Transfer mechanism for high-density integrated circuit lead frame
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN ALLMERIT TECH CO LTD
- Filing Date
- 2025-08-13
- Publication Date
- 2026-07-10
AI Technical Summary
The existing lead frame transfer mechanism cannot adapt to lead frames of different sizes, resulting in inaccurate positioning of the grippers, which affects production efficiency and equipment compatibility.
A material handling mechanism for high-density integrated circuit lead frames was designed. It adopts a handling component with adjustable gripper spacing, combined with a guide and limit component and a lifting and feeding mechanism to achieve precise handling and delivery of lead frames of different sizes.
It improves the adaptability and production efficiency of the material transfer mechanism, ensures the accurate handling and conveying of the lead frame, reduces the time for changing grippers, and enhances the continuous operation capability of the automated production line.
Smart Images

Figure CN224477616U_ABST