Optionally, the first groove 1232a extends through one side surface of the boss 123 along the first direction S1, thereby making it easier for the potting compound 300 to enter the first groove 1232a from one side of the boss 123 along the first direction S1, thus improving the filling effect of the potting compound 300 on the first groove 1232a. On the other hand, it also allows the solder overflowing into the first groove 1232a to overflow to one side of the boss 123 along the first direction S1, thereby reducing the possibility of short circuit between the opposite solder feet 213 along the second direction S2.

[0096] Optionally, a second groove 1232b is provided between adjacent solder feet 213 along the first direction S1. Two partitions 1231 are provided on both sides of the second groove 1232b along the first direction S1. The ends of the two partitions 1231 away from the middle part 1230 are spaced apart or connected to each other. This can improve the bonding stability between the potting compound 300 and the device support 10 through the second groove 1232b, reduce the weight of the housing 1 and the material cost, and reduce the possibility of short circuits between adjacent solder feet 213 along the first direction S1.

[0097] The larger the length c2 of the contour shape formed by the second groove 1232b on the surface of the boss 123, the better the effect of increasing the connection surface area between the boss 123 and the potting compound 300, and the greater the reduction in weight and material cost of the housing 1. However, it will lead to a poorer structural strength of the boss 123. Therefore, the length c2 should not be too large. Based on this, the length c2 of the contour shape formed by the second groove 1232b on the surface of the boss 123 can optionally satisfy: 0.1mm≤c2≤0.6mm. For example, the length c2 can be 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm or 0.6mm, etc.

[0098] Optionally, at least one groove 1232 has a marking structure 1232c at the bottom. The marking structure 1232c may include recesses or protrusions in the shape of letters, symbols, geometric shapes, or numbers. The marking structure 1232c is used to mark the polarity of the solder feet 213 of the device bracket 10 so that when the light-emitting device 100 is assembled, the multiple solder feet 213 can be respectively connected to the respective input and output terminals in the external circuit.

[0099] As shown in Figure 12, this application also provides a light-emitting device 100, including a light-emitting chip 20, encapsulating adhesive 30, and a device support 10 as described in the previous embodiments. Referring again to Figures 1 and 3, the light-emitting chip 20 is disposed within the cup-shaped space 110 of the light-emitting chip 20 and is fixedly connected and electrically conductive to the pad portion 211 of the light-emitting chip 20. The encapsulating adhesive 30 covers the light-emitting chip 20 and the pad portion 211. By using the aforementioned device support 10, the encapsulating adhesive 300 can better encapsulate and protect the light-emitting device 100, and can also improve the structural consistency and bending stability of the pins 21.

[0100] As shown in Figure 13, this application also provides a light-emitting device, including a substrate 200 and at least one light-emitting device 100 as described in the foregoing embodiments. Referring again to Figures 1 and 3, the substrate 200 has a control circuit, and a potting compound 300 is disposed on the substrate 200, connected to the base portion 12 of the light-emitting device 100, and covers the portion of the pins 21 exposed to the outside of the light-emitting device 100. The solder pad portion 213 of the light-emitting device 100 is fixedly connected and electrically connected to the control circuit. By using the aforementioned light-emitting device 100, the overall structural stability and operational stability of the light-emitting device can be improved.

[0101] In some embodiments, the control circuitry may be placed on the front or back of the substrate 200.

[0102] In some embodiments, this application includes at least the following features:

[0103] By forming a second stepped surface 145 on the side of the housing 1 along the first direction S1, the potting compound 300 that climbs along the outer periphery of the base portion 12 of the device support 10 can be provided with an attachment object through the second stepped surface 145, increasing the bonding force between the two, so that the potting compound 300 covers the part of the pin 21 exposed to the outside of the light-emitting device 100, reducing the entry of moisture into the light-emitting device along the connection between the pin 21 and the base portion 12, so that the potting compound 300 can better encapsulate and protect the device support 10.

[0104] By providing a slot 1420 on the second side 142, the protrusion of the external fixing frame can be engaged with the slot 1420 to restrict the posture of the housing 1 from the two opposite sides along the first direction S1. When cutting the pins 21 of the device support 10, the external fixing frame can fix multiple device supports 10 respectively, thereby improving the accuracy of the cutting position of the pins 21 and improving the structural consistency of the pins 21.

