A module shock absorbing and buffering device

By designing a module shock absorption and buffer device, and utilizing the collaborative work of flexible and elastic components, the problems of difficult handling and damage during battery module flipping are solved, achieving efficient and safe module assembly.

CN224464623UActive Publication Date: 2026-07-07HUATING HEFEI POWER TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HUATING HEFEI POWER TECH
Filing Date
2025-06-20
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

The existing battery modules are heavy and difficult for employees to handle during the flipping process. Furthermore, the ABS plastic parts are easily damaged when the modules are flipped and fall, which affects the subsequent welding process.

Method used

Design a module shock absorption and buffer device, including an operating table, a displacement structure and a buffer structure. Through the coordinated work of flexible and elastic components, it provides shock absorption, assists in module flipping and absorbs impact energy to avoid damage.

Benefits of technology

This improves the convenience and efficiency of module assembly, prevents damage to the module structure, and ensures the smooth progress of subsequent welding processes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment provides a module damping and buffering device, and relates to the field of battery module manufacturing.The module damping and buffering device comprises an operation table, a displacement structure and a buffering structure.The operation table is sequentially provided with a temporary storage station, a displacement station and a receiving station, the displacement structure is arranged at the displacement station, and the displacement structure is used for realizing the movement of the module between the temporary storage station and the receiving station; the buffering structure is arranged at the receiving station, and the buffering structure is used for providing receiving and buffering for the falling end of the module during the overturning and falling of the module on the displacement station.The module damping and buffering device can improve the process convenience of the overturning process of the battery module assembly, assist the operator to move the module with less force, improve the efficiency of the module assembly, effectively absorb the impact energy of the module during the overturning and falling process, avoid the damage of the module during the assembly process, and maintain the structural integrity of the module.
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Description

Technical Field

[0001] This application relates to the field of battery module manufacturing, and more specifically, to a module shock absorption and buffer device. Background Technology

[0002] The production process of the battery module coating section is as follows: First, ABS plates (including cover plates and base plates) are placed; then, glue dispensing is performed; next, side plates are installed at both ends of the ABS base plate; then, battery cells are assembled on the base plate; then, the cover plate is installed and the C-shaped iron side is reinforced; finally, the module is removed from the production line and transferred to the workbench for manual flipping to complete the reinforcement of the other side with magnetic iron; finally, the surface of the module battery cells is cleaned to remove glue.

[0003] However, the current process has the following problems: When the module is removed from the production line and transferred to the workbench for manual flipping, the C-shaped iron on the other side needs to be secured to the ABS board with screws. Because this process involves manual handling and flipping, and the module is quite heavy after assembly, it is difficult for employees to handle and flip it. Furthermore, the module is difficult to place slowly and smoothly when flipped and dropped, often landing heavily on the workbench. This situation may not only affect the subsequent assembly process of the overall module structure but may also cause minor damage to the ABS plastic parts due to the impact, thus adversely affecting subsequent welding processes. Utility Model Content

[0004] This utility model provides a module shock absorption and buffer device to improve the process convenience of battery module assembly and flipping, assisting operators to move the module with less force and improve the efficiency of module assembly; at the same time, the device can effectively absorb the impact energy of the module during the flipping and falling process, avoid damage to the module during assembly, and maintain the structural integrity of the module.

[0005] This utility model embodiment can be implemented as follows:

[0006] A module shock absorption and buffer device includes an operating platform, which is sequentially provided with a temporary storage station, a displacement station, and a receiving station; a displacement structure, which is disposed at the displacement station and is used to realize the movement of the module between the temporary storage station and the receiving station; and a buffer structure, which is disposed at the receiving station and is used to provide a receiving and buffering effect on the falling end of the module during the flipping and falling process of the module at the displacement station.

[0007] Optionally, the buffer structure includes a flexible component and an elastic component. The elastic component has a first end and a second end. The first end is connected to the operating table, and the second end is connected to the flexible component. The flexible component is used to provide a cushioning effect on the falling end of the module during the flipping and falling process of the module at the displacement station.

[0008] Optionally, the operating table includes a tabletop and a support surface disposed below the tabletop. The temporary storage station, displacement station, and receiving station are formed on the tabletop. The receiving station on the tabletop is provided with a through groove. The flexible component is disposed in the through groove, with its first end connected to the support surface and its second end connected to the bottom of the flexible component.

