A thermally conductive adhesive fixing structure for chip packaging
By designing a thermally conductive adhesive fixing structure, and utilizing components such as a substrate, thermally conductive adhesive filling groove, connecting plate, and elastic retaining ring, the problem of position movement during chip packaging is solved, thereby improving the stability and reliability of the packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN SHISHIYUZHIYUAN TECHNOLOGY CO LTD
- Filing Date
- 2025-08-15
- Publication Date
- 2026-07-03
AI Technical Summary
In existing technologies, the chip's position is prone to shifting during the packaging process, resulting in poor packaging stability and thermal conductivity.
The packaging uses a thermally conductive adhesive fixing structure, which includes components such as a substrate, thermally conductive adhesive filling groove, connecting plate, elastic retaining ring, and guide post. The precise positioning and limiting structure ensures the stability of the chip during the packaging process.
It effectively prevents chip displacement and slippage during the packaging process due to incomplete curing of the colloid, thus improving the stability of the packaging and its long-term reliability.
Smart Images
Figure CN224460595U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip processing technology, and in particular to a thermally conductive adhesive fixing structure for chip packaging. Background Technology
[0002] Chip fabrication refers to the entire process of transforming a designed integrated circuit from raw materials into a chip core with specific functions through a series of precision manufacturing processes. The end point of chip fabrication is the bare chip, and the starting point of packaging is the processing of the bare chip. The bare chip needs to be packaged to achieve physical protection, electrical connection and heat dissipation in order to become a chip product that can be used in practice. The core function of thermal conductive adhesive is to fill the gap between the bare chip and the packaging substrate and reduce thermal resistance. Its performance parameters need to be selected according to the thermal characteristics of the chip determined by the processing stage.
[0003] When packaging and fixing existing chips, the chip's position can usually only be simply limited by the slot position, and secondary auxiliary positioning cannot be implemented. As a result, the chip is very prone to positional displacement during the packaging and filling of thermal conductive adhesive, which in turn affects the stability of the packaging and the thermal conductivity. Utility Model Content
[0004] The technical problem to be solved by this utility model is that the chip is prone to displacement during the packaging and fixing process in the prior art. To address this, we propose a thermally conductive adhesive fixing structure for chip packaging.
[0005] To achieve the above objectives, this application adopts the following technical solution: a thermally conductive adhesive fixing structure for chip packaging, comprising a substrate: a chip body is mounted on the top of the substrate, a thermally conductive adhesive filling groove is formed on the top of the substrate, the chip body is placed inside the thermally conductive adhesive filling groove, four connecting plates are mounted on the top of the substrate, and elastic retaining rings are mounted on the top of the connecting plates, with the bottom end of the elastic retaining rings abutting against the top of the chip body.
[0006] Preferably, the interior of the thermally conductive adhesive filling groove is equipped with fixing ribs, and the number of fixing ribs is multiple and the shape is square.
[0007] Preferably, four guide pillars are installed inside the thermally conductive adhesive filling groove, and four guide grooves are formed on the surface of the chip body. The inside of the guide pillars is slidably connected to the guide grooves.
[0008] Preferably, the inner diameter of the guide groove is designed to match the size of the guide post.
[0009] Preferably, the surface of the elastic retaining ring is fitted with a rubber contact pad.
[0010] The technical effects and advantages of this utility model are as follows:
[0011] In this invention, by precisely fixing the position of the chip body, a stable limiting structure can be formed when the thermally conductive adhesive comes into contact with the chip body. This effectively prevents displacement such as shifting or sliding of the adhesive due to incomplete curing, fundamentally avoiding poor contact caused by adhesive displacement during the encapsulation process, and significantly improving the overall stability and long-term reliability of the chip body during encapsulation. Attached Figure Description
[0012] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts:
[0013] Figure 1 This is a schematic diagram of the main structure of the substrate and chip of this utility model;
[0014] Figure 2 This is a schematic diagram of the substrate body of this utility model and an enlarged structural diagram.
[0015] Figure 3 This is a schematic diagram of the main structure of the chip of this utility model;
[0016] Figure 4 This is a schematic diagram of the connecting plate and elastic retaining ring structure of this utility model.
[0017] Illustration: 1. Substrate; 2. Chip body; 3. Thermal adhesive filling groove; 4. Connecting plate; 5. Elastic retaining ring; 6. Fixing rib; 7. Guide post; 8. Guide groove; 9. Rubber contact pad. Detailed Implementation
[0018] Based on the technical solution of this utility model, without changing the essential spirit of this utility model, those skilled in the art can propose various interchangeable structural methods and implementation methods. Therefore, the following specific embodiments and accompanying drawings are only exemplary descriptions of the technical solution of this utility model, and should not be regarded as the whole of this utility model or as a limitation or restriction on the technical solution of this utility model.
