A packaging apparatus for a circuit board production

Abstract

The utility model relates to the technical field of packaging, and disclose a kind of packaging equipment for circuit board production, solve the packaging equipment for current circuit board production clamping process, too big, easy to make circuit board damaged, affect the problem of packaging quality, it includes base, the base upper end one side is connected with processing frame, the base upper end middle part is connected with placing tray, the utility model, rotating screw rod, make two clamping plate and circuit board external contact, it is fixed limit, avoid circuit board to be offset, affect processing quality, while spring is compressed under pressure, produce elastic potential energy, under the condition that guaranteeing circuit board fixed, through spring, can buffer the pressure received by circuit board in the process of clamping, to avoid extrusion force too big to cause damage to circuit board, silica gel soft pad and circuit board outside contact, protect circuit board, avoid wearing and tearing in clamping process, guarantee circuit board packaging quality.

Description

Technical Field

[0001] This utility model belongs to the field of packaging technology, specifically a packaging equipment for circuit board production. Background Technology

[0002] Circuit boards (PCBs) come in various names, including ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCBs, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, ultra-thin circuit boards, and printed circuit boards (using copper etching technology). Circuit boards miniaturize and visualize circuits, playing a crucial role in the mass production of fixed circuits and optimizing the layout of electrical appliances. Packaging refers to connecting the circuit pins on a silicon wafer to external connectors using wires, facilitating connection to other devices. The packaging form refers to the casing used to mount semiconductor integrated circuit chips. During PCB processing, clamping devices are used to hold and fix them. Typically, the clamping devices inside packaging equipment are rigid clamps. Because circuit boards are relatively fragile, the clamping plate directly contacts the circuit board, and excessive clamping force can easily damage the circuit board, affecting packaging quality. Therefore, excessive clamping force during the packaging process of such PCB production packaging equipment can easily damage the circuit board and affect packaging quality. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, this utility model provides a packaging equipment for circuit board production, which effectively solves the problem that excessive force during the clamping process of current circuit board production packaging equipment can easily damage the circuit board and affect the packaging quality.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a packaging device for circuit board production, comprising a base, a processing frame connected to one side of the upper end of the base, a placement tray connected to the middle of the upper end of the base, a sliding groove formed in the middle of the upper end of the placement tray, a placement slot formed at the upper end of the placement tray, a clamping assembly connected inside the placement slot, the clamping assembly comprising a lead screw installed inside one side of the placement tray, one end of the lead screw extending through to the outside of the placement tray, a gear sleeved on the outside of the lead screw, one side of the gear extending through to the outside of the placement tray, support plates sleeved on both sides of the outside of the lead screw, one end of the support plate connected to one side of the inner wall of the placement tray.

[0005] Optionally, push plates are threaded to both sides of the lead screw. A limit rod is connected through one end of the push plate. One end of the limit rod is connected to one side of the support plate, and the other end of the limit rod is connected to one side of the inner wall of the placement plate.

[0006] Optionally, one end of the push plate extends through into the placement groove and is connected to a movable plate. Both ends of the movable plate are connected to fixed sleeves, and a sleeve is slidably connected to the inner side of the fixed sleeve.

[0007] Optionally, a pressure plate is connected to one side of the inside of the sleeve, one end of the pressure plate extends to the outside of the sleeve and connects to the inside of the fixed sleeve, and a spring is connected to one end of the pressure plate, with one end of the spring connected to one side of the inner wall of the sleeve.

[0008] Optionally, a clamping plate is connected to one end of the sleeve, and a silicone pad is connected to one end of the clamping plate.

[0009] Optionally, a suction fan is connected to one side of the upper end of the base, a suction pipe is connected to the upper end of the suction fan, and an adsorption cover is connected to one end of the suction pipe. The adsorption cover is located above the placement slot.

[0010] Optionally, one end of the adsorption cover is connected to a mounting plate, and the lower end of the mounting plate is connected to a slider. The slider is located inside the slide groove, and the slider is slidably connected to the slide groove. Both the slider and the slide groove have a T-shaped cross-section.

[0011] Optionally, a support rod is connected to one side of the upper end of the base, and a toothed plate is connected to the upper end of the support rod. The upper end of the toothed plate meshes with the outer side of the gear.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This invention utilizes a clamping assembly. By rotating the lead screw, two clamping plates come into contact with the outside of the circuit board, fixing and limiting its movement to prevent displacement and ensure processing quality. Simultaneously, the spring is compressed, generating elastic potential energy. While maintaining the circuit board's fixation, the spring buffers the pressure on the circuit board during clamping, preventing excessive pressure from damaging it. The silicone pad contacts the outside of the circuit board, protecting it from wear during clamping and ensuring the quality of the circuit board's encapsulation.

