Paving mat leveling device

Abstract

The utility model relates to the technical field of sheet type multilayer ceramic capacitor end sealing processing, especially pad leveling device, it can solve the problem that the chip will be pushed down by the roller, the problem of skew of the chip because of the too big difference of length-width ratio, the problem of skew of the chip diagonal line greater than 2.5mm, it includes the leveling mechanism lower platform and the leveling mechanism upper platform, four groups of leveling mechanism guide rods are fixedly connected between the leveling mechanism lower platform and the leveling mechanism upper platform, the leveling mechanism movable platform is slidably installed on four groups of leveling mechanism guide rods, the leveling mechanism lower platform top fixedly connected with the leveling stage lower plate, the limiting lifting cylinder is installed on the leveling mechanism lower platform, the limiting lifting cylinder output is fixedly connected with the limiting baffle, the conveying lifting cylinder is installed on the leveling mechanism lower platform, the conveying platform is fixedly connected with the conveying lifting cylinder output, the end sealing plate is placed on the conveying platform, and the conveying guide rail is installed on the conveying platform.

Description

Technical Field

[0001] This utility model relates to the technical field of end-capping processing of multilayer ceramic chip capacitors, and in particular to a pad leveling device. Background Technology

[0002] MLCC is short for Multilayer Ceramic Chip Capacitor. The manufacturing process of this component requires multiple stages, including a copper-plating end-capping process. The end-capping steps are as follows: 1. The chip is vibrated and inserted into the guide plate hole; 2. A bed of needles is used to press the chip from the guide plate hole into the end-capping plate hole; 3. The height of the chip's A end is leveled and consistent within the end-capping plate hole to ensure consistent chip slurry width; 4. The chip's A end is dipped in slurry within the end-capping plate hole; 5. The slurry at the A end is dried; 6. The chip is reversed and protrudes to form the B end; 7. The height of the chip's B end is leveled and consistent within the end-capping plate hole to ensure consistent chip slurry width; 8. The chip's B end is dipped in slurry within the end-capping plate hole; 9. The slurry at the B end is dried; 10. The chip is removed from the end-capping plate hole, completing the end-capping process.

[0003] In the third step of the semi-automatic production process of copper end capping, the height of the chip A end inside the end capping plate hole is leveled to ensure consistent chip slurry width. The operation process is as follows: Place the end capping plate with the protruding part of the chip facing upward on the leveling platform. Manually push the leveling platform under the leveling shaft. The leveling shaft rolls back and forth on the chip end face until the leveling height is consistent. Push it back to its original position and remove the end capping plate to complete the leveling operation.

[0004] The production process in the third step described above has the following problems:

[0005] 1. The leveling height is limited. The outer diameter of the rolling shaft needs to be controlled within 1mm of the highest point of the chip. If the height difference exceeds 1mm, the chip will be pushed over.

[0006] 2. There are requirements for the flatness ratio of the chip end face. If the difference between the length and width ratio of the end face is greater than 1, the chip will be skewed after rolling.

[0007] 3. There are requirements for the diagonal size of the chip end face. If the diagonal is greater than 2.5mm, the chip will be crooked after rolling. Utility Model Content

[0008] To solve the above-mentioned technical problems, this utility model provides a pad leveling device that can solve the problems of chips being pushed over by rollers, chip skewing due to excessive length-to-width ratio differences, and chip skewing when the diagonal is greater than 2.5mm.

[0009] Technical solution

[0010] To achieve the above objectives, this utility model provides the following technical solution: a pad leveling device, characterized in that it includes a lower leveling platform and an upper leveling platform, four sets of leveling guide rods are fixedly connected between the lower and upper leveling platforms, a movable leveling platform is slidably mounted on the four sets of leveling guide rods, a leveling platform upper plate is fixedly connected to the bottom of the movable leveling platform, a pad is fixedly connected to the bottom of the leveling platform upper plate, a lower leveling platform lower plate is fixedly connected to the top of the lower leveling platform, and a pad is mounted on the lower leveling platform. The system includes a limit lifting cylinder with a limit stop bar fixedly connected to its output end. A conveying lifting cylinder is installed on the lower platform of the leveling mechanism, with a conveying platform fixedly connected to its output end. An end-sealing plate is placed on the conveying platform, and a conveying guide rail is installed on the conveying platform. The padding component includes two sets of pads that are bolted parallel to each other and fixed to the bottom of the leveling platform. The two sets of pads are distributed on the front and rear sides of the end-sealing plate. The padding component also includes a pad block that is bolted to the bottom of the leveling platform. The pad block has a frame structure and surrounds the end-sealing plate.

