A PCB tray
By setting vents, heat-resistant tape, and heat-dissipating tape on the PCB tray, a dual positioning and conductive heat dissipation structure is formed, which solves the problems of PCB board displacement, static electricity, and heat dissipation, and improves the processing quality and the reliability of electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAMEN MAOSHI IND CO LTD
- Filing Date
- 2025-08-18
- Publication Date
- 2026-07-10
AI Technical Summary
Traditional PCB trays suffer from problems such as inaccurate board displacement, insufficient electrostatic protection, and poor heat dissipation when handling PCB boards, which affect product quality and the performance and lifespan of electronic components.
A substrate with anti-static properties is used, with ventilation holes and tin plating on the substrate. Heat-resistant tape and a reference block are pasted on the surface, and heat-dissipating tape is pasted on the bottom, forming a dual positioning and conductive heat dissipation structure.
It achieves precise positioning of PCB boards, prevents slippage and static electricity buildup, improves processing quality and yield, and extends the lifespan of electronic components.
Smart Images
Figure CN224477226U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic manufacturing technology, and in particular to a PCB tray. Background Technology
[0002] In the electronics manufacturing industry, PCB boards have strict requirements for the carriers used for placement and transportation during processing. Traditional trays present several problems when handling boards requiring soldering and surface mount technology. On the one hand, they cannot effectively prevent board displacement on the tray, leading to inaccurate processing positions and affecting product quality. On the other hand, they lack adequate electrostatic discharge (ESD) protection, making electronic components highly susceptible to ESD damage, resulting in product damage and increased costs. Furthermore, they lack effective heat dissipation methods; if the heat generated during board operation cannot be dissipated in time, it will affect the performance and lifespan of electronic components. Therefore, developing a PCB tray that can accurately position boards and possesses good ESD protection and heat dissipation functions is an urgent problem to be solved. To address this, a PCB tray is provided. Utility Model Content
[0003] Technical problems to be solved
[0004] The purpose of this application is to provide a PCB tray that has the characteristics of accurately positioning the board material and having good anti-static and heat dissipation functions.
[0005] This application provides a PCB tray with the following technical solution: it includes a substrate and a PCB board with anti-static properties, the anti-static properties being inherent in the material itself. The substrate has ventilation holes around its perimeter, and solder is deposited inside the ventilation holes. A heat-resistant tape is adhered to the upper surface of the substrate; the heat-resistant tape is made of a high-temperature insulating material, and its position corresponds to the solder placement on the PCB board. A first comparison block is provided on the upper surface of the substrate, and the first comparison block is fixedly connected to the upper surface of the substrate by the heat-resistant tape. Multiple sets of the first comparison blocks are provided and symmetrically arranged on the upper surface of the substrate. A second comparison block corresponding to the position of the first comparison block is adhered to the lower surface of the PCB board. A heat-dissipating tape, made of metal and having conductive properties, is adhered to the bottom of the substrate.
[0006] By adopting the above technical solution, a dual positioning structure is formed by setting multiple sets of symmetrical first comparison blocks on the upper surface of the substrate and simultaneously attaching second comparison blocks corresponding to the positions of the first comparison blocks on the lower surface of the PCB board. When placing the PCB board, the operator only needs to place the second comparison blocks corresponding to the first comparison blocks to quickly determine the accurate position of the PCB board. This structural combination significantly improves the placement accuracy of the PCB board on the substrate, effectively avoiding errors in processing steps such as soldering and surface mounting caused by positional deviations, thereby improving product processing quality and reducing the defect rate. The heat-resistant tape attached to the upper surface of the substrate is made of high-temperature resistant insulating material and corresponds to the soldering position on the PCB board. When the PCB board is placed on the substrate, the heat-resistant tape contacts the lower surface of the PCB board, and its own properties generate a large frictional force to prevent the PCB board from sliding during processing and transportation. Meanwhile, the first comparison block is fixed to the upper surface of the substrate with heat-resistant tape, further enhancing the stability of the overall structure and ensuring that the PCB board always remains in the preset processing position, guaranteeing the accuracy and consistency of the processing. The substrate itself has anti-static properties, and the vent holes have solder inside. A conductive metal heat dissipation tape is adhered to the bottom of the substrate. When static electricity is generated on the PCB board, it is conducted to the substrate through the contact between the PCB board and the soldered area inside the vent holes, and then from the substrate to the heat dissipation tape. As a conductive medium, the heat dissipation tape can collect the static electricity and conduct it to the ground through subsequent grounding devices, preventing static electricity from accumulating on the PCB board. This effectively prevents static electricity from damaging the electronic components on the PCB board, improving the product yield and reliability. The heat dissipation tape adhered to the bottom of the substrate is made of metal and has good thermal conductivity. During the operation of the PCB board, the heat generated is transferred to the substrate through the contact between the PCB board and the substrate, and then from the substrate to the heat dissipation tape. Thermal tape can quickly disperse heat to the surrounding environment, preventing heat from accumulating on the PCB board, maintaining the normal operating temperature of electronic components, extending the service life of electronic components, and ensuring the overall performance stability of the PCB board.
