A multilayer integrated package structure for a smart card chip
By designing a multi-layer integrated packaging structure, the problem of faulty smart card chip connection interfaces was solved, thereby improving the stability of chip connection and packaging efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU HONGTAN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-10-19
- Publication Date
- 2026-07-07
AI Technical Summary
When existing smart card chips are packaged using wire bonding, poor connection is prone to occur at the interface positions at both ends of the connection wire, which affects the use of the chip and leads to a decrease in packaging efficiency.
The multi-layer integrated packaging structure is adopted. The design of the card plate, connector, connector slot and pressing block stabilizes the position of the connecting wire. The connector of the connecting wire is fixed by chip glue to ensure a stable connection between the first chip and the second chip.
It improves the stability and efficiency of chip packaging, reduces the occurrence of poor connections, reduces the possibility of packaging rework, and simplifies the operation process.
Smart Images
Figure CN224472041U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of packaging structure technology, and in particular to a multi-layer integrated packaging structure for smart card chips. Background Technology
[0002] A CPU card, also known as a smart card, is an integrated circuit card with a built-in microprocessor. The chip includes a central processing unit (CPU), storage units (RAM, ROM, EEPROM), and a chip operating system (COS). It has data processing, security encryption, and multi-application management functions. The packaged chip is easy to install and transport. The quality of the packaging technology also directly affects the performance of the chip itself and the design and manufacturing of the PCB (printed circuit board) connected to it.
[0003] In the prior art, Chinese patent CN204991695U proposes a smart card chip packaging structure that employs both flip-chip packaging and wire bonding packaging. Compared to flip-chip bonding, the chip area is reduced, which helps to lower costs. Compared to pure wire bonding packaging, the chip utilization rate is improved. However, in practical applications, when using wire bonding packaging for smart card chips, poor connection at both ends of the connector is prone to occur, affecting the use of the chip and requiring rework and repackaging, thus delaying chip packaging efficiency. Therefore, we disclose a multi-layer integrated packaging structure for smart card chips. Utility Model Content
[0004] The purpose of this invention is to propose a multi-layer integrated packaging structure for smart card chips, in order to solve the problem that poor connection is prone to occur at the interface positions at both ends of the connecting wire when smart card chips are packaged using wire bonding.
[0005] To achieve the above objectives, this utility model provides a multi-layer integrated packaging structure for smart card chips, including a card plate. One end of the card plate is fixedly connected to a first connector, and one end of the first connector is fixedly connected to a first chip. Several second chips are placed on the side of the first chip. One end of each second chip is fixedly connected to a second connector. One end of the second connector has a first connecting groove, and the other end of the first connector has several second connecting grooves. A connecting guide plate is fixedly connected to one end of each of the second and first connecting grooves. A pressing block is placed on the upper end of the connecting guide plate. A connecting wire is placed between the connecting guide plate and the pressing block. Both ends of the connecting wire are connected to the first and second connectors, respectively. Chip adhesive is applied to both the first and second connecting grooves to fix the position of the pressing block after fixing the connecting wire. The second connector is fixedly connected to the card plate. The first chip and several second chips constitute a complete chip.
[0006] Preferably, both the second connecting groove and the second connecting seat include a cylindrical groove and a right-angled trapezoidal groove. The pressing block is slidably connected to the cylindrical groove, and the connecting line is attached to the bottom surface of the right-angled trapezoidal groove. The cylindrical groove and the right-angled trapezoidal groove are connected. Both the second connecting groove and the second connecting seat are coated with chip adhesive to fix the position of the connecting line after it is fixed by the pressing block.
[0007] Preferably, a plurality of connecting plates are fixedly connected to the side of the first connecting base, and a connecting frame is fixedly connected to one end of the second chip, wherein the connecting plates and the connecting frame are slidably connected.
[0008] Preferably, one end of the connecting frame is provided with a sliding groove, and the connecting plate is slidably connected to the sliding groove.