[0011] Preferably, the horizontal accuracy of the upper and lower plates of the leveling platform is 0.005mm, and the accuracy of the upper and lower working planes of the two pads is 0.005mm.

[0012] Preferably, the thickness of the pad is consistent with the sum of the end cap thickness and the required protrusion height of the chip.

[0013] Preferably, when the end cap is a thin plastic sheet with a thickness of less than 5mm, the upper plate of the leveling platform has a vacuum adsorption hole at the contact position with the end cap surface, and the lower plate of the leveling platform has evenly spaced support columns between the chip contact surfaces.

[0014] Preferably, the position held on the leveling platform for a set dwell time can be repeated multiple times from high to low.

[0015] Preferably, the pad can also be installed within the area of ​​the lower platform and the upper platform of the leveling mechanism.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows: In use, the end-sealing plate to be leveled is placed face down on the conveying platform and delivered to the position of the limit stop bar. By activating the limit lifting cylinder, the limit lifting cylinder descends, causing the limit stop bar to descend as well. The lower position of the limit stop bar is lower than the height of the lower plate of the leveling platform. The upper plate of the leveling platform moves downward through the bottom of the leveling mechanism's movable platform to adhere to the upper part of the end-sealing plate. The detection device on the upper plate of the leveling platform senses whether the thick rubber plate is horizontally adhered. If it is qualified, the next step is performed. The conveying platform maintains an upward reaction force on the end-sealing plate, and the movable platform of the leveling mechanism pushes the upper plate of the leveling platform downward, causing the upper plate of the leveling platform to push the end-sealing plate to continue moving downward, so that the pad fixed on the upper plate of the leveling platform adheres to the lower plate of the leveling platform. The leveling platform maintains its position for a set dwell time, while the end-sealing plate contacts the lower surface of the leveling platform. Chips with inconsistent heights are compressed and retract into the holes of the end-sealing plate, thus achieving uniform chip height. The moving platform of the leveling mechanism moves upward to return to its original position. A conveying lifting cylinder drives the conveying platform to rise, separating the end-sealing plate from the lower surface of the leveling platform. The end-sealing plate is then sent to the discharge position via a conveying guide rail, completing the leveling action. This leveling device applies an average force to the chip end face as a whole, unaffected by the length, width, or diagonal dimensions of the chip end face, ensuring uniform chip height. This solves the problem of chips being pushed over by rollers and the skew problem caused by excessive differences in length and width ratios. Chips with diagonals greater than 2.5mm will exhibit skewness. Attached Figure Description

[0017] Figure 1 This is a front view structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the right-side structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the rear view structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the left-side structure of this utility model;

[0021] Figure 5 This is a top view of the structure of this utility model;

[0022] Figure 6 This is a top view of the structure of the gaskets distributed along the edge of the end cap in this utility model.

[0023] Figure 7 This is a structural schematic diagram of the pad strip from various perspectives in this utility model;

[0024] Figure 8 This is a schematic diagram of the structure of the pad block in this utility model;

[0025] The following are labeled in the attached diagram: 1. Leveling platform upper plate; 2. Leveling platform lower plate; 3. Leveling mechanism lower platform; 4. Leveling mechanism upper platform; 5. Leveling mechanism guide rod; 6. Leveling mechanism movable platform; 7. Pad; 8. End plate; 9. Conveyor guide rail; 10. Conveyor platform; 12. Conveyor lifting cylinder; 13. Limit stop bar; 14. Limit lifting cylinder; 15. Pad strip; 16. Pad block. Detailed Implementation

