Chip heating device

Abstract

The utility model provides a kind of chip heating device, probe that is led out from temperature controller is contacted and connected with the first solder pad on first circuit board;Adopt the contact connection of probe and first solder pad, replace the plug-in connection of probe and plug-in, avoid the elastic deterioration of plug-in caused by continuous high temperature and large current impact, leading to unstable contact, so that chip test temperature is unstable.The utility model probe is contacted and connected with first solder pad, and connection is more stable.The inner circle protrusion of base is embedded in the annular back recess of floating plate and is fixed, and it is more easy to install and fix heating sheet.The inner circle protrusion of base replaces the 4 fixing holes on the four corners of base before improvement.If a plurality of heating resistors are connected in series, in this way, only one heating resistor is damaged, the whole circuit is broken, not heated, it is easy to find abnormality, and chip test temperature is more stable.

Description

Technical Field

[0001] This utility model belongs to the field of chip testing technology, and specifically relates to a chip heating device. Background Technology

[0002] Testing chips at different temperatures is a critical step in ensuring their reliability, stability, and performance, and typically involves temperature cycling tests, high / low temperature operating tests, aging tests, etc.

[0003] The connection method uses probes and plug-in mating contacts. Due to continuous high temperature and high current impact, the elasticity of the plug-in deteriorates, leading to unstable contact and unstable chip testing temperature. Furthermore, Figure 1 A schematic diagram showing the use of parallel-connected heating resistors in an existing heating device. (Example) Figure 1 As shown, multiple heating resistors in the heating device are connected in parallel. If one heating resistor is damaged, the overall resistance of the heating element will decrease, and the heat generated per unit time will increase, which will easily lead to temperature instability. Moreover, the circuit will still work, which is not easy to detect. Utility Model Content

[0004] The purpose of this invention is to provide a chip heating device in which a probe led from a temperature controller makes contact with a first solder pad on a first circuit board; this probe-to-solder pad contact connection provides a more stable connection. The inner ring protrusion of the substrate is embedded in the annular back groove of the floating plate for fixation, making it easier to install and fix the heating element. Several heating resistors are connected in series; thus, if one heating resistor fails, the entire circuit breaks, heating stops, and abnormalities are easily detected, resulting in more stable chip testing temperatures. This improves the accuracy of the chip testing environment temperature, thereby increasing the yield rate of chip testing.

[0005] This utility model provides a chip heating device, comprising:

[0006] A heating element, comprising a substrate, the substrate being in the shape of a hollow ring, wherein a plurality of heating resistors connected in series are embedded in the annular groove of the substrate;

[0007] A floating plate, wherein a chip is disposed in the central region of the floating plate; the inner annular side of the substrate has an inner ring protrusion extending along the thickness direction of the substrate, and the side of the floating plate facing the substrate has an annular back groove surrounding the chip; during assembly, the inner ring protrusion is embedded in the annular back groove for fixation; the heating resistor is used to heat the chip;

[0008] A first circuit board and a temperature controller, wherein the temperature controller is connected to the heating resistor via the first circuit board and controls the temperature of the heating resistor;

[0009] The first circuit board is provided with a first pad group, and the probe led out from the temperature controller is in contact with the first pad in the first pad group.

[0010] Furthermore, the first circuit board includes a flexible circuit board or a rigid circuit board.

[0011] Furthermore, the top surface of the inner ring protrusion of the substrate is higher than the top surface of the annular outer ring of the substrate.

[0012] Furthermore, the chip heating device also includes a temperature sensor, which tests the real-time temperature of the heating resistor and transmits the real-time temperature to the temperature controller through the first circuit board. The temperature controller adjusts the final temperature of the heating resistor based on the real-time temperature.

[0013] Furthermore, the temperature sensor includes any one of thermocouples, resistance temperature detectors (RTDs), thermistors, and infrared temperature sensors.

[0014] Furthermore, a wire groove is provided on the side of the substrate facing the first circuit board, and the series wires of the heating resistor and the wire harness of the temperature sensor are both led out from the wire groove and connected to the first circuit board.

[0015] Furthermore, a second pad group is provided on the first circuit board, and the series wire of the heating resistor and the wiring harness of the temperature sensor are respectively electrically connected to the second pad in the second pad group.

