Wafer thinning and edge trimming device

Abstract

The wafer thinning and trimming device comprises a base, a thinning module arranged on the base, a front-end module arranged on the base and adjacent to the incoming end of the thinning module, a trimming module arranged on the base and adjacent to the outgoing end of the thinning module, and a cleaning module arranged on the base in parallel with the thinning module, adjacent to the outgoing end of the thinning module and / or adjacent to the outgoing end of the trimming module, and adjacent to the front-end module. The wafer thinning and trimming device can improve the utilization rate of the wafer thinning and trimming device space. Meanwhile, the wafer thinning and trimming device can also achieve the purpose of improving production efficiency.

Description

Technical Field

[0001] This disclosure belongs to the field of wafer fabrication technology, and particularly relates to a wafer thinning and trimming device. Background Technology

[0002] As semiconductor devices evolve towards ultra-high integration and high performance, three-dimensional integrated circuits have emerged. Wafer bonding technology can tightly combine two or more wafers, thereby improving the performance and integration of semiconductor devices. To meet the requirements of semiconductor device performance, integration density, structure, and process compatibility, backside grinding and trimming processes of bonded wafers are crucial.

[0003] For wafer back-side thinning processes, at least the following functions are required: loading and placing the wafer to be processed onto the thinning worktable, performing back-side grinding and thinning on the wafer, and removing the wafer after back-side grinding and thinning. For wafer trimming processes, at least the following functions are required: loading and placing the wafer to be processed onto the trimming worktable, the trimming worktable rotating the wafer, the cutting tool cutting along the edge of the wafer, and completing the edge trimming by rotating the wafer one revolution, thereby ensuring the integrity and smoothness of the trimmed wafer edge.

[0004] In related technologies, the wafer back-side thinning process and the wafer trimming process adopt independent operation modes, which means that two independent machines need to be set up for the wafer back-side thinning equipment and the wafer trimming equipment. This not only has the disadvantages of large space occupation and low space utilization, but also results in low production efficiency of wafer back-side thinning and trimming due to the large workload and high risk of transfer between the machines.

[0005] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0006] This disclosure aims to at least partially solve the technical problems of large space occupation, low space utilization, and low production efficiency in wafer backside thinning and trimming operations. To this end, this disclosure provides a wafer thinning and trimming apparatus.

[0007] In some embodiments, this disclosure provides a wafer thinning and trimming apparatus, comprising: a base; a thinning module disposed on the base; a front-end module disposed on the base, the front-end module being adjacent to the input end of the thinning module; a trimming module disposed on the base, the input end of the trimming module being adjacent to the output end of the thinning module; and a cleaning module disposed parallel to the thinning module on the base, the input end of the cleaning module being adjacent to the output end of the thinning module and / or the input end of the cleaning module being adjacent to the output end of the trimming module, the output end of the cleaning module being adjacent to the front-end module.

[0008] In some embodiments, the wafer thinning and trimming apparatus further includes: a centering unit disposed on the base and adjacent to the input end of the thinning module; and / or, a calibration unit disposed on the base and adjacent to the output end of the thinning module and adjacent to the input end of the trimming module.

[0009] In some embodiments, the wafer thinning and trimming apparatus further includes a loading and unloading module, which is disposed on the base and located on the side of the front end module away from the thinning module.

[0010] In some embodiments, the wafer thinning and trimming device further includes: a first robotic arm, which is disposed on the base and is adjacent to the front-end module, the centering unit, the input end of the thinning module, and the output end of the cleaning module.

[0011] In some embodiments, the wafer thinning and trimming apparatus further includes a wafer loading unit disposed on the base, the wafer loading unit being located between the thinning module and the trimming module, and the wafer loading unit being adjacent to the input end of the cleaning module.

[0012] In some embodiments, the wafer thinning and trimming device further includes: a second robotic arm disposed on the base, the second robotic arm being adjacent to the output end of the thinning module, the calibration unit, the input end of the trimming module, and the wafer loading unit; and / or, a third robotic arm disposed on the base, the third robotic arm being adjacent to the output end of the trimming module, the wafer loading unit, and the input end of the cleaning unit.

[0013] In some embodiments, the thinning module includes: a rotating base rotatably disposed on the machine base; at least two first rotating stages rotatably disposed on the rotating base, at least one of the first rotating stages being used to adhere to the front side of the wafer, and at least one of the first rotating stages being provided with a cleaning head; a coarse grinding unit disposed on the machine base, wherein the orthographic projection of the coarse grinding head of the coarse grinding unit on the machine base is at least partially coincident with the orthographic projection of one of the first rotating stages on the machine base; and a fine grinding unit disposed on the machine base, wherein the orthographic projection of the fine grinding head of the fine grinding unit on the machine base is at least partially coincident with the orthographic projection of one of the first rotating stages on the machine base.

[0014] In some embodiments, the wafer thinning and trimming apparatus further includes a thickness detection unit disposed on the base and adjacent to the grinding unit.

[0015] In some embodiments, the trimming module includes: a linear moving base movably disposed on the base; at least two second rotating stages rotatably disposed on the linear moving base, the second rotating stages being used to adsorb and fix the wafer; a first trimming unit disposed on the base, and a first trimming blade of the first trimming unit corresponding to one of the second rotating stages; and a second trimming unit disposed on the base, and a second trimming blade of the second trimming unit corresponding to another second rotating stage.