[0007] Preferably, the shapes of the first comparison block and the second comparison block are adapted to each other, and their contact surfaces are in contact.
[0008] By adopting the above technical solution, the first comparison block and the second comparison block are matched in shape and their contact surfaces are in contact, which further improves the fitting accuracy of the two, makes the PCB board more accurately and stably positioned on the substrate, reduces the positional deviation caused by the fitting gap of the comparison blocks, and ensures the accuracy of the processing.
[0009] Preferably, the surface of the heat-resistant tape is provided with anti-slip texture.
[0010] By adopting the above technical solution, the anti-slip texture on the surface of the heat-resistant tape enhances its friction with the lower surface of the PCB board, which can more effectively prevent the PCB board from sliding on the substrate and improve the stability of the PCB board placement. Especially during processing and transportation, it can avoid processing errors caused by sliding.
[0011] Preferably, the vent holes are evenly distributed on the substrate.
[0012] By adopting the above technical solution, the vent holes are evenly distributed on the substrate, making the air permeability of each area of the substrate more balanced, which is conducive to heat dissipation. At the same time, it makes the contact between each part of the PCB board and the soldering part of the vent holes more uniform, ensuring the stability of electrostatic conduction and avoiding local static electricity accumulation.
[0013] Preferably, the area of the heat dissipation tape is not less than two-thirds of the bottom area of the substrate.
[0014] By adopting the above technical solution, the area of the heat dissipation tape is not less than two-thirds of the bottom area of the substrate, which increases the heat dissipation area and can more quickly and comprehensively disperse the heat transferred from the PCB board to the substrate, improve heat dissipation efficiency, and prevent heat accumulation from affecting the performance of electronic components.
[0015] Preferably, the edge of the substrate is provided with a groove to facilitate handling.
[0016] By adopting the above technical solution, the groove on the edge of the substrate provides a convenient force application point for operators to handle the pallet, making it easier to pick up, put down and move the pallet, reducing pallet tilting or PCB board displacement caused by inconvenient operation during handling, and improving the convenience of operation.
[0017] Preferably, both the first and second comparison blocks are made of high-temperature resistant materials.
[0018] By adopting the above technical solution, the first comparison block and the second comparison block are made of high temperature resistant materials, which can maintain their own performance stability in the high temperature environment of PCB board processing (such as tinning) and will not be deformed or damaged due to high temperature, thus ensuring the long-term reliability of the positioning function.
[0019] Preferably, the substrate is made of an insulating material.
[0020] By adopting the above technical solution, the substrate is made of insulating material, which can prevent the substrate from becoming a conductive medium and interfering with the electrostatic conduction path. It ensures that static electricity can only be conducted through the vent holes, the soldering parts, and the heat dissipation tape. At the same time, it prevents unnecessary conductivity between the substrate and the PCB board, thus ensuring the safety of electronic components.
[0021] In summary, this application includes at least one of the following beneficial technical effects:
[0022] 1. This PCB tray features a dual-positioning structure formed by setting multiple symmetrical first comparison blocks on the upper surface of the substrate and simultaneously attaching second comparison blocks corresponding to the positions of the first comparison blocks to the lower surface of the PCB. When placing the PCB, operators only need to align the second comparison blocks with the first comparison blocks to quickly determine the accurate position of the PCB. This structure significantly improves the placement accuracy of the PCB on the substrate, effectively avoiding errors in soldering and surface mount processes caused by positional deviations, thereby improving product quality and reducing the defect rate. The heat-resistant tape attached to the upper surface of the substrate is made of high-temperature resistant insulating material and corresponds to the soldering position on the PCB. When the PCB is placed on the substrate, the heat-resistant tape contacts the lower surface of the PCB, and its inherent properties generate significant friction, preventing the PCB from sliding during processing and transportation. Simultaneously, the first comparison blocks are fixed to the upper surface of the substrate by the heat-resistant tape, further enhancing the overall structural stability and ensuring that the PCB always remains in the preset processing position, guaranteeing the accuracy and consistency of the processing.