[0016] Furthermore, the chip is located in the middle region of the ring-shaped heating resistors, which heat the floating plate and then heat the chip on the floating plate through heat conduction.

[0017] Furthermore, during assembly, after filling the annular back groove in the floating plate with thermally conductive adhesive, the inner ring protrusion is then embedded into the annular back groove for fixation.

[0018] Furthermore, three to eight heating resistors connected in series are embedded in the annular groove of the substrate.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] This utility model provides a chip heating device, comprising: a heating element, the heating element including a substrate, the substrate being in the shape of a hollow ring, and a plurality of heating resistors connected in series embedded in the annular groove of the substrate; a floating plate, the central region of which a chip is disposed; the inner side of the annular substrate has an inner ring protrusion extending along the thickness direction of the substrate, and the side of the floating plate facing the substrate has an annular back groove surrounding the chip; during assembly, the inner ring protrusion is embedded in the annular back groove for fixation; the heating resistors are used to heat the chip; a first circuit board and a temperature controller, the temperature controller being connected to the heating resistors through the first circuit board and controlling the temperature of the heating resistors; a first pad group is disposed on the first circuit board, and a probe led out from the temperature controller contacts and connects to the first pad in the first pad group.

[0021] In this invention, a probe extending from the temperature controller contacts and connects to a first solder pad on the first circuit board. This contact connection between the probe and the first solder pad replaces the plug-in connection, avoiding the loss of elasticity in the plug-in caused by continuous high temperature and high current surges, which leads to unstable contact and unstable chip testing temperatures. The probe-first solder pad contact connection in this invention provides a more stable connection. The inner ring protrusion of the substrate is embedded in the annular back groove of the floating plate for fixation, making it easier to install and fix the heating element. The inner ring protrusion of the substrate replaces the four fixing holes at the four corners of the original substrate. Several heating resistors are connected in series; therefore, if one heating resistor fails, the entire circuit breaks, and heating ceases, making it easier to detect abnormalities and resulting in more stable chip testing temperatures. Attached Figure Description

[0022] Figure 1 A schematic diagram showing the use of a heating resistor connected in parallel for an existing heating device.

[0023] Figure 2 This is a schematic diagram of the chip heating device according to an embodiment of the present invention.

[0024] Figure 3 This is a schematic diagram of the contact between the probe and the first solder pad in the chip heating device of this utility model embodiment.

[0025] Figure 4 This is a three-dimensional schematic diagram of the substrate in the chip heating device according to an embodiment of the present invention.

[0026] Figure 5 This is a front view of the substrate in the chip heating device according to an embodiment of the present invention.

[0027] Figure 6 This is a schematic diagram of the substrate and floating plate in the chip heating device of this utility model embodiment.

[0028] The reference numerals in the attached figures are as follows:

[0029] P - Heating element; 10 - Substrate; 10a - Inner ring protrusion; 10b - Wire groove; 10c - Substrate annular outer ring; 11 - Heating resistor; 12 - Temperature sensor; 13 - Wire; 20 - First circuit board; 21 - First solder pad; 22 - Second solder pad; 30 - Temperature controller; 31 - Second circuit board; 32 - Probe; 40 - Floating plate;

[0030] 41- Annular back groove; 42- Chip. Detailed Implementation

[0031] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0032] For ease of description, some embodiments of this application may use spatially relative terms such as “above,” “below,” “top,” and “under” to describe the relationship between one element or component and another (or more) elements or components as shown in the accompanying drawings. It should be understood that, in addition to the orientations described in the drawings, spatially relative terms are also intended to include different orientations of the device during use or operation. For example, if the device in the drawings is flipped, it is described as an element or component “below” or “under” other elements or components, and will subsequently be positioned “above” or “on” other elements or components. The terms “first,” “second,” etc., used below are used to distinguish between similar elements and are not necessarily used to describe a particular order or temporal sequence. It should be understood that these terms, as used, may be replaced where appropriate.

[0033] This utility model embodiment provides a chip heating device, such as Figures 2 to 6 As shown, it includes:

[0034] The heating element P includes a base 10, which is in the shape of a hollow ring. Several heating resistors 11 connected in series are embedded in the annular groove of the base 10.