[0019] Reference Figure 1 - Figure 4As shown, this utility model provides a technical solution: a thermally conductive adhesive fixing structure for chip packaging, including a substrate 1: a chip body 2 is mounted on the top of the substrate 1, a thermally conductive adhesive filling groove 3 is opened on the top of the substrate 1, the chip body 2 is placed inside the thermally conductive adhesive filling groove 3, four connecting plates 4 are mounted on the top of the substrate 1, an elastic retaining ring 5 is mounted on the top of the connecting plate 4, the bottom end of the elastic retaining ring 5 abuts against the top of the chip body 2, four guide posts 7 are installed inside the thermally conductive adhesive filling groove 3, four guide grooves 8 are opened on the surface of the chip body 2, the inside of the guide posts 7 is slidably connected to the guide grooves 8, the inner diameter of the guide grooves 8 is designed to match the size of the guide posts 7, and a rubber contact pad 9 is mounted on the surface of the elastic retaining ring 5.
[0020] Specifically: When the staff needs to install the chip body 2 onto the substrate 1, they first need to fill an appropriate amount of thermally conductive adhesive into the thermally conductive adhesive filling groove 3. After filling, the chip body 2 is placed in the thermally conductive adhesive filling groove 3. During the placement process, it is necessary to ensure that the matching guide groove 8 designed on the surface of the chip body 2 is accurately aligned with the guide post 7 to achieve stable guidance of the chip body 2 during installation. After placement, the elastic ring 5 will act on the top of the chip body 2 to provide a stable auxiliary limiting effect, ensuring that the thermally conductive adhesive will not shift during the drying process. In addition, the rubber contact pad 9 can enhance the contact friction and further improve the limiting effect of the chip body 2. By setting the position of the chip body 2 to be precisely fixed, when the thermally conductive adhesive comes into contact with the chip body 2, a stable limiting structure can be formed, which can effectively prevent the displacement and sliding of the adhesive due to incomplete curing. This fundamentally avoids the contact problems caused by adhesive displacement during the packaging process, and significantly improves the overall stability and long-term reliability of the chip body 2 during packaging.
[0021] Reference Figure 2 As shown in this embodiment: the interior of the thermally conductive adhesive filling groove 3 is equipped with fixing ribs 6, and the number of fixing ribs 6 is multiple and the shape is square;
[0022] Specifically, by setting the fixing ribs 6, the space inside the thermally conductive adhesive filling groove 3 is divided into multiple independent or semi-independent small areas. When the thermally conductive adhesive is filled, it will wrap the sides and bottom of the fixing ribs 6. After curing, it forms a structure similar to reinforced concrete. The fixing ribs 6 provide rigid support as a skeleton, and the thermally conductive adhesive, as a filler, tightly bonds the chip body 2, the fixing ribs 6, and the substrate 1. This structure can greatly improve the chip body 2's resistance to shearing and peeling. Especially in vibration or impact environments, it can effectively prevent the chip body 2 from shifting or falling off due to a single adhesive layer.
[0023] Working principle: When the operator needs to install the chip body 2 onto the substrate 1, firstly, an appropriate amount of thermally conductive adhesive needs to be filled into the thermally conductive adhesive filling groove 3. After filling, the chip body 2 is placed in the thermally conductive adhesive filling groove 3. During the placement process, it is necessary to ensure that the matching guide groove 8 designed on the surface of the chip body 2 is accurately aligned with the guide post 7 to achieve stable guidance of the chip body 2 during the installation process. After placement, the elastic ring 5 will act on the top of the chip body 2 to provide a stable auxiliary limiting effect, ensuring that the thermally conductive adhesive will not shift during the drying process. In addition, the rubber contact pad 9 can enhance the contact friction and further improve the limiting effect of the chip body 2.
[0024] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.
Claims
1. A thermally conductive adhesive fixing structure for chip packaging, comprising a substrate (1): characterized in that, A chip body (2) is mounted on the top of the substrate (1). A thermally conductive adhesive filling groove (3) is opened on the top of the substrate (1). The chip body (2) is placed inside the thermally conductive adhesive filling groove (3). Four connecting plates (4) are mounted on the top of the substrate (1). An elastic retaining ring (5) is mounted on the top of the connecting plate (4). The bottom end of the elastic retaining ring (5) abuts against the top of the chip body (2).
2. The heat-conductive adhesive fixing structure for a chip package according to claim 1, wherein: The interior of the thermally conductive adhesive filling groove (3) is equipped with fixing ribs (6), and the number of fixing ribs (6) is multiple and the shape is square.
3. The heat-conductive adhesive fixing structure for a chip package according to claim 1, wherein: The thermally conductive adhesive filling groove (3) is equipped with four guide pillars (7), and the surface of the chip body (2) is provided with four guide grooves (8). The interior of the guide pillars (7) is slidably connected to the guide grooves (8).
4. The heat-conductive adhesive fixing structure for a chip package according to claim 3, wherein: The inner diameter of the guide groove (8) is designed to be compatible with the size of the guide post (7).
5. The heat-conductive adhesive fixing structure for a chip package according to claim 1, wherein: The surface of the elastic retaining ring (5) is fitted with a rubber contact pad (9).