[0026] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope. Example

[0027] Please see Figures 1-7The pad leveling device of this utility model is characterized by comprising a lower leveling platform 3 and an upper leveling platform 4, with four sets of leveling guide rods 5 fixedly connected between the lower leveling platform 3 and the upper leveling platform 4, and a movable leveling platform 6 slidably mounted on the four sets of leveling guide rods 5. A leveling platform upper plate 1 is fixedly connected to the bottom end of the movable leveling platform 6, and a pad 7 is fixedly connected to the bottom end of the leveling platform upper plate 1. A lower leveling platform lower plate 2 is fixedly connected to the top end of the lower leveling platform 3. A limit lifting cylinder 14 is installed on the lower leveling platform 3, and a limit stop bar 13 is fixedly connected to the output end of the limit lifting cylinder 14. A conveying lifting cylinder 12 is installed on the lower leveling platform 3, and a conveying platform is fixedly connected to the output end of the conveying lifting cylinder 12. Platform 10, on which end-sealing plates 8 are placed, and conveyor rails 9 are installed. The padding component 7 includes two sets of parallel pad strips 15 bolted to the bottom of the leveling platform 1, with the two sets of pad strips 15 distributed on the front and rear sides of the end-sealing plate 8. The padding component 7 also includes pad blocks 16 bolted to the bottom of the leveling platform 1, the pad blocks 16 having a frame structure and surrounding the end-sealing plate 8. In use, the end-sealing plate 8 to be leveled is placed face down on the conveyor platform 10 and conveyed to the position of the limit stop bar 13. By activating the limit lifting cylinder 14, the limit lifting cylinder 14 descends, causing the limit stop bar 13 to descend. The descending position of the limit stop bar 13 is lower than the height of the lower plate 2 of the leveling platform. The leveling mechanism moves the platform... 6. The bottom leveling platform 1 moves downwards to fit against the top of the end-sealing plate 8. The detection device on the leveling platform 1 senses whether the thick rubber plate is horizontally fitted. If it is qualified, proceed to the next step. The conveying platform 10 maintains an upward reaction force on the end-sealing plate 8. The moving platform 6 of the leveling mechanism pushes the leveling platform 1 downwards, causing the leveling platform 1 to push the end-sealing plate 8 to continue moving downwards. This allows the pad 7 fixed on the leveling platform 1 to fit against the surface of the lower leveling platform 2. When the leveling height is greater than 5mm, two pad strips 15 are used for the pad 7. When the leveling height is less than 5mm, a frame-type pad block 16 is used for the pad 7 to avoid deformation of the pad 7 and improve the horizontal accuracy of the leveling platform 1 and the lower leveling platform 2. The leveling platform 1 is designed to... During a fixed dwell time, the end-sealing plate 8 remains in place and contacts the lower plate 2 of the leveling stage. Chips with inconsistent heights are compressed and retract into the holes of the end-sealing plate 8, thus making the chip heights uniform. The moving platform 6 of the leveling mechanism moves upward to restore the original position. The conveying lifting cylinder 12 drives the conveying platform 10 to rise and separate the end-sealing plate 8 from the lower plate 2 of the leveling stage. The end-sealing plate 8 is then sent to the discharge position via the conveying guide rail 9, completing the leveling action. This leveling device applies an average force to the chip end face as a whole, regardless of the length, width, or diagonal dimensions of the chip end face, ensuring that the chips are at a uniform height. This solves the problem of chips being pushed over by rollers and the skew problem caused by excessive differences in the length and width ratio of the chips. Chips with diagonals greater than 2.5mm will skew.

[0028] The horizontal accuracy of the upper plate 1 and the lower plate 2 of the leveling platform is 0.005mm, and the vertical accuracy of the two pads 7 is 0.005mm; thus ensuring good leveling accuracy.

[0029] The thickness of the pad 7 is the same as the sum of the thickness of the end cap 8 and the required protrusion height of the chip; in use, the thickness of the end cap 8 is 8.9mm, and the thickness of the pad 7 is the chip protrusion height plus 8.9mm.

[0030] When the end capping plate 8 is a thin plastic sheet with a thickness of less than 5mm, the upper plate 1 of the leveling platform has a vacuum adsorption hole at the contact position with the end capping plate 8. The lower plate 2 of the leveling platform has evenly spaced support columns between the chip contact surfaces. By opening the vacuum adsorption hole, when using a thin plastic sheet as the end capping plate 8 with a thickness of less than 5mm, the end capping plate 8 can be kept flat. The support columns maintain an upward force on the end capping plate 8 and prevent it from falling due to gravity.

[0031] The leveling platform 1 can maintain its position from high to low for a set dwell time, and this process can be repeated multiple times. Through this operation, the chip can be gradually inserted into the hole of the end cap 8, thereby improving the consistency of the end face.

[0032] The pad 7 can also be installed within the area of ​​the lower platform 3 and the upper platform 4 of the leveling mechanism, thus expanding its application range.