[0014] Furthermore, by setting up a suction fan, suction pipe, and adsorption cover, the suction fan generates suction force, and the dust on the outside of the circuit board is adsorbed by the adsorption cover, thereby improving the packaging quality of the circuit board. Attached Figure Description

[0015] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0016] In the attached diagram:

[0017] Figure 1 This is a schematic diagram of the structure of a packaging equipment for circuit board production according to the present invention;

[0018] Figure 2 This is a schematic diagram of the opening structure of the slide groove of this utility model;

[0019] Figure 3 This is a schematic diagram of the clamping assembly of this utility model;

[0020] Figure 4 This is a schematic diagram of the connection structure of the spring of this utility model;

[0021] Figure 5 This is a schematic diagram of the connection structure of the toothed plate of this utility model;

[0022] Figure 6 This is a schematic diagram of the connection structure of the slider of this utility model.

[0023] In the diagram: 1. Base; 2. Processing frame; 3. Placement tray; 4. Slide groove; 5. Placement slot; 6. Clamping assembly; 61. Lead screw; 62. Gear; 63. Support plate; 64. Push plate; 65. Limiting rod; 66. Moving plate; 67. Fixing sleeve; 68. Sleeve; 69. Pressure plate; 610. Spring; 611. Clamping plate; 612. Silicone pad; 7. Fan; 8. Suction pipe; 9. Adsorption cover; 10. Mounting plate; 11. Slider; 12. Support rod; 13. Gear plate. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with specific embodiments.

[0025] It should be noted that, unless otherwise defined, the technical or scientific terms used in this utility model should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "first," "second," and similar terms used in this utility model do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0026] The following is in conjunction with the appendix Figures 1-6 This application will be described in further detail.

[0027] This application discloses a packaging device for circuit board manufacturing. (Refer to...) Figure 1-5The system includes a base 1, a processing frame 2 connected to one side of the upper end of the base 1, a packaging device inside the processing frame 2, a placement tray 3 connected to the middle of the upper end of the base 1 for placing the circuit board, a sliding groove 4 opened in the middle of the upper end of the placement tray 3, and a placement slot 5 opened at the upper end of the placement tray 3 for initially fixing the circuit board, a support rod 12 connected to one side of the upper end of the base 1, and a toothed plate 13 connected to the upper end of the support rod 12. When the gear 62 meshes with the toothed plate 13, the gear 62 rotates under the cooperation of the toothed plate 13, the gear 62 drives the lead screw 61 to rotate, the lead screw 61 drives the push plate 64 to move, and then the clamping plate 611 moves to both sides. At this time, the clamping plate 611 does not contact the circuit board, the circuit board is in a movable state, which makes it easy to take out the processed circuit board and realize automatic material discharge. The upper end of the toothed plate 13 meshes with the outer side of the gear 62.

[0028] Reference Figure 3 The placement slot 5 is connected to a clamping assembly 6. The clamping assembly 6 includes a lead screw 61 installed on one side inside the placement tray 3. The external thread direction of the lead screw 61 is symmetrical about the center. When the lead screw 61 rotates, two push plates 64 move simultaneously towards the center or both sides along the external thread direction of the lead screw 61. One end of the lead screw 61 extends through to the outside of the placement tray 3. A gear 62 is sleeved on the outside of the lead screw 61. One side of the gear 62 extends through to the outside of the placement tray 3. Support plates 63 are sleeved on both sides of the outside of the lead screw 61. The support plates 63 support the lead screw 61, making the lead screw 61 more stable during rotation.

[0029] One end of the support plate 63 is connected to one side of the inner wall of the placement plate 3. Both sides of the lead screw 61 are threaded with push plates 64. One end of the push plate 64 is connected to a limit rod 65, which slides and limits the push plate 64, so that the push plate 64 can only move along the support, ensuring the stability of the push plate 64 during movement. One end of the limit rod 65 is connected to one side of the support plate 63, and the other end of the limit rod 65 is connected to one side of the inner wall of the placement plate 3. One end of the push plate 64 extends through to the inside of the placement groove 5 and is connected to a moving plate 66. Both ends of the moving plate 66 are connected to fixed sleeves 67.

[0030] Additionally, refer to Figure 4 As shown, when the clamping plate 611 clamps and fixes the circuit board, the fixed sleeve 67 slides along the outside of the sleeve 68 under the push of the moving plate 66, which in turn drives the pressure plate 69 to move and compress the spring 610. The sleeve 68 is slidably connected to the inside of the fixed sleeve 67, and the pressure plate 69 is connected to one side of the inside of the sleeve 68. One end of the pressure plate 69 extends to the outside of the sleeve 68 and is connected to the inside of the fixed sleeve 67. One end of the pressure plate 69 is connected to the spring 610, and one end of the spring 610 is connected to one side of the inner wall of the sleeve 68. The clamping plate 611 is connected to one end of the sleeve 68. The clamping plate 611 clamps and fixes both sides of the circuit board under the push, ensuring that the circuit board will not shift or shake during processing.

[0031] At the same time, the spring 610 is compressed and generates elastic potential energy. While ensuring the circuit board is fixed, the spring 610 can buffer the pressure on the circuit board during the clamping process, thereby avoiding excessive squeezing force that could damage the circuit board. One end of the clamping plate 611 is connected to a silicone pad 612, which contacts the outside of the circuit board to protect it and prevent wear during the clamping process.

