A power module integrated with a motor and an electric heating driver

Abstract

The utility model belongs to the field of semiconductor electron electric power technology provides a kind of integrated motor and power module of electric heating drive, it mainly includes package body;Motor control unit is set in package body, it includes six first power chip;Electric heater control unit is set in package body, it includes multiple second power chip, multiple second power chip is located in the side or both sides of motor control unit;Temperature detection unit is set in package body, it includes several temperature sensor, temperature sensor is close to first power chip setting and / or close to second power chip setting;Wherein, in package body, six first power chip is linear distribution or staggered distribution. By adopting above-mentioned setting, the three units of power module are packaged in package body, reduce the volume of power module, at the same time, adopt above-mentioned chip layout mode, make it have better heat dissipation performance, and reduce energy loss, improve power module efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor electronic power technology, and in particular refers to a power module that integrates motor and electric heating drive. Background Technology

[0002] In existing integrated controllers for automotive electric compressors and heaters, multiple IGBTs are required and distributed within the controller. Each IGBT needs an external temperature sensor to monitor its temperature for thermal protection, and thermally conductive insulating pads are used for insulation and heat dissipation.

[0003] In existing technologies, multiple IGBTs occupy a significant amount of space, hindering product miniaturization. Furthermore, each IGBT requires thermally conductive insulating cloth or ceramic sheets for insulation and heat conduction. Thermally conductive insulating cloth has low thermal conductivity, hindering heat dissipation, while ceramic sheets are fragile and difficult to assemble. Additionally, external temperature sensors are used to detect the IGBT temperature. However, due to the influence of ambient temperature and thermal resistance, external temperature sensors cannot accurately detect the IGBT temperature, making the IGBT prone to overheating and failure. Based on these technical problems, it is necessary for those skilled in the art to improve the product to overcome the deficiencies in the existing technology. Utility Model Content

[0004] This invention provides a power module that integrates a motor and an electric heating drive, solving the problems of low thermal conductivity and difficult heat dissipation mentioned above.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A power module integrating a motor and electric heating drive, comprising:

[0007] Package;

[0008] A motor control unit is disposed within the package. The motor control unit includes six first power chips, which form a three-phase full-bridge topology circuit within the package.

[0009] An electric heater control unit is disposed within the package, and the electric heater control unit includes a plurality of second power chips, which are located on one or both sides of the motor control unit;

[0010] A temperature detection unit is disposed within the package. The temperature detection unit includes a plurality of temperature sensors, which are disposed near the first power chip and / or near the second power chip.

[0011] Within the package, the six first power chips are arranged in a straight line or in an alternating pattern.

[0012] In some embodiments, the first power chip and the second power chip are one or more of IGBT chips, SiC chips, MOSFET chips, SBD chips, FRD chips and GaN chips.

[0013] In some embodiments, the package also includes a plurality of power pin terminals and a plurality of signal pin terminals extending from inside the package, wherein the plurality of power pin terminals are located on a first side of the package and the plurality of signal pin terminals are located on a second side of the package, wherein the first side and the second side are positioned opposite each other.

[0014] In some embodiments, the two adjacent power pin terminals extend at different lengths relative to the package body, so that the two adjacent power pin terminals are staggered.

[0015] In some embodiments, the lengths of two adjacent signal pin terminals extending relative to the package are different, so that the adjacent signal pin terminals are staggered.

[0016] In some embodiments, a copper-clad ceramic substrate disposed inside the package body is also included, the package body covering the copper-clad ceramic substrate, and both the first power chip and the second power chip are disposed on the copper-clad ceramic substrate.

[0017] In some implementations, when the six first power chips are arranged in a straight line, the arrangement order of the first power chips is as follows: upper U-phase transistor, upper V-phase transistor, upper W-phase transistor, lower U-phase transistor, lower V-phase transistor, and lower W-phase transistor of the three-phase full-bridge circuit; or they are arranged in reverse order.