[0105] By including at least two chamfered segments 1430 and two inclined segments 1431 on the edge of the third side 143 away from the cup-shaped portion 11, the chamfered segments 1430 are located on two opposite sides of the third side 143 along the second direction S2, and the two inclined segments 1431 are connected to the two chamfered segments 1430 respectively. The closer the inclined segments 1431 are to the connected chamfered segments 1430, the further away they are from the cup-shaped portion 11. Thus, on the one hand, the base portion 12 of the housing 1 can form a chamfer at the bend of the main body portion 212. Since some material will bend when the main body portion 212 is bent, The inner side forms an accumulation, so this arrangement allows the base portion 12 to avoid the bend of the main body portion 212, which is beneficial for bending the main body portion 212 to an ideal angle. On the other hand, the surface of the base portion 12 away from the cup-shaped portion 11 includes two opposing inclined surfaces 120 along the second direction S2, so that the pin 21 can be bent to a greater extent along the inclined surfaces 120, so that the bend of the pin 21 can form a bend angle of less than 90 degrees. At this time, the bending stability of the pin 21 is greater than the bending stability of the pin 21 when the bend angle is equal to or greater than 90 degrees.

[0106] In this description, the terms "upper," "lower," "left," "right," etc., refer to the orientations or positional relationships shown in the accompanying drawings, and are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Furthermore, the terms "first" and "second" are used for distinction in description and have no special meaning.

[0107] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

Claims

1. A device support, comprising: A housing includes a cup-shaped portion and a base portion. The cup-shaped portion is disposed on one side of the base portion and has a cup-shaped space with an opening facing away from the base portion. The side of the housing along a first direction includes a first side, a second side, and a third side arranged sequentially from the cup-shaped portion to the base portion. The second side protrudes outward from the housing along the first direction relative to the first side and the third side. A first stepped surface is formed between the second side and the first side, and a second stepped surface is formed between the second side and the third side. The second side is provided with a slot. The edge of the third side away from the cup-shaped portion includes at least two chamfered segments and two inclined segments. The two chamfered segments are respectively located on two opposite sides of the third side along the second direction. The two inclined segments are respectively connected to the two chamfered segments, and the closer the inclined segments are to the connected chamfered segments, the further away from the cup-shaped portion they are. as well as, A lead frame includes multiple pins, each pin including a pad portion, a body portion, and a solder foot portion connected in sequence. At least a portion of the pad portion is located within the cup-shaped space. The body portion extends from one side of the housing along a second direction and is bent so that the solder foot portion abuts against the side of the base portion away from the cup-shaped portion. The body portion extends from both opposite sides of the housing along the second direction, and the first direction is perpendicular to the second direction.

2. The device holder of claim 1, wherein, Along the first direction, the slot has a depth d1, and the first step surface has a width d2, where d1 > d2.

3. The device holder of claim 1, wherein, Along the first direction, the slot has a depth d1, 0.1 mm ≤ d1 ≤ 0.3 mm.

4. The device holder of claim 1, wherein, A plurality of card slots are provided on one of the second side surfaces, and the plurality of card slots are arranged along the second direction.

5. The device holder of claim 4, wherein, The minimum distance between two adjacent slots along the second direction is h1, where 0 mm ≤ h1 ≤ 2 mm.

6. The device holder according to any one of claims 1-5, wherein, The slot has a concave groove wall surface along the first direction, and the groove wall surface is an arc surface.

7. The device holder of claim 1, wherein, The inclined segment forms an angle θ1 with the second direction, where 0 degrees < θ1 ≤ 10 degrees.

8. The device holder of claim 1, wherein, The weld foot abuts against the side of the base portion away from the cup-shaped portion and has two inclined surfaces. The two inclined surfaces are opposite each other along the second direction. The portion of the inclined surface that is closer to the outer periphery of the base portion along the second direction is further away from the cup-shaped portion. The weld foot abuts against the inclined surfaces.

9. The device holder of claim 1, wherein, The first side is inclined, and the portions of the two first sides that are further away from the base portion are closer together.

10. The device holder of claim 9, wherein, The first side faces an angle θ2 with the third direction, where 5 degrees ≤ θ2 ≤ 30 degrees, and the third direction is perpendicular to both the first and second directions.