[0016] In some embodiments, the cleaning module includes: a first cleaning unit disposed on the base and adjacent to the output end of the thinning module and / or adjacent to the output end of the trimming module; a drying unit disposed on the base and adjacent to the front-end module; and a second cleaning unit disposed on the base and located between the first cleaning unit and the drying unit.

[0017] The embodiments disclosed herein have at least the following beneficial effects:

[0018] The aforementioned wafer thinning and trimming device integrates the thinning module, trimming module, and cleaning module onto the base, which reduces the number of front-end modules required for these modules. This allows the thinning, trimming, and cleaning modules to share the same set of front-end modules, thereby reducing the cost of the wafer thinning and trimming device and minimizing its external space usage, thus improving the utilization rate of the external space. Meanwhile, in the aforementioned wafer thinning and trimming apparatus, by arranging the front-end module adjacent to the input end of the thinning module, the input end of the trimming module adjacent to the output end of the thinning module, the input end of the cleaning module adjacent to the output end of the thinning module, and / or the input end of the cleaning module adjacent to the output end of the trimming module, and the output end of the cleaning module adjacent to the front-end module, on the one hand, by rationally arranging the positions of each module on the base, the internal space utilization rate of the wafer thinning and trimming apparatus can be improved; on the other hand, the wafer transfer path is optimized, the transfer distance of the wafer between each module is shortened, and the thinning through the thinning module is made more efficient. After trimming, the wafers can directly enter the trimming module for trimming. After trimming, the wafers can directly enter the cleaning module for cleaning. After cleaning, the wafers can be directly transferred out through the front-end module. This reduces the number of times the wafers enter and exit different equipment, which reduces human intervention in the wafer thinning and trimming process, reduces the risk of breakage during transportation, reduces transportation workload, improves transportation efficiency, and reduces queue time (Q-time). In turn, it can improve equipment utilization, shorten production cycle, and increase wafer per hour (WPH), thereby achieving the goal of improving production efficiency. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A top view schematic diagram of a wafer thinning and trimming apparatus according to an embodiment of the present disclosure is shown;

[0021] Figure 2 It shows Figure 1 Schematic diagram of the wafer transfer path in the wafer thinning and trimming device.

[0022] Figure label:

[0023] 100. Base; 200. Front-end module; 300. Thinning module; 310. Rotating platform; 320. First rotating stage; 321. First rotating stage for wafer adsorption; 322. First rotating stage equipped with a cleaning head; 330. Rough grinding unit; 331. Rough grinding head; 332. Rough grinding frame; 340. Fine grinding unit; 341. Fine grinding head; 342. Fine grinding frame; 400. Trimming module; 410. Linear moving platform; 420. Second rotating stage; 430. First trimming unit; 431. 432. First trimming cutter wheel; 440. First trimming cutter holder; 441. Second trimming unit; 442. Second trimming cutter holder; 500. Cleaning module; 510. First cleaning unit; 520. Second cleaning unit; 530. Drying unit; 600. Centering unit; 700. Calibration unit; 800. Loading / unloading module; 900. First robotic arm; 1000. Wafer loading unit; 1100. Second robotic arm; 1200. Third robotic arm; 1300. Thickness detection unit. Detailed Implementation

[0024] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. Based on the embodiments of this disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this disclosure.

[0025] Furthermore, reference numerals and / or reference letters may be repeated in different examples in this disclosure. Such repetition is for simplification and clarity purposes and does not in itself indicate a relationship between the various embodiments and / or settings discussed. In addition, this disclosure provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0026] This disclosure is described below with reference to the accompanying drawings and specific embodiments:

[0027] In this disclosure, a wafer may also be referred to as a wafer, silicon wafer, substrate, or substrate, etc., with the same meaning and practical function.

[0028] Figure 1 This diagram shows a top view of a wafer thinning and trimming apparatus according to an embodiment of the present disclosure. Figure 2 It shows Figure 1 A schematic diagram of the wafer transfer path in a wafer thinning and trimming device. (See diagram below.) Figure 1 and Figure 2As shown, this disclosure proposes a wafer thinning and trimming apparatus, which includes a base 100, a front-end module 200, a thinning module 300, a trimming module 400, and a cleaning module 500. The thinning module 300 is disposed on the base 100; the front-end module 200 is disposed on the base 100, and the input end of the front-end module 200 is adjacent to the input end of the thinning module 300; the trimming module 400 is disposed on the base 100, and the input end of the trimming module 400 is adjacent to the output end of the thinning module 300; and the cleaning module 500 is disposed side by side with the thinning module 300 on the base 100, the input end of the cleaning module 500 is adjacent to the output end of the thinning module 300 and / or the input end of the cleaning module 500 is adjacent to the output end of the trimming module 400, and the output end of the cleaning module 500 is adjacent to the front-end module 200.