[0018] In some implementations, when the six first power chips are staggered, they are arranged in two rows, including a first row of units and a second row of units. The first row of units consists of the upper U-phase transistor, the upper V-phase transistor, and the upper W-phase transistor of a three-phase full-bridge circuit, and the second row of units consists of the lower U-phase transistor, the lower V-phase transistor, and the lower W-phase transistor of a three-phase full-bridge circuit.

[0019] In some embodiments, the temperature detection unit includes a first temperature sensor and a second temperature sensor, wherein the first temperature sensor is located near the motor control unit and the second temperature sensor is located near the electric heater control unit.

[0020] Compared with the prior art, the beneficial effects of this utility model are:

[0021] This application employs a linear or staggered arrangement of the six first power chips, effectively balancing the self-heating of the multiple first power chips and the coupling heat between them, thus improving the heat dissipation performance of the power module. Simultaneously, this layout also takes into account the overall package inductance characteristics, further reducing energy loss in the power module's control section and improving the module's efficiency.

[0022] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0023] Figure 1 This is a schematic diagram showing the linear distribution of the first power chip in a power module that integrates a motor and an electric heating drive according to this utility model.

[0024] Figure 2 This is a schematic diagram showing the staggered distribution of the first power chips in a power module that integrates a motor and an electric heating drive according to this utility model.

[0025] Figure 3 This is a schematic diagram of the internal circuit connection of a power module for integrating a motor and electric heating drive according to this utility model. Detailed Implementation

[0026] The present application will be further described in detail below with reference to the accompanying drawings. In the description of the embodiments, unless otherwise stated, the terms "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the present application must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present application.

[0027] In one embodiment, such as Figure 1 and Figure 2 As shown, this utility model provides a power module that integrates a motor and an electric heating drive.

[0028] The main encapsulation body, which is the potting layer, is formed by encapsulating with epoxy resin to create a solid structure, and the encapsulation body provides insulation. The motor control unit is housed within the encapsulation body and includes six primary power chips. These six primary power chips form a three-phase full-bridge topology circuit within the encapsulation body.

[0029] An electric heater control unit is housed within a package. The electric heater control unit includes multiple second power chips, which are located on one or both sides of the motor control unit. In this embodiment, there are three second power chips, which are located on one side of the motor control unit. The three second power chips are staggered and arranged in a triangular structure.

[0030] The temperature detection unit is mainly used for real-time temperature monitoring of the first and second power chips to prevent overheating during operation. The unit includes multiple temperature sensors housed within a package. The number and distribution of these sensors are configured based on the number of first and second power chips to be monitored, allowing for temperature monitoring of only the first, only the second, or both chips simultaneously.

[0031] The aforementioned electric heater control unit, motor control unit, and temperature detection unit are all encapsulated in a package, integrated into one package, which makes the power module highly integrated, reduces the volume occupied by the power module, and miniaturizes the power module.

[0032] It is important to note that the six primary power chips are arranged in a straight line or staggered within the package. Specifically, the six primary power chips are arranged in a linear shape, with their distribution direction aligned with the length of the power module and positioned near the center of the package. When using this layout, the arrangement order of the primary power chips is as follows: upper U-phase transistor, upper V-phase transistor, upper W-phase transistor, lower U-phase transistor, lower V-phase transistor, lower W-phase transistor of the three-phase full-bridge circuit; or the reverse order.

[0033] When the six primary power chips are arranged in an interleaved manner, such as Figure 2 As shown, the units are arranged in two rows, including a first row of units and a second row of units. The first row of units consists of the upper U-phase transistor, the upper V-phase transistor, and the upper W-phase transistor of the three-phase full-bridge circuit. The second row of units consists of the lower U-phase transistor, the lower V-phase transistor, and the lower W-phase transistor of the three-phase full-bridge circuit.

[0034] By employing the two layouts described above for the six primary power chips, the self-heating of the power chips and the coupling heat between them are fully considered, resulting in better heat dissipation performance for the power module. Simultaneously, the loop inductance characteristics introduced by the overall packaging are taken into account, further reducing energy loss during controller operation and improving the controller efficiency of the power module. Furthermore, this power module is compatible with the safety requirements of multiple voltage platforms, facilitating the selection and use of controllers at multiple voltage levels.