[0009] Optionally, the flexible element is higher than the platform in both the initial state and the compressed state; wherein, the initial state represents the state in which the module is not in contact with the flexible element, and the compressed state represents the state in which the falling end of the module contacts and is fully supported by the flexible element.

[0010] Optionally, the buffer structure further includes a support plate, which includes a first support plate and a second support plate, which are disposed opposite to each other; the first support plate has a first surface and a second surface, the first surface is connected to the first end, and the second surface is connected to the support surface; the second support plate has a third surface and a fourth surface, the third surface is connected to the second end, and the fourth surface is fitted and connected to the bottom of the flexible member.

[0011] Optionally, there are multiple elastic elements, which are spaced apart between the first support plate and the second support plate and distributed along the length direction of the first support plate and the second support plate.

[0012] Optionally, the buffer structure further includes a fixing member and a guide rod, the guide rod being sleeved inside the elastic member; one end of the guide rod is used to pass through the second support plate and be threadedly connected to the fixing member, and the other end of the guide rod is fixedly connected to the first support plate; one end of the elastic member abuts against the third surface, and the other end abuts against the first surface.

[0013] Optionally, the buffer structure further includes a mounting portion disposed on the first support plate and the second support plate, and the mounting portion is correspondingly disposed with the guide rod; the mounting portion is a ring structure, with both ends of the elastic member respectively sleeved in the mounting portion, and the end of the guide rod away from the flexible member connected to the mounting portion.

[0014] Optionally, the bottom of the flexible member is provided with a mounting hole, and the ends of the fixing member and the guide rod are located in the mounting hole and are connected to the inner surface of the mounting hole.

[0015] Optionally, the displacement structure includes multiple rows of rollers arranged in parallel, each row of which includes multiple rollers spaced apart; the multiple rows of rollers are perpendicular to the extension direction of the connecting groove.

[0016] The beneficial effects of the modular shock absorption and buffer device provided by this utility model include, for example:

[0017] The module's shock absorption and cushioning device includes an operating platform, a displacement structure, and a cushioning structure. The operating platform is sequentially equipped with a temporary storage station, a displacement station, and a receiving station. The displacement structure, located at the displacement station, facilitates the movement of the module between the temporary storage station and the receiving station. The cushioning structure, located at the receiving station, provides cushioning for the module's falling end during its flipping and descent at the displacement station. The displacement structure at the displacement station and the cushioning structure at the receiving station assist operators in moving and flipping the module with less force, improving assembly efficiency. Furthermore, when the module approaches the cushioning structure for flipping, the falling end is effectively caught by the cushioning structure, preventing impact on the platform caused by free fall. This protective mechanism prevents damage to the module structure and ensures the smooth progress of subsequent assembly processes, especially welding. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the module shock absorption and buffer device provided in this embodiment of the present invention from a first-view perspective;

[0020] Figure 2 A schematic diagram of the module shock absorption and buffer device provided in this embodiment of the present invention from a second perspective;

[0021] Figure 3 A schematic diagram of the buffer structure (with flexible components omitted) provided in the embodiment of this utility model for the purposes of this application, viewed from a first perspective;

[0022] Figure 4 A schematic diagram of the structure of the flexible component provided in the embodiment of this utility model, as shown in the first viewpoint, for the purposes of this application.

[0023] Icons: 10-Module shock absorption and buffer device; 100-Operating table; 200-Displacement structure; 300-Buffer structure; 101-Temporary storage station; 102-Displacement station; 103-Receiving station; 310-Flexible component; 330-Elastic component; 331-First end; 332-Second end; 110-Tabletop; 120-Supporting surface; 111-Connecting groove; 350-Supporting plate; 351-First support plate; 352-Second support plate; 351a-First surface; 351b-Second surface; 352a-Third surface; 352b-Fourth surface; 360-Fixing component; 370-Guide rod; 353-Mounting part; 311-Mounting hole; 210-Roller assembly. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0027] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0028] Please refer to Figure 1 and Figure 2This application provides a module shock absorption and buffer device to improve the process convenience of battery module assembly and flipping, while effectively absorbing the impact energy of the module during the flipping and falling process, avoiding damage to the module during assembly and maintaining the integrity of the module structure.

