A dual-mode frequency converter

Abstract

The utility model provides a kind of dual-mode frequency converter, including front shell and radiator, the radiator includes side wall and back wall, the lower end of the back wall is close to front shell, its upper end is inclined to the rear surface of radiator direction extension and then vertically upward extension, so that the rear surface of radiator forms the air guide groove of lower end groove depth greater than upper end groove depth, the back wall is vertically set and is extended to the rear surface of radiator direction and is equipped with the heat dissipation fin of heat dissipation groove bottom position correspondence, the lower end of the air guide groove is equipped with heat dissipation fan;The upper end groove width of the air guide groove narrows to make the wall thickness of side wall upper segment position thickening to form the heat conduction plane that is level with the rear surface of radiator with the side wall surface to the rear surface of radiator;The surface of the back wall to front shell forms the inclined installation surface corresponding to inclined position and the vertical installation surface corresponding to vertical position, and the IGBT module is mounted on the inclined installation surface.The utility model has the advantages that the heat dissipation power redundancy is large, and active or passive heat dissipation can be carried out according to installation occasion.

Description

Technical Field

[0001] This utility model relates to the field of frequency converters, specifically to a dual-mode frequency converter. Background Technology

[0002] A frequency converter is a power control device that uses frequency conversion technology and microelectronics to control an AC motor by changing the frequency of the motor's power supply. The higher the power of the frequency converter, the more heat its IGBT module dissipates during operation. Therefore, based on the power, it is generally divided into active cooling (fan and heat sink fins) and passive cooling (direct heat sink fins). The above two cooling methods are fixed at the beginning of the design and cannot be adjusted or changed according to the later installation site or environment. Utility Model Content

[0003] Based on the above problems, the purpose of this utility model is to provide a dual-mode frequency converter with a large heat dissipation power redundancy and the ability to perform active or passive heat dissipation depending on the installation environment.

[0004] To address the above issues, the following technical solution is provided: A dual-mode frequency converter includes a front housing and a heat sink located behind the front housing. The heat sink includes a side wall and a rear wall located between the two side walls. The lower end of the rear wall is close to the front housing, and its upper end extends obliquely towards the back of the heat sink and then extends vertically upward, forming a duct on the back of the heat sink with a lower groove depth greater than the upper groove depth. The rear wall has vertically opened heat dissipation fins extending towards the back of the heat sink at the bottom of the duct. A cooling fan is provided at the lower end of the duct. The narrowing of the upper groove of the duct causes the upper section of the side wall to thicken, forming a heat-conducting plane flush with the back of the heat sink on the side facing the back of the side wall. A fixing lug is provided inside the back of the heat sink. The side of the rear wall facing the front housing forms an inclined mounting surface corresponding to the inclined part and a vertical mounting surface corresponding to the vertical part. An IGBT module is mounted on the inclined mounting surface.

[0005] The present invention is further configured such that the inclined mounting surface has a first heat pipe groove extending upward to the vertical mounting surface; a first heat pipe is provided in the first heat pipe groove, and the IGBT module presses on top of the first heat pipe to fix the first heat pipe in the first heat pipe groove; the first heat pipe follows the first heat pipe groove to the vertical mounting surface and is fixed in the first heat pipe groove by a vertical pressure block.

[0006] The present invention is further configured such that the left and right sides of the vertical mounting surface are provided with auxiliary heat-conducting surfaces that are recessed inward toward the heat-conducting plane and located in the same plane as the inclined mounting surface; the inclined mounting surface is provided with a second heat pipe groove extending upward to the auxiliary heat-conducting surface; a second heat pipe is provided in the second heat pipe groove, and the IGBT module is pressed on top of the second heat pipe to fix the second heat pipe in the second heat pipe groove; the second heat pipe follows the second heat pipe groove to the auxiliary heat-conducting surface and is fixed in the second heat pipe groove by an auxiliary pressing block.

[0007] The present invention is further configured such that the IGBT modules are arranged in two groups on the inclined mounting surface, with each group consisting of one or more IGBT modules; the first heat pipe groove and the first heat pipe are two or more groups of an even number.

[0008] The present invention is further configured such that the IGBT modules are arranged in two groups on the inclined mounting surface, with each group consisting of one or more IGBT modules; the second heat pipe groove and the second heat pipe are two or more groups of an even number.

[0009] The present invention is further configured such that thermally conductive silicone grease is filled between the back of the IGBT module and the inclined mounting surface.

[0010] The present invention is further configured such that the heat sink is made of copper or copper alloy or aluminum or aluminum alloy.

[0011] The present invention is further configured such that the heat dissipation fins are several fins, which are parallel to each other and spaced apart.

[0012] The present invention is further configured such that the number of heat dissipation fins at the lower end of the air guide groove is greater than the number of heat dissipation fins at the upper end of the air guide groove.