[0035] In one embodiment, both the first power chip and the second power chip are one or more of the following: IGBT chip, SiC chip, MOSFET chip, SBD chip, FRD chip, and GaN chip. Depending on the actual needs, these chips can be used in combination or individually.

[0036] In one embodiment, Figure 1 As shown, the power module also includes multiple power terminal pins and multiple signal terminal pins, wherein the multiple power pins are located on the first side of the package (i.e., Figure 1 (as shown in the first side), multiple signal pin terminals are located on the second side of the package (i.e. Figure 1 (as shown in the second side), wherein the first side and the second side are positioned opposite each other. The power module separates the power pin terminals and signal pin terminals on both sides of the package, which facilitates the layout of the controller circuit.

[0037] Specifically, the power pin terminals include P pin, U pin, V pin, W pin, NU pin, NV pin, NW pin, E1 pin, C2 pin, C3 pin, and E23 pin;

[0038] The signal pin terminals include T1-1 pin, T1-2 pin, GUH pin, KUH pin, GVH pin, KVH pin, GWH pin, KWH pin, GUL pin, KUL pin, GVL pin, KVL pin, GWL pin, KWL pin, G1 pin, K1 pin, G2 pin, G3 pin, K23 pin, T2-1 pin, and T2-2 pin;

[0039] The six primary power chips include Q1, Q2, Q3, Q4, Q5, and Q6.

[0040] The three secondary power chips include the Q7 chip, the Q8 chip, and the Q9 chip;

[0041] Each first power chip and each second power chip are provided with a first port, a second port and a third port. The first port is the gate, the second port is the collector and the third port is the emitter.

[0042] The temperature sensor includes a first temperature sensor T1 and a second temperature sensor T2, wherein the first temperature sensor is located near the motor control unit and the second temperature sensor is located near the electric heater control unit.

[0043] like Figure 3The diagram shows the circuit connections of each chip and its pins. The first port of chip Q1 is connected to the GUH pin of the power module. The second port of chip Q1 is connected to the second ports of chips Q2, Q3, and Q7, as well as the P pin of the power module. The third port of chip Q1 is connected to the KUH pin of the power module, the second port of chip Q4, and the U pin of the power module. The first port of chip Q2 is connected to the GVH pin of the power module. The third port of chip Q2 is connected to the KVH pin of the power module, the second port of chip Q5, and the V pin of the power module. The first port of chip Q3 is connected to the GWH pin of the power module. The third port of chip Q3 is connected to the KWH pin of the power module, the second port of chip Q6, and the W pin of the power module. The first port of chip Q4 is connected to the GUL pin of the power module. The third port of chip Q4 is connected to the KUL pin and the NU pin of the power module. The first port of chip Q5... The first port of the Q5 chip is connected to the GVL pin of the power module; the third port of the Q5 chip is connected to the KVL pin and the NV pin of the power module; the first port of the Q6 chip is connected to the GWL pin of the power module; the third port of the Q6 chip is connected to the KWL pin and the NW pin of the power module; the first port of the Q7 chip is connected to the G1 pin of the power module; the emitter of the Q7 chip is connected to the K1 pin and the E1 pin of the power module; the first port of the Q8 chip is connected to the G2 pin of the power module; the second port of the Q8 chip is connected to the C2 pin of the power module; the third port of the Q8 chip is connected to the third port of the Q9 chip, the K23 pin of the power module, and the E23 pin of the power module; the first port of the Q9 chip is connected to the G3 pin of the power module; the second port of the Q9 chip is connected to the C3 pin of the power module.

[0044] One end of the first temperature sensor T1 is connected to pin T1-1 of the power module; the other end of the first temperature sensor T1 is connected to pin T1-2 of the power module; one end of the second temperature sensor T2 is connected to pin T2-1 of the power module; the other end of the second temperature sensor T2 is connected to pin T2-2 of the power module. The first and second temperature sensors are built-in sensors of the power module and are used to detect the temperature of each chip.

