Speaker and electronic device

Abstract

The application provides a loudspeaker and an electronic device. The loudspeaker comprises a basket, a magnetic circuit assembly, a first diaphragm, a first voice coil, a first electrical connector and a first circuit board. The magnetic circuit assembly is fixedly connected to the basket. The periphery of the first diaphragm is fixed to the basket and located on one side of the magnetic circuit assembly. The magnetic circuit assembly has a first magnetic gap. One end of the first voice coil is fixedly connected to the first diaphragm, and the other end is located in the first magnetic gap. The first electrical connector is electrically connected to the first voice coil. At least part of the first electrical connector is embedded in the basket, and part of the first electrical connector is exposed relative to the outer side of the basket. The first circuit board comprises a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to and electrically connected to the first electrical connector. The second connecting portion is located on the side of the first diaphragm away from the magnetic circuit assembly. The loudspeaker in the application has a small size and a simple structure. The electronic device is convenient to assemble and has a small size.

Description

Technical Field

[0001] This application relates to the field of audio technology, and more particularly to a loudspeaker and electronic device. Background Technology

[0002] Miniature speakers are widely used in electronic devices such as headphones, glasses, and mobile phones. As electronic devices continue to evolve towards thinner and smaller designs, especially headphones which require comfortable wear, there are high demands on the slim and lightweight design of these products. Limited internal space necessitates that speakers have a small footprint.

[0003] However, the electrical connectors of existing loudspeakers occupy too much space in the circumferential direction of the loudspeaker, resulting in an increase in the size of the loudspeaker in the circumferential direction. This not only hinders the miniaturization of the loudspeaker, but also limits the size of the diaphragm. Utility Model Content

[0004] This application provides a loudspeaker and an electronic device. The loudspeaker is small in size and has a simple structure. The electronic device including the loudspeaker is easy to assemble and is also small in size.

[0005] In a first aspect, embodiments of this application provide a loudspeaker. The loudspeaker includes a frame, a magnetic circuit assembly, a first diaphragm, a first voice coil, a first electrical connector, and a first circuit board. The magnetic circuit assembly is fixedly connected to the frame, and the periphery of the first diaphragm is fixed to the frame and located on one side of the magnetic circuit assembly. The magnetic circuit assembly has a first magnetic gap, one end of the first voice coil is fixedly connected to the first diaphragm, and the other end is located in the first magnetic gap. The frame includes an outer side and an inner side facing away from each other. The first electrical connector is electrically connected to the first voice coil, at least a portion of the first electrical connector is embedded in the frame, and a portion of the first electrical connector is exposed relative to the outer side of the frame. The first circuit board includes a first connecting portion and a second connecting portion, the first connecting portion is fixedly connected to the first electrical connector and electrically connected to the first electrical connector, and the second connecting portion is located on the side of the first diaphragm facing away from the magnetic circuit assembly.

[0006] In this embodiment, the second connection portion of the first circuit board is disposed on the side of the first diaphragm away from the frame magnetic circuit assembly, so that the second connection portion of the first circuit board can make reasonable use of the space on the side of the first diaphragm away from the frame. Thus, the second connection portion will not occupy too much space in the circumferential direction of the speaker, which is conducive to reducing the circumferential size of the speaker and thus conducive to the miniaturization of the speaker.

[0007] Secondly, the maximum low-frequency output capability of a loudspeaker depends on the maximum displacement volume (Vdmax) of the loudspeaker diaphragm in one direction. The maximum low-frequency output capability of a loudspeaker is positively correlated with Vdmax; increasing Vdmax can improve the maximum low-frequency output capability, thereby improving the sound quality. Since Vdmax = Sd * Xmax, the maximum displacement volume (Vdmax) of the loudspeaker diaphragm in one direction is related to the effective radiation area (Sd) and the maximum amplitude (Xmax) of the diaphragm. Increasing Sd or Xmax can increase Vdmax, thereby improving the maximum low-frequency output capability of the loudspeaker. In this embodiment, by placing the first circuit board on the outside of the frame, the first circuit board does not occupy the space inside the frame, allowing for a larger diameter of the first diaphragm, thus a larger total area of ​​the first diaphragm, i.e., a larger Sd. This, in turn, allows for a larger maximum displacement volume (Vdmax) of the first diaphragm, enabling the loudspeaker to have a better maximum low-frequency output capability.

[0008] Furthermore, in this embodiment, a circuit board is used as the electrical connector between the electrical connector and the external power supply. The circuit board has good corrosion resistance, which makes it less likely for the electrical connection between the electrical connector and the external power supply to fail, thus improving the reliability of the speaker.

[0009] In some possible implementations, the plane of the first connecting portion intersects with the plane of the second connecting portion.

[0010] In this embodiment, since the plane where the first connecting part of the first circuit board is located intersects with the plane where the second connecting part is located, when the first circuit board is mounted on the frame, the first connecting part can be located on the outer side of the outer side of the frame, and the second connecting part can be located on the side of the first diaphragm facing away from the magnetic circuit assembly. As a result, the second connecting part will not occupy too much space in the circumferential direction of the speaker, which is beneficial to reducing the circumferential size of the speaker and thus facilitating the miniaturization of the speaker.

[0011] In some possible implementations, the plane of the first connection is parallel to the axis of the speaker, and the plane of the second connection is perpendicular to the axis of the speaker.

[0012] In this embodiment, by setting the plane of the first connecting portion of the first circuit board parallel to the axial direction of the speaker, the first connecting portion can be positioned close to the outer side of the speaker frame, which helps to reduce the circumferential size of the speaker and thus facilitates speaker miniaturization. Similarly, by setting the plane of the second connecting portion of the first circuit board perpendicular to the axial direction of the speaker, the second connecting portion does not occupy excessive space in the axial direction of the speaker, further reducing its axial size and contributing to miniaturization. Thus, when the speaker is installed inside the casing of the electronic device, it occupies less space, which not only facilitates the arrangement of other internal components but also promotes the miniaturization of the electronic device.

[0013] In some possible implementations, the first circuit board further includes a third connecting portion electrically connected between the first and second connecting portions, and the third connecting portion is deformable. This allows the shape of the third connecting portion of the first circuit board to be adjusted according to the shape of the sidewall of the housing to fit the housing, thereby reducing the external size of the speaker. Secondly, the shape of the first circuit board can be designed according to actual needs, allowing the speaker structure to be flexibly adjusted as required. Thus, when the speaker is installed inside the housing of the electronic device, it occupies less space within the housing, which not only facilitates the arrangement of other components inside the electronic device but also contributes to the miniaturization of the electronic device.

[0014] In some possible implementations, the first end of the third connecting portion is connected to the first connecting portion, and the second end of the third connecting portion is bent relative to the first connecting portion toward the direction of the first diaphragm and connected to the second connecting portion.

[0015] In this embodiment, the second end b of the third connecting portion is bent relative to the first connecting portion towards the first diaphragm, allowing the first circuit board to be positioned close to the first diaphragm, thereby reducing the size of the speaker. Furthermore, the shape of the first circuit board can be adjusted according to the shape of the housing to fit the housing, so that when the speaker is installed inside the housing of the electronic device, the speaker occupies less space inside the housing, which not only facilitates the arrangement of other components inside the electronic device but also contributes to the miniaturization of the electronic device.

[0016] In some possible implementations, the third connecting portion includes a third sub-connecting portion and a fourth sub-connecting portion, which are spaced apart; the third sub-connecting portion and the fourth sub-connecting portion are electrically connected between the first connecting portion and the second connecting portion, respectively.

[0017] In this embodiment, by setting the third connecting part as a spaced-apart first sub-connecting part and second sub-connecting part, the bending stress when the first sub-connecting part and the second sub-connecting part are bent is small, and they are not easy to break, thereby improving the reliability of the third connecting part.

[0018] In some possible implementations, the loudspeaker further includes a housing, which is fixedly connected to a frame, with at least a portion of the first diaphragm located between the housing and the frame; a second connection portion located on the side of the housing opposite to the first diaphragm and fixedly connected to the housing; and at least a portion of a third connection portion disposed opposite to the housing.

[0019] In this embodiment, the second connecting portion of the first circuit board can be fixedly connected to the housing, thereby allowing the second connecting portion to be fixedly connected to the speaker frame via the housing. This improves the connection strength between the first circuit board and the speaker frame, ensuring the robustness of the first circuit board connection and thus guaranteeing the reliability of the speaker's electrical connection.

[0020] In some possible implementations, the housing includes a top wall and a side wall, the side wall surrounding the top wall and bending relative to the top wall toward the direction of the first diaphragm; the side wall is fixedly connected to the periphery of the first diaphragm, and the top wall is located on the side of the first diaphragm facing away from the magnetic circuit assembly; a second connecting portion is fixedly connected to the top wall, and at least a portion of the third connecting portion is disposed opposite to the side wall.