[0029] The wafer thinning and trimming apparatus of this disclosure embodiment, such as Figure 1 As shown, the thinning module 300, trimming module 400, and cleaning module 500 are all integrated on the base 100. This reduces the number of front-end modules 200 required for each module, allowing them to share the same set of front-end modules 200. This reduces the cost of the wafer thinning and trimming device and also minimizes its external space requirements, improving space utilization. Furthermore, in the aforementioned wafer thinning and trimming device, as... Figure 1 and Figure 2As shown, by arranging the front-end module 200 adjacent to the input end of the thinning module 300, the input end of the trimming module 400 adjacent to the output end of the thinning module 300, the input end of the cleaning module 500 adjacent to the output end of the thinning module 300, and / or the input end of the cleaning module 500 adjacent to the output end of the trimming module 400, and the output end of the cleaning module 500 adjacent to the front-end module 200, on the one hand, by rationally arranging the positions of each module on the base 100, the internal space utilization rate of the wafer thinning and trimming device can be improved; on the other hand, the wafer transfer path is optimized, and the time is shortened. The transfer distance between the various modules allows wafers thinned by the thinning module 300 to directly enter the trimming module 400 for trimming. After trimming by the trimming module 400, the wafers can directly enter the cleaning module 500 for cleaning. After cleaning by the cleaning module 500, the wafers can be directly transferred out through the front-end module 200. This reduces the number of times the wafer enters and exits different equipment, thereby reducing human intervention in the wafer thinning and trimming process, lowering the risk of breakage during transfer, reducing transfer workload, improving transfer efficiency, and reducing queue time (Q-time). In turn, this improves equipment utilization, shortens production cycle, and increases wafer per hour (WPH), thus achieving the goal of improving production efficiency.

[0030] Q-time refers to the time that a certain process or piece of equipment in the production process waits to be processed after receiving a task.

[0031] In related technologies, the back-side thinning and trimming processes for bonding wafers generally employ a dual-machine independent operation mode, using a back-side thinning machine for back-side thinning and a trimming machine for trimming. However, the application of two independent wafer processing machines often presents the following problems:

[0032] High external space occupancy: Each of the two independent wafer processing machines requires a loadport and an Equipment Front End Module (EFEM) for transmission. The loadport and EFEM occupy a large amount of space, resulting in a large overall size of the two independent wafer processing machines and a high external space occupancy. In addition, the space-constrained layout of the two independent wafer processing machines is quite difficult.

[0033] Low utilization of internal space: Due to the long wafer transfer path and numerous workstations within the two independent wafer processing machines, the internal space utilization is low and the transmission efficiency is low.

[0034] Transferring wafers between equipment is difficult, risky, and inefficient: During the production process, wafers need to be transferred between two independent wafer processing machines. On the one hand, the transfer workload is large, which will put a certain burden on the application of the overhead crane system; on the other hand, it will also introduce the risk of human intervention, such as wafer breakage during the transfer process; in addition, the transfer of wafers between equipment will also affect the wafer processing efficiency.

[0035] Low equipment utilization and low production efficiency: After wafer bonding, the back side thinning and trimming of the wafer should be a continuous process. If two independent wafer processing machines are used to perform back side thinning and trimming respectively, it will affect Q-Time and WPH, resulting in a longer Q-Time and a lower WPH, which will in turn lead to reduced equipment utilization, increased production cycle and reduced production efficiency.

[0036] While related technologies can improve the automation and integration of back-side thinning equipment by optimizing the efficient transfer between mechanisms within the equipment, or by optimizing the wafer transport mechanism to make the wafer trimming equipment more compact and the wafer flow path more rational, thus addressing the low space utilization of wafer trimming equipment, these optimization methods only apply to a single wafer processing device, and their effects on improving equipment space utilization and processing efficiency are relatively limited.

[0037] Compared to related technologies where the back-side thinning and trimming processes of bonded wafers are performed using two separate wafer processing devices, the wafer thinning and trimming apparatus proposed in this disclosure integrates the back-side thinning and trimming processes of bonded wafers into one device, achieving the following objectives:

[0038] Reduced external space occupancy: The back-side thinning and trimming processes can share the same front-end module 200, reducing the number of front-end modules 200. This allows for a smaller overall size of the wafer thinning and trimming device, reducing the external space occupancy and facilitating the installation of the wafer thinning and trimming device in space-constrained environments. Furthermore, it also reduces the manufacturing cost of the wafer thinning and trimming device.

[0039] Improved internal space utilization: By optimizing the relative positions of the thinning module 300, the trimming module 400, and the cleaning module 500, the wafer transfer path can be shortened, the number of workstations can be reduced, and the internal space utilization and transmission efficiency of the wafer thinning and trimming device can be improved.

[0040] The difficulty and risk of inter-equipment transfer are reduced, and the transfer efficiency is improved: the transfer of wafers between two independent wafer processing equipment is avoided in the production process, which can reduce the transfer workload, avoid the risk of human intervention, and reduce the risk of wafer breakage during the transfer process; at the same time, it can also improve the transfer efficiency.

[0041] Improved equipment utilization and production efficiency: The wafer thinning and trimming device disclosed herein enables the back-side thinning and trimming processes of the wafer to be performed continuously after wafer bonding, which can effectively reduce Q-Time, increase WPH, and thus improve equipment utilization, shorten production cycle and increase production efficiency.

[0042] As an alternative implementation method, such as Figure 1 As shown, the wafer thinning and trimming apparatus further includes a centering unit 600, which is disposed on the base 100 and adjacent to the input end of the thinning module 300; and / or a calibration unit 700, which is disposed on the base 100 and adjacent to the output end of the thinning module 300 and adjacent to the input end of the trimming module 400.

[0043] In some embodiments of this disclosure, the centering unit 600 is used for wafer centering. The structure of the centering unit 600 can refer to the structure commonly used in the art, and will not be described in detail here.

