A socket for testing a semiconductor integrated circuit

Abstract

The utility model provides a kind of socket for semiconductor integrated circuit test.The socket for semiconductor integrated circuit test includes: the pull opening is opened in the position of the front side of shell near one side, the inside sliding connection of the pull opening has second movable frame, the back of the second movable frame is fixedly connected with first movable frame, the top of the first movable frame and second movable frame is opened with the through placement opening in the position of middle, the front and back of the inside wall of the placement opening are all opened with movable mouth, the bottom of the inside wall of the movable mouth is all fixedly connected with two fixed discs, the top of each fixed disc is all fixedly connected with auxiliary spring, the top end of each group of auxiliary spring is all fixedly connected with contact plate.The socket for semiconductor integrated circuit test provided by the utility model can make the first movable frame and second movable frame alternately contact test semiconductor integrated circuit and test socket contact end, improve the efficiency of batch semiconductor integrated circuit test.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor integrated circuit test socket technology, and in particular to a semiconductor integrated circuit test socket. Background Technology

[0002] A semiconductor integrated circuit is a semiconductor integrated circuit device that has at least one circuit block on a semiconductor substrate. A semiconductor integrated circuit interconnects active components such as transistors and diodes with passive components such as resistors and capacitors according to a certain circuit.

[0003] After the semiconductor integrated circuit is manufactured, in order to ensure that the semiconductor integrated circuit can operate normally, it is necessary to use a special test socket for testing before it leaves the factory. The semiconductor integrated circuit test socket consists of the part where the chip and chip test socket pins contact, the structure of the contact medium part, the pin lead-out part, and the external fixing structure of the test socket.

[0004] Existing semiconductor integrated circuit test sockets are generally single-position slots. In actual testing, semiconductor integrated circuits need to be inserted one by one, and then removed from the socket after each test before the next semiconductor integrated circuit can be tested. This frequent insertion and removal will affect the efficiency of batch semiconductor integrated circuit testing.

[0005] Therefore, it is necessary to provide a socket for testing semiconductor integrated circuits to solve the above-mentioned technical problems. Utility Model Content

[0006] This invention provides a semiconductor integrated circuit test socket, which solves the problem that frequent handling of a single placement port semiconductor integrated circuit test socket can affect the testing efficiency of batch semiconductor integrated circuits.

[0007] To solve the above-mentioned technical problems, the semiconductor integrated circuit testing socket provided by this utility model includes: a housing;

[0008] A pull-out opening is located on the front side of the housing, near one side. A second movable frame is slidably connected inside the pull-out opening. A first movable frame is fixedly connected to the back of the second movable frame. Both the top of the first and second movable frames have through-holes at the middle position. Movable openings are provided on the front and back of the inner wall of the placement opening. Two fixed plates are fixedly connected to the bottom of the inner wall of each movable opening. An auxiliary spring is fixedly connected to the top of each fixed plate. A contact plate is fixedly connected to the top of each set of auxiliary springs.

[0009] The mounting port is located on the top of the housing near one side. A test socket contact terminal is installed on the bottom of the inner wall of the mounting port. A sealing cover is installed on the top of the housing near one side. A telescopic rod is installed on the top of the sealing cover. A docking plate is installed on the telescopic end of the telescopic rod. A push plate is installed at the bottom center of the docking plate. Anti-scratch pads are installed on both sides of the bottom of the docking plate.

[0010] The pull-out opening extends through the front and back of the housing. Two auxiliary springs in the same movable opening form a group. The contact plate is located inside the movable opening. After the semiconductor integrated circuit is inserted, the contact plate ensures that the top of the semiconductor integrated circuit is flush with the top of the movable bracket. The mounting opening and the pull-out opening are positioned correspondingly. The sealing cover can seal the top of the mounting opening. The push plate contacts the top of the semiconductor integrated circuit and pushes the semiconductor integrated circuit downward to make it contact the test socket contact end.

[0011] Preferably, an operation screen is installed on the top of the housing near the other side, and an indicator light is installed on the front of the housing;

[0012] The indicator lights can show the test status; the light that illuminates at the start of the test is different from the light that illuminates when the test is complete.

[0013] Preferably, a heat dissipation hole is provided on one side of the housing, and an adjustment base is installed at the bottom of the housing;

[0014] The heat dissipation holes extend through the mounting opening.

[0015] Preferably, the adjusting base includes a base plate, and internal threaded bolts are fixedly connected to the bottom of the base plate near the four corners;

[0016] Adjusting the base can adjust the stability of the housing.

[0017] Preferably, each of the four internally threaded bolts has an adjusting bolt threaded to its bottom, and the bottom end of each adjusting bolt is fixedly connected to a contact plate.

[0018] The flatness of the housing can be adjusted by rotating the adjusting bolt in uneven locations.

[0019] Preferably, a base is mounted on the back of the housing, and a power switch is mounted on the back of the base.

