Multilayer thermoforming mold

By introducing a multi-layer design and a heat-conducting profiler positioning structure into the hot pressing mold, the problem of low efficiency in existing molds is solved, achieving high-efficiency production and product consistency, and it is suitable for hot pressing of various materials.

CN224465358UActive Publication Date: 2026-07-07GUANGDONG XINXIU NEW MATERIAL CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGDONG XINXIU NEW MATERIAL CO LTD
Filing Date
2025-05-13
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

The single-layer cavity design of existing thermoforming molds limits processing efficiency and makes it difficult to meet the needs of large-scale, high-efficiency production.

Method used

A multi-layer hot-press forming mold is adopted. By setting a heat-conducting contour plate between the upper and lower molds, an upper cavity and a lower cavity are formed. The heat-conducting contour plate has a positioning structure that cooperates with the mold to ensure accurate positioning and stable forming.

Benefits of technology

It enables the simultaneous production of two-layer products in a single hot pressing operation, significantly improving production efficiency, reducing production costs and equipment wear, ensuring product consistency and quality stability, and is suitable for hot pressing of various materials.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a multilayer hot press forming die, including upper die, heat conduction profiling board and lower die, heat conduction profiling board is located between upper die with lower die, the upper cavity is formed between heat conduction profiling board with upper die, the lower cavity is formed between heat conduction profiling board with lower die, heat conduction profiling board has first positioning structure, and lower die and / or upper die has the second positioning structure with first positioning structure cooperation. The multilayer hot press forming die of this has high production efficiency, long service life, can effectively reduce production cost.
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Description

Technical Field

[0001] This utility model relates to the field of molding die technology, and in particular to multi-layer hot pressing molding die. Background Technology

[0002] Hot pressing is a process that heats and applies pressure to shape a material. Specifically, it uses heat to soften the material, and then, under pressure, forces the material to flow and deform in a mold to obtain a product of the desired shape and size. Materials can be thermoplastics, thermosetting plastics, composite materials, etc.

[0003] With the continuous development of industrial production, thermoforming technology has been widely used in many fields, such as automotive parts manufacturing, electronic device housing molding, and aerospace composite material component production. Existing thermoforming molds generally include mating lower and upper molds, forming a cavity between them for molding the product. In current technology, this cavity is a single-layer structure, and each thermoforming operation can only form a maximum of multiple products on the same layer. This design, to some extent, limits the improvement of processing efficiency and makes it difficult to meet the urgent needs of large-scale, high-efficiency production. Utility Model Content

[0004] The technical problem solved by this utility model is to provide a multi-layer hot pressing mold with high production efficiency.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a multi-layer hot pressing molding die, including an upper die, a heat-conducting contour plate and a lower die, wherein the heat-conducting contour plate is located between the upper die and the lower die, an upper cavity is formed between the heat-conducting contour plate and the upper die, and a lower cavity is formed between the heat-conducting contour plate and the lower die, wherein the heat-conducting contour plate has a first positioning structure, and the lower die and / or the upper die has a second positioning structure that cooperates with the first positioning structure.

[0006] In one embodiment, the heat-conducting contour plate includes a main body, a connecting portion located outside the main body and connected to the main body, and a contact portion located outside the connecting portion and connected to the connecting portion, the contact portion respectively abutting against the upper mold and the lower mold; the upper cavity is formed between the main body and the upper mold, and the lower cavity is formed between the main body and the lower mold.

[0007] In one embodiment, the second positioning structure is a positioning block, the positioning block having a first positioning surface and a second positioning surface, the first positioning surface and the second positioning surface forming a positioning angle, the end face of the contact portion being a first contact surface that abuts against the first positioning surface, and the connecting portion having a second contact surface that abuts against the second positioning surface.

[0008] In one embodiment, the first abutting surface and the top surface of the contact portion transition through a slope or an arc surface; and / or, the first abutting surface and the bottom surface of the contact portion transition through a slope or an arc surface; and / or, the second abutting surface and the top surface of the connecting portion transition through a slope or an arc surface; and / or, the second abutting surface and the bottom surface of the connecting portion transition through a slope or an arc surface.

[0009] In one embodiment, the heat-conducting contour plate has contact portions on opposite sides, and the two ends of the contact portions are respectively provided with positioning blocks.

[0010] In one embodiment, an upper isolation groove is formed between the connecting portion and the upper mold, and a lower isolation groove is formed between the connecting portion and the lower mold.

[0011] In one embodiment, the upper cavity and the lower cavity are mirror-symmetrical.

[0012] In one embodiment, the number of the thermally conductive contour plates is one or more.