[0029] In this embodiment, the module shock absorption and buffer device 10 includes an operating platform 100, a displacement structure 200, and a buffer structure 300, with the module located on the operating platform. The operating platform 100 is sequentially provided with a temporary storage station 101, a displacement station 102, and a receiving station 103. The displacement structure 200 is located at the displacement station 102 and is used to move the module between the temporary storage station 101 and the receiving station 103. The buffer structure 300 is located at the receiving station 103 and is used to provide a receiving and buffering effect on the falling end of the module during its flipping and falling process at the displacement station 102.

[0030] When the module is removed from the production line and transferred to the operating table 100, it is located at the temporary storage station 101, with its long side roughly parallel to the edge of the operating table 100. The operator pushes the module horizontally, causing it to move from the temporary storage station 101 to the displacement station 102. As the module enters the displacement station 102, the dynamic friction between the module and the operating table 100 gradually decreases due to their relative motion; once the entire module has entered the displacement station 102, the dynamic friction remains constant. When the module moves to near its fixed position at the displacement station 102, a module flipping action is performed. It is important to emphasize that 'near the fixed position' here refers to the flipping operation when the module approaches the buffer structure 300, ensuring that the falling end of the module accurately lands in the receiving area of ​​the buffer structure 300, thereby effectively cushioning and stably receiving the falling end of the module with the help of the buffer structure 300.

[0031] The displacement structure 200 at displacement station 102 and the buffer structure 300 at receiving station 103 serve two purposes: firstly, they assist operators in using less force to flip the module, improving assembly efficiency; secondly, when the module approaches the buffer structure 300, the falling end is effectively caught by the buffer structure 300, preventing impact on the table surface 110 caused by free fall. This protective mechanism prevents damage to the module structure and ensures the smooth progress of subsequent assembly processes, especially welding.

[0032] It is worth noting that the area dimensions of temporary storage station 101 and displacement station 102 can be adjusted according to actual production needs to ensure compatibility with the process flow.

[0033] It should be noted that although this embodiment uses manual flipping as an example, in actual applications, automated robotic arms can also be used to achieve the flipping function.

[0034] In this embodiment, reference Figure 3 and Figure 4 The buffer structure 300 includes a flexible element 310 and an elastic element 330. The elastic element 330 has a first end 331 and a second end 332. The first end 331 is connected to the operating table 100, and the second end 332 is connected to the flexible element 310. The flexible element 310 is used to provide a cushioning for the falling end of the module during the flipping and falling process of the module on the displacement station 102.

[0035] The flexible component 310 can be made of polymer materials, including but not limited to single materials or combinations thereof such as polyurethane (PU), thermoplastic elastomer (TPE), silicone rubber (PDMS), and polycarbonate (PC). The specific material selection needs to be optimized based on the requirements of the actual working scenario, comprehensively considering key factors such as impact energy absorption capacity, operating temperature range, and service life. In practical applications, the cushioning effect of the material can be verified through tests such as dynamic compression ratio and rebound performance to ensure that it meets the performance requirements under specific working conditions and achieves optimal cushioning protection.

[0036] In this embodiment, the elastic element 330 adopts a spring structure. When the second end 332 of the elastic element 330 is subjected to pressure, the overall spring structure generates stable vertical compression deformation, ensuring that the force direction remains consistent and does not deviate. As a preferred embodiment, the elastic element 330 can adopt a flat-mouth spring structure, or a design scheme combining a spring and a guide structure, with the spring possessing a certain structural strength. The guide structure can be located inside or outside the spring, achieving directional displacement control through guiding engagement. This design ensures both the buffering performance of the elastic element 330 and effectively controls the movement trajectory, improving operational stability.

[0037] In this design, the second end 332 of the elastic element 330 is connected to the flexible element 310. This allows the flexible element 310 and the elastic element 330 to work together to absorb and cushion the falling module during the impact of the module falling on the buffer structure 300, resulting in a smoother attenuation of the impact force. The elastic element 330 provides linear elastic support and rapid rebound, making it suitable for scenarios that absorb high impact energy. The flexible element 310 absorbs the remaining energy through nonlinear deformation, reducing the peak impact force and avoiding rigid rebound.