[0013] The beneficial effects of this utility model are:

[0014] 1. Traditional active cooling inverters use fans for auxiliary cooling, which has the advantages of small size and light weight. However, in some dusty environments, dust accumulation on the radiator can affect the cooling efficiency. Therefore, by setting air guide slots, heat dissipation fins and cooling fans on the radiator, heat dissipation is achieved through the cooling fan when active cooling is not required. For some applications where active cooling is not suitable, the radiator can be fixed to a larger heat sink with mounting ears, and the heat is transferred to the heat sink using the heat-conducting plane, thereby achieving the purpose of dual-mode cooling.

[0015] 2. The first heat pipe adopts a flattening process to increase the heat conduction area between it and the IGBT module and the first heat pipe slot. After the IGBT module located at the lower end of the heat pipe heats up, the liquid at the lower end of the heat pipe evaporates rapidly and reaches the upper end of the heat pipe. After transferring the heat to the vertical mounting surface, it condenses and flows back to the lower end of the heat pipe through capillary action. Combined with the effect of gravity, the heat conduction efficiency can be greatly improved. On the one hand, it can quickly transfer the temperature to the entire heat sink. On the other hand, it can quickly transfer the temperature to the cooler heat conduction surface when the heat sink is in contact with the heat sink, so as to ensure the heat dissipation efficiency in both active and passive states.

[0016] 3. The second heat pipe adopts a flattening process to increase the heat conduction area between it and the IGBT module and the second heat pipe slot. After the IGBT module located at the lower end of the heat pipe heats up, the liquid at the lower end of the heat pipe evaporates rapidly and reaches the upper end of the heat pipe. The heat is transferred to the vertical mounting surface and then condenses and flows back to the lower end of the heat pipe through capillary action. Combined with gravity, this can greatly improve the heat conduction efficiency. On the one hand, it can quickly transfer the temperature to the entire heat sink, and on the other hand, it can quickly transfer the temperature to the cooler heat conduction surface when the heat sink is in contact with the heat sink, so as to ensure the heat dissipation efficiency in both active and passive states. The auxiliary heat conduction surface brings the heat pipe closer to the heat conduction surface, making the temperature transfer even faster.

[0017] 4. Each group of IGBT modules consists of three modules, arranged along the height direction of the inclined mounting surface. Each IGBT module is pressed onto the first heat pipe slot and the first heat pipe to ensure heat dissipation efficiency. Each group of IGBT modules consists of three modules, arranged along the height direction of the inclined mounting surface. Each IGBT module is pressed onto the second heat pipe slot and the second heat pipe to ensure heat dissipation efficiency. Attached Figure Description

[0018] Figure 1 This is a first-person perspective three-dimensional structural diagram of the present invention.

[0019] Figure 2 This is a three-dimensional cross-sectional view of the front housing of this utility model.

[0020] Figure 3 This is a schematic diagram of the exploded three-dimensional structure of this utility model.

[0021] Figure 4 This is a first-section, first-view three-dimensional structural diagram of the radiator of this utility model.

[0022] Figure 5 This is a schematic diagram of the second cross-sectional three-dimensional structure of the radiator of this utility model.

[0023] Figure 6 This is a schematic diagram of the third section of the heat sink of this utility model.

[0024] Figure 7 This is a schematic diagram of the overall second-view three-dimensional structure of this utility model.

[0025] Figure 8 This is a first cross-sectional, second-view perspective three-dimensional structural diagram of the radiator of this utility model.

[0026] Figure 9 This utility model Figure 3 A schematic diagram of the three-dimensional structure from the rear side view.

[0027] The labels in the diagram mean: 10-Front shell; 20-Heat sink; 21-Side wall; 22-Rear wall; 221-Inclined mounting surface; 222-Vertical mounting surface; 223-First heat pipe slot; 224-Auxiliary heat conduction surface; 225-Second heat pipe slot; 23-Air guide slot; 24-Heat sink fins; 25-Heat sink fan; 26-Heat conduction plane; 27-Fixing lug; 30-IGBT module; 31-First heat pipe; 32-Vertical pressure block; 33-Second heat pipe; 34-Auxiliary pressure block. Detailed Implementation

[0028] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0029] refer to Figures 1 to 9 ,like Figures 1 to 9 A dual-mode inverter is shown, including a front housing 10 and a heat sink 20 located behind the front housing 10. The heat sink 20 includes a side wall 21 and a rear wall 22 located between the two side walls 21. The lower end of the rear wall 22 is close to the front housing 10, and its upper end extends obliquely towards the back of the heat sink 20 and then extends vertically upward, forming an air guide groove 23 on the back of the heat sink 20 with a lower groove depth greater than the upper groove depth. The rear wall 22 has vertically opened heat dissipation fins 2 corresponding to the bottom of the air guide groove 23, which extend towards the back of the heat sink 20. 4. A cooling fan 25 is provided at the lower end of the air guide slot 23; the width of the upper end of the air guide slot 23 narrows, causing the wall thickness of the upper section of the side wall 21 to increase, so that the side wall 21 facing the back of the heat sink 20 forms a heat-conducting plane 26 that is flush with the back of the heat sink 20, and a fixing ear 27 is provided inside the back of the heat sink 20; the side of the rear wall 22 facing the front housing 10 forms an inclined mounting surface 221 corresponding to the inclined part and a vertical mounting surface 222 corresponding to the vertical part, and the IGBT module 30 is mounted on the inclined mounting surface 221.