[0021] It is understood that in the embodiments of this application, the relative arrangement of components A and B can be such that component A is projected along the target direction to obtain projection C, and component B is projected along the target direction to obtain projection D, and projection C and projection D can at least largely overlap. In some embodiments, substantial overlap can be any of the following: projection C is completely located within projection D; or projection D is completely located within projection C; or projection C and projection D intersect each other, and the intersection area of ​​projection C and projection D accounts for more than 50% of projection C or projection D.

[0022] In this embodiment, by allowing at least a portion of the third connecting part of the first circuit board to be disposed opposite to the sidewall, the shape of the third connecting part of the first circuit board can be adapted to the sidewall of the housing, allowing it to be disposed close to the sidewall of the housing. This reduces the size of the speaker and facilitates speaker miniaturization. In some examples, the third connecting part can be bonded to the housing by dispensing adhesive, backing adhesive, or the like.

[0023] In some possible implementations, the first electrical connector includes a first connecting surface, at least a portion of which is exposed relative to the outer side of the frame; the first connecting portion includes a first surface and a second surface facing away from each other, with the first surface of the first connecting portion facing the first connecting surface; the first circuit board further includes a first pad, a second pad, and a first conductive element, the first pad being exposed relative to the first surface of the first connecting portion, the second pad being disposed on the second surface of the first connecting portion, a portion of the first conductive element being fixedly connected to the first pad and the first connecting surface, and a portion of the first conductive element being fixedly connected to the second pad.

[0024] In this embodiment, the first conductive element can extend from the first side of the first connecting portion to the second side of the first connecting portion, which is beneficial to improving the connection strength between the first circuit board and the first electrical connector.

[0025] In some possible implementations, the first connecting portion is further provided with a first through hole, the first through hole of the first connecting portion connecting the first pad and the second pad; a portion of the first conductive element is located between the first pad and the first connecting surface, and a portion of the first conductive element is provided in the first through hole of the first connecting portion.

[0026] In this embodiment, the first conductive element can extend from the first pad through the first through hole to the second pad, which facilitates the connection between the first conductive element and the first electrical connector, the first pad, and the second pad.

[0027] In some possible implementations, the loudspeaker further includes a second diaphragm, a second voice coil, and a third electrical connector; the periphery of the second diaphragm is fixed to the frame, the magnetic circuit assembly has a second magnetic gap, one end of the second voice coil is fixedly connected to the second diaphragm, and the other end is located in the second magnetic gap; the third electrical connector is electrically connected to the second voice coil, at least a portion of the third electrical connector is embedded in the frame, a portion of the third electrical connector is exposed relative to the outer side of the frame and is fixedly connected to the first connecting portion, and is electrically connected to the first connecting portion.

[0028] In this embodiment, the sound generated by the second diaphragm can propagate to the side of the second diaphragm facing away from the first diaphragm. The sound generated by the first diaphragm and the sound generated by the second diaphragm can form a sound field superposition on the side of the second diaphragm facing away from the first diaphragm, thereby improving the sound quality of the speaker.

[0029] In some possible implementations, the first and third electrical connectors are arranged circumferentially around the speaker. This allows for efficient use of the space on the speaker frame, resulting in a more rational speaker structure design. Furthermore, the staggered arrangement of the first and third electrical connectors circumferentially helps prevent interference between them.

[0030] In some possible implementations, the first electrical connector and the third electrical connector are arranged along the axial direction of the speaker. In this way, the first electrical connector and the third electrical connector can be arranged more compactly, so that the size of the first connection portion of the first circuit board can be smaller and the structure can be simpler, which is beneficial to the assembly of the first circuit board.

[0031] In some possible implementations, the first connecting portion includes a first sub-connecting portion and a second sub-connecting portion, the first sub-connecting portion and the second sub-connecting portion are spaced apart and both are connected to the second connecting portion; the first sub-connecting portion is fixedly connected to the first electrical connector and is electrically connected to the first electrical connector, and the second sub-connecting portion is fixedly connected to the third electrical connector and is electrically connected to the third electrical connector.

[0032] In this embodiment, the first and second electrical connectors can be electrically connected to the first circuit board via the first sub-connection portion, and the third and fourth electrical connectors can be electrically connected to the first circuit board via the second sub-connection portion. Compared to the scheme where all four electrical connectors are soldered to the same component, this embodiment separates the first and second sub-connection portions, allowing the first and second electrical connectors to be soldered individually to the first sub-connection portion, and the third and fourth electrical connectors to be soldered individually to the second sub-connection portion. This facilitates the assembly of the first circuit board with the first, second, third, and fourth electrical connectors, and also allows for the separate layout of the traces within the first and second sub-connection portions, thus reducing the likelihood of interference between the traces within the first and second sub-connection portions.

[0033] In some possible implementations, there is only one first circuit board. This allows the first and third electrical connectors to be electrically connected to external components of the speaker via the same first circuit board. The speaker's structure is relatively simple.

[0034] In some possible implementations, there are multiple first circuit boards, at least one first circuit board has a first connecting portion fixedly connected to a first electrical connector and electrically connected to the first electrical connector, and at least another first circuit board has a first connecting portion fixedly connected to a third electrical connector and electrically connected to the third electrical connector.

[0035] In this embodiment, the first electrical connector can be electrically connected to the external components of the speaker through a first circuit board, and the third electrical connector can be electrically connected to the external components of the speaker through another first circuit board. On the one hand, this facilitates the assembly between the first circuit board and the first and third electrical connectors; on the other hand, the wiring in different first circuit boards can be laid out separately, and the wiring in different first circuit boards is less likely to interfere with each other, which is beneficial for the individual control of the first and second diaphragms.

[0036] In some possible implementations, the first connecting portion is welded to the first electrical connector, and the first connecting portion is also bonded to the outer side of the basin frame.

[0037] In this embodiment, welding the first circuit board to the first electrical connector enables electrical connection between the two, and the connection reliability between the first circuit board and the first electrical connector is good. Furthermore, bonding the first connecting portion to the outer surface of the basin frame helps improve the connection strength between the first circuit board and the basin frame, thus preventing the first circuit board from easily detaching.

[0038] In some possible implementations, the first circuit board is a flexible circuit board. This allows at least a portion of the first circuit board to be bent. For example, the third connecting portion of the first circuit board can be bent, so that the shape of the first circuit board can be adjusted according to the shape of the housing to fit the housing, thereby reducing the circumferential size of the speaker and facilitating its miniaturization. Secondly, the shape of the first circuit board can be designed according to actual needs, and the speaker structure can be flexibly adjusted according to actual requirements. Therefore, when the speaker is installed inside the housing of the electronic device, it occupies less space within the housing, which not only facilitates the arrangement of other components inside the electronic device but also contributes to its miniaturization.

[0039] Secondly, embodiments of this application also provide an electronic device. The electronic device includes a housing and the aforementioned speaker, with the speaker mounted on the housing. In this embodiment, when the speaker is mounted inside the housing of the electronic device, the speaker occupies less space inside the housing, which not only facilitates the arrangement of other components inside the electronic device but also contributes to the miniaturization of the electronic device.

[0040] In some possible implementations, the electronic device also includes a motherboard mounted on the housing, located on the side of the second connection portion away from the first diaphragm, and electrically connected to the first circuit board.

[0041] In this embodiment, the motherboard can be located on the side of the second connection portion of the first circuit board away from the first diaphragm. This results in a more rational structural arrangement of the electronic device, making efficient use of the internal space and facilitating the arrangement of internal components. Furthermore, the motherboard can control the speaker. For example, a controller (not shown) on the motherboard can also be used to control the current state of the voice coil, thereby controlling the vibration frequency and amplitude of the first and second diaphragms.

[0042] In some possible implementations, the electronic device further includes a second circuit board electrically connected between the motherboard and the first circuit board.

[0043] In this embodiment, the first circuit board of the speaker can be electrically connected to the main board via the second circuit board, thereby enabling electrical connection to other components of the electronic device via the main board. For example, the speaker can be electrically connected to the power supply (not shown) of the electronic device via the second circuit board and the main board, allowing the power supply of the electronic device to power the speaker. Furthermore, the structure of the electronic device is relatively simple, and the use of circuit boards to achieve the electrical connection between the first circuit board and the main board results in better reliability of the electrical connection between the first circuit board and the main board. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0045] Figure 1 This is a schematic diagram of the structure of the electronic device provided in some embodiments of this application;

[0046] Figure 2 yes Figure 1 The diagram shown is a structural schematic of a loudspeaker in some embodiments;

[0047] Figure 3 yes Figure 2 The speaker shown is a partial exploded view of its structure in some embodiments.

[0048] Figure 4 yes Figure 3 The illustrated basin rack is shown as a partial structural exploded view in some embodiments.