[0044] In some embodiments of this disclosure, such as Figure 1 As shown, the centering unit 600 is adjacent to the input end of the thinning module 300. At the same time, the front-end module 200 is adjacent to the input end of the thinning module 300. Therefore, the front-end module 200 is also adjacent to the centering unit 600. Thus, the wafer can be quickly and conveniently transferred to the centering unit 600 for centering through the front-end module 200. The wafer after centering through the centering unit 600 can also be directly transferred to the thinning module 300, which can shorten the wafer transfer path and reduce the adverse effects of wafer centering during the transfer process to a certain extent.

[0045] In some embodiments of this disclosure, such as Figure 1 As shown, optionally, in order to avoid interference between the wafer input and output of the centering unit 600 and the wafer output of the cleaning module 500, the centering unit 600 can be located on the side closer to the thinning module 300 and farther away from the cleaning module 500.

[0046] In some embodiments of this disclosure, the calibration unit 700 can also be used for wafer calibration. The structure of the calibration unit 700 can refer to the structure commonly used in the art, and will not be described in detail here.

[0047] In some embodiments of this disclosure, such as Figure 1As shown, the calibration unit 700 can calibrate the wafer after it has been thinned by the thinning module 300. Since the calibration unit 700 is adjacent to the output end of the thinning module 300 and the input end of the trimming module 400, the wafer calibrated by the calibration module can be easily transferred to the trimming module 400 to ensure that the wafer transferred to the trimming module 400 is trimmed with accurate positioning.

[0048] As an alternative implementation method, such as Figure 1 As shown, the wafer thinning and trimming device also includes a loading and unloading module 800, which is mounted on the base 100 and located on the side of the front-end module 200 away from the thinning module 300.

[0049] In some embodiments of this disclosure, the loading and unloading module 800 is used for loading wafer cassettes. The structure of the loading and unloading module 800 can refer to the structures commonly used in the art, and will not be described in detail here.

[0050] In some embodiments of this disclosure, such as Figure 1 As shown, the loading and unloading module 800 is located on the side of the front-end module 200 away from the thinning module 300, that is, the loading and unloading module 800 is adjacent to the front-end module 200. This allows the front-end module 200 to easily extract the wafer to be processed from the wafer cassette loaded by the loading and unloading module 800, and also allows the front-end module 200 to easily transfer the processed wafer to the wafer cassette loaded by the loading and unloading module 800.

[0051] In some embodiments of this disclosure, such as Figure 1 As shown, the wafer thinning and trimming device can be equipped with two loading and unloading modules 800. On the one hand, the loading and unloading modules 800 of the wafer thinning and trimming device can have a certain design redundancy, so that the operation of the whole wafer thinning and trimming device will not be affected when one of the loading and unloading modules 800 is damaged. On the other hand, the two loading and unloading modules 800 can also work simultaneously, thereby improving the operating efficiency of the wafer thinning and trimming device.

[0052] As an alternative implementation method, such as Figure 1 As shown, the wafer thinning and trimming device also includes a first robot arm 900, which is mounted on the base 100. The first robot arm 900 is adjacent to the input end of the front-end module 200, the centering unit 600, the thinning module 300, and the output end of the cleaning module 500.

[0053] In some embodiments of this disclosure, such as Figure 1As shown, the first robotic arm 900 is adjacent to the input end of the front-end module 200, the centering unit 600, the thinning module 300, and the output end of the cleaning module 500. The first robotic arm 900 can be used for the input and output of wafers between the input end of the front-end module 200, the centering unit 600, the thinning module 300, and the output end of the cleaning module 500. This allows the front-end module 200, the centering unit 600, the thinning module 300, and the cleaning module 500 to share the first robotic arm 900. This reduces the number of robotic arms required for the wafer thinning and trimming device, lowers the cost of the wafer thinning and trimming device, and improves the internal space utilization of the wafer thinning and trimming device. At the same time, it can also avoid interference between too many robotic arms or between too many robotic arms and other structures.

[0054] In some embodiments of this disclosure, such as Figure 1 As shown, the first robotic arm 900 can be located in the area where the front-end module 200 is located. The first robotic arm 900 can be used to transfer wafers between the loading and unloading module 800 and the front-end module 200, and can also be used to transfer wafers from the front-end module 200 to the centering unit 600, and can also be used to transfer wafers from the output end of the cleaning module 500 to the front-end module 200.

[0055] In some embodiments of this disclosure, the first robotic arm 900 may optionally be used to transfer a wafer from the centering unit 600 to the thinning module 300.

[0056] As an alternative implementation method, such as Figure 1 As shown, the wafer thinning and trimming device also includes a wafer loading unit 1000, which is disposed on the base 100. The wafer loading unit 1000 is located between the thinning module 300 and the trimming module 400, and is also adjacent to the input end of the cleaning module 500.

[0057] In some embodiments of this disclosure, such as Figure 1 As shown, the wafer loading unit 1000 is located between the thinning module 300 and the trimming module 400, and the wafer loading unit 1000 is also adjacent to the input end of the cleaning module 500. Therefore, the wafer loading unit 1000 can be used to receive and temporarily store the wafer after it has been thinned by the thinning module 300. The wafer loading unit 1000 can also transmit the temporarily stored wafer to the wafer trimming module 400 for trimming the wafer.

[0058] When the wafer thinning and trimming device is equipped with a calibration unit 700, such as Figure 1 and Figure 2 As shown, the wafer loading unit 1000 can also transfer the temporarily stored wafer to the calibration unit 700 so that the wafer to be transferred to the trimming module 400 can be calibrated by the calibration unit 700.