[0020] Compared with related technologies, the semiconductor integrated circuit testing socket provided by this utility model has the following advantages:

[0021] This invention provides a semiconductor integrated circuit test socket. To improve the efficiency of testing the contact terminals of batch semiconductor integrated circuits using the test socket, a pull-out opening extending from the front to the back of the housing is provided. A first movable frame and a second movable frame are then assembled together, allowing them to move alternately within the opening. Each of the first and second movable frames has a placement opening for the semiconductor integrated circuit at its top. Two sets of contact plates are mounted in the movable openings communicating with the placement openings via auxiliary springs, allowing the semiconductor integrated circuit to move up and down through the contact plates. Testing is completed during the contact process between the semiconductor integrated circuit and the test socket contact terminal. This design allows the first and second movable frames to alternately perform contact testing on the semiconductor integrated circuit and the test socket contact terminal, thus improving the efficiency of batch semiconductor integrated circuit testing. Attached Figure Description

[0022] Figure 1 A schematic diagram of a preferred embodiment of the semiconductor integrated circuit test socket provided by this utility model;

[0023] Figure 2 A structural schematic diagram of the first movable frame is provided for this utility model;

[0024] Figure 3 A schematic diagram of the movable opening is provided for this utility model;

[0025] Figure 4 A structural schematic diagram of the shell is provided for this utility model;

[0026] Figure 5 Provided for this utility model Figure 4 An enlarged view of point A shown.

[0027] The diagram is labeled as follows: 1. Adjustable base; 101. Base plate; 102. Internal threaded bolt; 103. Contact plate; 104. Adjusting bolt; 2. Housing; 3. Heat dissipation hole; 4. Operation panel; 5. First movable frame; 6. Movable opening; 7. Placement opening; 8. Telescopic rod; 9. Sealing cover; 10. Second movable frame; 11. Indicator light; 12. Power switch; 13. Base; 14. Fixed plate; 15. Auxiliary spring; 16. Pull-out opening; 17. Test socket contact end; 18. Mounting opening; 19. Contact plate; 20. Push plate; 21. Anti-scratch pad; 22. Connecting plate. Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0029] Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in, Figure 1 A schematic diagram of a preferred embodiment of the semiconductor integrated circuit test socket provided by this utility model; Figure 2 A structural schematic diagram of the first movable frame is provided for this utility model; Figure 3 A schematic diagram of the movable opening is provided for this utility model; Figure 4 A structural schematic diagram of the shell is provided for this utility model; Figure 5 Provided for this utility model Figure 4 A magnified view of point A shown. The semiconductor integrated circuit test socket includes: housing 2;

[0030] A pull-out opening 16 is located on the front side of the housing 2, near one side. A second movable frame 10 is slidably connected inside the pull-out opening 16. A first movable frame 5 is fixedly connected to the back of the second movable frame 10. A through placement opening 7 is provided at the middle position of the top of both the first movable frame 5 and the second movable frame 10. Movable openings 6 are provided on the front and back of the inner wall of the placement opening 7. Two fixed plates 14 are fixedly connected to the bottom of the inner wall of each movable opening 6. An auxiliary spring 15 is fixedly connected to the top of each fixed plate 14. A contact plate 19 is fixedly connected to the top of each set of auxiliary springs 15.

[0031] Mounting port 18 is located on the top of housing 2 near one side. A test socket contact end 17 is installed on the bottom of the inner wall of mounting port 18. A sealing cover 9 is installed on the top of housing 2 near one side. A telescopic rod 8 is installed on the top of sealing cover 9. A docking plate 22 is installed on the telescopic end of telescopic rod 8. A push plate 20 is installed at the bottom center of docking plate 22. Anti-scratch pads 21 are installed on both sides of the bottom of docking plate 22.

[0032] Pull-out opening 16 extends through the front and back of housing 2. Two auxiliary springs 15 in the same movable opening 6 form a group. Contact plate 19 is located inside movable opening 6. After the semiconductor integrated circuit is inserted, contact plate 19 ensures that the top of the semiconductor integrated circuit is flush with the top of the movable frame. Mounting opening 18 and pull-out opening 16 are positioned correspondingly. Sealing cover 9 can seal the top of mounting opening 18. Push plate 20 contacts the top of semiconductor integrated circuit and pushes semiconductor integrated circuit downward to contact the test socket contact end 17 to complete the test. Anti-scratch pad 21 contacts contact plate 19 to increase the stability of semiconductor integrated circuit moving downward.

[0033] An operation screen 4 is installed on the top of the housing 2 near the other side, and an indicator light 11 is installed on the front of the housing 2;

[0034] Indicator light 11 can display the test status; the light that illuminates when the test starts is different from the light that illuminates when the test is completed.

[0035] A heat dissipation hole 3 is provided on one side of the housing 2, and an adjustment base 1 is installed at the bottom of the housing 2;

[0036] The heat dissipation hole 3 extends through the mounting port 18, which can help dissipate heat from the mounting port 18.

[0037] The adjusting base 1 includes a base plate 101, and internal threaded bolts 102 are fixedly connected to the bottom of the base plate 101 near the four corners.

[0038] The adjusting base 1 can adjust the stability of the housing 2, and the bottom of the internal threaded bolt 102 has an opening for threaded connection with the adjusting bolt 104.