[0023] 2. This PCB tray features an anti-static substrate with soldered vent holes. A conductive metal thermal tape is adhered to the bottom of the substrate. When static electricity is generated on the PCB, it is conducted through the contact between the PCB and the soldered vent holes to the substrate, and then from the substrate to the thermal tape. The thermal tape, acting as a conductive medium, collects the static electricity and conducts it to the ground via grounding devices, preventing static buildup on the PCB and effectively preventing damage to electronic components. This improves product yield and reliability. The metal thermal tape adhered to the bottom of the substrate has excellent thermal conductivity. During PCB operation, heat is transferred through the contact between the PCB and the substrate, and then from the substrate to the thermal tape. The thermal tape quickly disperses heat into the surrounding environment, preventing heat accumulation on the PCB, maintaining the normal operating temperature of electronic components, extending their lifespan, and ensuring the overall stability of the PCB performance. Attached Figure Description
[0024] Figure 1 This is a three-dimensional structural diagram of the present application.
[0025] Figure 2 This is a schematic diagram of the structure of the upper surface of the substrate of this application;
[0026] Figure 3 This is a schematic diagram of the structure of the lower surface of the PCB board in this application;
[0027] Figure 4 This is a schematic diagram of the structure of the lower surface of the substrate of this application;
[0028] Figure 5 This is a partial structural schematic diagram of the heat-resistant tape of this application.
[0029] In the picture:
[0030] 1. Substrate; 2. PCB board; 3. Vent hole; 4. Heat-resistant tape; 5. First comparison block; 6. Second comparison block; 7. Heat dissipation tape; 8. Groove. Detailed Implementation
[0031] The following is in conjunction with the appendix Figure 1 -Appendix Figure 5 This application will be described in further detail below.
[0032] Example 1: A PCB tray, referring to Figure 2 , Figure 3 and Figure 4The system includes a substrate 1 and a PCB board 2, both possessing anti-static properties inherent in their material. The substrate 1 has ventilation holes 3 around its perimeter, with solder embedded within the holes. A heat-resistant tape 4, made of high-temperature insulating material, is adhered to the upper surface of the substrate 1, corresponding to the solder placement on the PCB board 2. Multiple sets of first comparison blocks 5 are symmetrically arranged on the upper surface of the substrate 1, fixed to the substrate 1 by the heat-resistant tape 4. A second comparison block 6, corresponding to the position of the first comparison block 5, is adhered to the lower surface of the PCB board 2. A heat-dissipating tape 7, made of metal and conductive, is adhered to the bottom of the substrate 1. By creating multiple symmetrical sets of first comparison blocks 5 on the upper surface of the substrate 1 and attaching corresponding second comparison blocks 6 to the lower surface of the PCB board 2, a dual positioning structure is formed. When placing the PCB board 2, the operator only needs to align the second comparison block 6 with the first comparison block 5 to quickly determine the accurate position of the PCB board 2. This structural design significantly improves the placement accuracy of the PCB board 2 on the substrate 1, effectively preventing errors in soldering and surface mount processes caused by positional deviations. This improves product quality and reduces the defect rate. The heat-resistant tape 4 adhered to the upper surface of the substrate 1 is made of high-temperature resistant insulating material and corresponds to the soldering position of the PCB board 2. When the PCB board 2 is placed on the substrate 1, the heat-resistant tape 4 contacts the lower surface of the PCB board 2, and its inherent properties generate significant friction, preventing the PCB board 2 from sliding during processing and transportation. Simultaneously, the first comparison block 5 is fixed to the upper surface of the substrate 1 by the heat-resistant tape 4, further enhancing the overall structural stability and ensuring that the PCB board 2 always remains in the preset processing position, guaranteeing the accuracy and consistency of the processing. The substrate 1 itself has anti-static properties, and the vent holes 3 have solder inside. A conductive heat-dissipating tape 7 made of metal is adhered to the bottom of the substrate 1. When static electricity is generated on PCB 2, it is conducted to substrate 1 through the contact between PCB 2 and the solder joint inside the vent hole 3, and then from substrate 1 to the thermal adhesive tape 7. As a conductive medium, the thermal adhesive tape 7 collects the static electricity and conducts it to the ground through subsequent grounding devices, preventing static electricity buildup on PCB 2 and effectively preventing damage to the electronic components on PCB 2, thus improving product yield and reliability. The thermal adhesive tape 7, attached to the bottom of substrate 1, is made of metal and has excellent thermal conductivity. During the operation of PCB 2, the heat generated is transferred to substrate 1 through the contact between PCB 2 and substrate 1, and then from substrate 1 to the thermal adhesive tape 7. The thermal adhesive tape 7 quickly disperses heat into the surrounding environment, preventing heat accumulation on PCB 2, maintaining the normal operating temperature of electronic components, extending the lifespan of electronic components, and ensuring the overall stable performance of PCB 2.
