Wafer macro inspection assembly

Abstract

The utility model discloses a wafer macroscopical detection assembly relates to chip wafer macroscopical detection technical field, this wafer macroscopical detection assembly includes the central control rotating platform, still includes rotating detection station and wafer fixing device, the central control rotating platform includes the central control platform and first rotating mechanism, the wafer fixing device includes vacuum chuck and second rotating mechanism, the rotating detection station is installed with third rotating mechanism, the utility model discloses a first rotating motor can transversely rotate wafer piece's wafer fixing device cooperation can longitudinally rotate wafer fixing device's second rotating motor can carry out multi -angle rotation demonstration to wafer piece, still can surround formula rotation demonstration wafer through the first rotating shaft of central control platform upper end, can multi -angle to wafer surface carries out detection, avoids the defect omission.

Description

Technical Field

[0001] This utility model relates to the technical field of macroscopic inspection of chip wafers, specifically to a wafer macroscopic inspection component. Background Technology

[0002] A wafer is a core material in the semiconductor industry. Its manufacturing process and application run through the entire chip production process. It is a thin film made of high-purity single-crystal silicon. It is named for its circular shape. It is the basic material for manufacturing integrated circuits (ICs) and provides the physical carrier for subsequent chip manufacturing.

[0003] Wafer macroscopic inspection is mainly used to identify macroscopic defects on the wafer surface, such as scratches, cracks, contamination, and foreign matter. These defects may affect subsequent chip manufacturing processes and the performance of the final product. During inspection, the wafer surface needs to be scanned with a high-resolution camera, the images are analyzed, and images of macroscopic defects are captured. When inspecting a wafer, it needs to be fixed in the inspection area and displayed by flipping the wafer through a display device so that the entire surface of the wafer can be inspected.

[0004] In existing wafer macroscopic inspection, wafer display equipment typically only rotates the wafer in a plane and flips it between the front and back sides. However, wafer surface defects such as scratches, cracks, pits, or bumps appear differently at different angles, and some defects can only be seen at specific angles. Existing display devices are difficult to display from multiple angles. Although some display devices are equipped with lifting functions to increase the observation angle, the increased observation angle is limited, and there is a risk of missing defects, which affects the product quality of subsequent chips. Utility Model Content

[0005] This invention provides a wafer macroscopic inspection component, which has the advantage of flexible multi-angle display of wafers, thus solving the problem of limited detection angles and missed defects in existing wafer defect detection and display equipment.

[0006] This utility model provides the following technical solution: a wafer macroscopic inspection assembly, including a central control rotating platform, and further including a rotating inspection stage and a wafer fixing device, wherein:

[0007] The central control rotating platform includes a central control console and a first rotating mechanism disposed on the upper part of the central control console. The first rotating mechanism is used to drive the rotating detection table to rotate.

[0008] The wafer fixing device includes a vacuum chuck and a second rotating mechanism mounted on the upper end of the rotating inspection stage for fixing the wafer, the second rotating mechanism being used to drive the vacuum chuck to rotate;

[0009] The rotating inspection stage is equipped with a third rotating mechanism for driving the wafer fixing device to rotate.

[0010] As a preferred technical solution of this utility model, the first rotating mechanism includes a first rotating shaft installed on the upper part of the central control panel and driven by a motor, and the upper end of the first rotating shaft is fixedly connected to the rotating detection table.

[0011] As a preferred embodiment of the present invention, the second rotating mechanism includes a first rotating motor disposed on the upper end of the rotating detection platform, and the output end of the first rotating motor is fixedly connected to the vacuum suction cup.

[0012] As a preferred technical solution of this utility model, the third rotating mechanism includes a second rotating motor installed in a rotating detection table. The upper end of the rotating detection table is provided with a rotating groove. A rotating table is rotatably connected in the rotating groove through a second rotating shaft. The first rotating motor is fixed on the upper end of the rotating table. A first transmission disk and a second transmission disk are respectively installed on the output end of the second rotating motor and the second rotating shaft on one side. The first transmission disk and the second transmission disk are connected by a transmission belt.

[0013] As a preferred technical solution of this utility model, a controller is installed at the front end of the rotating detection table, and the first rotating motor, the second rotating motor and the motor driving the first rotating shaft are all electrically connected to the controller.