[0049] Figure 5 yes Figure 4 The illustrated basin rack is shown in partial structural exploded view in some embodiments;

[0050] Figure 6 yes Figure 4 The diagram shows a partial cross-sectional view of the basin frame cut along point AA in some embodiments.

[0051] Figure 7 yes Figure 4 A schematic diagram of the basin stand from another angle;

[0052] Figure 8 yes Figure 4 The diagram shows a partial cross-sectional view of the basin frame cut along point BB in some embodiments.

[0053] Figure 9 yes Figure 4 A schematic diagram of the basin stand from another angle;

[0054] Figure 10A yes Figure 2The speaker shown is a partial exploded view of its structure in some embodiments.

[0055] Figure 10B yes Figure 2 The diagram shown is a partial structural schematic of a loudspeaker in some embodiments.

[0056] Figure 11 yes Figure 10B The diagram shows a partial cross-sectional view of the speaker structure taken along the CC line in some embodiments.

[0057] Figure 12 yes Figure 10B The diagram shows a partial cross-sectional view of the speaker structure taken along DD in some embodiments.

[0058] Figure 13A yes Figure 3 The diagram shown is a partial structural schematic of a loudspeaker in some embodiments.

[0059] Figure 13B yes Figure 2 The diagram shown is a partial structural schematic of a loudspeaker in some embodiments.

[0060] Figure 14 yes Figure 13B The diagram shows a partial cross-sectional view of the speaker structure taken along EE.

[0061] Figure 15 yes Figure 2 The diagram shows a partial exploded view of the magnetic circuit assembly in some embodiments.

[0062] Figure 16 yes Figure 13B The diagram shows a partial cross-sectional view of the speaker structure taken along the FF line.

[0063] Figure 17A yes Figure 4 The diagram shown is a structural schematic of the first circuit board in some embodiments;

[0064] Figure 17B yes Figure 17A The diagram shows the structure of the first circuit board from another angle;

[0065] Figure 18A yes Figure 2 The speaker shown is a partial exploded view of its structure in some embodiments.

[0066] Figure 18B yes Figure 2 The diagram shown is a partial structural schematic of a loudspeaker in some embodiments.

[0067] Figure 19yes Figure 18B The diagram shows a partial cross-sectional structure of the speaker cut along point GG.

[0068] Figure 20 yes Figure 18B The diagram shows a partial cross-sectional view of the loudspeaker taken along point HH.

[0069] Figure 21A yes Figure 2 The diagram shows a structural schematic of the speaker in some other embodiments;

[0070] Figure 21B yes Figure 2 The diagram shows a structural schematic of the speaker in some other embodiments;

[0071] Figure 21C yes Figure 21B The speaker shown is a partial exploded view of its structure in some embodiments.

[0072] Figure 22 yes Figure 1 The diagram shows a partial exploded view of the structure of the electronic device in some embodiments.

[0073] Figure 23 yes Figure 1 The diagram shows a cross-sectional view of a portion of the electronic device's structure in some embodiments. Specific Implementation

[0074] The embodiments of this application are described below with reference to the accompanying drawings.

[0075] In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" refers to a connection between two objects in which their relative positional relationship remains unchanged after the connection.

[0076] The term "one-piece molding" refers to the process of forming one of two parts, in which the part is connected to the other part without the need for further processing (such as bonding, welding, snap-fit, screw connection) to join the two parts together.

[0077] The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "inner," "outer," "top," and "side," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0078] In the embodiments of this application, the terms "first," "second," "third," "fourth," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," "third," "fourth," etc., may explicitly or implicitly include one or more of that feature.

[0079] References or "some embodiments" as described in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiments, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0080] The terms “including,” “having,” and their variations all mean “including but not limited to,” unless otherwise specifically emphasized. The term “multiple” means at least two.

[0081] The terms "parallel" and "perpendicular" are relative to the current technological level, not absolute mathematical definitions. Slight deviations are permissible; approximations of parallelism or perpendicularity are acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, with the angle between them ranging from 0° to 10°. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, with the angle between them ranging from 80° to 100°.

[0082] It is understood that the specific embodiments described herein are merely illustrative of related embodiments and not intended to limit the scope of those embodiments. Furthermore, it should be noted that, for ease of description, only the parts relevant to the embodiments are shown in the accompanying drawings.

[0083] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0084] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0085] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the electronic device 100 provided in this application in some embodiments.

[0086] In some embodiments, the electronic device 100 may be a device with audio playback capabilities, such as headphones, mobile phone, tablet computer, multimedia player, speaker, laptop computer, in-vehicle device, foldable terminal device, or wearable device. Wearable devices may include smart bracelets, smartwatches, smart headsets, smart glasses, etc. This application does not strictly limit the type of electronic device 100.

[0087] Figure 1 The electronic device 100 shown is illustrated using headphones as an example. It is understood that the headphones can be wireless or wired. Wireless headphones can communicate with the terminal device using electromagnetic waves. Examples include Bluetooth headphones and infrared headphones. Wired headphones can communicate with the terminal device via a wire.

[0088] In some embodiments, the electronic device 100 may include a housing 10 and a speaker 20. The speaker 20 may be housed within the housing 10. The speaker 20 is used to convert electrical signals into sound signals, which can be propagated through the housing 10 to the outside of the electronic device 100 to achieve sound playback.

[0089] It is understood that the housing 10 of the electronic device 100 is the earpiece of the headphones, and the earpiece is the main structure of the headphones. The headphones may also include an ear stem 11 (also called an ear stick). The ear stem 11 is fixed to the housing 10. For example, the ear stem 11 may be fixed to the side or bottom of the housing 10. Exemplarily, the housing 10 of the electronic device 100 may have a sound outlet 101. The sound emitted by the speaker 20 can be transmitted through the sound outlet 101 to the electronic device 100 for reception by the user. Exemplarily, the electronic device 100 may also include a motherboard 30, which may be housed within the housing 10. In some examples, the motherboard 30 may have a controller (not shown) for controlling the sound output of the speaker 20. Exemplarily, the electronic device 100 may also include a power supply 12 (i.e., a battery). The power supply 12 may be housed within the ear stem 11 and is used to power the electronic device 100. In some instances, the electronic device 100 may be a wireless headphone. Wireless earphones can be used in earphone assemblies, which include an earphone case. The wireless earphones can be detachably stored inside the earphone case. In this case, the electronic device 100 can be provided with charging contacts 13, which can be located on the housing 10. When the electronic device 100 is installed in the earphone case of the earphone assembly, the earphone case can charge the electronic device 100 through the charging contacts 13.

[0090] Understandable, Figure 1 Some components of the electronic device 100 are shown only schematically; the actual shape and size of these components are not subject to change. Figure 1 As defined in the accompanying drawings below. It should be understood that the electronic device 100 may include more or fewer components. For example, the electronic device 100 may not include the ear stem 11, in which case the main components of the electronic device 100 may be housed in the housing 10, or partially housed in the housing 10 and partially housed in other parts of the electronic device 100. The embodiments of this application do not strictly limit the specific structure of the electronic device 100 and the arrangement of its components.

[0091] It is understandable that the above mainly introduces the general structure of electronic device 100 and the location of some components. The specific structure of electronic device 100, the structure and arrangement of internal components (e.g., speaker 20) will be introduced below and will not be elaborated here.

[0092] Please see Figure 2 and Figure 3 , Figure 2 yes Figure 1 The diagram shown is a structural schematic of the speaker 20 in some embodiments. Figure 3 yes Figure 2 The speaker 20 shown is a partial exploded view in some embodiments.

[0093] In some embodiments, the loudspeaker 20 may include a frame 21, a magnetic circuit assembly 22, a first diaphragm 231, a first voice coil 241, a second diaphragm 232, a second voice coil 242, a first electrical connector 251, a second electrical connector 252, a third electrical connector 253, a fourth electrical connector 254, a first circuit board 26, and a housing 27. The first diaphragm 231 and the first voice coil 241 can form a first vibration assembly. The first voice coil 241 can be energized to vibrate, thereby driving the first diaphragm 231 to vibrate, thus enabling the loudspeaker 20 to produce sound. The second diaphragm 232 and the second voice coil 242 can form a second vibration assembly. The second voice coil 242 can be energized to vibrate, thereby driving the second diaphragm 232 to vibrate, thus enabling the loudspeaker 20 to produce sound.

[0094] Understandable, Figure 2 , Figure 3 The accompanying drawings below only schematically illustrate some of the components included in the speaker 20; the actual shape, size, location, and construction of these components are not subject to change. Figure 2 , Figure 3As defined in the accompanying drawings below. It will be understood that the loudspeaker 20 may include more or fewer parts. In some other embodiments, the loudspeaker 20 may include fewer components. For example, the loudspeaker 20 may also exclude the second diaphragm 232, and / or the second voice coil 242, and / or the third electrical connector 253, and / or the fourth electrical connector 254, and / or the housing 27.