[0039] Each of the four internally threaded bolts 102 is threaded to the bottom of an adjusting bolt 104, and the bottom end of each adjusting bolt 104 is fixedly connected to a contact plate 103.

[0040] The flatness of the housing 2 can be adjusted by rotating the adjusting bolt 104 in uneven locations.

[0041] A base 13 is mounted on the back of the housing 2, and a power switch 12 is mounted on the back of the base 13.

[0042] The power switch 12 can be used to test the operation of the socket contact terminal 17.

[0043] The working principle of the semiconductor integrated circuit testing socket provided by this utility model is as follows:

[0044] A pull-out opening 16 extending from the front to the back of the housing 2 is provided. The first movable frame 5 and the second movable frame 10 are then assembled together, allowing them to move alternately within the pull-out opening 16. Both the first and second movable frames 5 and 10 have a placement opening 7 for placing a semiconductor integrated circuit at their top. Two sets of contact plates 19 are mounted in movable openings 6 communicating with the placement opening 7 via auxiliary springs 15, allowing the semiconductor integrated circuit to move up and down through the contact plates 19. Testing is completed during the contact between the semiconductor integrated circuit and the test socket contact end 17. In practice, the semiconductor integrated circuit is first placed in the placement opening 7 on the first movable frame 5, ensuring it contacts the tops of the two contact plates 19, with the top of the semiconductor integrated circuit flush with the top of the first movable frame 5. Then, only... To move the first movable frame 5 out, the second movable frame 10 can be moved so that the semiconductor integrated circuit is positioned above the test socket contact end 17. Then, simply activate the telescopic rod 8 to push the semiconductor integrated circuit on the contact plate 19 downwards via the push plate 20, so that it contacts the test socket contact end 17. Then, activate the test socket contact end 17 to perform the test. During this process, the operator can place the semiconductor integrated circuit to be tested into the placement slot 7 on the second movable frame 10. After the test is completed, simply reset the push plate 20, and the contact plate 19 will drive the semiconductor integrated circuit to reset via the auxiliary spring 15. The operator then needs to push the second movable frame 10 to move the first movable frame 5 out, so that the semiconductor integrated circuit on the second movable frame 10 can be tested. The tested semiconductor integrated circuit can then be removed from the first movable frame 5.

[0045] Compared with related technologies, the semiconductor integrated circuit testing socket provided by this utility model has the following advantages:

[0046] To improve the efficiency of batch testing of semiconductor integrated circuits using test socket contacts, a pull-out opening 16 extending from the front to the back of the housing 2 is provided. Then, the first movable frame 5 and the second movable frame 10 are assembled together, allowing them to move alternately within the pull-out opening 16. The tops of both the first and second movable frames 5 and 10 have a placement opening 7 for placing semiconductor integrated circuits. Two sets of contact plates 19 are mounted in movable openings 6 communicating with the placement opening 7 via auxiliary springs 15, allowing the semiconductor integrated circuits to move up and down through the contact plates 19. Testing is completed during the contact process between the semiconductor integrated circuit and the test socket contact 17. This design allows the first movable frame 5 and the second movable frame 10 to alternately perform contact testing on the semiconductor integrated circuit and the test socket contact 17, improving the efficiency of batch semiconductor integrated circuit testing.

[0047] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A socket for testing semiconductor integrated circuits, characterized in that, include: case; A pull-out opening is located on the front side of the housing, near one side. A second movable frame is slidably connected inside the pull-out opening. A first movable frame is fixedly connected to the back of the second movable frame. Both the top of the first and second movable frames have through-holes at the middle position. Movable openings are provided on the front and back of the inner wall of the placement opening. Two fixed plates are fixedly connected to the bottom of the inner wall of each movable opening. An auxiliary spring is fixedly connected to the top of each fixed plate. A contact plate is fixedly connected to the top of each set of auxiliary springs. The mounting port is located on the top of the housing near one side. A test socket contact terminal is installed on the bottom of the inner wall of the mounting port. A sealing cover is installed on the top of the housing near one side. A telescopic rod is installed on the top of the sealing cover. A docking plate is installed on the telescopic end of the telescopic rod. A push plate is installed at the bottom center of the docking plate. Anti-scratch pads are installed on both sides of the bottom of the docking plate.

2. The semiconductor integrated circuit test socket according to claim 1, characterized in that, An operation panel is installed on the top of the housing near the other side, and an indicator light is installed on the front of the housing.

3. The semiconductor integrated circuit test socket according to claim 1, characterized in that, A heat dissipation hole is provided on one side of the housing, and an adjustment base is installed at the bottom of the housing.

4. The semiconductor integrated circuit test socket according to claim 3, characterized in that, The adjustment base includes a base plate, and internal threaded bolts are fixedly connected to the bottom of the base plate near the four corners.

5. The semiconductor integrated circuit test socket according to claim 4, characterized in that, Each of the four internally threaded bolts has an adjusting bolt threaded to its bottom, and the bottom end of each adjusting bolt is fixedly connected to a contact plate.

6. The semiconductor integrated circuit test socket according to claim 1, characterized in that, A base is mounted on the back of the housing, and a power switch is mounted on the back of the base.

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