[0009] Preferably, a limiting hole is provided at one end of the connecting frame, and a limiting block is fixedly connected to one end of the connecting plate, wherein the limiting block is movably engaged with the limiting hole.
[0010] Preferably, the card plate is fixedly connected to the first connector, the first chip, the second chip, the second connector, and the connector frame by chip adhesive.
[0011] The beneficial effects of this utility model are as follows: By fixing the relative positions of the second chip and the second connector, and by connecting the first connector and the second connector with a connecting line, the first chip and the second chip are connected. This also makes the position of the connecting line and the connecting guide plate stable, which is convenient for subsequent fixing of the position of the connecting line and makes the joint position of the connecting line stable. This makes the connection between the first chip and the second chip stable, reduces the occurrence of poor connection between the first chip and the second chip, and thus reduces the occurrence of chip packaging rework and improves the efficiency of chip packaging.
[0012] Before connecting the connecting wires, the connecting board and the connecting frame are connected to restrict the relative movement of the first chip and the second chip, making it easier for the staff to connect the connecting wires. The connecting frame restricts the position of the limiting block through the limiting hole, thereby restricting the position of the connecting board. This ensures that the relative position of the first chip and the second chip is fixed when the connecting wires are connected, making it easier for the staff to work. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of an embodiment of the present utility model;
[0014] Figure 2 This is a partially cutaway three-dimensional structural diagram of the card plate of this utility model;
[0015] Figure 3This is a partially cutaway three-dimensional structural diagram of the first connecting seat, the second connecting seat, and the connecting frame of this utility model.
[0016] The diagram is marked as follows:
[0017] 1. Card plate; 2. First connector; 3. First chip; 4. Second chip; 5. Second connector; 6. First connector groove; 7. Connecting guide plate; 8. Pressing block; 9. Connecting wire; 10. Second connector groove; 11. Connecting frame; 12. Connecting plate; 13. Limiting block; 14. Limiting hole. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments.
[0019] like Figures 1-3As shown, a multi-layer integrated packaging structure for a smart card chip includes a card plate 1. A first connector 2 is fixedly connected to one end of the card plate 1. A first chip 3 is fixedly connected to one end of the first connector 2. Several second chips 4 are placed on the side of the first chip 3. The first chip 3 and the several second chips 4 form a complete chip. A second connector 5 is fixedly connected to one end of each second chip 4. A first connection slot 6 is formed at one end of the second connector 5. Several second connection slots 10 are formed at the other end of the first connector 2. A connecting guide plate 7 is fixedly connected to one end of each of the second connection slots 10 and the first connection slots 6. A pressing block 8 is placed on the upper end of the connecting guide plate 7. A connecting wire 9 is placed between the connecting guide plate 7 and the pressing block 8. The two ends of the connecting wire 9 are respectively connected to the first chip 3. A first connecting seat 2 and a second connecting seat 5 are connected. Chip adhesive is applied to both the first connecting groove 6 and the second connecting groove 10 to fix the position of the pressing block 8 after fixing the connecting line 9. The second connecting seat 5 is fixedly connected to the card plate 1. Both the second connecting groove 10 and the second connecting seat 5 include a cylindrical groove and a right-angled trapezoidal groove. The pressing block 8 is slidably connected to the cylindrical groove, and the connecting line 9 is in contact with the bottom surface of the right-angled