[0095] For example, the speaker 20 can be a circular speaker. The central axis A1-A1 of the speaker 20 can pass through the center of the frame 21, the magnetic circuit assembly 22, the first diaphragm 231, and the second diaphragm 232. It is understood that "axial" as mentioned below refers to the direction of extension of the central axis A1-A1, and "circumferential" refers to the direction perpendicular to the central axis. In other embodiments, the speaker 20 can also be square or other shapes, which are not strictly limited in this application.

[0096] Please refer to the following: Figure 4 and Figure 5 , Figure 4 yes Figure 3 The exploded view of a portion of the structure of the basin stand 21 in some embodiments is shown. Figure 5 yes Figure 4 The exploded view of part of the structure of the basin stand 21 shown in some embodiments.

[0097] In some embodiments, the speaker frame 21 may be generally annular, such as circular. The speaker frame 21 may include an upper frame 211 and a lower frame 212. The upper frame 211 and the lower frame 212 may be arranged along the axial direction of the speaker 20, and the upper frame 211 is fixedly connected to the lower frame 212. It is understood that, in the embodiments of this application, other components of the speaker 20 may first be installed on the upper frame 211 or the lower frame 212 respectively, and then the upper frame 211 and the lower frame 212 may be fixedly connected by means of adhesive, snap-fit, etc. In this way, the assembly of the speaker 20 is more convenient.

[0098] For example, the speaker frame 21 may include an outer side 213 and an inner side 214 disposed opposite to each other. The outer side 213 may surround the inner side 214 of the speaker frame 21. The outer side 213 of the speaker frame 21 may include the outer side 213a of the upper frame 211 and the outer side 213b of the lower frame 212. The inner side 214 of the speaker frame 21 may include the inner side 214a of the upper frame 211 and the inner side 214b of the lower frame 212. It is understood that, for ease of description, the speaker 20 and its components or structures are defined below as follows: the side of the outer side 213 of the speaker frame 21 away from the inner side 214 is referred to as "outer," and the side of the inner side 214 of the speaker frame 21 away from the outer side 213 is referred to as "inner."

[0099] For example, the speaker frame 21 may include a clearance groove 215. The clearance groove 215 may extend through the inner side 214 and the outer side 213 of the speaker frame 21. In the axial direction of the speaker 20, the clearance groove 215 may be located between the upper speaker frame 211 and the lower speaker frame 212. That is, the upper speaker frame 211 and the lower speaker frame 212 may together form the clearance groove 215.

[0100] Please refer to the following: Figures 4 to 6 , Figure 6 yes Figure 4 The diagram shows a partial cross-sectional view of the basin frame 21 cut along point AA in some embodiments.

[0101] In some embodiments, the basin stand 21 may further include a first groove 2161 and a second groove 2162. The first groove 2161 and the second groove 2162 are spaced apart. The openings of both the first groove 2161 and the second groove 2162 may be located on the outer side 213 of the basin stand 21, for example, the openings of both the first groove 2161 and the second groove 2162 may be located on the outer side 213a of the upper basin stand 211. It is understood that in some other examples, the first groove 2161 and the second groove 2162 may also be located on the lower basin stand 212 or other positions on the basin stand 21, and this application does not limit this.

[0102] Please refer to the following: Figure 6 and Figure 7 , Figure 7 yes Figure 4 The diagram shows the structure of the basin stand 21 from another angle.

[0103] In some embodiments, the basin stand 21 may further include a first protrusion 2163, which may protrude into the interior of the basin stand 21 from a portion of the inner side surface 214. Exemplarily, the first protrusion 2163 may be located on the upper basin stand 211. In other examples, the first protrusion 2163 may also be located on the lower basin stand 212 or other locations on the basin stand 21, which is not limited herein. Exemplarily, the first protrusion 2163 may have a first receiving groove 2164 and a second receiving groove 2165. The first receiving groove 2164 and the second receiving groove 2165 are spaced apart. The first receiving groove 2164 may communicate with a first recess 2161. The second receiving groove 2165 may communicate with a second recess 2162.

[0104] Please refer to the following: Figure 4 , Figure 5 and Figure 8 , Figure 8 yes Figure 4 The diagram shows a partial cross-sectional view of the basin frame 21 cut along BB in some embodiments.

[0105] In some embodiments, the basin stand 21 may further include a third groove 2171 and a fourth groove 2172. The third groove 2171 and the fourth groove 2172 are spaced apart and are both spaced apart from the first groove 2161 and the second groove 2162. The openings of the third groove 2171 and the fourth groove 2172 may both be located on the outer side 213 of the basin stand 21. For example, the openings of the third groove 2171 and the fourth groove 2172 may both be located on the outer side 213b of the lower basin stand 212. It is understood that in some other examples, the third groove 2171 and the fourth groove 2172 may also be provided at other positions on the upper basin stand 211 or the basin stand 21, and this application does not limit this.

[0106] Please refer to the following: Figure 8 and Figure 9 , Figure 9 yes Figure 4 The diagram shows the structure of the basin stand 21 from another angle.

[0107] In some embodiments, the basin stand 21 may further include a second protrusion 2173, which may protrude into the interior of the basin stand 21 from a portion of the inner side surface 214. In some examples, the second protrusion 2173 may be located on the lower basin stand 212. In other examples, the second protrusion 2173 may also be located on the upper basin stand 211 or at other locations on the basin stand 21, which is not limited in this application.

[0108] For example, the second protrusion 2173 may be provided with a third receiving groove 2174 and a fourth receiving groove 2175. The third receiving groove 2174 and the fourth receiving groove 2175 are spaced apart. The third receiving groove 2174 may communicate with the third recess 2171. The fourth receiving groove 2175 may communicate with the fourth recess 2172.

[0109] Please refer to the following: Figure 10A and Figure 10B , Figure 10A yes Figure 2 The speaker 20 shown is a partial exploded view in some embodiments. Figure 10B yes Figure 2 The speaker 20 shown is a partial structural schematic diagram in some embodiments. Exemplary, Figure 10A The structure of the speaker 20's frame 21, first electrical connector 251, second electrical connector 252, third electrical connector 253, and fourth electrical connector 254 is mainly shown. Figure 10B The assembly structure of the basin frame 21, the first electrical connector 251, the second electrical connector 252, the third electrical connector 253 and the fourth electrical connector 254 is mainly shown.

[0110] In some embodiments, the first electrical connector 251 may include a first portion 2511 and a second portion 2512. The second portion 2512 is connected to the first portion 2511 and may be bent relative to the first portion 2511. It is understood that the first portion 2511 and the second portion 2512 of the first electrical connector 251 may be arranged at an angle. For example, the angle between the first portion 2511 and the second portion 2512 of the first electrical connector 251 may be in the range of 80° to 100°. Exemplarily, the first portion 2511 of the first electrical connector 251 may include a first connecting surface 2513. The second portion 2512 of the first electrical connector 251 may include a second connecting surface 2514.

[0111] In this embodiment, the structure and materials of the second electrical connector 252 can be the same as those of the first electrical connector 251. The basic design of the second electrical connector 252 and its connection relationship with other structures can refer to the relevant schemes of the first electrical connector 251. At the same time, slight differences in the detailed structure or positional arrangement of components are allowed between the second electrical connector 252 and the first electrical connector 251. Specific details will not be elaborated here. In other embodiments, the second electrical connector 252 and the first electrical connector 251 can also have similar structures, symmetrical or partially symmetrical structures, or different structures. This application does not impose strict limitations on these aspects.

[0112] In some embodiments, the third electrical connector 253 may include a third portion 2531 and a fourth portion 2532. The fourth portion 2532 is connected to the third portion 2531 and may be bent relative to the third portion 2531. Exemplarily, the third portion 2531 of the third electrical connector 253 may include a third connecting surface 2533. The fourth portion 2532 of the third electrical connector 253 may include a fourth connecting surface 2534.

[0113] In this embodiment, the structure and materials of the fourth electrical connector 254 can be the same as those of the first electrical connector 251. The basic design of the fourth electrical connector 254 can be found in the relevant scheme of the third electrical connector 253. Slight differences in the detailed structure or positional arrangement of the components between the fourth electrical connector 254 and the third electrical connector 253 are also permissible. Specific details will not be elaborated here. In other embodiments, the fourth electrical connector 254 and the third electrical connector 253 can also have similar, symmetrical, partially symmetrical, or different structures. This application does not impose strict limitations on these aspects.

[0114] In some embodiments, the first electrical connector 251, the second electrical connector 252, the third electrical connector 253, and the fourth electrical connector 254 can be arranged circumferentially around the speaker 20. This allows for efficient use of the space on the speaker frame 21, resulting in a more rational structural design for the speaker 20. Furthermore, the first and second electrical connectors 251 and 252 are staggered from the third and fourth electrical connectors 253 and 254 in the circumferential direction of the speaker 20, which helps to prevent interference between them.