[0038] In this embodiment, the operating table 100 includes a table surface 110 and a support surface 120 disposed below the table surface 110. A temporary storage station 101, a displacement station 102 and a receiving station 103 are formed on the table surface 110. A connecting groove 111 is provided through the receiving station 103 of the table surface 110. A flexible member 310 is disposed in the connecting groove 111, with its first end 331 connected to the support surface 120 and its second end 332 connected to the bottom of the flexible member 310.

[0039] The shock absorption and buffer device 10 of this module adopts a double-layer structure design of platform 110 and support surface 120. By fixing one end of the elastic element 330 to the support surface 120, the overall stability of the buffer structure 300 during impact deformation is significantly improved, making it particularly suitable for module assembly scenarios with large self-weight. The flexible element 310 in the device is set inside the connecting groove 111 to ensure that when subjected to impact, the elastic element 330 remains within the limited area of ​​the connecting groove 111 throughout the entire deformation process and will not displace or fall out.

[0040] To further optimize performance, a protective guide structure perpendicular to the platform 110 can be added to the inner surface of the connecting groove 111. This structure can effectively constrain the movement trajectory of the elastic element 330, ensuring that it deforms only in the vertical direction, avoiding the problem of displacement caused by uneven force, thereby ensuring the controllability of the buffering process. In other embodiments, the protective guide structure can also be provided on the outer periphery of the support and / or the elastic element 330.

[0041] In this embodiment, the flexible component is higher than the platform in both the initial state and the compressed state; wherein, the initial state represents the state in which the module does not contact the flexible component, and the compressed state represents the state in which the falling end of the module contacts and fully supports the flexible component.

[0042] During the module's descent, its falling end contacts the buffer structure 300. At this point, the flexible element 310 and the elastic element 330 bear the maximum initial impact force. The flexible element 310 and the elastic element 330 effectively absorb kinetic energy through coordinated deformation, providing a smooth buffer for the module's descent. In particular, the buffer structure 300 ensures that the lowest position of the flexible element 310 is always higher than the reference surface 110. This ensures that the module can descend in a controllable manner, avoiding rigid collisions with the platform 110; it also creates favorable conditions for subsequent processes. Understandably, when the module needs to be pushed back to the temporary storage station 101, the safe gap maintained between the buffer element and the platform 110 provides a smooth transition space for the pushing operation, ensuring a smooth and reliable module transfer process.

[0043] The upper surface of the flexible component 310 adopts an arc-shaped design or is optimized into a gently transitioning curved surface. This design has a dual advantage: firstly, the arc-shaped upper surface provides a smooth contact surface for the module, ensuring that the buffer structure 300 withstands uniform impact force during the module's buffered descent; secondly, the optimized curved surface structure facilitates the smooth return of the module to the temporary storage station 101 after buffering, thereby maintaining a smooth transition during the module's descent (from the flexible component 310 to the platform 110) and avoiding impact vibration. The arc-shaped design or gently transitioning curved surface not only meets the buffering performance requirements but also optimizes the continuity of the production process, making the entire module handling process more reliable.

[0044] In this embodiment, the buffer structure 300 further includes a support plate 350, which includes a first support plate 351 and a second support plate 352, which are disposed opposite to each other. The first support plate 351 has a first surface 351a and a second surface 351b, the first surface 351a being connected to the first end 331 and the second surface 351b being connected to the support surface 120. The second support plate 352 has a third surface 352a and a fourth surface 352b, the third surface 352a being connected to the second end 332 and the fourth surface 352b being attached to the bottom of the flexible member 310.

[0045] refer to Figure 1 and Figure 4 In this embodiment, the support plate 350 adopts a long strip structure design, and its outer contour shape matches the connecting groove 111. Specifically, two support plates 350 are configured and arranged between the bottom of the flexible member 310 and the support surface 120, forming a stable double-layer buffer support structure. The flexible member 310 is fixed to the fourth surface 352b of the support plate 350 by adhesive bonding, while the second surface 351b of the support plate 350 can be detachably connected to the support surface 120 by bolts. This design ensures both ease of assembly and reliable mechanical support strength for the falling module.