[0013] In one embodiment, a locking structure is further included, the locking structure being disposed on the upper mold, the locking structure including a locking hook for hooking the heat-conducting profile plate.

[0014] In one embodiment, the upper mold is provided with a mounting block, the locking hook is rotatably connected to the mounting block, the locking structure also includes an elastic element, the elastic element contacts the locking hook and the mounting block respectively, and the bottom end of the locking hook is provided with a guide surface near the heat-conducting contour plate, the guide surface being an inclined surface or an arc surface.

[0015] The beneficial effects of this utility model are as follows:

[0016] By setting a heat-conducting molding plate between the upper and lower molds to form an upper cavity and a lower cavity, two layers of products can be produced simultaneously in one hot pressing operation, which significantly improves production efficiency and effectively meets the needs of large-scale, high-efficiency production.

[0017] The design of the heat-conducting profile plate not only increases the number of cavities, but also maintains the simplicity and ease of operation of the mold structure, eliminating the need for large-scale modifications to existing hot pressing equipment and reducing production costs.

[0018] The heat-conducting profile plate has a first positioning structure, which cooperates with the second positioning structure of the lower mold and / or upper mold to ensure accurate positioning and stable molding of the upper and lower cavities, thereby improving the consistency and quality stability of the products.

[0019] This multi-cavity design also reduces the frequency of mold replacements, extends mold life, and further reduces equipment wear and maintenance costs. Simultaneously, the mold is suitable for hot pressing of various materials, such as thermoplastics, thermosetting plastics, and composite materials, exhibiting wide applicability and good versatility. It can be widely used in automotive parts manufacturing, electronic device housing molding, and aerospace composite component production, providing strong technical support for the development of related industries and demonstrating significant economic and social benefits. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 This is an exploded view of the multi-layer hot pressing mold of Embodiment 1 of this utility model;

[0022] Figure 2 This is a cross-sectional view of the multi-layer hot pressing mold of Embodiment 1 of this utility model;

[0023] Figure 3 This is a schematic diagram of the upper mold in the multi-layer hot pressing mold of Embodiment 1 of this utility model;

[0024] Figure 4 This is a cross-sectional view of the multi-layer hot pressing mold of Embodiment 2 of this utility model;

[0025] Figure 5 This is an exploded view of the multi-layer hot pressing mold of Embodiment 3 of this utility model;

[0026] Figure 6 This is a schematic diagram of the upper mold in the multi-layer hot pressing mold of Embodiment 3 of this utility model;

[0027] Figure 7 for Figure 6 Enlarged view of point A in the middle.

[0028] Explanation of icon numbers:

[0029] 1. Upper mold;

[0030] 2. Thermally conductive contour plate; 21. Main body; 22. Connecting part; 221. Upper isolation groove; 222. Lower isolation groove; 223. Second contact surface; 23. Contact part; 231. First contact surface;

[0031] 3. Lower mold;

[0032] 4. Positioning block; 41. First positioning surface; 42. Second positioning surface;

[0033] 5. Upper cavity; 51. Upper layer product;

[0034] 6. Lower cavity; 61. Lower layer product;

[0035] 7. Locking structure; 71. Locking hook; 711. Guide surface; 72. Mounting block. Detailed Implementation

[0036] The purpose, features, and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] It should be noted that if the embodiments of this utility model involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0039] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0040] Furthermore, if the meaning of "and / or" appears throughout the text, it refers to three parallel solutions. For example, "and / or" includes solution 1, solution 2, and solution 3, which simultaneously satisfy the above conditions. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0041] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0042] Example 1

[0043] Please refer to Figures 1 to 3 Embodiment 1 of this utility model is a multi-layer hot-press molding die, including an upper mold 1, a heat-conducting contour plate 2, and a lower mold 3. The heat-conducting contour plate 2 is located between the upper mold 1 and the lower mold 3, forming an upper cavity 5 between the heat-conducting contour plate 2 and the upper mold 1. The upper cavity 5 is used to form an upper product 51. The heat-conducting contour plate 2 and the lower mold 3 form a lower cavity 6, which is used to form a lower product 61. The heat-conducting contour plate 2 has a first positioning structure, and the lower mold 3 and / or the upper mold 1 have a second positioning structure that cooperates with the first positioning structure. In this embodiment, the number of heat-conducting contour plates is one.