[0115] Please refer to the following: Figures 10A to 11 , Figure 11 yes Figure 10B The diagram shows a partial cross-sectional view of the speaker 20 shown in some embodiments, cut along the CC direction.

[0116] In some embodiments, at least a portion of the first electrical connector 251 may be embedded in the basin holder 21. Exemplarily, at least a portion of the first portion 2511 of the first electrical connector 251 may be located in the first recess 2161, and the first connecting surface 2513 may be exposed relative to the first recess 2161. At least a portion of the second portion 2512 of the first electrical connector 251 may be located in the first receiving groove 2164, and the second connecting surface 2514 may be exposed relative to the first receiving groove 2164.

[0117] For example, at least a portion of the second electrical connector 252 may be embedded in the basin holder 21. For example, a portion of the second electrical connector 252 may be located in the second recess 2162, and a portion of the surface of the second electrical connector 252 may be exposed relative to the second recess 2162. A portion of the second electrical connector 252 may be located in the second receiving groove 2165, and a portion of the surface of the second electrical connector 252 may be exposed relative to the second receiving groove 2165.

[0118] In this embodiment, a portion of the first electrical connector 251 may be located inside the speaker 20, and another portion may protrude outside the speaker 20. Thus, the first electrical connector 251 can be used to electrically connect components inside the speaker 20 to components outside the speaker 20, thereby achieving electrical connection between the components inside and outside the speaker 20. Similarly, the second electrical connector 252 can also be used to electrically connect components inside and outside the speaker 20, thereby achieving electrical connection between the components inside and outside the speaker 20.

[0119] Please refer to the following: Figure 10A, Figure 10B and Figure 12 , Figure 12 yes Figure 10B The diagram shows a partial cross-sectional view of the speaker 20 along the DD section in some embodiments.

[0120] In some embodiments, at least a portion of the third electrical connector 253 may be embedded in the basin holder 21. Exemplarily, at least a portion of the third portion 2531 of the third electrical connector 253 may be located in the third recess 2171, and the third connecting surface 2533 may be exposed relative to the third recess 2171. At least a portion of the fourth portion 2532 of the third electrical connector 253 may be located in the third receiving groove 2174, and the fourth connecting surface 2534 may be exposed relative to the third receiving groove 2174.

[0121] For example, at least a portion of the fourth electrical connector 254 may be embedded in the basin holder 21. For example, a portion of the fourth electrical connector 254 may be located in the fourth recess 2172, and a portion of the surface of the fourth electrical connector 254 may be exposed relative to the fourth recess 2172. A portion of the fourth electrical connector 254 may be located in the fourth receiving groove 2175, and a portion of the surface of the fourth electrical connector 254 may be exposed relative to the fourth receiving groove 2175.

[0122] In this embodiment, a portion of the first electrical connector 251 may be located inside the speaker 20, and another portion may protrude outside the speaker 20. Thus, the first electrical connector 251 can be used to electrically connect components inside the speaker 20 and components outside the speaker 20, thereby achieving electrical connection between the components inside and outside the speaker 20. Similarly, the second electrical connector 252 can also be used to electrically connect components inside and outside the speaker 20, thereby achieving electrical connection between the components inside and outside the speaker 20.

[0123] Please refer to the following: Figures 13A to 14 , Figure 13A yes Figure 3 The diagram shown is a partial structural schematic of the speaker 20 in some embodiments. Figure 13B yes Figure 2 The diagram shown is a partial structural schematic of the speaker 20 in some embodiments. Figure 14 yes Figure 13B The diagram shows a partial cross-sectional view of the speaker 20 taken along the EE. For example, Figure 13AThe structure of the frame 21, magnetic circuit assembly 22, first diaphragm 231, first voice coil 241, second diaphragm 232, second voice coil 242, first electrical connector 251, second electrical connector 252, third electrical connector 253 and fourth electrical connector 254 are mainly shown. Figure 13B and Figure 14 The image mainly shows the assembly structure of the frame 21, magnetic circuit assembly 22, first diaphragm 231, first voice coil 241, second diaphragm 232, second voice coil 242, first electrical connector 251, second electrical connector 252, third electrical connector 253 and fourth electrical connector 254.

[0124] In some embodiments, the first diaphragm 231 is fixedly connected to the basin frame 21. For example, the periphery of the first diaphragm 231 may be fixedly connected to the upper basin frame 211.

[0125] For example, the first diaphragm 231 may include a vibrating portion 2311, a folded ring portion 2312, and a fixing portion 2313. The folded ring portion 2312 surrounds the outer periphery of the vibrating portion 2311 and is connected to the vibrating portion 2311, while the fixing portion 2313 surrounds the outer periphery of the folded ring portion 2312 and is connected to the folded ring portion 2312. The fixing portion 2313 may be fixedly connected to the frame 21. The folded ring portion 2312 may be deformable; for example, it may be a ring structure with an overall arcuate surface, which is easily deformed and stretched to allow the vibrating portion 2311 to be displaced relative to the fixing portion 2313 in the axial direction of the speaker 20.

[0126] In some embodiments, the second diaphragm 232 is fixedly connected to the basin frame 21. For example, the periphery of the second diaphragm 232 may be fixedly connected to the lower basin frame 212. Exemplarily, the first diaphragm 231 and the second diaphragm 232 may be located on opposite sides of the basin frame 21. In other words, at least a portion of the basin frame 21 may be located between the first diaphragm 231 and the second diaphragm 232.

[0127] For example, the second diaphragm 232 may have a first through-hole 2320. The first through-hole 2320 may be located in the middle of the second diaphragm 232. The first through-hole 2320 may connect the interior of the speaker 20 to the exterior of the speaker 20. In some examples, the periphery of the first through-hole 2320 may be fixedly connected to the magnetic circuit assembly 22. For example, the periphery of the first through-hole 2320 may be fixedly connected to the center magnet of the magnetic circuit assembly 22.

[0128] For example, the second diaphragm 232 may include a vibrating part 2321, a first folded ring part 2322, a second folded ring part 2323, and a fixing part 2324. The second folded ring part 2323 surrounds the first through hole 2320, the vibrating part 2321 surrounds the outer periphery of the second folded ring part 2323 and is connected to the second folded ring part 2323, the first folded ring part 2322 surrounds the outer periphery of the vibrating part 2321 and is connected to the vibrating part 2321, and the fixing part 2324 surrounds the outer periphery of the first folded ring part 2322 and is connected to the first folded ring part 2322. The fixing part 2324 can be fixedly connected to the basin frame 21.

[0129] Please refer to the following: Figure 13A , Figure 14 and Figure 15 , Figure 15 yes Figure 2 The diagram shows a partial exploded view of the magnetic circuit assembly 22 in some embodiments.

[0130] In some embodiments, the magnetic circuit assembly 22 may be located inside the frame 21 and fixedly connected to the frame 21. For example, in the axial direction of the speaker 20, the magnetic circuit assembly 22 may be located between the first diaphragm 231 and the second diaphragm 232, that is, the first diaphragm 231 and the second diaphragm 232 may be located on opposite sides of the magnetic circuit assembly 22.

[0131] In some embodiments, the magnetic circuit assembly 22 may include a central magnet 221 and side magnets 222. The side magnets 222 may be arranged around the central magnet 221. Exemplarily, the number of side magnets 222 may be two. The two side magnets 222 may be arc-shaped and arranged around the central magnet 221. In some other examples, the number of side magnets 222 may also be one. The side magnet 222 may be ring-shaped. Exemplarily, the gap between the side magnets 222 and the central magnet 221 forms a magnetic gap in the magnetic circuit assembly 22.

[0132] For example, the central magnet 221 may be generally annular. It is understood that the central magnet 221 may have a second through-hole 2211. The second through-hole 2211 may extend through the central magnet 221 along its axial direction. The second through-hole 2211 may connect to the first through-hole 2320 of the second diaphragm 232, thereby communicating with the outside of the speaker 20.

[0133] In some embodiments, the magnetic circuit assembly 22 may further include a magnetically conductive element 223. The magnetically conductive element 223 may be made of a magnetically conductive material. Exemplarily, the magnetically conductive element 223 may include a main body portion 2231, a peripheral portion 2232, and a connecting portion 2233. The connecting portion 2233 may connect between the main body portion 2231 and the peripheral portion 2232, and the connecting portion 2233 is bent relative to the main body portion 2231 and the peripheral portion 2232. Exemplarily, the connecting portion 2233 may surround the outer periphery of the main body portion 2231, and the peripheral portion 2232 may be connected to the outer periphery of the connecting portion 2233. Exemplarily, Figure 14 The main body 2231, peripheral part 2232, and connecting part 2233 are schematically divided by dashed lines. For example, the main body 2231 of the magnetic conductor 223 may be provided with a third through hole 2234.

