A tin paste printing device for a tin paste printer

Abstract

This utility model discloses a solder paste application device for a solder paste printing machine, including a frame, a printing plate mounted on the frame, a squeegee mounted on the frame, a solder paste container and a spreading mechanism mounted on the frame, a first moving mechanism mounted on one side of the frame, and the solder paste container mounted on the first moving mechanism, with a distribution tube connected to the solder paste container and extending into the frame, and a second moving mechanism mounted on the other side of the frame, with the spreading mechanism mounted on the second moving mechanism, the spreading mechanism including a fixed plate mounted on the second moving mechanism, and a movable plate slidably mounted on one side of the fixed plate. This eliminates the need for manual hand-held squeegee application of solder paste; the even distribution of solder paste is achieved through the automated action of the spreading mechanism, reducing manual operation steps, lowering the labor intensity of operators, avoiding errors caused by manual operation, and improving the consistency of solder paste distribution.

Description

Technical Field

[0001] This utility model relates to the field of solder paste printing machine technology, specifically to a solder paste adding device for a solder paste printing machine. Background Technology

[0002] Solder paste is a new type of soldering material that emerged with the development of surface mount technology (SMT). It is a paste-like mixture of solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components such as resistors, capacitors, and ICs on PCBs in the SMT industry. Solder paste printing involves placing the solder paste onto the solder pads (PCB pads) of the substrate through holes in the stencil. With the automation of PCB production, the movement of general PCBs and the contact between the PCB and the printing fixture are generally automated, as is the scraping of solder paste. However, the process of adding solder paste to the printing fixture is mostly done manually, which is not very convenient.

[0003] A search revealed a patent with publication number CN222329284U, which proposes a solder paste printing fixture for easy solder paste addition, belonging to the field of solder paste printing fixture technology. It includes a printing box and a mounting plate. The printing box has a printing plate at its bottom, and the mounting plate has a scraping mechanism at its bottom. A retaining seat is fitted onto the outer side of the printing box, and a support base is fixedly connected to the top surface of the retaining seat. A multi-stage electric push rod drives the conveying cylinder and the solder paste dispensing tube to move. A second motor drives a spiral conveying rod to rotate, causing the solder paste in the storage cylinder to move from the conveying cylinder. The solder paste is then injected onto the printing plate through the dispensing tube. A first motor drives a reciprocating screw to rotate, and the cooperation between the reciprocating screw and the moving base moves the dispensing tube back and forth, evenly adding solder paste to the center of the top surface of the printing plate. This achieves automatic solder paste addition, improving the practicality of this easy-to-add solder paste printing fixture.

[0004] In the aforementioned prior art, although the solder paste can be injected into the middle of the printed circuit board by moving back and forth through the discharge tube, the solder paste will exist on the surface of the printed circuit board in the form of dot-like or strip-like accumulations after flowing out of the discharge tube, and the accumulation thickness is uneven. As a result, before the subsequent scraping mechanism works, the operator must manually scrape the solder paste evenly with a scraper, which is too cumbersome. Utility Model Content

[0005] The purpose of this section is to outline some aspects of the embodiments of this utility model and to briefly introduce some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be used to limit the scope of this utility model.

[0006] In view of the problems existing in the above and / or existing solder paste application devices for solder paste printing machines, this utility model is proposed.

[0007] To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution:

[0008] A solder paste application device for a solder paste printing machine includes a frame, a printing plate disposed on the frame, a scraper disposed on the frame, a solder paste container and a spreading mechanism disposed on the frame.

[0009] As a preferred embodiment of the solder paste adding device for a solder paste printing machine described in this utility model, a first moving mechanism is provided on one side of the frame, and the solder paste can is disposed on the first moving mechanism.

[0010] As a preferred embodiment of the solder paste adding device for a solder paste printing machine described in this utility model, the solder paste container is provided with a distribution pipe, and the distribution pipe extends into the frame.

[0011] As a preferred embodiment of the solder paste application device for a solder paste printing machine described in this utility model, a second moving mechanism is provided on the other side of the frame, and the spreading mechanism is provided on the second moving mechanism.

[0012] As a preferred embodiment of the solder paste application device for a solder paste printing machine described in this utility model, the spreading mechanism includes a fixed plate disposed on a second moving mechanism, and a movable plate is slidably mounted on one side of the fixed plate.

[0013] As a preferred embodiment of the solder paste adding device for a solder paste printing machine described in this utility model, a contact block is provided on one side of the fixing plate, and protrusions are provided at both ends of one side of the inner wall of the frame, and the protrusions are arranged vertically.