[0045] In one embodiment, adjacent power pin terminals extend at different lengths relative to the package body, resulting in an interleaved distribution of adjacent power pin terminals. This structure allows for a staggered distribution of multiple power terminals, providing space for interfacing with external components.

[0046] Similarly, adjacent signal pins extend at different lengths relative to the package, allowing them to be staggered. This structure enables multiple signal pins to be misaligned, providing space for interfacing with external components.

[0047] In one embodiment, the power module further includes a copper-clad ceramic substrate disposed inside a package, which encapsulates the substrate for insulation. The first power chip and the second power chip are mounted on the copper-clad ceramic substrate. In this intelligent power module solution integrating motor and electric heater drive, both the first and second power chips are mounted on the copper-clad ceramic substrate, providing internal insulation. External thermally conductive insulating cloth or ceramic sheets are not required for insulation and heat conduction, increasing the thermal conductivity of the first and second power chips and reducing the risk of thermal failure.

[0048] The above description is merely a preferred embodiment of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model. These improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A power module integrating a motor and an electric heating drive, characterized in that, include: Package; A motor control unit is disposed within the package. The motor control unit includes six first power chips, which form a three-phase full-bridge topology circuit within the package. An electric heater control unit is disposed within the package, and the electric heater control unit includes a plurality of second power chips, which are located on one or both sides of the motor control unit; A temperature detection unit is disposed within the package. The temperature detection unit includes a plurality of temperature sensors, which are disposed near the first power chip and / or near the second power chip. Within the package, the six first power chips are arranged in a straight line or in an alternating pattern.

2. The power module integrating a motor and electric heating drive according to claim 1, characterized in that, Both the first power chip and the second power chip are one or more of IGBT chips, SiC chips, MOSFET chips, SBD chips, FRD chips, and GaN chips.

3. The power module integrating a motor and electric heating drive according to claim 1, characterized in that, It also includes multiple power pin terminals and multiple signal pin terminals extending from inside the package, wherein the multiple power pin terminals are located on a first side of the package and the multiple signal pin terminals are located on a second side of the package, wherein the first side and the second side are positioned opposite each other.

4. The power module integrating a motor and electric heating drive according to claim 3, characterized in that, The two adjacent power pin terminals extend at different lengths relative to the package body, so that the two adjacent power pin terminals are staggered.

5. A power module integrating a motor and electric heating drive according to claim 3, characterized in that, The two adjacent signal pin terminals extend at different lengths relative to the package body, so that the two adjacent signal pin terminals are staggered.

6. A power module integrating a motor and electric heating drive according to any one of claims 1-5, characterized in that, It also includes a copper-clad ceramic substrate disposed inside the package, the package covering the copper-clad ceramic substrate, and both the first power chip and the second power chip are disposed on the copper-clad ceramic substrate.

7. The power module integrating a motor and electric heating drive according to claim 1, characterized in that, When the six first power chips are arranged in a straight line, the arrangement order of the first power chips is as follows: upper U-phase transistor, upper V-phase transistor, upper W-phase transistor, lower U-phase transistor, lower V-phase transistor, lower W-phase transistor of the three-phase full-bridge circuit; or arranged in reverse order.

8. The power module integrating a motor and electric heating drive according to claim 1, characterized in that, When the six first power chips are staggered, they are arranged in two rows, including a first row of units and a second row of units. The first row of units consists of the upper U-phase transistor, the upper V-phase transistor, and the upper W-phase transistor of the three-phase full-bridge circuit, and the second row of units consists of the lower U-phase transistor, the lower V-phase transistor, and the lower W-phase transistor of the three-phase full-bridge circuit.

9. A power module integrating a motor and electric heating drive according to claim 1, characterized in that, The temperature detection unit includes a first temperature sensor and a second temperature sensor, wherein the first temperature sensor is located near the motor control unit and the second temperature sensor is located near the electric heater control unit.

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