A multi-channel solid state relay
By using a modular design and a three-stage heat dissipation structure, the multi-channel solid-state relay solves the problem of heat dissipation difficulties in integrated housings, achieving efficient heat dissipation and low-cost multi-channel relay applications.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI TIANHAO ELECTRON CO LTD
- Filing Date
- 2025-08-13
- Publication Date
- 2026-07-07
AI Technical Summary
The current practice of integrating multiple solid-state relays into the same housing requires custom selection and is difficult to dissipate heat, resulting in high costs and temperature rise issues.
It adopts a modular design and uses a three-stage heat dissipation structure of heat-conducting components, heat pipes and fins, combined with sliding installation and independent heat dissipation channels to achieve efficient heat dissipation, and allows users to select the number of relays and channel configuration according to their needs.
It reduces R&D and production costs, improves heat dissipation efficiency, reduces inter-unit thermal interference, ensures that a single-channel failure does not affect the operation of other channels, and shortens maintenance time.
Smart Images
Figure CN224472405U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of solid-state relay technology, specifically a multi-channel solid-state relay. Background Technology
[0002] A solid-state relay is a contactless switching device composed entirely of solid-state electronic components, which uses semiconductor devices to control the on / off state of a circuit.
[0003] A multi-channel solid-state relay is an electronic switching device that integrates multiple independent solid-state relay units into one unit. However, existing multi-channel solid-state relays are generally standardized in types such as four-way and eight-way, and have a unified circuit. In some new technology requirements, it is necessary to customize relays for specific channels, which results in higher costs. Furthermore, integrating multiple relay units into the same housing can easily lead to rapid temperature increases and heat dissipation difficulties, thereby affecting the operation of the relay.
[0004] Therefore, this application provides a multi-channel solid-state relay to solve the above problems. Utility Model Content
[0005] This application provides a multi-channel solid-state relay, which aims to solve the problems mentioned in the background art of existing multi-channel solid-state relays requiring customized selection and having difficulty in heat dissipation due to their integrated installation in the same housing.
[0006] To achieve the above objectives, this application provides the following technical solution: a multi-channel solid-state relay, comprising multiple solid-state relay bodies, each solid-state relay body being equipped with a DIN rail connection frame, a heat-conducting component fixedly mounted on the DIN rail connection frame and in contact with the back of the solid-state relay body, the solid-state relay body being slidably mounted on the heat-conducting component, a heat-conducting baffle plate slidably connected to the heat-conducting component and in contact with the side of the solid-state relay body, a limiting plate fixedly connected to one end of the heat-conducting component, a limiting clip slidably connected to the heat-conducting component to move closer to or away from the limiting plate to press against the heat-conducting baffle plate and the solid-state relay body, a locking bolt being provided on the limiting clip, a heat pipe being embedded in the heat-conducting component along its length, both ends of the heat pipe extending to the outside of the heat-conducting component, and both ends of the heat pipe being fixedly connected to fins. In this way, through modular design, users can select the number of relay bodies and channel configuration according to their needs, without the need to customize the overall housing, which significantly reduces R&D and production costs. Moreover, the three-level heat dissipation structure of heat conduction components, heat pipes and fins improves heat dissipation efficiency compared with traditional integrated housings, effectively solving the temperature rise problem caused by dense installation of multiple relays.
[0007] Preferably, the heat-conducting component has flanges on both sides along its length, and each flange has several flat-head screws that are screwed onto the DIN rail connecting bracket.
[0008] Preferably, the heat-conducting component has a T-shaped track at its center, and the solid-state relay body has a groove on its back corresponding to the T-shaped track.
[0009] Preferably, the back of the heat-conducting partition and the limiting card are respectively provided with a first track groove and a second track groove corresponding to the T-shaped track.
[0010] Preferably, thermally conductive silicone pads are fixedly connected to both sides of the thermally conductive partition.
[0011] Preferably, two locking bolts are provided and symmetrically screwed onto the limiting card, and the locking bolts contact the surface of the T-shaped track to lock the limiting card onto the T-shaped track.
[0012] Preferably, the side of the DIN rail connector away from the solid-state relay body has a clamp that matches the DIN rail.
[0013] Preferably, the DIN rail connector has a cutout on its side.
[0014] This multi-channel solid-state relay features a modular design, allowing users to select the number of relay bodies and channel configurations according to their needs without the need for a customized overall housing. This significantly reduces R&D and production costs. Furthermore, the three-stage heat dissipation structure, consisting of heat-conducting components, heat pipes, and fins, improves heat dissipation efficiency compared to traditional integrated housings, effectively solving the temperature rise problem caused by dense installation of multiple relays.
[0015] This multi-channel solid-state relay features an independent heat dissipation channel design to reduce thermal interference between units. A single channel failure does not affect the operation of other channels, and the sliding installation structure allows for quick disassembly and assembly without tools, thus shortening maintenance time. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of a multi-channel solid-state relay;
[0017] Figure 2 This is a schematic diagram of the exploded structure of a multi-channel solid-state relay;
[0018] Figure 3 This is a schematic diagram of the side structure of a DIN rail mounting bracket for a multi-channel solid-state relay.
[0019] Figure 4 This is a schematic diagram of the side structure of the heat-conducting component of a multi-channel solid-state relay;
[0020] Figure 5 This is a schematic diagram of the side structure of a limit card for a multi-channel solid-state relay;
[0021] Figure 6This is a schematic diagram of the structure of the side of the heat-conducting partition of a multi-channel solid-state relay.
[0022] In the picture:
[0023] 1. Solid-state relay body;
[0024] 2. DIN rail connector; 21. Clamp; 22. Hollowed-out;
[0025] 3. Heat-conducting components; 31. Flanges; 32. T-rails; 33. Flathead screws; 34. Heat pipes; 341. Fins; 35. Limiting plates;
[0026] 4. Thermally conductive partition; 41. First track groove; 42. Thermally conductive silicone pad;
[0027] 5. Limiting card; 51. Second track groove; 52. Locking bolt. Detailed Implementation
[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0029] This embodiment provides a multi-channel solid-state relay, such as Figures 1-6 As shown, the multi-channel solid-state relay includes multiple solid-state relay bodies 1. Each solid-state relay body 1 is equipped with a DIN rail connection bracket 2. A heat-conducting component 3 is fixedly installed on the DIN rail connection bracket 2, which contacts the back of the solid-state relay body 1. The solid-state relay body 1 is slidably mounted on the heat-conducting component 3. A heat-conducting partition 4, which contacts the side of the solid-state relay body 1, is slidably connected to the heat-conducting component 3. A limiting plate 35 is fixedly connected to one end of the heat-conducting component 3. A limiting clip 5 is slidably connected to the heat-conducting component 3, which moves closer to or away from the limiting plate 35 to press against the heat-conducting partition 4 and the solid-state relay body 1. A locking bolt 52 is provided on the limiting clip 5. A heat pipe 34 is embedded in the heat-conducting component 3 along its length. Both ends of the heat pipe 34 extend to the outside of the heat-conducting component 3, and fins 341 are fixedly connected to both ends of the heat pipe 34.
[0030] In use, each solid-state relay body 1 is independently installed via a DIN rail mounting bracket 2. The heat-conducting component 3 is in direct contact with the back of the solid-state relay body 1, forming the main heat transfer path. The heat-conducting partition 4 is slidably inserted between adjacent solid-state relay bodies 1, serving as a physical barrier to prevent short circuits and also assisting in heat conduction through side contact. The heat pipe 34 embedded inside the heat-conducting component 3 utilizes the working fluid phase change principle to quickly transfer heat from the heat-conducting component 3 to the fins 341 at both ends, achieving efficient long-distance heat dissipation. The heat generated by the solid-state relay body 1 is diffused laterally through the heat-conducting component 3 and simultaneously conducted longitudinally to the fins 341 via the heat pipe 34, forming a three-dimensional heat dissipation network. The fins 341 enhance convection heat dissipation by increasing the surface area, preventing heat accumulation inside the housing. Any solid-state relay body 1 can be slidably disassembled by tightening and loosening the locking bolt 52, enabling independent maintenance and assembly of a single channel.
[0031] Specifically, the heat-conducting component 3 has flanges 31 on both sides along its length, and several flat-head screws 33 pass through the flanges 31 to be screwed to the DIN rail connection frame 2; the flanges 31 are extension structures on both sides of the heat-conducting component 3, and are screwed to the DIN rail connection frame 2 through the flat-head screws 33 to form a rigid connection.