[0014] As a preferred embodiment of the solder paste application device for a solder paste printing machine described in this utility model, the upper and lower sides of the contact block are configured as parallel inclined surfaces.

[0015] As a preferred embodiment of the solder paste adding device for a solder paste printing machine described in this utility model, a mounting plate is provided on the outer wall of the fixed plate, magnetic blocks are symmetrically arranged on the outer wall of the mounting plate, and a magnetic mating plate is provided on the other side of the movable plate, and the magnetic mating plate and the magnetic blocks are magnetically mated.

[0016] As a preferred embodiment of the solder paste adding device for a solder paste printing machine described in this utility model, a collection groove is provided on one side of the inner wall of the frame.

[0017] As a preferred embodiment of the solder paste adding device for a solder paste printing machine described in this utility model, a scraper is provided on the outer wall of the arrangement tube.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] In this solution, there is no need for manual hand-held scraper to spread the solder paste evenly. The uniform distribution of solder paste can be completed through the automated action of the spreading mechanism, reducing manual operation steps, reducing the labor intensity of operators, avoiding errors caused by manual operation, and improving the consistency of solder paste distribution.

[0020] In this solution, the solder paste is evenly applied and residual solder paste is scraped off simultaneously through one back-and-forth movement of the movable plate, simplifying the operation process, shortening the preparation time before a single printing, and improving overall production efficiency.

[0021] In this solution, the collection tank and scraper can effectively recycle residual solder paste, reduce solder paste waste, lower production costs, and at the same time prevent residual solder paste from accumulating and contaminating inside the device, thus extending the device's service life. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0023] Figure 1 This is a schematic diagram of the overall structure of a solder paste application device for a solder paste printing machine according to the present invention;

[0024] Figure 2 This is a schematic diagram of the protrusion position structure of a solder paste application device for a solder paste printing machine according to the present invention;

[0025] Figure 3 This is a schematic diagram of the scraper structure of a solder paste application device for a solder paste printing machine according to the present invention;

[0026] Figure 4 for Figure 3 Enlarged view of the middle section structure;

[0027] Figure 5 This is a schematic diagram of the contact block and bump mating structure of a solder paste application device for a solder paste printing machine according to the present invention;

[0028] Figure 6 This is a schematic diagram of the magnetic block position structure of a solder paste application device for a solder paste printing machine according to the present invention.

[0029] In the diagram: 1. Frame; 2. Printed circuit board; 3. Squeegee; 4. First moving mechanism; 5. Second moving mechanism; 6. Solder paste container; 7. Arrangement tube; 8. Spreading mechanism; 9. Scraper; 10. Collection tank; 11. Protrusion; 12. Fixed plate; 13. Movable plate; 14. Contact block; 15. Mounting plate; 16. Magnetic block; 17. Magnetic mating plate. Detailed Implementation

[0030] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0031] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views showing the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0032] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0033] Example

[0034] Please see Figures 1-6 This utility model provides a technical solution: a solder paste feeding device for a solder paste printer, including a frame 1. The frame 1 serves as the basic support structure of the entire device, providing a mounting carrier for each component. A printing plate 2 is mounted on the frame 1. The printing plate 2 is the core supporting component for the solder paste printing operation. The PCB board to be printed can be placed under the printing plate 2. A scraper 3 is also mounted on the frame 1. The scraper 3 is used for subsequent printing and scraping operations on the solder paste on the printing plate 2 to ensure that the solder paste can be demolded through the holes to the PCB board pads. The frame 1 is also equipped with a solder paste container 6 for storing solder paste and a spreading mechanism 8 for achieving uniform distribution of solder paste. The solder paste container 6 provides a continuous supply of solder paste to the device, and the spreading mechanism 8 solves the problem of uneven solder paste accumulation in the prior art.

[0035] A first moving mechanism 4 is provided on one side of the frame 1. The first moving mechanism 4 provides power for the application of solder paste, and the solder paste can 6 is mounted on the first moving mechanism 4 so that the position of the solder paste can 6 can be adjusted according to the movement of the first moving mechanism 4. A distribution tube 7 is connected to the solder paste can 6. The distribution tube 7 is the channel for conveying solder paste from the solder paste can 6 to the printing area, and the distribution tube 7 extends into the frame 1 to ensure that the solder paste can be accurately delivered to the vicinity of the printing board 2. A second moving mechanism 5 is provided on the other side of the frame 1. The second moving mechanism 5 provides power for the movement of the spreading mechanism 8, and the spreading mechanism 8 is mounted on the second moving mechanism 5 so that the spreading mechanism 8 can move flexibly within the frame 1 to complete the spreading and scraping of solder paste.

