Circuit board heat dissipation assembly, preparation method thereof and energy storage system

By constructing a heat dissipation cavity between the circuit board and functional components using thermally conductive adhesive and a frame, the problem of heat accumulation between the circuit board and functional components in the energy storage system is solved, achieving efficient heat dissipation and structural stability, simplifying assembly and reducing costs.

CN122121047BActive Publication Date: 2026-06-30SHENZHEN POWEROAK NEWENER CO LTD
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Patent Information

Application Number
CN202610593859.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-04-30
Publication Date
2026-06-30
Estimated Expiration
2046-04-30

AI Technical Summary

Technical Problem

In energy storage systems, the heat from the circuit boards and functional components accumulates, leading to an increase in local heat flux density. Existing heat dissipation methods suffer from complex assembly, high costs, and reliability issues.

Method used

The heat dissipation cavity design, which is filled with thermally conductive adhesive, combines the frame and sealant to create a low thermal resistance heat conduction path. The heat dissipation cavity is filled by the natural flow of liquid thermally conductive adhesive, which then bonds the circuit board and functional components after curing. The frame provides flexible support.

Benefits of technology

It significantly improves heat dissipation efficiency, reduces the risk of circuit board deformation, enhances structural stability and operational reliability, simplifies the assembly process, and reduces costs.

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Abstract

This invention relates to the field of energy storage technology, particularly to circuit board heat dissipation components and their manufacturing methods, as well as energy storage systems. The circuit board heat dissipation component includes a circuit board, a frame, thermally conductive adhesive, and functional components. The circuit board has a heat-dissipating area and a connecting area, with the connecting area surrounding the heat-dissipating area. The frame forms a heat dissipation cavity. The functional components cover a first opening of the heat dissipation cavity. The circuit board is mounted on the frame via the connecting area to cover a second opening of the heat dissipation cavity. The heat-dissipating area communicates with the heat dissipation cavity. The heat-dissipating area has a potting hole and an overflow hole communicating with the heat dissipation cavity. The thermally conductive adhesive is configured to be injected into the heat dissipation cavity through the potting hole in a liquid state and then cured. The thermally conductive adhesive is fixed to both the heat-dissipating area and the functional components. Through the frame and thermally conductive adhesive, a heat conduction path is formed between the circuit board and the functional components, enabling efficient conduction and dissipation of heat generated by the circuit board or functional components, ensuring the operational reliability of the circuit board and functional components.
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