trapezoidal groove. The cylindrical groove and the right-angled trapezoidal groove are connected. Chip adhesive is applied to both the second connecting groove 10 and the second connecting seat 5 to fix the position of the connecting line 9 after it is fixed by the pressing block 8. In use, the first connecting seat 2 is fixedly connected to one end of the card plate 1, and the first chip 3 is fixedly connected to one end of the first connecting seat 2, so that after encapsulation, the card plate 1, the first connecting seat 2, and the first chip 3 are connected. The relative positions of the first chip 3 are fixed. A second connector 5 is fixedly connected to one end of the second chip 4, thus fixing the relative positions of the second chip 4 and the second connector 5. A first connector groove 6 is formed at one end of the second connector 2, and several second connector grooves 10 are formed at the other end of the first connector 2. A connecting guide plate 7 is fixedly connected to one end of both the second connector groove 10 and the first connector groove 6. A pressing block 8 is placed on the upper end of the connecting guide plate 7. A connecting wire 9 is placed between the connecting guide plate 7 and the pressing block 8. The two ends of the connecting wire 9 are respectively connected to the first connector 2 and the second connector 5, so that the first connector 2 and the second connector 5 are connected by the connecting wire 9, thereby connecting the first chip 3 and the second chip 4, and also connecting the pressing block. The 8-point restraint mechanism stabilizes the contact position of the connecting wire 9 against the connecting guide plate 7, facilitating subsequent fixation of the connecting wire 9 and ensuring a stable connector position. This, in turn, stabilizes the connection between the first chip 3 and the second chip 4, reducing the likelihood of poor connection and thus minimizing chip packaging rework, thereby improving packaging efficiency. Furthermore, after the connecting wire 9 is placed in the first connecting slot 6 and the second connecting slot 10, the pressing block 8 presses the connecting wire 9 until it is in contact with the connecting guide plate 7. Chip adhesive is then used to fix the pressing block 8 and the connecting wire 9 in their relatively fixed positions. This ensures a quick connection between the connecting wire 9 and the connecting guide plate 7, reducing the likelihood of poor connection. The operation is simple, fast, and has a high success rate.Chip adhesive is applied to both the first connecting groove 6 and the second connecting groove 10 to fix the position of the pressing block 8 after the connecting line 9 is fixed. This fixes the pressing block 8 in its position within the first connecting groove 6 and the second connecting groove 10. Both the second connecting groove 10 and the second connecting seat 5 include a cylindrical groove and a right-angled trapezoidal groove. The pressing block 8 slides in the cylindrical groove, and the cylindrical groove and the right-angled trapezoidal groove are connected. This allows the cylindrical groove to restrict the movement direction of the pressing block 8, ensuring that the pressing block 8, under its own weight, will compress the connecting line 9 and the connecting guide plate 7 when it falls, thus facilitating operation. The position of the pressing block 8 is fixed by personnel, which facilitates its fixation and reduces the possibility of poor connection of the connecting wire 9. The connecting wire 9 is attached to the bottom surface of the right-angled trapezoidal groove. Chip adhesive is applied to both the second connecting groove 10 and the second connecting seat 5 to fix the position of the connecting wire 9 after it is fixed by the pressing block 8. After the pressing block 8 is fixed, chip adhesive is dripped into the second connecting seat 5 and the second connecting groove 10 to fix the connecting wire 9 close to the pressing block 8, increasing the fixing area of the connecting wire 9, thereby reducing the possibility of shaking at the connection point and improving the connection stability of the connecting wire 9.