[0059] When the wafer does not require edge trimming, such as Figure 1 and Figure 2 As shown, the wafer loading unit 1000 can transfer the temporarily stored wafer to the cleaning module 500 for cleaning.

[0060] As an alternative implementation method, such as Figure 1 As shown, the wafer thinning and trimming device also includes a second robot 1100 and / or a third robot 1200. The second robot 1100 is disposed on the base 100 and is adjacent to the output end of the thinning module 300, the calibration unit 700, the input end of the trimming module 400, and the wafer loading unit 1000, respectively. The third robot 1200 is disposed on the base 100 and is adjacent to the output end of the trimming module 400, the wafer loading unit 1000, and the input end of the cleaning unit, respectively.

[0061] In some embodiments of this disclosure, optionally, such as Figure 1 As shown, the second robotic arm 1100 is adjacent to the output end of the thinning module 300, the calibration unit 700, the input end of the trimming module 400, and the wafer loading unit 1000, respectively. The second robotic arm 1100 can be used for the input and output of wafers between the output end of the thinning module 300, the calibration unit 700, the input end of the trimming module 400, and the wafer loading unit 1000, so that the output end of the thinning module 300, the calibration unit 700, the input end of the trimming module 400, and the wafer loading unit 1000 can share the second robotic arm 1100.

[0062] In some embodiments of this disclosure, optionally, such as Figure 1 As shown, the third robot 1200 is adjacent to the output end of the trimming module 400, the wafer loading unit 1000, and the input end of the cleaning unit, respectively. The third robot 1200 can be used for the input and output of wafers between the output end of the trimming module 400, the wafer loading unit 1000, and the input end of the cleaning unit, so that the output end of the trimming module 400, the wafer loading unit 1000, and the input end of the cleaning unit can share the third robot 1200.

[0063] In some embodiments of this disclosure, such as Figure 1As shown, the second robotic arm 1100 can be located between the thinning module 300 and the calibration unit 700, and can be mainly used to transfer wafers from the thinning module 300 to the calibration unit 700; the third robotic arm 1200 can be located between the trimming module 400 and the cleaning module 500, and can be mainly used to transfer wafers from the trimming module 400 to the cleaning module 500. Thus, through the cooperation between the second robotic arm 1100 and the third robotic arm 1200, the wafer transfer efficiency between the thinning module 300, the trimming module 400, and the cleaning module 500 can be improved.

[0064] As an alternative implementation method, such as Figure 1 As shown, the thinning module 300 includes a rotating base 310, at least two first rotating stages 320, a coarse grinding unit 330, and a fine grinding unit 340. The rotating base 310 is rotatably mounted on the base 100; the first rotating stages 320 are rotatably mounted on the rotating base 310, and at least one first rotating stage 320 is used to adhere to the front side of the wafer, and at least one first rotating stage 320 is provided with a cleaning head; the coarse grinding unit 330 is mounted on the base 100, and the orthographic projection of the coarse grinding head 331 of the coarse grinding unit 330 on the base 100 can at least partially overlap with the orthographic projection of one of the first rotating stages 320 on the base 100; the fine grinding unit 340 is mounted on the base 100, and the orthographic projection of the fine grinding head 341 of the fine grinding unit 340 on the base 100 can at least partially overlap with the orthographic projection of one of the first rotating stages 320 on the base 100.

[0065] In some embodiments of this disclosure, such as Figure 1As shown, the rotating base 310 is rotatably mounted on the base 100, thereby changing the position of the first rotating stage 320 by rotating the rotating base 310. This allows the first rotating stage 320 to correspond sequentially with the position of the coarse grinding head 331 of the coarse grinding unit 330 and the position of the fine grinding head 341 of the fine grinding unit 340. In other words, the orthographic projection of the coarse grinding head 331 of the coarse grinding unit 330 on the base 100 can at least partially overlap with the orthographic projection of the first rotating stage 320 on the base 100. The fine grinding unit 340 is vertically mounted on the base 100, and the orthographic projection of the fine grinding head 341 of the fine grinding unit 340 on the base 100 can at least partially overlap with the orthographic projection of the first rotating stage 320 on the base 100. Thus, the wafers adsorbed and fixed on the first rotating stage 320 can be thinned by the coarse grinding unit 330 and the fine grinding unit 340. Meanwhile, the first rotating stage 320 is rotatably mounted on the rotating base 310. When the wafers adsorbed and fixed by the first rotating stage 320 are thinned by the coarse grinding unit 330 and the fine grinding unit 340, the first rotating stage 320 can drive the adsorbed and fixed wafers to rotate, which can improve the efficiency of the thinning process. When the coarse grinding head 331 and the fine grinding head 341 are cleaned by the first rotating stage 320 equipped with a cleaning head, the first rotating stage 320 can drive the cleaning head to rotate, which can improve the cleaning efficiency of the coarse grinding head 331 and the fine grinding head 341.

[0066] When the first rotating stage 321 for adsorbing the wafer corresponds to the position of the coarse grinding head 331 of the coarse grinding unit 330, the back side of the wafer adsorbed by the first rotating stage 320 can be coarsely polished by the coarse grinding head 331 of the coarse grinding unit 330 to thin the back side of the wafer.

[0067] When the first rotating stage 321 for adsorbing the wafer is aligned with the fine grinding head 341 of the fine grinding unit 340, the back side of the wafer adsorbed by the first rotating stage 320 can be finely polished by the fine grinding head 341 of the fine grinding unit 340 to perform fine thinning treatment on the back side of the wafer. This ensures the accuracy of the thinning treatment and ensures that the back side of the wafer is flat and smooth after the thinning treatment.