[0134] For example, a portion of the side magnet 222 may be located within the clearance groove 215 of the basin frame 21 and fixedly connected to the basin frame 21. The peripheral portion 2232 of the magnetic conductor 223 may be located on the side of the side magnet 222 facing away from the first diaphragm 231 and fixedly connected to the side magnet 222 and the basin frame 21. The main body portion 2231 of the magnetic conductor 223 may be located on the side of the center magnet 221 facing away from the second diaphragm 232 and fixedly connected to the center magnet 221. The third through hole 2234 of the magnetic conductor 223 may communicate with the second through hole 2211 of the center magnet 221.

[0135] It is understood that in this embodiment, the central magnet 221 can be indirectly connected to the basin stand 21 via the magnetic conductor 223. In some other embodiments, the magnetic circuit assembly 22 may not include the magnetic conductor 223. The central magnet 221 can be fixedly connected to the basin stand 21 via structural components such as a bracket.

[0136] For example, the connecting portion 2233 of the magnetic conductor 223 can be located between the central magnet 221 and the side magnet 222, separating the gap between the central magnet 221 and the side magnet 222 into a first gap and a second gap. The first gap can form a first magnetic gap 22a of the magnetic circuit assembly 22. The second gap can form a second magnetic gap 22b of the magnetic circuit assembly 22. It is understood that the first magnetic gap 22a and the second magnetic gap 22b can be spaced apart.

[0137] Please continue reading. Figure 14 In some embodiments, one end of the first voice coil 241 is fixedly connected to the first diaphragm 231, for example, one end of the first voice coil 241 may be fixedly connected to the vibrating part of the first diaphragm 231. The other end of the first voice coil 241 (that is, the end of the first voice coil 241 away from the first diaphragm 231) may be located in the first magnetic gap 22a of the magnetic circuit assembly 22.

[0138] For example, the first voice coil 241 may include two terminals, namely a first terminal 2411 (see [link]). Figure 13A ) and second wiring section 2412 (see Figure 13A The first wiring portion 2411 and the second wiring portion 2412 can both be led out from the body of the first voice coil 241 and are located outside the body of the first voice coil 241. The first wiring portion 2411 can be electrically connected to the first electrical connector 251; for example, the first wiring portion 2411 can be connected to the second connection surface 2514 of the first electrical connector 251. It is understood that in this embodiment, the first voice coil 241 can be electrically connected to an external power source through the first electrical connector 251, for example, to the positive terminal of the external power source. The second wiring portion 2412 can be electrically connected to the second electrical connector 252. It is understood that in this embodiment, the first voice coil 241 can be electrically connected to an external power source through the second electrical connector 252, for example, to the negative terminal of the external power source. In this way, the external power source can supply power to the first voice coil 241. Current can form a circuit between the first electrical connector 251, the first voice coil 241, and the second electrical connector 252.

[0139] In this embodiment, when the first voice coil 241 is energized, it generates a force in the magnetic field of the magnetic circuit assembly 22, thereby driving the first diaphragm 231 to vibrate. The first diaphragm 231 then vibrates the air, thus enabling the speaker 20 to produce sound. In this embodiment, the sound generated by the first diaphragm 231 can propagate through the third through-hole 2234 of the magnetic conductor 223 of the magnetic circuit assembly 22, the second through-hole 2211 of the central magnet 221, and the first through-hole 2320 of the second diaphragm 232 to the side of the second diaphragm 232 facing away from the first diaphragm 231. The first voice coil 241 can receive alternating signals and generate alternating forces in the magnetic field.

[0140] Please see Figure 16 , Figure 16 yes Figure 13B The diagram shows a partial cross-sectional view of the speaker 20 along the FF line.

[0141] In some embodiments, one end of the second voice coil 242 is fixedly connected to the second diaphragm 232, for example, one end of the second voice coil 242 may be fixedly connected to the vibrating part 2321 of the second diaphragm 232. The other end of the second voice coil 242 (that is, the end of the second voice coil 242 away from the second diaphragm 232) may be located in the second magnetic gap 22b of the magnetic circuit assembly 22.

[0142] For example, the second voice coil 242 may include two terminals, namely a third terminal 2421 (see [link]). Figure 13A ) and fourth wiring section 2422 (see Figure 13ABoth the third wiring portion 2421 and the fourth wiring portion 2422 can be led out from the main body of the second voice coil 242 and are located outside the main body of the second voice coil 242. The third wiring portion 2421 can be electrically connected to the third electrical connector 253; for example, the third wiring portion 2421 can be connected to the fourth connecting surface 2534 of the third electrical connector 253. It is understood that in this embodiment, the second voice coil 242 can be electrically connected to an external power source through the third electrical connector 253, for example, to the positive terminal of the external power source. The fourth wiring portion 2422 can be electrically connected to the fourth electrical connector 254. It is understood that in this embodiment, the second voice coil 242 can be electrically connected to an external power source through the fourth electrical connector 254, for example, to the negative terminal of the external power source. In this way, the external power source can supply power to the second voice coil 242. Current can form a circuit between the third electrical connector 253, the second voice coil 242, and the fourth electrical connector 254.

[0143] In this embodiment, when the second voice coil 242 is energized, it generates a force in the magnetic field of the magnetic circuit assembly 22, thereby driving the second diaphragm 232 to vibrate. The second diaphragm 232 then vibrates the air to produce sound from the speaker 20. The second voice coil 242 can receive alternating signals and generate alternating forces in the magnetic field.

[0144] In this embodiment, the sound generated by the second diaphragm 232 can propagate to the side of the second diaphragm 232 facing away from the first diaphragm 231. The sound generated by the first diaphragm 231 and the sound generated by the second diaphragm 232 can form a sound field superposition on the side of the second diaphragm 232 facing away from the first diaphragm 231, thereby improving the sound quality of the speaker 20.

[0145] It is understood that, in the embodiments of this application, the external power supply for powering the first voice coil 241 and the external power supply for powering the second voice coil 242 can be different power supplies. In this way, the first voice coil 241 and the second voice coil 242 can be controlled by different circuits, allowing the first voice coil 241 and the second voice coil 242 to operate independently, thereby driving the first diaphragm 231 and the second diaphragm 232 to vibrate independently, respectively. In some other embodiments, the external power supply for powering the first voice coil 241 and the external power supply for powering the second voice coil 242 can also be the same power supply; this application does not strictly limit this.

[0146] Please see Figure 17A and Figure 17B , Figure 17A yes Figure 4 The diagram shown is a structural schematic of the first circuit board 26 in some embodiments. Figure 17B yes Figure 17AThe diagram shows the structure of the first circuit board 26 from another angle.

[0147] In some embodiments, the first circuit board 26 may include a first connecting portion 261, a second connecting portion 262, and a third connecting portion 263. The third connecting portion 263 is electrically connected between the first connecting portion 261 and the second connecting portion 262.

[0148] For example, the plane containing the first connecting portion 261 intersects with the plane containing the second connecting portion 262. It is understood that the angle between the plane containing the first connecting portion 261 and the plane containing the second connecting portion 262 can be in the range of 0° to 180°, such as 10°, 30°, 50°, 70°, 80°, 90°, 100°, 110°, 150°, 170°, etc.

[0149] For example, the first connecting portion 261 may include a first sub-connecting portion 2611 and a second sub-connecting portion 2612. The first sub-connecting portion 2611 and the second sub-connecting portion 2612 are spaced apart, and one end of the first sub-connecting portion 2611 and one end of the second sub-connecting portion 2612 are both connected to the second connecting portion 262.

[0150] For example, the third connecting portion 263 may include a first end 263a and a second end 263b. The first end 263a of the third connecting portion 263 may be connected to the first connecting portion 261. The second end 263b of the third connecting portion 263 may be bent relative to the first connecting portion 261 and connected to the second connecting portion 262.

[0151] For example, the third connecting portion 263 may include a third sub-connecting portion 2631 and a fourth sub-connecting portion 2632. The third sub-connecting portion 2631 and the fourth sub-connecting portion 2632 are spaced apart. The third sub-connecting portion 2631 may be electrically connected between the first sub-connecting portion 2611 and the second connecting portion 262. The fourth sub-connecting portion 2632 may be electrically connected between the second sub-connecting portion 2612 and the second connecting portion 262. It is understood that the first end 263a of the third connecting portion 263 may include the first end 2631a of the third sub-connecting portion 2631 and the first end 2632a of the fourth sub-connecting portion 2632. The second end 263b of the fourth connecting portion may include the second end 2631b of the third sub-connecting portion 2631 and the second end 2632b of the fourth sub-connecting portion 2632.