11. The device holder according to any one of claims 1-5 or any one of claims 7-10, wherein, The geometric information of the device support includes at least one of the following: Along a direction perpendicular to both the first and second directions, the second side has a height h2, where 0.3 mm ≤ h2 ≤ 1.5 mm; or, Along the first direction, the first step surface has a width d2, 0.1 mm ≤ d2 ≤ 0.3 mm.

12. The device holder according to any one of claims 1-5 or any one of claims 7-10, wherein, The geometric information of the device support includes at least one of the following: Along a direction perpendicular to both the first and second directions, the third side has a height h3, where 0.3 mm ≤ h3 ≤ 1.5 mm; or, Along the first direction, the second step surface has a width d3, where 1 mm ≤ d3 ≤ 3 mm.

13. The device holder according to any one of claims 1-5 or any one of claims 7-10, wherein, The side surface of the housing along the second direction includes a fourth side surface and a fifth side surface arranged sequentially from the cup-shaped portion to the base portion. The fourth side surface is inclined, and the portions of the two fourth side surfaces that are further away from the base portion are closer to each other.

14. The device holder of claim 13, wherein, The fourth side forms an angle θ3 with the third direction, where 5 degrees ≤ θ3 ≤ 30 degrees, and the third direction is perpendicular to both the first and second directions.

15. The device holder of claim 13, wherein, The angle θ3 formed by the fourth side and the third direction and the angle θ2 formed by the first side and the third direction satisfy: θ3 < θ2, wherein the third direction is perpendicular to the first direction and the second direction.

16. The device holder of claim 13, wherein, The fifth side is inclined, and the portions of the two fifth sides that are further away from the cup-shaped portion are closer together.

17. The device holder of claim 13, wherein, The fourth side protrudes relative to the fifth side along the second direction, and a third stepped surface is formed between the fifth side and the fourth side.

18. The device holder of claim 17, wherein, Along the second direction, the third step surface has a width d4, 0.3 mm ≤ d4 ≤ 1 mm.

19. The device holder of claim 17, wherein, The third step has a clearance groove corresponding to the main body, and part of the main body is located in the clearance groove.

20. The device holder of claim 19, wherein, Along a direction perpendicular to the first direction and the second direction, the clearance groove has a depth h7, 0.3 mm ≤ h7 ≤ 1.3 mm.

21. The device holder of claim 19, wherein, The main body extends out of the housing from the fourth side, and the third stepped surface is located on the side of the main body extending from the fourth side, close to the base.

22. The device holder of claim 17, wherein, The geometric information of the device support includes at least one of the following: The distance h8 between the edge of the fifth side surface connected to the third step surface and the end face of the base portion furthest from the cup-shaped portion satisfies: 0.3 mm ≤ h8 ≤ 1.3 mm; or, The distance h9 between the edge of the fifth side furthest from the third step surface and the end face of the base furthest from the cup-shaped part satisfies: 0.05 mm ≤ h9 ≤ 0.35 mm.

23. The device holder of claim 17, wherein, The fourth side protrudes along the second direction and is provided with a waterproof step.

24. The device holder of claim 23, wherein, Along a direction perpendicular to the first direction and the second direction, the waterproof step has a height h4, where 0.3 mm ≤ h4 ≤ 1 mm.

25. The device holder of claim 23, wherein, Along a direction perpendicular to the first direction and the second direction, the waterproof step has opposing fourth step surfaces and fifth step surfaces, the fourth step surface being connected to the fourth side surface, and along the second direction, the fourth step surface having a width d5, 0.1 mm ≤ d5 ≤ 0.5 mm; The fifth step surface is connected to the third step surface and is flush with the third step surface.

26. A light-emitting device, comprising a light-emitting chip, encapsulating adhesive, and a device support as described in any one of claims 1-25, wherein the light-emitting chip is disposed within a cup-shaped space of the light-emitting chip and is fixedly connected and electrically connected to a pad portion of the light-emitting chip, and the encapsulating adhesive covers the light-emitting chip and the pad portion.

27. A light-emitting device, comprising a substrate, a potting compound, and at least one light-emitting device as claimed in claim 26, wherein the substrate has a control circuit, the solder pads of the light-emitting device are fixedly connected to and electrically connected to the control circuit, and the potting compound is disposed on the substrate, connected to the base portion of the light-emitting device, and covers the portion of the pins exposed to the outside of the light-emitting device.

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