[0014] Compared with the prior art, the present invention provides a wafer macroscopic inspection component, which has the following beneficial effects:

[0015] This invention utilizes a first rotary motor to horizontally rotate the wafer fixing device, combined with a second rotary motor to vertically rotate the wafer fixing device, to allow for multi-angle rotation and display of the wafer. Furthermore, the first rotating axis at the top of the control panel allows for a circumferential rotation display of the wafer, enabling multi-angle inspection of the wafer surface and preventing defects from being missed. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of wafer fixing according to the present invention;

[0017] Figure 2 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 3 This is a top structural diagram of the rotating testing platform of this utility model;

[0019] Figure 4 This is a schematic diagram of the internal right side structure of the rotating testing table of this utility model;

[0020] Figure 5 This is a schematic diagram of the internal left side structure of the rotating testing platform of this utility model.

[0021] In the diagram: 1. Central control rotating platform; 11. Central control console; 12. First rotating mechanism; 121. First rotating shaft; 2. Rotating detection table; 21. Controller; 22. Rotary slot; 3. Wafer fixing device; 31. Vacuum chuck; 32. Second rotating mechanism; 321. First rotating motor; 322. Rotating table; 323. Second rotating shaft; 4. Third rotating mechanism; 41. Second rotating motor; 42. First transmission disc; 43. Transmission belt; 44. Second transmission disc; 5. Wafer. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1-5 This utility model discloses a wafer macroscopic inspection assembly, including a central control rotating platform 1, a rotating inspection stage 2, and a wafer fixing device 3, wherein:

[0024] The central control rotating platform 1 includes a central control console 11 and a first rotating mechanism 12 disposed on the upper end of the central control console 11. The first rotating mechanism 12 is used to drive the rotating detection table 2 to rotate.

[0025] The wafer fixing device 3 includes a vacuum chuck 31 for fixing the wafer 5 and a second rotating mechanism 32, which are disposed on the upper end of the rotating inspection stage 2. The second rotating mechanism 32 is used to drive the vacuum chuck 31 to rotate.

[0026] The rotating inspection stage 2 is equipped with a third rotating mechanism 4 for rotating the wafer fixing device 3.

[0027] Please refer to the appendix. Figure 1-3 The first rotating mechanism 12 includes a first rotating shaft 121 mounted on the upper end of the central control panel 11 and driven by a motor. The upper end of the first rotating shaft 121 is fixedly connected to the rotating detection table 2.

[0028] Specifically, driven by the motor, the first rotating shaft 121 rotates, causing the entire rotating inspection table 2 to rotate. The rotating inspection table 2 drives the wafer fixing device 3 to rotate as a whole. The wafer 5, which is fixed on the wafer fixing device 3 by the vacuum suction cup 31, rotates 360° laterally under the drive of the wafer fixing device 3.

[0029] Furthermore, the second rotating mechanism 32 includes a first rotating motor 321 disposed on the upper end of the rotating inspection stage 2. The output end of the first rotating motor 321 is fixedly connected to the vacuum chuck 31. The first rotating motor 321 drives the vacuum chuck 31 to rotate, thereby causing the wafer 5 to rotate.

[0030] Furthermore, the third rotating mechanism 4 includes a second rotating motor 41 installed in the rotating detection table 2. The upper end of the rotating detection table 2 is provided with a rotating groove 22. The rotating table 322 is rotatably connected in the rotating groove 22 through a second rotating shaft 323. The first rotating motor 321 is fixed on the upper end of the rotating table 322. The output end of the second rotating motor 41 and the second rotating shaft 323 on one side are respectively equipped with a first transmission disk 42 and a second transmission disk 44. The first transmission disk 42 and the second transmission disk 44 are connected by a transmission belt 43.

[0031] Specifically, the second rotary motor 41 drives the second rotary shaft 323 to rotate via the transmission belt 43, the first transmission disk 42 and the second transmission disk 44. The second rotary shaft 323 drives the rotating table 322 and the first rotary motor 321 to rotate, thereby causing the wafer 5 fixed on the vacuum chuck 31 to rotate longitudinally, so that the wafer 5 can be tilted at multiple angles for display.