[0152] In this embodiment, by separating the third sub-connecting portion 2631 and the fourth sub-connecting portion 2632, the structural design of the first circuit board 26 can be more flexible. The structures of the third sub-connecting portion 2631 and the fourth sub-connecting portion 2632, and their connection method with the second connecting portion 262, can be flexibly configured according to actual needs. For example, the structure of the third connecting portion 2631 can be the same as or different from the structure of the fourth connecting portion; the third sub-connecting portion 2631 and the fourth sub-connecting portion 2632 can be connected to the same or different positions on the second connecting portion 262. In some other embodiments, the first connecting portion 261 may not include the first sub-connecting portion 2611 and the second sub-connecting portion 2612. In this case, the third sub-connecting portion 2631 and the fourth sub-connecting portion 2632 can be electrically connected between the first connecting portion 261 and the second connecting portion 262, respectively. By configuring the third connecting portion 263 as a spaced-apart first sub-connecting portion 2611 and second sub-connecting portion 2612, the bending stress of the first sub-connecting portion 2611 and the second sub-connecting portion 2612 is smaller when bent, making them less prone to breakage, thereby improving the reliability of the third connecting portion 263.

[0153] In other examples, the third connection portion 263 of the first circuit board 26 may also be of other shapes, which are not strictly limited in this application.

[0154] In some other examples, the third connection portion 263 of the first circuit board 26 may also be a lead or other electrical connection structure.

[0155] In some other embodiments, the first circuit board 26 may not include the third connecting portion 263. In this case, the first connecting portion 261 can be directly connected to the second connecting portion 262. It is understood that the shape and structure of the first circuit board 26 can be adjusted according to actual needs, and this application does not strictly limit the specific shape and structure of the first circuit board 26.

[0156] Please continue reading. Figure 17A and Figure 17BIn some embodiments, the first connection portion 261 of the first circuit board 26 may include a first surface 2613 and a second surface 2614 disposed opposite to each other. The first connection portion 261 may also include a first pad 2641 and a second pad 2642, wherein the first pad 2641 may be exposed relative to the first surface 2613 of the first connection portion 261, and the second pad 2642 may be exposed relative to the second surface 2614 of the first connection portion 261. It is understood that the first pad 2641 and the second pad 2642 may be located on opposite sides of the first connection portion 261. For example, the first pad 2641 and the second pad 2642 may both be disposed on the first sub-connection portion 2611. It is understood that the first pad 2641 can be exposed relative to the first surface 2613 of the first connection portion 261. This can be either a portion of the first pad 2641 is embedded in the first connection portion 261, and a portion of the first pad 2641 is exposed on the first surface 2613 of the first connection portion 261; or the first pad 2641 can be connected to the first surface 2613 of the first connection portion 261. Similarly, the second pad 2642 being exposed relative to the second surface 2614 of the first connection portion 261 can also include the above two methods. Any description of pads being exposed relative to the surface of the circuit board in the following text can include both of these methods.

[0157] For example, the first connecting portion 261 is further provided with a first through hole 2643. The first through hole 2643 can penetrate the first connecting portion 261, and the first through hole 2643 can connect the first pad 2641 and the second pad 2642.

[0158] In some embodiments, the first connecting portion 261 may further include a third pad 2644 and a fourth pad 2645, wherein the third pad 2644 may be exposed relative to the first surface 2613 of the first connecting portion 261, and the fourth pad 2645 may be exposed relative to the second surface 2614 of the first connecting portion 261. It is understood that the third pad 2644 and the fourth pad 2645 may be located on opposite sides of the first connecting portion 261. For example, the third pad 2644 and the fourth pad 2645 may both be disposed on the first sub-connecting portion 2611. The third pad 2644 may be spaced apart from the first pad 2641, and the fourth pad 2645 may be spaced apart from the second pad 2642.

[0159] For example, the first connecting portion 261 is further provided with a second through hole 2646. The second through hole 2646 can penetrate the first connecting portion 261, and the second through hole 2646 can connect the third pad 2644 and the fourth pad 2645.

[0160] In some embodiments, the first connecting portion 261 may further include a fifth pad 2661 and a sixth pad 2662, wherein the fifth pad 2661 may be exposed relative to the first surface 2613 of the first connecting portion 261, and the sixth pad 2662 may be exposed relative to the second surface 2614 of the first connecting portion 261. It is understood that the fifth pad 2661 and the sixth pad 2662 may be located on opposite sides of the first connecting portion 261. Exemplarily, the fifth pad 2661 and the sixth pad 2662 may both be located on the second sub-connecting portion 2612.

[0161] For example, the first connecting portion 261 is further provided with a third through hole 2663. The third through hole 2663 can penetrate the first connecting portion 261, and the third through hole 2663 can connect the fifth pad 2661 and the sixth pad 2662.

[0162] In some embodiments, the first connecting portion 261 may further include a seventh pad 2664 and an eighth pad 2665, wherein the seventh pad 2664 may be exposed relative to the first surface 2613 of the first connecting portion 261, and the eighth pad 2665 may be exposed relative to the second surface 2614 of the first connecting portion 261. It is understood that the seventh pad 2664 and the eighth pad 2665 may be located on opposite sides of the first connecting portion 261. Exemplarily, the seventh pad 2664 and the eighth pad 2665 may both be located in the second sub-connecting portion 2612. The seventh pad 2664 may be spaced apart from the fifth pad 2661, and the eighth pad 2665 may be spaced apart from the sixth pad 2662.

[0163] For example, the first connecting portion 261 is further provided with a fourth through hole 2666. The fourth through hole 2666 can penetrate the first connecting portion 261, and the fourth through hole 2666 can connect the seventh pad 2664 and the eighth pad 2665.

[0164] Please refer to the following: Figures 18A to 19 , Figure 18A yes Figure 2 The speaker 20 shown is a partial exploded view in some embodiments. Figure 18B yes Figure 2 The diagram shown is a partial structural schematic of the speaker 20 in some embodiments. Figure 19 yes Figure 18B The diagram shows a partial cross-sectional view of the speaker 20 taken along line GG. It is understood that this is for ease of illustration. Figure 19 The structure of the speaker 20 is omitted, for example... Figure 19 The magnetic conductor is not shown.

[0165] In some embodiments, the housing 27 is fixedly connected to the frame 21. Exemplarily, the housing 27 may be located on the side of the first diaphragm 231 facing away from the magnetic circuit assembly 22 and fixedly connected to the periphery of the first diaphragm 231. It is understood that at least a portion of the first diaphragm 231 may be located between the housing 27 and the frame 21.

[0166] For example, the housing 27 may include a top wall 271 and a side wall 272, the side wall 272 surrounding and connected to the top wall 271. The side wall 272 may be bent relative to the top wall 271 toward the first diaphragm 231. The side wall 272 may be fixedly connected to the periphery of the first diaphragm 231, and the top wall 271 may be located on the side of the first diaphragm 231 facing away from the magnetic circuit assembly 22. It is understood that in this embodiment, the housing 27 may be indirectly fixedly connected to the frame 21 by being fixedly connected to the first diaphragm 231. In other embodiments, the housing 27 may also be directly fixedly connected to the frame 21, or fixedly connected to the frame 21 by other structural components.

[0167] In some examples, the material of the housing 27 may include plastic, etc. This makes the housing 27 lighter and less expensive. In other examples, the material of the housing 27 may include metal materials such as steel, thus giving the housing 27 better structural strength.

[0168] Please continue reading. Figures 18A to 19 In some embodiments, the first circuit board 26 is fixedly connected to and electrically connected to the first electrical connector 251. Exemplarily, the first connection portion 261 of the first circuit board 26 may be located on the outer side 213 of the frame 21. The first connection portion 261 of the first circuit board 26 is fixedly connected to and electrically connected to the first electrical connector 251. In this case, the second connection portion 262 of the first circuit board 26 may be located on the side of the first diaphragm 231 facing away from the magnetic circuit assembly 22. In some examples, the first sub-connection portion 2611 of the first connection portion 261 may be fixedly connected to and electrically connected to the first electrical connector 251.

[0169] It is understandable that, due to the intersection of the plane containing the first connecting portion 261 of the first circuit board 26 and the plane containing the second connecting portion 262, when the first circuit board 26 is mounted on the frame 21, the first connecting portion 261 can be located outside the outer side 213 of the frame 21, and the second connecting portion 262 can be located on the side of the first diaphragm 231 facing away from the magnetic circuit assembly 22. For example, the plane containing the first connecting portion 261 can be parallel to the axis of the speaker 20, and the plane containing the second connecting portion 262 can be perpendicular to the axis of the speaker 20. In this case, the angle between the plane containing the first connecting portion 261 and the plane containing the second connecting portion 262 is 90°. The axis of the speaker 20 is the extension direction of the central axis A1-A1 of the speaker 20.