[0032] Reference Figure 6 A suction fan 7 is connected to one side of the upper end of the base 1. The suction fan 7 generates suction. A suction pipe 8 is connected to the upper end of the suction fan 7. An adsorption cover 9 is connected to one end of the suction pipe 8. The adsorption cover 9 adsorbs the dust on the outside of the placement slot 5 and the circuit board. The adsorption cover 9 is located above the placement slot 5. A mounting plate 10 is connected to one end of the adsorption cover 9. A slider 11 is connected to the lower end of the mounting plate 10.

[0033] The slider 11 is located inside the slide groove 4 and is slidably connected to the slide groove 4. With the slider 11 and the slide groove 4, the adsorption cover 9 remains stable and maintains normal operation during the rotation of the placement plate 3. It will not move with the rotation of the placement plate 3. The cross-section of both the slider 11 and the slide groove 4 is T-shaped. This structure plays a limiting role to prevent the slider 11 from separating from the slide groove 4 and to ensure that the slider 11 slides inside the slide groove 4.

[0034] The implementation principle of the packaging equipment for circuit board production in this application embodiment is as follows: During use, the circuit board to be processed is placed inside the placement groove 5. The lead screw 61 is rotated. The lead screw 61 is threadedly connected to the push plate 64. The rotation of the lead screw 61 drives the two push plates 64 to move in a straight line towards the center. The two clamping plates 611 contact the outside of the circuit board and fix and limit it to ensure the stability of the circuit board during processing and prevent the circuit board from shifting, which would affect the processing quality. At the same time, the spring 610 is compressed and generates elastic potential energy. While ensuring the circuit board is fixed, the spring 610 can buffer the pressure on the circuit board during clamping, thereby avoiding excessive extrusion pressure that could damage the circuit board. The silicone pad 612 contacts the outside of the circuit board to protect the circuit board and prevent wear during clamping.

[0035] The suction force generated by the suction fan 7 allows dust on the outside of the circuit board to be adsorbed by the adsorption cover 9, thereby improving the packaging quality of the circuit board.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A packaging device for circuit board production, comprising a base (1), characterized in that: A processing frame (2) is connected to one side of the upper end of the base (1). A placement plate (3) is connected to the middle of the upper end of the base (1). A sliding groove (4) is opened in the middle of the upper end of the placement plate (3). A placement slot (5) is opened at the upper end of the placement plate (3). A clamping assembly (6) is connected inside the placement slot (5). The clamping assembly (6) includes a lead screw (61) installed inside one side of the placement plate (3). One end of the lead screw (61) extends through to the outside of the placement plate (3). A gear (62) is sleeved on the outside of the lead screw (61). One side of the gear (62) extends through to the outside of the placement plate (3). Support plates (63) are sleeved on both sides of the outside of the lead screw (61). One end of the support plate (63) is connected to one side of the inner wall of the placement plate (3).

2. The packaging equipment for circuit board production according to claim 1, characterized in that: Both sides of the lead screw (61) are threaded with push plates (64). One end of the push plate (64) is connected to a limit rod (65). One end of the limit rod (65) is connected to one side of the support plate (63), and the other end of the limit rod (65) is connected to one side of the inner wall of the placement plate (3).

3. The packaging equipment for circuit board production according to claim 2, characterized in that: One end of the push plate (64) extends through into the placement groove (5) and is connected to a movable plate (66). Both ends of the movable plate (66) are connected to fixed sleeves (67), and a sleeve (68) is slidably connected to the inside of the fixed sleeve (67).

4. The packaging equipment for circuit board production according to claim 3, characterized in that: A pressure plate (69) is connected to one side of the inside of the sleeve (68). One end of the pressure plate (69) extends to the outside of the sleeve (68) and is connected to the inside of the fixed sleeve (67). A spring (610) is connected to one end of the pressure plate (69). One end of the spring (610) is connected to one side of the inner wall of the sleeve (68).

5. The packaging equipment for circuit board production according to claim 4, characterized in that: One end of the sleeve (68) is connected to a clamping plate (611), and one end of the clamping plate (611) is connected to a silicone pad (612).

6. The packaging equipment for circuit board production according to claim 1, characterized in that: A suction fan (7) is connected to one side of the upper end of the base (1), and a suction pipe (8) is connected to the upper end of the suction fan (7). An adsorption cover (9) is connected to one end of the suction pipe (8), and the adsorption cover (9) is located above the placement slot (5).

7. The packaging equipment for circuit board production according to claim 6, characterized in that: The adsorption cover (9) is connected to an installation plate (10) at one end, and a slider (11) is connected to the lower end of the installation plate (10). The slider (11) is located inside the slide groove (4), and the slider (11) is slidably connected to the slide groove (4). The cross-sections of the slider (11) and the slide groove (4) are both T-shaped structures.

8. The packaging equipment for circuit board production according to claim 1, characterized in that: A support rod (12) is connected to one side of the upper end of the base (1), and a toothed plate (13) is connected to the upper end of the support rod (12). The upper end of the toothed plate (13) meshes with the outer side of the gear (62).

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