[0032] A controller 21 is installed at the front end of the rotating testing table 2. The first rotating motor 321, the second rotating motor 41, and the motor that drives the first rotating shaft 121 are all electrically connected to the controller 21.

[0033] Working principle and usage process of this utility model:

[0034] During the testing process, the controller 21 drives the first rotary motor 321, the second rotary motor 41 and the motor that drives the first rotary shaft 121 to start and adjust. Under the drive of the motor, the first rotary shaft 121 rotates, causing the entire rotary testing table 2 to rotate. The rotary testing table 2 drives the wafer fixing device 3 to rotate as a whole. The wafer 5 fixed on the wafer fixing device 3 by the vacuum suction cup 31 is rotated 360° laterally under the drive of the wafer fixing device 3.

[0035] The second rotary motor 41 drives the second rotary shaft 323 to rotate via the transmission belt 43, the first transmission disk 42 and the second transmission disk 44. The second rotary shaft 323 drives the rotating table 322 and the first rotary motor 321 to rotate, thereby causing the wafer 5 fixed on the vacuum chuck 31 to rotate longitudinally, so that the wafer 5 can be tilted at multiple angles for display.

[0036] The first rotary motor 321 drives the vacuum chuck 31 to rotate, thereby causing the wafer 5 to rotate;

[0037] At this time, the wafer 5, which is adsorbed and fixed on the vacuum chuck 31, rotates 360° under the drive of the first rotating shaft 121. At the same time, under the action of the second rotating motor 41, the wafer 5 can be tilted at multiple angles to perform defect detection on the wafer 5 at a preset angle. During the detection, the first rotating motor 321 drives the wafer 5 to rotate so that the entire wafer 5 is completely detected at a specific angle.

Claims

1. A wafer macroscopic inspection assembly, comprising a central control rotating platform (1), characterized in that, It also includes a rotating inspection stage (2) and a wafer fixing device (3), wherein: The central control rotating platform (1) includes a central control console (11) and a first rotating mechanism (12) disposed on the upper end of the central control console (11). The first rotating mechanism (12) is used to drive the rotating detection table (2) to rotate. The wafer fixing device (3) includes a vacuum chuck (31) for adsorbing and fixing the wafer (5) and a second rotating mechanism (32), wherein the second rotating mechanism (32) is used to drive the vacuum chuck (31) to rotate. The rotating inspection stage (2) is equipped with a third rotating mechanism (4) for driving the wafer fixing device (3) to rotate.

2. The wafer macroscopic inspection component according to claim 1, characterized in that: The first rotating mechanism (12) includes a first rotating shaft (121) installed on the upper end of the central control panel (11) and driven by a motor. The upper end of the first rotating shaft (121) is fixedly connected to the rotating detection table (2).

3. The wafer macroscopic inspection component according to claim 2, characterized in that: The second rotating mechanism (32) includes a first rotating motor (321) disposed on the upper end of the rotating detection table (2), and the output end of the first rotating motor (321) is fixedly connected to the vacuum suction cup (31).

4. The wafer macroscopic inspection component according to claim 3, characterized in that: The third rotating mechanism (4) includes a second rotating motor (41) installed in the rotating detection table (2). The upper end of the rotating detection table (2) is provided with a rotating groove (22). A rotating table (322) driven by the second rotating motor (41) is rotatably connected in the rotating groove (22). The first rotating motor (321) is fixed on the upper end of the rotating table (322).

5. The wafer macroscopic inspection component according to claim 4, characterized in that: The rotating platform (322) is symmetrically equipped with a second rotating shaft (323) on both sides. The rotating platform (322) is rotatably connected to the rotating groove (22) through the shaft hole. The second rotating shaft (323) is connected to the second rotating motor (41) for transmission.

6. The wafer macroscopic inspection component according to claim 5, characterized in that: The output end of the second rotary motor (41) and the second rotating shaft (323) on one side are respectively equipped with a first transmission disk (42) and a second transmission disk (44), and the first transmission disk (42) and the second transmission disk (44) are connected by a transmission belt (43).

7. The wafer macroscopic inspection component according to claim 6, characterized in that: The rotating testing platform (2) is equipped with a controller (21) at its front end. The first rotating motor (321), the second rotating motor (41) and the motor that drives the first rotating shaft (121) are all electrically connected to the controller (21).

Images