[0170] For example, the first surface 2613 of the first connection portion 261 of the first circuit board 26 may face the first connection surface 2513 of the first electrical connector 251. In this case, at least a portion of the first pad 2641 may be disposed opposite to the first connection surface 2513 of the first electrical connector 251. The first pad 2641 may be fixedly connected to and electrically connected to the first connection surface 2513 of the first electrical connector 251.

[0171] For example, the speaker 20 may further include a first conductive element 281. A portion of the first conductive element 281 may be located between the first pad 2641 and the first connecting surface 2513, and fixedly connect the first pad 2641 and the first connecting surface 2513. A portion of the first conductive element 281 may be disposed in the first through hole 2643 of the first connecting portion 261. A portion of the first conductive element 281 may be fixedly connected to the second pad 2642.

[0172] It is understandable that the first conductive element 281 can fill the gap between the first pad 2641 and the first connecting surface 2513 to achieve electrical connection between the first pad 2641 and the first electrical connector 251, thereby achieving electrical connection between the first circuit board 26 and the first electrical connector 251.

[0173] In this embodiment, the first conductive element 281 can extend from the first surface 2613 of the first connecting portion 261 to the second surface 2614 of the first connecting portion 261, which helps to improve the connection strength between the first circuit board 26 and the first electrical connector 251. The first conductive element 281 can extend from the first pad 2641 through the first through-hole 2643 to the second pad 2642, facilitating the connection between the first conductive element 281 and the first electrical connector 251, the first pad 2641, and the second pad 2642. In other embodiments, the first conductive element 281 can also extend from the first pad 2641 around the outside of the first connecting portion 261 to the second pad 2642.

[0174] In this embodiment, the first circuit board 26 can be fixedly connected to the first electrical connector 251 by soldering, and is electrically connected to the first electrical connector 251. In this case, the first conductive element 281 can be a solder joint. It is understood that the soldering methods between the first circuit board 26 and the first electrical connector 251 include, but are not limited to, soldering, laser soldering, hot bar soldering, and resistance soldering. In some other embodiments, the first circuit board 26 is fixedly connected to the first electrical connector 251 by adhesive bonding, and is electrically connected to the first electrical connector 251. In this case, the first conductive element 281 can be conductive adhesive. In this embodiment, soldering the first circuit board 26 to the first electrical connector 251 can achieve an electrical connection between the first circuit board 26 and the first electrical connector 251, and the connection reliability between the first circuit board 26 and the first electrical connector 251 is good.

[0175] Similarly, the first circuit board 26 is fixedly connected to the second electrical connector 252 and electrically connected to the second electrical connector 252. For example, the first connecting portion 261 of the first circuit board 26 can be fixedly connected to the second electrical connector 252 and electrically connected to the second electrical connector 252. In some examples, the first sub-connecting portion 2611 of the first connecting portion 261 can be fixedly connected to the second electrical connector 252 and electrically connected to the second electrical connector 252.

[0176] For example, at least a portion of the third pad 2644 may be disposed opposite to the second electrical connection 252. The speaker 20 may also include a second conductive element 282. A portion of the second conductive element 282 may be located on the third pad 2644 (see [link to documentation]). Figure 17B The third pad 2644 is fixedly connected to the second electrical connector 252 between the second conductive element 282 and the second electrical connector 252. A portion of the second conductive element 282 may pass through the second through hole 2646 (see [reference]). Figure 17A and Figure 17B A portion of the second conductive element 282 can be fixedly connected to the fourth solder pad 2645. In this embodiment, the second conductive element 282 can be a solder joint, conductive adhesive, etc.

[0177] It is understandable that the second conductive element 282 can fill the gap between the third pad 2644 and the second electrical connector 252 to achieve electrical connection between the third pad 2644 and the second electrical connector 252, thereby achieving electrical connection between the first circuit board 26 and the second electrical connector 252.

[0178] In this embodiment, the second conductive element 282 can extend from the first surface 2613 of the first connecting portion 261 to the second surface 2614 of the first connecting portion 261, which helps to improve the connection strength between the first circuit board 26 and the second electrical connector 252. The second conductive element 282 can also extend from the third pad 2644 through the second through hole 2646 to the fourth pad 2645, facilitating the connection between the second conductive element 282 and the second electrical connector 252, the third pad 2644, and the fourth pad 2645. In other embodiments, the second conductive element 282 can also extend from the third pad 2644 around the outside of the first connecting portion 261 to the fourth pad 2645.

[0179] Please continue reading. Figures 18A to 19 In some embodiments, the first circuit board 26 is also fixedly connected to the basin frame 21. For example, the first connecting portion 261 of the first circuit board 26 can be fixedly connected to the basin frame 21 by an adhesive (not shown), such as the first connecting portion 261 being fixedly connected to the outer surface 213 of the basin frame 21. It is understood that the bonding method between the first circuit board 26 and the basin frame 21 includes, but is not limited to, bonding by applying adhesive, backing adhesive, etc. This helps to improve the connection strength between the first circuit board 26 and the basin frame 21, thus making it less likely for the first circuit board 26 to detach.

[0180] Please see Figure 19 In some embodiments, the first circuit board 26 is fixedly connected to the housing 27. Exemplarily, the second connection portion 262 of the first circuit board 26 may be located on the side of the housing 27 facing away from the first diaphragm 231 and fixedly connected to the housing 27. For example, the second connection portion 262 of the first circuit board 26 may be fixedly connected to the top wall 271 of the housing 27. In some examples, the second connection portion 262 of the first circuit board 26 may be fixedly connected to the housing 27 by an adhesive 29. In this embodiment, the second connection portion 262 of the first circuit board 26 may be fixedly connected to the housing 27, thereby allowing the second connection portion 262 to be fixedly connected to the frame 21 via the housing 27. This improves the connection strength between the first circuit board 26 and the frame 21, ensuring the robustness of the connection of the first circuit board 26 and thus guaranteeing the reliability of the electrical connection of the speaker 20.

[0181] It should be understood that Figure 19 The image only schematically illustrates one embodiment of the adhesive 29, but the shape, size, and position of the adhesive 29 are not limited to this. Figure 19 The limitations are not specified. In some other embodiments, the adhesive 29 may also be of other shapes and sizes, and the adhesive 29 may also be disposed at other locations between the first circuit board 26 and the housing 27. This application does not impose strict limitations on these aspects.

[0182] For example, at least a portion of the third connecting portion 263 may be disposed opposite to the housing 27. At least a portion of the third connecting portion 263 of the first circuit board 26 may be disposed opposite to the side wall 272. It is understood that, in the embodiments of this application, the opposite arrangement of component A and component B may be such that component A is projected along the target direction to obtain projection C, and component B is projected along the target direction to obtain projection D, and projection C and projection D may at least largely overlap. In some embodiments, the substantial overlap may be any of the following: projection C is completely located within projection D. Or, projection D is completely located within projection C. Or, projection C and projection D intersect each other, and the intersection area of ​​projection C and projection D accounts for more than 50% of projection C or projection D. In this embodiment, by allowing at least a portion of the third connecting portion 263 of the first circuit board 26 to be disposed opposite to the side wall 272, the shape of the third connecting portion 263 of the first circuit board 26 can be adapted to the side wall 272 of the housing 27 to be disposed close to the side wall 272 of the housing 27, thereby reducing the size of the speaker 20 and facilitating the miniaturization of the speaker 20. In some examples, the third connection 263 can be bonded to the housing 27 by dispensing adhesive, backing adhesive, etc.

[0183] For example, the second end 263b of the third connecting portion 263 is bent relative to the first connecting portion 261 towards the first diaphragm 231, so that the first circuit board 26 can be disposed close to the first diaphragm 231, thereby facilitating a reduction in the size of the speaker 20. In this embodiment, since the first circuit board 26 is a flexible circuit board, at least a portion of the first circuit board 26 can be deformed, for example, the third connecting portion 263 of the first circuit board 26 can be deformed. Thus, the shape of the third connecting portion 263 of the first circuit board 26 can be adjusted according to the shape of the side wall 272 of the housing 27 to fit the housing 27, thereby reducing the external size of the speaker 20. In other examples, the third connecting portion 263 of the first circuit board 26 can also be other shapes. For example, the third connecting portion 263 can extend along the outer side of the frame 21 to the side of the frame 21 opposite to the first electrical connector 251, and then extend from the other side to above the first diaphragm 231.

[0184] For example, the housing 27 may be provided with a through hole 273. The through hole 273 may connect to the side of the first diaphragm 231 away from the frame 21. The second connection portion 262 of the first circuit board 26 may be offset from the through hole 273 of the housing 27. In some other embodiments, the second connection portion 262 of the first circuit board 26 may also cover a portion of the through hole 273 of the housing 27.

[0185] