A temperature and pressure integrated sensor of a new type of packaging structure
By improving the sensor's packaging structure and signal transmission design, the problems of sealing failure, signal crosstalk, and dynamic response lag in traditional integrated temperature and pressure sensors have been solved, resulting in a highly reliable and fast-response integrated temperature and pressure sensor.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BRETT ZHILIAN TECH (HANGZHOU) CO LTD
- Filing Date
- 2025-08-16
- Publication Date
- 2026-07-07
AI Technical Summary
Traditional integrated temperature and pressure sensors suffer from problems such as sealing failure, severe signal crosstalk, and lag in dynamic response, especially in high-pressure media environments.
The device employs a coaxial housing, core base, and sheath structure, combined with axial and radial sealing rings, and uses hydrogenated nitrile rubber O-rings for triple sealing. The flexible circuit board uses a polyimide-based double-sided FPC board for signal shielding. The pressure sensor and temperature sensor are connected through a ceramic resistor thick film printing process to achieve highly reliable and low-interference signal transmission.
It achieves a sealing effect with a leakage rate of less than 0.001 mL/min under 10 MPa conditions, reduces signal crosstalk by 15 dB, and has a dynamic response time of less than 3 ms, thereby improving the reliability and anti-interference capability of the sensor.
Smart Images
Figure CN224471085U_ABST