[0036] The solder paste spreading mechanism 8 includes a fixed plate 12 mounted on the second moving mechanism 5. The fixed plate 12 is the basic mounting component of the solder paste spreading mechanism 8 and provides sliding support for the movable plate 13. The movable plate 13 is slidably mounted on one side of the fixed plate 12. The movable plate 13 is the core component that directly contacts the solder paste and realizes the even spreading and cleaning of the solder paste. A contact block 14 is provided on one side of the fixed plate 12. Both ends of one side of the inner wall of the frame 1 are provided with protrusions 11, and the protrusions 11 are arranged vertically. The contact block 14 and the protrusions 11 cooperate to realize the lifting and lowering switching of the movable plate 13. The upper and lower sides of the contact block 14 are set as parallel inclined structures. The inclined design allows the contact block 14 to guide the movable plate 13 to move more smoothly when it contacts the protrusions 11, avoiding jamming.

[0037] A mounting plate 15 is provided on the outer wall of the fixed plate 12. The mounting plate 15 provides a fixed position for the magnetic block 16. Magnetic blocks 16 are symmetrically arranged on the outer wall of the mounting plate 15. A magnetic mating plate 17 is provided on the other side of the movable plate 13. The magnetic mating plate 17 and the magnetic block 16 are magnetically mated. Through the magnetic attraction force, the movable plate 13 can be stably maintained in the target position after lifting and lowering, avoiding positional deviation during operation. A collection groove 10 is opened on one side of the inner wall of the frame 1. The collection groove 10 is used to collect the residual solder paste after the printing operation, which not only avoids the waste of solder paste, but also prevents the residual solder paste from contaminating the inside of the device. A scraper 9 is provided on the outer wall of the arrangement tube 7. The scraper 9 is used to scrape off and recycle the residual solder paste on the surface of the movable plate 13, further improving the utilization rate of solder paste.

[0038] In use, the device is first started, and the first moving mechanism 4 begins to operate, driving the solder paste can 6 on it to move smoothly along the horizontal axis of the frame 1. The solder paste inside the can 6, under its own weight and the conveying power, is continuously transported through the connecting pipe 7 to the area near the printed circuit board 2 within the frame 1, achieving initial application of the solder paste around the printed circuit board 2 and preventing it from accumulating at a single point. After the initial application of the solder paste is completed, the second moving mechanism 5 is started, driving the spreading mechanism 8 towards the printed circuit board 2. At this time, the movable plate 13 in the spreading mechanism 8 is in its initial position, maintaining a certain distance between the movable plate 13 and the printed circuit board 2. When the movable plate 13 contacts the initially applied solder paste, the solder paste... Under the pushing action of the movable plate 13, the solder paste can flow smoothly through the distance between the movable plate 13 and the printed circuit board 2, gradually covering the entire printing area of ​​the printed circuit board 2, achieving uniform distribution of solder paste, and completely solving the problems of dot-like or strip-like accumulation and uneven thickness of solder paste in the prior art. When the movable plate 13 moves to the other side of the frame 1 with the second moving mechanism 5, the contact block 14 on the movable plate 13 contacts the protrusion 11 on the inner wall of the frame 1 on that side. Since the two sides of the contact block 14 are inclined structures, under the blocking and guiding action of the protrusion 11, the contact block 14 drives the movable plate 13 to move down along the sliding direction of the fixed plate 12 until the movable plate 13 is in complete contact with the printed circuit board 2. At this time, the solder paste on the movable plate 13... The magnetic mating plate 17 and the magnetic block 16 located on the lower side of the mounting plate 15 are tightly attached, and the position of the movable plate 13 is firmly locked by magnetic attraction, ensuring that the movable plate 13 maintains stable contact with the printed circuit board 2 during the subsequent retraction process. Then, the second moving mechanism 5 drives the spreading mechanism 8 to move back in the initial direction. During the retraction process, the movable plate 13 thoroughly scrapes away the excess residual solder paste on the printed circuit board 2. This residual solder paste is smoothly pushed into the collection groove 10 on one side of the inner wall of the frame 1, completing the collection of residual solder paste. During the retraction process of the movable plate 13, the first moving mechanism 4 can drive the solder paste can 6 to move again. At this time, the scraper 9 on the outer wall of the arrangement tube 7 moves synchronously with the solder paste can 6. When the scraper 9 passes the movable plate 13, the scraper 9 moves with the solder paste can 6. When the movable plate 13 is moved to one side, the residual solder paste attached to the surface of the movable plate 13 can be scraped off. The scraped solder paste can fall into the collection tank 10 or flow back to the printing area as the scraper 9 moves, further realizing the recycling of solder paste and avoiding the solder paste adhering to the movable plate 13 and affecting the next operation. When the movable plate 13 returns to the initial side with the spreading mechanism 8, the contact block 14 on the movable plate 13 contacts the protrusion 11 on the inner wall of the frame 1 on that side. Under the pushing action of the protrusion 11, the contact block 14 drives the movable plate 13 to move upward along the fixed plate 12. The magnetic mating plate 17 magnetically attaches with the upper magnetic block 16. The movable plate 13 returns to the initial position with a gap from the printing plate 2, preparing for the next solder paste spreading operation.