[0068] When the first rotating stage 322 equipped with a cleaning head corresponds to the position of the coarse grinding head 331 of the coarse grinding unit 330, the cleaning head can be used to clean the coarse grinding head 331 to ensure that the coarse grinding head 331 remains clean and to avoid scratching or contaminating the wafers that will undergo subsequent thinning processes. Similarly, when the first rotating stage 322 equipped with a cleaning head corresponds to the position of the fine grinding head 341 of the fine grinding unit 340, the cleaning head can be used to clean the fine grinding head 341 to avoid scratching or contaminating the wafers that will undergo subsequent thinning processes.

[0069] In some embodiments of this disclosure, such as Figure 1 As shown, the rotating stage 310 can rotate counterclockwise relative to the base so that the first rotating stage 321 for adsorbing the wafer can first be coarsely polished by the coarse grinding head 331 of the coarse grinding unit 330, and then finely polished by the fine grinding head 341 of the fine grinding unit 340; at the same time, the first rotating stage 322 equipped with a cleaning head can pass through the coarse grinding head 331 of the coarse grinding unit 330 and the fine grinding head 341 of the fine grinding unit 340 in sequence, so that the coarse grinding head 331 of the coarse grinding unit 330 and the fine grinding head 341 of the fine grinding unit 340 can be cleaned.

[0070] In some embodiments of this disclosure, such as Figure 1 As shown, the rotating base 310 may be provided with three first rotating stages 320, two of which can be used to adsorb and fix the wafer, and the other first rotating stage 320 is used to set the cleaning head.

[0071] In some embodiments of this disclosure, optionally, the first rotating platform 320 is vertically and flexibly disposed on the rotating base 310, and / or, the coarse grinding unit 330 and the fine grinding unit 340 are vertically and flexibly disposed on the base, so that when the first rotating platform 320 passes under the coarse grinding head 331 of the coarse grinding unit 330, the distance between the first rotating platform 320 and the coarse grinding head 331 is adjustable, and the distance between the first rotating platform 320 and the fine grinding head 341 is adjustable. Thus, when the rotating base 310 rotates, the first rotating platform 320 and the coarse grinding head 331 can avoid each other without interference; similarly, the first rotating platform 320 and the fine grinding head 341 can avoid each other without interference. When rough polishing is required on the wafer held and fixed by the first rotating stage 320, the rough polishing head 331 can be brought into contact with the wafer held and fixed by the first rotating stage 320 for rough polishing. Similarly, when fine polishing is required on the wafer held and fixed by the first rotating stage 320, the fine polishing head 341 can be brought into contact with the wafer held and fixed by the first rotating stage 320 for fine polishing. When the first rotating stage 322 equipped with a cleaning head cleans the rough polishing head 331, the cleaning head can be brought into contact with the rough polishing head 331 for cleaning. Similarly, when the first rotating stage 322 equipped with a cleaning head cleans the fine polishing head 341, the cleaning head can be brought into contact with the fine polishing head 341 for cleaning.

[0072] In some embodiments of this disclosure, optionally, the lifting method of the first rotating platform 320 relative to the rotating base 310, and the lifting method of the rough grinding unit 330 and the fine grinding unit 340 relative to the base, can adopt conventional lifting structures in the art, which will not be described in detail here. For example, such as Figure 1As shown, the coarse grinding unit 330 may include a coarse grinding frame 332 and a coarse grinding head 331 disposed on the coarse grinding frame 332, and the coarse grinding frame 332 may drive the coarse grinding head 331 to rise and fall relative to the base; the fine grinding unit 340 may include a fine grinding frame 342 and a fine grinding head 341 disposed on the fine grinding frame 342, and the fine grinding frame 342 may drive the fine grinding head 341 to rise and fall relative to the base.

[0073] In some embodiments of this disclosure, optionally, the wafer, after being centered by the centering unit 600, can be transferred by the first robotic arm 900 to the first rotating stage 320 for adsorbing and fixing the wafer.

[0074] As an alternative implementation method, such as Figure 1 As shown, the wafer thinning and trimming device also includes a thickness detection unit 1300, which is disposed on the base 100 and is adjacent to the fine grinding unit 340.

[0075] In some embodiments of this disclosure, the thickness detection unit 1300 is adjacent to the fine grinding unit 340 and can be used to detect the thickness of the wafer after it has been thinned by the fine grinding unit 340 in real time. After the thickness detection unit 1300 detects that the wafer has reached the preset thickness, the wafer thinning and trimming device can automatically control the fine grinding unit 340 to stop the fine polishing and thinning, thereby improving the accuracy of the thinning process and enabling the thinned wafer to be promptly transmitted to the calibration unit 700 for calibration.

[0076] As an alternative implementation method, such as Figure 1 As shown, the trimming module 400 includes a linear moving base 410, at least two second rotating stages 420, a first trimming unit 430, and a second trimming unit 440. The linear moving base 410 is movably disposed on the base 100; the second rotating stage 420 is rotatably disposed on the linear moving base 410 and is used to adsorb and fix the wafer; the first trimming unit 430 is disposed on the base 100, and the first trimming blade 431 of the first trimming unit 430 corresponds to one of the second rotating stages 420; the second trimming unit 440 is disposed on the base 100, and the second trimming blade 441 of the second trimming unit 440 corresponds to the other second rotating stage 420.