[0035] A floating plate 40 has a chip 42 disposed in its central region; the inner side of the substrate 10 has an inner ring protrusion 10a extending along the thickness direction of the substrate, and the side of the floating plate 40 facing the substrate 10 has an annular back groove 41 surrounding the chip 42; during assembly, the inner ring protrusion 10a is embedded into the inner ring of the annular back groove 41 for fixation; the heating resistor 11 is used to heat the chip 42.

[0036] The first circuit board 20 and the temperature controller 30 are connected to the heating resistor 11 through the first circuit board 20 and control the temperature of the heating resistor 11.

[0037] A first pad group is provided on the first circuit board 20, and the probe 32 led out from the temperature controller 30 is in contact with the first pad 21 in the first pad group.

[0038] Specifically, 3 to 8 heating resistors 11 connected in series are embedded in the annular groove of the substrate 10. With several heating resistors connected in series, when a single heating resistor fails, the entire circuit is open, and heating ceases, making it easier to detect abnormalities and ensuring more stable chip testing temperatures. A probe 32 leading from the temperature controller 30 contacts and connects to the first solder pad 21 on the first circuit board 20. This contact connection between the probe 32 and the first solder pad 21 replaces the plug-in connection, changing the point-to-point contact to a point-to-surface contact, thus solving the problem of unstable contact. This avoids the loss of elasticity in the plug-in caused by continuous high temperatures and high current surges, which leads to unstable contact and thus unstable chip testing temperatures. The contact connection between the probe 32 and the first solder pad 21 in this invention is more stable. The temperature controller 30 is located on the second circuit board 31. The first circuit board 20 can be a flexible circuit board or a rigid circuit board.

[0039] The chip heating device also includes a temperature sensor 12, which measures the real-time temperature of the heating resistor 11 and transmits the real-time temperature to the temperature controller 30 via the first circuit board 20. The temperature controller 30 adjusts the final temperature of the heating resistor 11 based on the real-time temperature. The temperature sensor 12 can be any one of a thermocouple, a resistance temperature detector (RTD), a thermistor, or an infrared temperature sensor.

[0040] A wire groove 10b is provided on the side of the substrate 10 facing the first circuit board 20. The series wires of the heating resistor 11 and the wire harness of the temperature sensor 12 are led out from the wire groove 10b and connected to the first circuit board 20. A second pad group is provided on the first circuit board 20. The series wires of the heating resistor 11 and the wire harness of the temperature sensor 12 are electrically connected to the second pad 22 in the second pad group.

[0041] Chip 42 is located in the middle region of the annularly distributed heating resistors 11. The annularly distributed heating resistors 11 heat the floating plate 40, and the heat is transferred to the chip 42 on the floating plate 40 through heat conduction. During assembly, after filling the annular back groove 41 in the floating plate 40 with thermally conductive adhesive, the inner ring protrusion 10a is embedded into the inner ring of the annular back groove 41 for fixation. The top surface of the inner ring protrusion 10a of the substrate 10 is higher than the top surface of the annular outer ring 10c of the substrate 10. The inner ring protrusion 10a of the substrate is embedded in the annular back groove 41 of the floating plate 40 for fixation, making it easier to install and fix the heating element. The inner ring protrusion 10a of the substrate replaces the four fixing holes on the four corners of the original substrate. The four fixing holes on the four corners of the original substrate were aligned and fixed with the four positioning posts of the floating plate, which were prone to falling off during use.

[0042] After nearly a month of comparative testing of chips using the improved chip heating device of this invention and the original heating device, the data shows that the chip data tested by the improved chip heating device of this invention is significantly better than the chip data tested by the original heating device.