[0033] The working principle of this utility model's pad leveling device is as follows: In use, the end cap 8 to be leveled is placed face down on the conveyor platform 10. The conveyor platform 10 delivers it to the position of the limit stop 13. By activating the limit lifting cylinder 14, the limit lifting cylinder 14 descends, causing the limit stop 13 to descend as well. The lower position of the limit stop 13 is below the height of the lower plate 2 of the leveling platform. The lower plate 1 of the leveling mechanism's movable platform 6 moves downwards to adhere to the top of the end cap 8. A detection device on the upper plate 1 senses whether the thick rubber sheet is horizontally adhered. If it is qualified, the next step is performed. The conveyor platform 10 maintains an upward reaction force on the end cap 8. The movable platform 6 of the leveling mechanism pushes the upper plate 1 of the leveling platform downwards, causing the upper plate 1 of the leveling platform to push the end cap 8 further downwards, fixing it to the leveling platform. The pad 7 on the upper plate 1 of the platform is attached to the lower plate 2 of the leveling platform. When the leveling height is greater than 5mm, two pad strips 15 are selected for the pad 7. When the leveling height is less than 5mm, a frame-type pad block 16 is selected for the pad 7 to avoid deformation of the pad 7 and improve the horizontal accuracy of the upper plate 1 and the lower plate 2 of the leveling platform. The upper plate 1 of the leveling platform remains unchanged in position for a set dwell time. The end plate 8 contacts the lower plate 2 of the leveling platform. Chips with inconsistent heights are compressed into the holes of the end plate 8 under pressure, thereby making the chip heights consistent. The moving platform 6 of the leveling mechanism moves upward to restore the original position. The conveying lifting cylinder 12 drives the conveying platform 10 to rise and separate the end plate 8 from the lower plate 2 of the leveling platform. The end plate 8 is sent to the discharge position through the conveying guide rail 9 to complete the leveling action.

[0034] The pad leveling device of this utility model can be installed, connected or set in a common mechanical way, and can be implemented as long as it can achieve its beneficial effect. The conveying lifting cylinder 12 and the limiting lifting cylinder 14 of the pad leveling device of this utility model are purchased from the market. Technical personnel in this industry only need to install and operate them according to the accompanying instruction manual.

[0035] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A pad leveling device, characterized in that, The system includes a lower platform (3) and an upper platform (4) of a leveling mechanism. Four sets of leveling mechanism guide rods (5) are fixedly connected between the lower platform (3) and the upper platform (4). A leveling mechanism movable platform (6) is slidably installed on the four sets of leveling mechanism guide rods (5). A leveling platform upper plate (1) is fixedly connected to the bottom of the leveling mechanism movable platform (6). A pad (7) is fixedly connected to the bottom of the leveling platform upper plate (1). A leveling platform lower plate (2) is fixedly connected to the top of the lower platform (3). A limit lifting cylinder (14) is installed on the lower platform (3). A limit stop bar (13) is fixedly connected to the output end of the limit lifting cylinder (14). A conveying lifting cylinder (12) is installed on the lower platform (3). A conveying platform (10) is fixedly connected to the output end of the conveying lifting cylinder (12). An end plate (8) is placed on the conveying platform (10). A conveying guide rail (9) is installed on the conveying platform (10).

2. The pad leveling device as described in claim 1, characterized in that, The padding includes two sets of pads (15) that are fixed in parallel to the bottom of the leveling platform plate (1) by bolts. The two sets of pads (15) are distributed on the front and rear sides of the end cap plate (8).

3. The pad leveling device as described in claim 2, characterized in that, The padding includes a pad (16) that is bolted to the bottom of the leveling platform plate (1). The pad (16) has a frame structure and surrounds the end cap plate (8).

4. The pad leveling device as described in claim 3, characterized in that, The horizontal accuracy of the upper plate (1) and lower plate (2) of the leveling platform is 0.005mm, and the vertical accuracy of the two pads (7) is 0.005mm.

5. The pad leveling device as described in claim 4, characterized in that, The thickness of the pad (7) is the same as the sum of the thickness of the end cap (8) and the required protrusion height of the chip.

6. The pad leveling device as described in claim 5, characterized in that, When the end cap (8) is a thin plastic plate with a thickness of less than 5 mm, the upper plate (1) of the leveling stage is provided with a vacuum adsorption hole at the contact position with the end cap (8), and the lower plate (2) of the leveling stage is provided with average support columns between the chip contact surfaces.

7. The pad leveling device as described in claim 6, characterized in that, The leveling platform (1) maintains its position from high to low for a set dwell time, repeating this process multiple times.

8. The pad leveling device as described in claim 7, characterized in that, The pad (7) is installed in the area between the lower platform (3) and the upper platform (4) of the leveling mechanism.

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