[0046] There are four elastic elements 330, which are spaced apart between the first support plate 351 and the second support plate 352 and distributed along the length of the first support plate 351 and the second support plate 352. The multiple elastic elements 330 can be arranged symmetrically, which can improve the mechanical performance of the elastic elements 330 when subjected to the impact of the module falling, making the force on the elastic elements 330 more uniform. This not only extends the service life of the elastic elements 330, but also ensures the reliability of the device under long-term cyclic loads, thus improving the overall durability of the device.

[0047] In this embodiment, the buffer structure 300 further includes a fixing member 360 and a guide rod 370. The guide rod 370 is sleeved within the elastic member 330. One end of the guide rod 370 passes through the second support plate 352 and is threadedly connected to the fixing member 360. The other end of the guide rod 370 is fixedly connected to the first support plate 351. One end of the elastic member abuts against the third surface, and the other end abuts against the first surface. The guide rod 370 adopts a through-type design, with one end passing through the second support plate 352 and forming a threaded fastening connection with the fixing member 360, thereby constructing a stable connection structure including the guide rod 370, the fixing member 360, and the second support plate 352. In some embodiments, considering that the buffer structure 300 needs to repeatedly withstand the falling impact load of the module, this periodic impact can easily cause the connection structure between the guide rod 370, the fixing member 360, and the second support plate 352 to loosen and fail. Therefore, an engineering gasket can be added between the fixing member 360 and the second support plate 352. The gasket can effectively absorb and disperse impact vibration energy, significantly improve the self-locking performance of the threaded connection, enhance the structural stability of the overall device under long-term cyclic load, and effectively extend the service life of the buffer structure 300.

[0048] In this embodiment, the buffer structure 300 further includes a mounting part 353, which is disposed on the first support plate 351 and the second support plate 352. The mounting part 353 is correspondingly disposed with the guide rod 370. The mounting part 353 is a ring structure, and the two ends of the elastic member 330 are respectively sleeved in the mounting part 353. The end of the guide rod 370 away from the flexible member 310 is connected to the mounting part 353.

[0049] It is easy to understand that the length design of the mounting part 353 is flexible: it can be a full-coverage design with the same length as the elastic member 330, or a partial design that only wraps the end of the elastic member 330.

[0050] In this embodiment, reference Figure 4 The bottom of the flexible component has a mounting hole, and the ends of the fixing component and the guide rod are located inside the mounting hole and connected to the inner surface of the mounting hole.

[0051] Compared to the case where the flexible component 310 does not have mounting holes 311, the mounting holes 311 are opened in the bottom area of ​​the flexible component 310 corresponding to the end of the guide rod 370. This can increase the contact area between the two parts, improve the interface bonding force, and enable the elastic buffer system to maintain the stable connection performance between the flexible component 310 and related components when subjected to long-term cyclic impacts, making it less likely to fall off or become misaligned.

[0052] In this embodiment, the displacement structure 200 includes four rows of roller groups 210 arranged in parallel, each row of roller groups 210 including four rollers spaced apart; the multiple rows of roller groups 210 are perpendicular to the extension direction of the connecting groove 111, thereby facilitating low-friction displacement of the module on the displacement structure 200, enabling the module to slide easily and reducing pushing resistance.

[0053] The working principle and process of the module shock absorption and buffer device 10 provided in this embodiment of the utility model are as follows:

[0054] The module is transferred from the production line to the temporary storage station 101, and then pushed from the temporary storage station 101 to the displacement station 102. At the displacement station 102, the module achieves low-friction displacement and continuously approaches the receiving station 103. The module stops at the appropriate position at the displacement station 102 for a flipping operation. During the flipping process, the falling end of the module lands on the buffer structure 300, which provides a cushioning effect, allowing the module to fall smoothly onto the operating table 100. Then, the operator performs relevant operations on the other side of the module, and finally pushes the module from the receiving station 103 back to the temporary storage station 101 via the displacement station 102.

[0055] In summary, the module shock absorption and buffer device 10 can improve the process convenience of battery module assembly and flipping, assisting operators to move the module with less force and improve the efficiency of module assembly; at the same time, the device can effectively absorb the impact energy of the module during the flipping and falling process, avoid damage to the module during assembly, and maintain the structural integrity of the module.