[0033] Reference Figure 2 , Figure 3 and Figure 5 The first comparison block 5 and the second comparison block 6 are shaped to match each other and their contact surfaces are in contact. The heat-resistant tape 4 has anti-slip texture on its surface. The matching shape and contact surfaces of the first comparison block 5 and the second comparison block 6 further improve the fitting accuracy of the two, making the positioning of the PCB board 2 on the substrate 1 more accurate and stable. This reduces the positional deviation caused by the gap between the comparison blocks and ensures the accuracy of the processing. The anti-slip texture on the surface of the heat-resistant tape 4 enhances its friction with the lower surface of the PCB board 2, which can more effectively prevent the PCB board 2 from sliding on the substrate 1 and improve the stability of the PCB board 2. Especially during processing and transportation, it can avoid processing errors caused by sliding.
[0034] Reference Figure 2 , Figure 3 and Figure 4 The ventilation holes 3 are evenly distributed on the substrate 1, and the area of the heat dissipation tape 7 is not less than two-thirds of the bottom area of the substrate 1. The even distribution of the ventilation holes 3 on the substrate 1 makes the air permeability of each area of the substrate 1 more balanced, which is conducive to heat dissipation. At the same time, it makes the contact between each part of the PCB board 2 and the soldering part of the ventilation holes 3 more uniform, ensuring the stability of electrostatic conduction and avoiding local electrostatic accumulation. The area of the heat dissipation tape 7 is not less than two-thirds of the bottom area of the substrate 1, which increases the heat dissipation area and can more quickly and comprehensively disperse the heat transferred from the PCB board 2 to the substrate 1, improve heat dissipation efficiency, and prevent heat accumulation from affecting the performance of electronic components.
[0035] Reference Figure 1 , Figure 2 and Figure 3 The substrate 1 has a groove 8 on its edge for easy handling. The first comparison block 5 and the second comparison block 6 are both made of high-temperature resistant material. The substrate 1 is made of insulating material. The groove 8 on the edge of the substrate 1 provides a convenient force point for the operator to handle the pallet, which facilitates the picking up, placing and moving of the pallet. This reduces the tilting of the pallet or the displacement of the PCB board 2 due to inconvenient operation during handling, and improves the convenience of operation. The first comparison block 5 and the second comparison block 6 are made of high-temperature resistant material, which can maintain their own performance stability in the high-temperature environment of PCB board 2 processing (such as soldering) and will not deform or be damaged due to high temperature, ensuring the long-term reliability of the positioning function. The substrate 1 is made of insulating material, which can prevent the substrate 1 from becoming a conductive medium and interfering with the electrostatic conduction path. It ensures that static electricity can only be conducted through the vent hole 3, the soldering part and the heat dissipation tape 7, and at the same time prevent unnecessary conductivity between the substrate 1 and the PCB board 2, ensuring the safety of electronic components.
[0036] In this embodiment, a dual positioning structure is formed by setting multiple sets of symmetrical first comparison blocks 5 on the upper surface of the substrate 1, and simultaneously attaching second comparison blocks 6 corresponding to the positions of the first comparison blocks 5 to the lower surface of the PCB board 2. When placing the PCB board 2, the operator only needs to place the second comparison blocks 6 corresponding to the first comparison blocks 5 to quickly determine the accurate position of the PCB board 2. This structural combination significantly improves the placement accuracy of the PCB board 2 on the substrate 1, effectively avoiding errors in processing steps such as soldering and surface mounting caused by positional deviations, thereby improving product processing quality and reducing the defect rate. The heat-resistant tape 4 attached to the upper surface of the substrate 1 is made of high-temperature resistant insulating material and corresponds to the soldering position of the PCB board 2. When the PCB board 2 is placed on the substrate 1, the heat-resistant tape 4 contacts the lower surface of the PCB board 2, and its own properties can generate a large frictional force to prevent the PCB board 2 from sliding during processing and transportation. At the same time, the first comparison blocks 5 are fixed to the upper surface of the substrate 1 by the heat-resistant tape 4, further enhancing the stability of the overall structure and ensuring that the PCB board 2 always remains in the preset processing position, ensuring the accuracy and consistency of the processing process.