[0030] In the above structure, the traditional active cooling inverter uses a fan for auxiliary cooling, which has the advantages of small size and light weight. However, in some dusty environments, dust accumulation on the radiator 20 can affect the cooling efficiency. Therefore, by setting air guide slots 23, heat dissipation fins 24 and cooling fan 25 on the radiator 20, heat dissipation is achieved through the cooling fan 25 while meeting the requirements of active cooling. For some applications where active cooling is not suitable, the radiator 20 can be fixed to a larger heat dissipation radiator (not shown in the figure) by fixing lugs 27, and the heat is transferred to the heat dissipation radiator (not shown in the figure) by using the heat-conducting plane 26, thereby achieving the purpose of dual-mode cooling.

[0031] In this embodiment, the inclined mounting surface 221 has a first heat pipe groove 223 extending upward to the vertical mounting surface 222; a first heat pipe 31 is provided in the first heat pipe groove 223, and the IGBT module 30 presses on the first heat pipe 31 to fix the first heat pipe 31 in the first heat pipe groove 223; the first heat pipe 31 follows the first heat pipe groove 223 to the vertical mounting surface 222 and is fixed in the first heat pipe groove 223 by the vertical pressure block 32.

[0032] In the above structure, the first heat pipe 31 is flattened to increase the heat conduction area between it and the IGBT module 30 and the first heat pipe groove 223. After the IGBT module 30 located at the lower end of the heat pipe heats up, the liquid at the lower end of the heat pipe evaporates rapidly and reaches the upper end of the heat pipe. After transferring the heat to the vertical mounting surface 222, it condenses and flows back to the lower end of the heat pipe through capillary action. Combined with the effect of gravity, the heat conduction efficiency can be greatly improved. On the one hand, the temperature can be quickly transferred to the entire heat sink 20. On the other hand, when the heat sink 20 is in contact with the heat sink (not shown in the figure), the temperature can be quickly transferred to the lower temperature heat conduction surface 26 to ensure the heat dissipation efficiency in both active and passive states.

[0033] In this embodiment, the vertical mounting surface 222 has auxiliary heat-conducting surfaces 224 on its left and right sides that are recessed inward toward the heat-conducting plane 26 and located in the same plane as the inclined mounting surface 221; the inclined mounting surface 221 has a second heat pipe groove 225 extending upward to the auxiliary heat-conducting surface 224; a second heat pipe 33 is provided in the second heat pipe groove 225, and the IGBT module 30 presses on the second heat pipe 33 to fix the second heat pipe 33 in the second heat pipe groove 225; the second heat pipe 33 follows the second heat pipe groove 225 to the auxiliary heat-conducting surface 224 and is fixed in the second heat pipe groove 225 by the auxiliary pressure block 34.

[0034] In the above structure, the second heat pipe 33 is flattened to increase the heat conduction area between it and the IGBT module 30 and the second heat pipe slot 225. After the IGBT module 30 located at the lower end of the heat pipe heats up, the liquid at the lower end of the heat pipe evaporates rapidly and reaches the upper end of the heat pipe. After transferring heat to the vertical mounting surface 222, it condenses and flows back to the lower end of the heat pipe through capillary action. Combined with gravity, this can greatly improve the heat conduction efficiency. On the one hand, it can quickly transfer the temperature to the entire heat sink 20. On the other hand, it can quickly transfer the temperature to the lower heat conduction surface 26 when the heat sink 20 is in contact with the heat sink (not shown in the figure), so as to ensure the heat dissipation efficiency in both active and passive states. The auxiliary heat conduction surface 224 makes the heat pipe closer to the heat conduction surface 26, and the temperature transfer is more rapid.

[0035] In this embodiment, the IGBT modules 30 are arranged in two groups on the inclined mounting surface 221, with one or more IGBT modules 30 in each group; the first heat pipe groove 223 and the first heat pipe 31 are two or more even numbers.

[0036] In the above structure, each group of IGBT modules 30 consists of three modules, arranged along the height direction of the inclined mounting surface 221. Each IGBT module 30 is pressed onto the first heat pipe groove 223 and the first heat pipe 31 to ensure heat dissipation efficiency.

[0037] In this embodiment, the IGBT modules 30 are arranged in two groups on the inclined mounting surface 221, with one or more IGBT modules 30 in each group; the second heat pipe groove 225 and the second heat pipe 33 are two or more even numbers.

[0038] In the above structure, each group of IGBT modules 30 consists of three modules, arranged along the height direction of the inclined mounting surface 221. Each IGBT module 30 is pressed onto the second heat pipe groove 225 and the second heat pipe 33 to ensure heat dissipation efficiency.

[0039] In this embodiment, thermally conductive silicone grease is filled between the back of the IGBT module 30 and the inclined mounting surface 221.

[0040] The above structure can improve the thermal conductivity between the IGBT module 30 and the inclined mounting surface 221.

[0041] In this embodiment, the radiator 20 is made of copper or a copper alloy or aluminum or an aluminum alloy.

[0042] In the above structure, the heat sink 20 is preferably made of aluminum alloy.

[0043] In this embodiment, the heat dissipation fins 24 are several fins that are parallel to each other and spaced apart.

[0044] The above structure can increase the heat dissipation area.

[0045] In this embodiment, the number of heat dissipation fins 24 at the lower end of the air guide slot 23 is greater than the number of heat dissipation fins 24 at the upper end of the air guide slot 23.

[0046] In the above structure, the air velocity at the lower end of the air guide slot 23 is lower than that at the upper end, allowing sufficient time for heat absorption.

[0047] In this embodiment, the IGBT module 30, the vertical pressure block 32, and the auxiliary pressure block 34 are all fixed to the rear wall 22 by screws.

[0048] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model. These improvements and modifications assumed above should also be considered within the protection scope of the present utility model.

Claims

1. A dual-mode frequency converter, comprising a front housing and a heat sink located behind the front housing, characterized in that: The radiator includes a side wall and a rear wall located between the two side walls. The lower end of the rear wall is close to the front housing, and its upper end extends obliquely towards the back of the radiator and then vertically upward, forming an air guide channel on the back of the radiator with a lower groove depth greater than the upper groove depth. The rear wall has vertically opened heat dissipation fins that extend towards the back of the radiator at the bottom of the air guide channel. A cooling fan is provided at the lower end of the air guide channel. The narrowing of the upper groove of the air guide channel causes the wall thickness of the upper section of the side wall to increase, forming a heat-conducting plane flush with the back of the radiator on the side facing the back of the side wall. A fixing lug is provided inside the back of the radiator. The side of the rear wall facing the front housing forms an inclined mounting surface corresponding to the inclined part and a vertical mounting surface corresponding to the vertical part. An IGBT module is mounted on the inclined mounting surface.

2. The dual-mode frequency converter according to claim 1, characterized in that: The inclined mounting surface has a first heat pipe groove extending upward to the vertical mounting surface; a first heat pipe is provided in the first heat pipe groove, and the IGBT module presses on top of the first heat pipe to fix the first heat pipe in the first heat pipe groove; the first heat pipe follows the first heat pipe groove to the vertical mounting surface and is fixed in the first heat pipe groove by a vertical pressure block.

3. A dual-mode frequency converter according to claim 2, characterized in that: The vertical mounting surface has auxiliary heat-conducting surfaces on both sides that are recessed inward toward the heat-conducting plane and located in the same plane as the inclined mounting surface; the inclined mounting surface has a second heat pipe groove extending upward to the auxiliary heat-conducting surface; a second heat pipe is provided in the second heat pipe groove, and the IGBT module is pressed on top of the second heat pipe to fix the second heat pipe in the second heat pipe groove; the second heat pipe follows the second heat pipe groove to the auxiliary heat-conducting surface and is fixed in the second heat pipe groove by an auxiliary pressure block.

4. A dual-mode frequency converter according to claim 2 or 3, characterized in that: The IGBT modules are arranged in two groups on the inclined mounting surface, with one or more IGBT modules in each group; the first heat pipe slot and the first heat pipe are two or more groups of an even number.

5. A dual-mode frequency converter according to claim 3, characterized in that: The IGBT modules are arranged in two groups on the inclined mounting surface, with one or more IGBT modules in each group; the second heat pipe groove and the second heat pipe are two or more groups of an even number.

6. A dual-mode frequency converter according to claim 1, characterized in that: Thermal grease is filled between the back of the IGBT module and the inclined mounting surface.

7. A dual-mode frequency converter according to claim 1, characterized in that: The radiator is made of copper or a copper alloy, or aluminum or an aluminum alloy.

8. A dual-mode frequency converter according to claim 1, characterized in that: The heat dissipation fins are several pieces that are parallel to each other and spaced apart.

9. A dual-mode frequency converter according to claim 8, characterized in that: The number of heat dissipation fins at the lower end of the air guide slot is greater than the number of heat dissipation fins at the upper end of the air guide slot.

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