[0056] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A modular shock absorption and buffer device, characterized in that, include: The operating table (100) is provided with a temporary storage station (101), a displacement station (102) and a receiving station (103) in sequence; A displacement structure (200) is provided at the displacement station (102) and is used to realize the movement of the module between the temporary storage station (101) and the receiving station (103). A buffer structure (300) is provided at the receiving station (103). The buffer structure (300) is used to provide a receiving buffer for the falling end of the module during the flipping and falling process of the module at the displacement station (102).

2. The module shock absorption and buffer device according to claim 1, characterized in that, The buffer structure (300) includes a flexible element (310) and an elastic element (330). The elastic element (330) has a first end (331) and a second end (332). The first end (331) is connected to the operating table (100), and the second end (332) is connected to the flexible element (310). The flexible element (310) is used to provide a cushioning effect on the falling end of the module during the flipping and falling process of the module on the displacement station (102).

3. The module shock absorption and buffer device according to claim 2, characterized in that, The operating table (100) includes a table surface (110) and a support surface (120) disposed below the table surface (110). The temporary storage station (101), the displacement station (102) and the receiving station (103) are formed on the table surface (110). The receiving station (103) of the table (110) is provided with a through groove (111), and the flexible component (310) is disposed in the through groove (111). The first end (331) is connected to the support surface (120), and the second end (332) is connected to the bottom of the flexible component (310).

4. The module shock absorption and buffer device according to claim 3, characterized in that, The flexible element (310) is higher than the platform (110) in both the initial state and the compressed state; wherein, the initial state represents the state in which the module does not contact the flexible element (310), and the compressed state represents the state in which the falling end of the module contacts and is fully supported by the flexible element (310).

5. The module shock absorption and buffer device according to claim 3, characterized in that, The buffer structure (300) further includes a support plate (350), which includes a first support plate (351) and a second support plate (352), and the first support plate (351) and the second support plate (352) are arranged opposite to each other; The first support plate (351) has a first surface (351a) and a second surface (351b), the first surface (351a) being connected to the first end (331), and the second surface (351b) being connected to the support surface (120); The second support plate (352) has a third surface (352a) and a fourth surface (352b), the third surface (352a) being connected to the second end (332), and the fourth surface (352b) being fitted and connected to the bottom of the flexible member (310).

6. The module shock absorption and buffer device according to claim 5, characterized in that, The number of elastic elements (330) is multiple, and the multiple elastic elements (330) are spaced apart between the first support plate (351) and the second support plate (352) and distributed along the length direction of the first support plate (351) and the second support plate (352).

7. The module shock absorption and buffer device according to claim 5, characterized in that, The buffer structure (300) further includes a fixing member (360) and a guide rod (370), the guide rod (370) being sleeved inside the elastic member (330); One end of the guide rod (370) is used to pass through the second support plate (352) and be threaded to the fastener (360), and the other end of the guide rod (370) is fixedly connected to the first support plate (351); One end of the elastic member (330) abuts against the third surface (352a), and the other end abuts against the first surface (351a).

8. The module shock absorption and buffer device according to claim 7, characterized in that, The buffer structure (300) further includes a mounting part (353), which is disposed on the first support plate (351) and the second support plate (352), and the mounting part (353) is correspondingly disposed with the guide rod (370); The mounting part (353) has a ring structure. The two ends of the elastic member (330) are respectively sleeved in the mounting part (353). The end of the guide rod (370) away from the flexible member (310) is connected to the mounting part (353).

9. The module shock absorption and buffer device according to claim 7, characterized in that, The bottom of the flexible component (310) is provided with a mounting hole (311), and the ends of the fixing component (360) and the guide rod (370) are located in the mounting hole (311) and connected to the inner surface of the mounting hole (311).

10. The module shock absorption and buffer device according to any one of claims 2-9, characterized in that, The displacement structure (200) includes multiple rows of roller groups (210) arranged in parallel, each row of roller groups (210) including multiple rollers distributed at intervals; the multiple rows of roller groups (210) are perpendicular to the extension direction of the flexible member (310).