[0077] In some embodiments of this disclosure, such as Figure 1 As shown, the linear moving platform 410 is movably disposed on the base 100, thereby adjusting the position of the linear moving platform 410 relative to the first trimming unit 430 and the second trimming unit 440, so that the wafers adsorbed and fixed by the second rotating stage 420 disposed on the linear moving platform 410 can contact the first trimming unit 430 and the second trimming unit 440 for trimming processing.

[0078] In some embodiments of this disclosure, such as Figure 1 As shown, the linear moving base 410 can move relative to the base in a first direction and a second direction to achieve horizontal movement of the linear moving base 410 relative to the base. Optionally, the linear moving base 410 can use a linear motor, worm gear, or other structures to achieve horizontal movement relative to the base. Those skilled in the art can use suitable structures according to design needs, which will not be elaborated here.

[0079] In some embodiments of this disclosure, such as Figure 1 As shown, the second rotating stage 420 is rotatably mounted on the linear moving base 410. The second rotating stage 420 is used to adsorb and fix the wafer, and simultaneously drive the adsorbed and fixed wafer to rotate. When the two second rotating stages 420 are aligned with the first trimming wheel 431 of the first trimming unit 430 and the second trimming wheel 441 of the second trimming unit 440 respectively by the linear moving base 410, the wafers adsorbed and fixed by the two second rotating stages 420 can be brought into contact with the first trimming wheel 431 and the second trimming wheel 441 respectively, and then the first trimming wheel 431 and the second trimming wheel 441 respectively trim the wafers adsorbed and fixed by the two second rotating stages 420.

[0080] In some embodiments of this disclosure, optionally, such as Figure 1 As shown, the first trimming unit 430 includes a first trimming cutter wheel 431 and a first trimming cutter holder 432. The first trimming cutter wheel 431 can be mounted on the machine base 100 via the first trimming cutter holder 432. The second trimming unit 440 includes a second trimming cutter wheel 441 and a second trimming cutter holder 442. The second trimming cutter wheel 441 can be mounted on the machine base 100 via the second trimming cutter holder 442.

[0081] In some embodiments of this disclosure, optionally, a first trimming tool holder 432 is movably disposed on the machine base 100, so that the position of the first trimming cutter wheel 431 relative to the second rotary table 420 can be adjusted in the X or Y axis direction by means of the first trimming tool holder 432. Optionally, a second trimming tool holder 442 is movably disposed on the machine base 100, so that the position of the second trimming cutter wheel 441 relative to the second rotary table 420 can be adjusted in the X or Y axis direction by means of the second trimming tool holder 442.

[0082] As an alternative implementation method, such as Figure 1As shown, the cleaning module 500 includes a first cleaning unit 510, a second cleaning unit 520, and a drying unit 530. The first cleaning unit 510 is disposed on the base 100, and the first cleaning unit 510 is adjacent to the output end of the thinning module 300 and / or the first cleaning unit 510 is adjacent to the output end of the trimming module 400; the drying unit 530 is disposed on the base 100, and the drying unit 530 is adjacent to the front end module 200; the second cleaning unit 520 is disposed on the base 100, and the second cleaning unit 520 is located between the first cleaning unit 510 and the drying unit 530.

[0083] In some embodiments of this disclosure, the first cleaning unit 510 and the second cleaning unit 520 are used for front-side cleaning and back-side cleaning of the wafer, respectively. After being cleaned by the first cleaning unit 510 and the second cleaning unit 520, the wafer can be transferred to the drying unit 530 for drying.

[0084] In some embodiments of this disclosure, the first cleaning unit 510 is adjacent to the output end of the thinning module 300 and / or the first cleaning unit 510 is adjacent to the output end of the trimming module 400, so the wafers output from the output end of the thinning module 300 can be conveniently and quickly transferred to the first cleaning unit 510.

[0085] In some embodiments of this disclosure, when the wafer thinning and trimming apparatus is provided with a wafer loading unit 1000, the first cleaning unit 510 is adjacent to the wafer loading unit 1000, so the wafers passed from the wafer loading unit 1000 can be conveniently and quickly passed to the first cleaning unit 510.

[0086] In some embodiments of this disclosure, optionally, the first cleaning unit 510 may be provided with a first adsorption stage, which can adsorb and fix the wafer to be cleaned. The first cleaning unit 510 may also be provided with a first cleaning nozzle or a first cleaning tank, which can spray cleaning fluid onto the wafer adsorbed and fixed on the first adsorption stage through the first cleaning nozzle, or immerse the wafer adsorbed and fixed on the first adsorption stage into the cleaning fluid in the first cleaning tank for cleaning.

[0087] In some embodiments of this disclosure, optionally, the second cleaning unit 520 may be provided with a second adsorption stage, which can adsorb and fix the wafer to be cleaned. The second cleaning unit 520 may also be provided with a second cleaning nozzle or a second cleaning tank, which can spray cleaning fluid onto the wafer adsorbed and fixed on the second adsorption stage through the second cleaning nozzle, or immerse the wafer adsorbed and fixed on the second adsorption stage into the cleaning fluid in the second cleaning tank for cleaning.

[0088] In some embodiments of this disclosure, optionally, during the transfer of the wafer from the first adsorption stage to the second adsorption stage, the side of the wafer that is adsorbed and fixed can be changed so that both opposite sides of the wafer can be adequately cleaned.