[0043] In summary, this utility model provides a chip heating device, comprising: a substrate, the substrate being in the shape of a hollow ring, with a plurality of heating resistors connected in series embedded in the annular groove of the substrate; a floating plate, with a chip disposed in the central region of the floating plate; the inner side of the annular surface of the substrate having an inner ring protrusion extending along the thickness direction of the substrate, and an annular back groove surrounding the chip being disposed on the side of the floating plate facing the substrate; during assembly, the inner ring protrusion is embedded in the annular back groove for fixation; the heating resistors are used to heat the chip; a first circuit board and a temperature controller, the temperature controller being connected to the heating resistors through the first circuit board and controlling the temperature of the heating resistors; a first pad group being disposed on the first circuit board, and a probe leading out from the temperature controller contacting and connecting with the first pad in the first pad group.

[0044] In this invention, a probe extending from the temperature controller contacts and connects to a first solder pad on the first circuit board. This contact connection between the probe and the first solder pad replaces the plug-in connection, avoiding the loss of elasticity in the plug-in caused by continuous high temperature and high current surges, which leads to unstable contact and unstable chip testing temperatures. The probe-first solder pad contact connection in this invention provides a more stable connection. The inner ring protrusion of the substrate is embedded in the annular back groove of the floating plate for fixation, making it easier to install and fix the heating element. The inner ring protrusion of the substrate replaces the four fixing holes at the four corners of the original substrate. Several heating resistors are connected in series; therefore, if one heating resistor fails, the entire circuit breaks, and heating ceases, making it easier to detect abnormalities and resulting in more stable chip testing temperatures.

[0045] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. The methods disclosed in the embodiments are described simply because they correspond to the devices disclosed in the embodiments; relevant details can be found in the method section.

[0046] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model. Any person skilled in the art can make possible changes and modifications to the technical solution of the present utility model by using the methods and techniques disclosed above without departing from the spirit and scope of the present utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the content of the technical solution of the present utility model shall fall within the protection scope of the technical solution of the present utility model.

Claims

1. A chip heating device, characterized in that, include: A heating element, comprising a substrate, the substrate being in the shape of a hollow ring, wherein a plurality of heating resistors connected in series are embedded in the annular groove of the substrate; A floating plate, wherein a chip is disposed in the central region of the floating plate; the inner annular side of the substrate has an inner ring protrusion extending along the thickness direction of the substrate, and the side of the floating plate facing the substrate has an annular back groove surrounding the chip; during assembly, the inner ring protrusion is embedded in the annular back groove for fixation; the heating resistor is used to heat the chip; A first circuit board and a temperature controller, wherein the temperature controller is connected to the heating resistor via the first circuit board and controls the temperature of the heating resistor; The first circuit board is provided with a first pad group, and the probe led out from the temperature controller is in contact with the first pad in the first pad group.

2. The chip heating device as described in claim 1, characterized in that, The first circuit board includes a flexible circuit board or a rigid circuit board.

3. The chip heating device as described in claim 1, characterized in that, The top surface of the inner ring protrusion of the substrate is higher than the top surface of the outer ring of the substrate.

4. The chip heating device as described in claim 1, characterized in that, The chip heating device also includes a temperature sensor, which tests the real-time temperature of the heating resistor and transmits the real-time temperature to the temperature controller through the first circuit board. The temperature controller adjusts the final temperature of the heating resistor according to the real-time temperature.

5. The chip heating device as described in claim 4, characterized in that, The temperature sensor includes any one of thermocouples, resistance temperature detectors (RTDs), thermistors, and infrared temperature sensors.

6. The chip heating device as described in claim 4, characterized in that, The substrate has a wire groove on the side facing the first circuit board. The series wires of the heating resistor and the wire harness of the temperature sensor are both led out from the wire groove and connected to the first circuit board.

7. The chip heating device as described in claim 6, characterized in that, The first circuit board is provided with a second pad group, and the series wire of the heating resistor and the wire harness of the temperature sensor are respectively electrically connected to the second pad in the second pad group.

8. The chip heating device as described in claim 1, characterized in that, The chip is located in the middle region of the ring-shaped heating resistors, which heat the floating plate and then heat the chip on the floating plate through heat conduction.

9. The chip heating device as described in claim 1, characterized in that, During assembly, after filling the annular back groove in the floating plate with thermally conductive adhesive, the inner ring protrusion is then embedded into the annular back groove for fixation.

10. The chip heating device as described in claim 1, characterized in that, Three to eight heating resistors connected in series are embedded in the annular groove of the substrate.

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