[0044] Optionally, the heat-conducting contour plate 2 is made of steel. In this embodiment, the heat-conducting contour plate 2 is made of NAK80 material, the lower mold 3 is made of graphite, and the upper mold 1 is made of graphite. In other embodiments, the heat-conducting contour plate 2 can also be made of other heat-conducting materials. Similarly, the lower mold 3 can also be made of other heat-conducting materials, and the upper mold 1 can also be made of other heat-conducting materials.

[0045] Specifically, the heat-conducting contour plate 2 includes a main body 21, a connecting part 22 located outside the main body 21 and connected to the main body 21, and a contact part 23 located outside the connecting part 22 and connected to the connecting part 22. The main body 21 and the upper mold 1 form the upper cavity 5, and the main body 21 and the lower mold 3 form the lower cavity 6. The contact part 23 abuts against the upper mold 1 and the lower mold 3 respectively. That is, the upper mold 1 and the lower mold 3 fix the heat-conducting contour plate 2 by clamping the contact part 23, thereby ensuring the dimensional stability of the upper cavity 5 and the lower cavity 6, and thus ensuring the dimensional accuracy of the product.

[0046] To facilitate demolding of the product and discharge of excess material, an upper isolation groove 221 is formed between the connecting part 22 and the upper mold 1, and a lower isolation groove 222 is formed between the connecting part 22 and the lower mold 3.

[0047] Preferably, the connecting portion 22 is arranged in a ring around the edge of the main body 21. In this embodiment, the main body 21 is rectangular, and the connecting portion 22 is rectangular.

[0048] In other embodiments, the upper cavity 5 and the lower cavity 6 can be staggered, and the upper cavity 5 and the lower cavity 6 can have different dimensions, so that the upper cavity 5 and the lower cavity 6 can produce products of different sizes and shapes. However, in this embodiment, the upper cavity 5 and the lower cavity 6 have the same size, and the upper cavity 5 and the lower cavity 6 produce products of the same size and shape. In this case, it is preferable that the upper cavity 5 and the lower cavity 6 are arranged in a one-to-one correspondence.

[0049] In detail, the second positioning structure is a positioning block 4, which has a first positioning surface 41 and a second positioning surface 42. A positioning angle is formed between the first positioning surface 41 and the second positioning surface 42. The end face of the contact portion 23 is a first contact surface 231 that abuts against the first positioning surface 41, and the connecting portion 22 has a second contact surface 223 that abuts against the second positioning surface 42. Optionally, the positioning angle is an acute angle, a right angle, or an obtuse angle.

[0050] During the process of placing and removing the heat-conducting profile plate 2, there is frictional loss between the connecting part 22 and the positioning block 4, as well as between the contact part 23 and the positioning block 4. Therefore, the positioning block 4 is preferably made of wear-resistant material. In this embodiment, the positioning block 4 is made of steel, which can extend the service life of the multi-layer hot pressing mold.

[0051] To facilitate the placement and removal of the heat-conducting contour plate 2, the first contact surface 231 and the top surface of the contact portion 23 are transitioned by a slope or an arc surface; and / or, the first contact surface 231 and the bottom surface of the contact portion 23 are transitioned by a slope or an arc surface; and / or, the second contact surface 223 and the top surface of the connecting portion 22 are transitioned by a slope or an arc surface; and / or, the second contact surface 223 and the bottom surface of the connecting portion 22 are transitioned by a slope or an arc surface.

[0052] In this embodiment, the heat-conducting contour plate 2 has contact portions 23 on opposite sides, and the two ends of the contact portions 23 are respectively provided with positioning blocks 4; there are four positioning blocks 4, which are arranged in a rectangular array, so that the heat-conducting contour plate 2 can be positioned more effectively.

[0053] To ensure the thermally conductive profile plate 2 is more stably clamped and fixed, thereby guaranteeing the dimensional accuracy of the product processing, the two ends of the thermally conductive profile plate 2 are respectively provided with contact portions 23. In this case, corresponding positioning blocks 4 are not required at the ends of the thermally conductive profile plate 2. Figure 1 As shown.

[0054] Example 2

[0055] Please refer to Figure 4 Embodiment 2 of this utility model is a parallel technical solution to Embodiment 1, but differs from Embodiment 1 in that: in this embodiment, the upper cavity 5 and the lower cavity 6 are mirror-symmetrical. For products with high requirements for appearance and size, the mirror-symmetry of the upper cavity 5 and the lower cavity 6 ensures that the heat transfer paths of the upper mold 1 and the lower mold 3 are the same during product molding, thus better guaranteeing the stability of the product's appearance and size.