[0037] The implementation principle of this application embodiment is as follows: When processing the PCB board 2, the preliminary preparation work is first completed: on the upper surface of the substrate 1, heat-resistant tape 4 made of high-temperature insulating material is pasted according to the solder placement position of the PCB board 2, and multiple sets of symmetrically arranged first comparison blocks 5 are fixed to the upper surface of the substrate 1 through the heat-resistant tape 4; at the same time, second comparison blocks 6 corresponding to the positions of the first comparison blocks 5 are pasted on the lower surface of the PCB board 2. When placing the PCB board 2, the operator aligns and attaches the second comparison blocks 6 on the lower surface of the PCB board 2 with the first comparison blocks 5 on the upper surface of the substrate 1. With the correspondence between the two sets of comparison blocks, the PCB board 2 is accurately positioned on the substrate 1. At this time, the heat-resistant tape 4 on the substrate 1 is in contact with the lower surface of the PCB board 2. Due to the material properties of the heat-resistant tape 4 itself and its corresponding arrangement with the solder placement position of the PCB board 2, it can effectively support the PCB board 2, and at the same time, its friction prevents the PCB board 2 from sliding on the substrate 1, ensuring the stability of the PCB board 2 during the processing. During the processing of PCB board 2, if static electricity is generated, it will be conducted to substrate 1 through the contact between PCB board 2 and the solder joint inside the vent hole 3 on substrate 1. Because a conductive metal thermal tape 7 is adhered to the bottom of substrate 1, the static electricity will be further transferred from substrate 1 to the thermal tape 7, and then conducted to the ground through an external grounding device connected to the thermal tape 7, thus preventing damage to the electronic components on PCB board 2. Furthermore, the heat generated by PCB board 2 during operation will be transferred to substrate 1 through contact with it, and then conducted to the thermal tape 7 at the bottom of substrate 1. The thermal tape 7, with its excellent thermal conductivity, quickly disperses the heat to the surrounding environment, preventing heat accumulation on PCB board 2, ensuring that electronic components are at a suitable operating temperature, and guaranteeing the normal operation of PCB board 2.
[0038] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be included within the scope of protection of this application.
Claims
1. A PCB tray comprising a substrate (1) and a PCB board (2) having antistatic properties inherent in its material, characterized in that: The substrate (1) is provided with ventilation holes (3) except for the four sides. The ventilation holes (3) are filled with tin. The upper surface of the substrate (1) is covered with heat-resistant tape (4). The heat-resistant tape (4) is made of high-temperature insulating material. The heat-resistant tape (4) and the tin-filled position of the PCB board (2) correspond to each other. The upper surface of the substrate (1) is provided with a first comparison block (5). The first comparison block (5) is fixedly connected to the upper surface of the substrate (1) by the heat-resistant tape (4). There are multiple sets of the first comparison block (5) and they are symmetrically arranged on the upper surface of the substrate (1). The lower surface of the PCB board (2) is covered with a second comparison block (6) corresponding to the position of the first comparison block (5). The bottom of the substrate (1) is covered with heat-dissipating tape (7). The heat-dissipating tape (7) is made of metal and has conductive properties.
2. A PCB tray according to claim 1, characterized in that: The shapes of the first comparison block (5) and the second comparison block (6) are compatible, and their contact surfaces are in contact.
3. A PCB tray according to claim 1, characterized in that: The surface of the heat-resistant tape (4) is provided with anti-slip texture.
4. A PCB tray according to claim 1, characterized in that: The vent holes (3) are evenly distributed on the substrate (1).
5. A PCB tray according to claim 1, characterized in that: The area of the heat dissipation tape (7) is not less than two-thirds of the bottom area of the substrate (1).
6. A PCB tray according to claim 1, characterized in that: The edge of the substrate (1) is provided with a groove (8) for easy handling.
7. A PCB tray according to claim 1, characterized in that: Both the first comparison block (5) and the second comparison block (6) are made of high-temperature resistant materials.
8. A PCB tray according to claim 1, characterized in that: The substrate (1) is made of insulating material.