[0089] In some embodiments of this disclosure, after the wafer is dried by the drying unit 530, it can be transferred to the loading / unloading module 800 by the first robotic arm 900. In some embodiments of this disclosure, such as... Figure 1 and Figure 2 As shown, the wafer transfer path in the wafer thinning and trimming device is as follows:

[0090] Using the front-end module 200, the wafer is taken out from the loading stage and passed to the grinding mechanism, so that the bonded wafer undergoes a back-side thinning process, rough polishing and fine polishing, and the endpoint is controlled by the film thickness control device. Then, the edge trimming process is directly performed, and the edge trimming is completed by the cutter wheel control in the X and Y axis directions. After that, the wafer enters the cleaning mechanism to remove particles and contaminants, and finally it is returned to the loading stage.

[0091] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second object can include direct contact between the first and second objects, or contact between the first and second objects through another object between them. Furthermore, "above," "over," and "on top" of the second object includes the first object being directly above or diagonally above the second object, or simply indicates that the first object is at a higher horizontal level than the second object. "Below," "below," and "under" the second object includes the first object being directly below or diagonally below the second object, or simply indicates that the first object is at a lower horizontal level than the second object.

[0092] It should be noted that all directional indications in this embodiment are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0093] In this disclosure, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0094] Furthermore, the use of terms such as "first" and "second" in this disclosure is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0095] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this disclosure.

[0096] Although embodiments of the present disclosure have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer thinning and trimming device, characterized in that, The wafer thinning and trimming device includes: Base; A thinning module is disposed on the base; A front-end module is mounted on the base and is adjacent to the input end of the thinning module. A trimming module, wherein the trimming module is mounted on the base, and the input end of the trimming module is adjacent to the output end of the thinning module; and, A cleaning module is arranged side-by-side with the thinning module on the base. The input end of the cleaning module is adjacent to the output end of the thinning module and / or the input end of the cleaning module is adjacent to the output end of the trimming module. The output end of the cleaning module is adjacent to the front-end module.

2. The wafer thinning and trimming apparatus as described in claim 1, characterized in that, The wafer thinning and trimming device also includes: A centering unit is disposed on the base and is adjacent to the input end of the thinning module; and / or, A calibration unit is disposed on the base, the calibration unit is adjacent to the output end of the thinning module, and the calibration unit is adjacent to the input end of the trimming module.

3. The wafer thinning and trimming apparatus as described in claim 2, characterized in that, The wafer thinning and trimming device also includes: A loading and unloading module is disposed on the base and is located on the side of the front end module away from the thinning module.

4. The wafer thinning and trimming apparatus as described in claim 3, characterized in that, The wafer thinning and trimming device also includes: A first robotic arm is mounted on the base and is adjacent to the front-end module, the centering unit, the input end of the thinning module, and the output end of the cleaning module.

5. The wafer thinning and trimming apparatus as described in claim 2, characterized in that, The wafer thinning and trimming device further includes a wafer loading unit, which is disposed on the base and located between the thinning module and the trimming module. The wafer loading unit is also adjacent to the input end of the cleaning module.

6. The wafer thinning and trimming apparatus as described in claim 5, characterized in that, The wafer thinning and trimming device also includes: A second robotic arm, mounted on the base, is adjacent to the output end of the thinning module, the calibration unit, the input end of the trimming module, and the wafer loading unit; and / or, The third robotic arm is mounted on the base and is adjacent to the output end of the trimming module, the wafer loading unit, and the input end of the cleaning module.

7. The wafer thinning and trimming apparatus as described in claim 1, characterized in that, The thinning module includes: A rotating base, which is rotatably mounted on the machine base; At least two first rotating stages are rotatably disposed on the rotating base, at least one first rotating stage is used to adsorb onto the front side of the wafer, and at least one first rotating stage is provided with a cleaning head. A coarse grinding unit, wherein the coarse grinding unit is disposed on the machine base, and the orthographic projection of the coarse grinding head of the coarse grinding unit on the machine base at least partially coincides with the orthographic projection of a first rotating stage on the machine base; and, A fine grinding unit is disposed on the machine base, and the orthographic projection of the fine grinding head of the fine grinding unit on the machine base can at least partially coincide with the orthographic projection of a first rotating stage on the machine base.

8. The wafer thinning and trimming apparatus as described in claim 7, characterized in that, The wafer thinning and trimming device also includes a thickness detection unit, which is disposed on the base and adjacent to the grinding unit.

9. The wafer thinning and trimming apparatus according to any one of claims 1 to 8, characterized in that, The trimming module includes: A linearly movable base, which is movably mounted on the machine base; At least two second rotating stages are rotatably disposed on the linear moving base, and the second rotating stages are used to adsorb and fix the wafer; A first trimming unit, disposed on the machine base, wherein a first trimming cutter wheel of the first trimming unit corresponds to a second rotating platform; and, The second trimming unit is disposed on the machine base, and the second trimming cutter wheel of the second trimming unit corresponds to another second rotating platform.

10. The wafer thinning and trimming apparatus as described in claim 9, characterized in that, The cleaning module includes: A first cleaning unit is disposed on the base, and the first cleaning unit is adjacent to the output end of the thinning module and / or the first cleaning unit is adjacent to the output end of the trimming module. A drying unit, wherein the drying unit is disposed on the base and is adjacent to the front-end module; and, The second cleaning unit is disposed on the base and is located between the first cleaning unit and the drying unit.

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