[0032] Specifically, the heat-conducting component 3 has a T-shaped track 32 at its center that contacts the back of the solid-state relay body 1. The back of the solid-state relay body 1 has a groove corresponding to the T-shaped track 32. The T-shaped track 32 is a raised structure in the center of the heat-conducting component 3. It cooperates with the groove on the back of the solid-state relay body 1 to achieve precise positioning and sliding installation. The raised design of the T-shaped track 32 increases the contact pressure with the solid-state relay body 1, reduces the contact thermal resistance, and improves the heat conduction efficiency.
[0033] Understandably, the back of the heat-conducting partition 4 and the limiting card 5 are respectively provided with a first track groove 41 and a second track groove 51 corresponding to the T-shaped track 32; the first track groove 41 on the back of the heat-conducting partition 4 cooperates with the T-shaped track 32 to realize the precise insertion and positioning of the heat-conducting partition 4, while the limiting card 5 cooperates with the T-shaped track 32 through the second track groove 51.
[0034] Furthermore, thermally conductive silicone pads 42 are fixedly connected to both sides of the thermally conductive partition 4; the thermally conductive silicone pads 42 fill the tiny gap between the thermally conductive partition 4 and the solid-state relay body 1, eliminating air thermal resistance, and the silicone material absorbs vibration energy, protecting the solid-state relay body 1 from mechanical impact.
[0035] Specifically, there are two locking bolts 52 that are symmetrically screwed onto the limiting card 5. The locking bolts 52 contact the surface of the T-shaped track 32 to lock the limiting card 5 onto the T-shaped track 32. Tightening the locking bolts 52 makes them contact the surface of the T-shaped track 32, generating friction to lock the position.
[0036] Specifically, the DIN rail connector 2 has a clamp 21 that matches the DIN rail on the side away from the solid-state relay body 1. The side of the DIN rail connector 2 has a cutout 22. The clamp 21 is compatible with universal DIN rails, supports DIN rail cabinet or panel mounting, reduces adaptation costs, and the cutout 22 reduces the weight of the DIN rail connector 2 while promoting air circulation and assisting in heat dissipation.
[0037] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this application, based on the technical solution and concept of this application, should be included within the scope of protection of this application.
Claims
1. A multi-channel solid-state relay, comprising multiple solid-state relay bodies (1), characterized in that: The solid-state relay body (1) is equipped with a DIN rail connection frame (2). A heat-conducting component (3) is fixedly installed on the DIN rail connection frame (2) and contacts the back of the solid-state relay body (1). The solid-state relay body (1) is slidably installed on the heat-conducting component (3). A heat-conducting partition (4) is slidably connected on the heat-conducting component (3) and contacts the side of the solid-state relay body (1). A limiting plate (35) is fixedly connected to one end of the heat-conducting component (3). A limiting card (5) is slidably connected on the heat-conducting component (3) to move closer to or away from the limiting plate (35) to press against the heat-conducting partition (4) and the solid-state relay body (1). A locking bolt (52) is provided on the limiting card (5). A heat pipe (34) is embedded in the heat-conducting component (3) along the length direction. Both ends of the heat pipe (34) extend to the outside of the heat-conducting component (3), and fins (341) are fixedly connected to both ends of the heat pipe (34).
2. The multi-channel solid-state relay according to claim 1, characterized in that: The heat-conducting component (3) has flanges (31) on both sides along its length, and several flat-head screws (33) are threaded through the flanges (31) and screwed into the DIN rail connecting frame (2).
3. The multi-channel solid-state relay according to claim 2, characterized in that: The heat-conducting component (3) has a T-shaped track (32) at its center, and the solid-state relay body (1) has a groove on its back corresponding to the T-shaped track (32).
4. The multi-channel solid-state relay according to claim 3, characterized in that: The back of the heat-conducting partition (4) and the limiting card (5) are respectively provided with a first track groove (41) and a second track groove (51) corresponding to the T-shaped track (32).
5. The multi-channel solid-state relay according to claim 4, characterized in that: Both sides of the thermally conductive partition (4) are fixedly connected with thermally conductive silicone pads (42).
6. The multi-channel solid-state relay according to claim 5, characterized in that: Two locking bolts (52) are provided and symmetrically screwed onto the limiting card (5). The locking bolts (52) contact the surface of the T-shaped track (32) to lock the limiting card (5) onto the T-shaped track (32).
7. The multi-channel solid-state relay according to claim 6, characterized in that: The DIN rail connector (2) has a clamp (21) that matches the DIN rail on the side away from the solid-state relay body (1).
8. The multi-channel solid-state relay according to claim 7, characterized in that: The DIN rail connector (2) has a cutout (22) on its side.