[0056] Example 3

[0057] Please refer to Figures 5 to 7 The third embodiment of this utility model is a parallel technical solution to the first embodiment. The difference between the third and the first embodiment is that the number of heat-conducting contour plates 2 contained between the upper mold 1 and the lower mold 3 is multiple. The multiple heat-conducting contour plates 2 are stacked or arranged horizontally. In order to ensure smooth heat conduction and thus ensure the production quality of the product, it is preferred that the multiple heat-conducting contour plates 2 are arranged horizontally.

[0058] In this embodiment, the number of heat-conducting contour plates 2 is two.

[0059] In one or more embodiments, the multilayer hot-press forming mold further includes a locking structure 7 disposed on the upper mold 1. The locking structure 7 includes a hook 71 for hooking the heat-conducting profile plate 2. During mold opening, the locking structure 7 on the upper mold 1 can move the heat-conducting profile plate 2, thereby prying the heat-conducting profile plate 2 off the lower mold 3, thus overcoming the phenomenon that the heat-conducting profile plate 2 is difficult to remove due to vacuum adsorption. It is readily understood that the upper mold 1 has the locking structures 7 disposed opposite to each other at both ends.

[0060] Optionally, the upper mold 1 is provided with a mounting block 72, and the locking hook 71 is rotatably connected to the mounting block 72. The locking structure 7 also includes an elastic element, which may be a torsion spring, etc. The elastic element contacts the locking hook 71 and the mounting block 72 respectively. The bottom end of the locking hook 71 is provided with a guide surface 711 near the heat-conducting profile plate 2. The guide surface 711 is an inclined surface or an arc surface. When the mold is closed, the guide surface 711 abuts against the heat-conducting profile plate 2, which will drive the locking hook 71 to rotate, so that the locking hook 71 can automatically hook onto the heat-conducting profile plate 2, which facilitates the operation of the operator.

[0061] The above are merely optional embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A multi-layer hot pressing mold, characterized in that: The device includes an upper mold, a heat-conducting contour plate, and a lower mold. The heat-conducting contour plate is located between the upper mold and the lower mold. An upper cavity is formed between the heat-conducting contour plate and the upper mold, and a lower cavity is formed between the heat-conducting contour plate and the lower mold. The heat-conducting contour plate has a first positioning structure, and the lower mold and / or the upper mold has a second positioning structure that cooperates with the first positioning structure.

2. The multi-layer hot pressing mold according to claim 1, characterized in that: The heat-conducting contour plate includes a main body, a connecting part located outside the main body and connected to the main body, and a contact part located outside the connecting part and connected to the connecting part. The contact part abuts against the upper mold and the lower mold respectively. The upper cavity is formed between the main body and the upper mold, and the lower cavity is formed between the main body and the lower mold.

3. The multi-layer hot pressing mold according to claim 2, characterized in that: The second positioning structure is a positioning block, which has a first positioning surface and a second positioning surface. The first positioning surface and the second positioning surface form a positioning angle. The end face of the contact part is a first contact surface that abuts against the first positioning surface. The connecting part has a second contact surface that abuts against the second positioning surface.

4. The multi-layer hot pressing mold according to claim 3, characterized in that: The first abutting surface transitions to the top surface of the contact portion via a slope or an arc surface; and / or, the first abutting surface transitions to the bottom surface of the contact portion via a slope or an arc surface; and / or, the second abutting surface transitions to the top surface of the connecting portion via a slope or an arc surface; and / or, the second abutting surface transitions to the bottom surface of the connecting portion via a slope or an arc surface.

5. The multi-layer hot pressing mold according to claim 3, characterized in that: The heat-conducting contour plate has contact portions on its opposite sides, and the positioning blocks are respectively provided at both ends of the contact portions.

6. The multi-layer hot pressing mold according to claim 2, characterized in that: An upper isolation groove is formed between the connecting part and the upper mold, and a lower isolation groove is formed between the connecting part and the lower mold.

7. The multi-layer hot pressing mold according to claim 1, characterized in that: The upper cavity and the lower cavity are mirror images of each other.

8. The multi-layer hot pressing mold according to claim 1, characterized in that: The number of the heat-conducting contour plates is one or more.

9. The multi-layer hot pressing mold according to claim 1, characterized in that: It also includes a locking structure, which is disposed on the upper mold and includes a locking hook for hooking the heat-conducting profile plate.

10. The multi-layer hot pressing mold according to claim 9, characterized in that: The upper mold is provided with a mounting block, and the locking hook is rotatably connected to the mounting block. The locking structure also includes an elastic element, which contacts the locking hook and the mounting block respectively. The bottom end of the locking hook is provided with a guide surface on the side near the heat-conducting contour plate. The guide surface is an inclined surface or an arc surface.