[0020] As a preferred embodiment of this example, Figure 2 and Figure 3As shown, several connecting plates 12 are fixedly connected to the side of the first connecting seat 2, and a connecting frame 11 is fixedly connected to one end of the second chip 4. The connecting plates 12 and the connecting frame 11 are slidably connected. A sliding groove is provided at one end of the connecting frame 11, and the connecting plates 12 are slidably connected to the sliding groove. A limit hole 14 is provided at one end of the connecting frame 11, and a limit block 13 is fixedly connected to one end of the connecting plate 12. The limit block 13 is movably engaged with the limit hole 14. The card plate 1 is fixedly connected to the first connecting seat 2, the first chip 3, the second chip 4, the second connecting seat 5, and the connecting frame 11 by chip adhesive. Several connecting plates 12 are fixedly connected to the side of the first connecting seat 2, and a connecting frame 11 is fixedly connected to one end of the second chip 4. The connecting plates 12 and the connecting frame 11 are slidably connected, so that the connecting plates 12 and the connecting frame 11 are connected before the connecting wire 9 is connected, thereby restricting the relative movement of the first chip 3 and the second chip 4, which is convenient for workers. The connecting wire 9 is connected to the connecting frame 11, which has a sliding groove at one end. The connecting plate 12 is slidably connected to the sliding groove, so that the connecting frame 11 restricts the movement of the connecting plate 12 through the sliding groove. A limit hole 14 is provided at one end of the connecting frame 11, and a limit block 13 is fixedly connected to one end of the connecting plate 12. The limit block 13 is movably engaged with the limit hole 14, so that the connecting frame 11 restricts the position of the limit block 13 through the limit hole 14, thereby restricting the position of the connecting plate 12. This ensures that the relative positions of the first chip 3 and the second chip 4 are fixed when the connecting wire 9 between the first chip 3 and the second chip 4 is connected, which facilitates the operation of the staff. The card plate 1 is fixedly connected to the first connecting seat 2, the first chip 3, the second chip 4, the second connecting seat 5 and the connecting frame 11 through chip adhesive, so that the relative positions of the card plate 1 and the first connecting seat 2, the first chip 3, the second chip 4, the second connecting seat 5 and the connecting frame 11 are fixed.
[0021] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples; within the framework of the present invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in the details for the sake of brevity.
[0022] This utility model is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A multi-layer integrated packaging structure for a smart card chip, comprising a card board (1), characterized in that, One end of the card plate (1) is fixedly connected to a first connector (2), one end of the first connector (2) is fixedly connected to a first chip (3), several second chips (4) are placed on the side of the first chip (3), one end of the second chip (4) is fixedly connected to a second connector (5), one end of the second connector (5) is provided with a first connecting groove (6), the other end of the first connector (2) is provided with several second connecting grooves (10), and one end of each of the second connecting grooves (10) and the first connecting grooves (6) is fixedly connected to a connecting guide plate (7). A pressing block (8) is placed on the upper end of the connecting guide plate (7). A connecting line (9) is placed between the connecting guide plate (7) and the pressing block (8). The two ends of the connecting line (9) are respectively connected to the first connecting seat (2) and the second connecting seat (5). Chip glue is applied to the first connecting groove (6) and the second connecting groove (10) to fix the position of the pressing block (8) after fixing the connecting line (9). The second connecting seat (5) is fixedly connected to the card plate (1). The first chip (3) and several second chips (4) form a complete chip.
2. The multilayer integrated packaging structure for smart card chips according to claim 1, characterized in that, The second connecting groove (10) and the second connecting seat (5) both include a cylindrical groove and a right-angled trapezoidal groove. The pressing block (8) is slidably connected to the cylindrical groove. The connecting line (9) is attached to the bottom surface of the right-angled trapezoidal groove. The cylindrical groove and the right-angled trapezoidal groove are connected. Chip glue is applied to both the second connecting groove (10) and the second connecting seat (5) to fix the position of the connecting line (9) after it is fixed by the pressing block (8).
3. The multilayer integrated packaging structure for smart card chips according to claim 1, characterized in that, The first connector (2) has several connecting plates (12) fixedly connected to its side, and the second chip (4) has a connecting frame (11) fixedly connected to one end. The connecting plates (12) and the connecting frame (11) are slidably connected.
4. The multilayer integrated packaging structure for smart card chips according to claim 3, characterized in that, One end of the connecting frame (11) is provided with a sliding groove, and the connecting plate (12) is slidably connected to the sliding groove.
5. The multilayer integrated packaging structure for smart card chips according to claim 3, characterized in that, One end of the connecting frame (11) has a limiting hole (14), and one end of the connecting plate (12) is fixedly connected to a limiting block (13), which is movably engaged with the limiting hole (14).
6. The multilayer integrated packaging structure for smart card chips according to claim 3, characterized in that, The card plate (1) is fixedly connected to the first connector (2), the first chip (3), the second chip (4), the second connector (5) and the connector frame (11) by chip adhesive.