[0039] The working principle of this device is as follows: the first moving mechanism 4 drives the solder paste container 6 and the arrangement tube 7 to achieve the initial uniform application of solder paste, laying the foundation for subsequent uniform application. The second moving mechanism 5 drives the uniform application mechanism 8 to move, and the spacing between the movable plate 13 and the printed plate 2 is used to achieve uniform coverage of solder paste. Then, the movable plate 13 is raised and lowered by the inclined surface cooperation of the contact block 14 and the protrusion 11. With the magnetic locking of the magnetic cooperation plate 17 and the magnetic block 16, the movable plate 13 can thoroughly scrape off the residual solder paste when it moves back. At the same time, the cooperation of the scraper 9 and the collection tank 10 achieves effective recycling of solder paste. The whole process does not require manual intervention and realizes the full automation of solder paste application, uniform application, scraping and recycling.

[0040] Compared to existing technologies, this device offers significant advantages: First, it eliminates the need for manual application of solder paste using a hand-held scraper. The automated application mechanism 8 ensures uniform solder paste distribution, reducing manual steps, lowering the workload of operators, and avoiding errors caused by manual operation, thus improving the consistency of solder paste distribution. Second, the back-and-forth movement of the movable plate 13 simultaneously achieves uniform application of solder paste and scraping away residual solder paste, simplifying the workflow, shortening preparation time before each printing cycle, and improving overall production efficiency. Third, the collection tank 10 and scraper 9 effectively recycle residual solder paste, reducing waste and production costs, while also preventing residual solder paste from accumulating and contaminating the device, thus extending its service life.

[0041] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A solder paste application device for a solder paste printing machine, characterized in that, It includes a frame (1), a printing plate (2) is provided on the frame (1), a scraper (3) is also provided on the frame (1), a solder paste container (6) and a spreading mechanism (8) are provided on the frame (1).

2. The solder paste application device for a solder paste printing machine according to claim 1, characterized in that, A first moving mechanism (4) is provided on one side of the frame (1), and a solder paste can (6) is provided on the first moving mechanism (4).

3. The solder paste application device for a solder paste printing machine according to claim 1, characterized in that, The solder paste container (6) is connected to a placement tube (7), which extends into the frame (1).

4. The solder paste application device for a solder paste printing machine according to claim 1, characterized in that, A second moving mechanism (5) is provided on the other side of the frame (1), and a spreading mechanism (8) is provided on the second moving mechanism (5).

5. A solder paste application device for a solder paste printing machine according to claim 1, characterized in that, The spreading mechanism (8) includes a fixed plate (12) disposed on the second moving mechanism (5), and a movable plate (13) is slidably mounted on one side of the fixed plate (12).

6. The solder paste application device for a solder paste printing machine according to claim 5, characterized in that, A contact block (14) is provided on one side of the fixing plate (12), and protrusions (11) are provided at both ends of one side of the inner wall of the frame (1), and the protrusions (11) are arranged vertically.

7. A solder paste application device for a solder paste printing machine according to claim 6, characterized in that, The upper and lower sides of the contact block (14) are set as parallel inclined surfaces.

8. A solder paste application device for a solder paste printing machine according to claim 5, characterized in that, An mounting plate (15) is provided on the outer wall of the fixed plate (12), and magnetic blocks (16) are symmetrically arranged on the outer wall of the mounting plate (15). A magnetic mating plate (17) is provided on the other side of the movable plate (13), and the magnetic mating plate (17) and the magnetic blocks (16) are magnetically mated.

9. A solder paste application device for a solder paste printing machine according to claim 1, characterized in that, A collection trough (10) is provided on one side of the inner wall of the frame (1).

10. A solder paste application device for a solder paste printing machine according to claim 3, characterized in that, A scraper (9) is provided on the outer wall of the arrangement pipe (7).

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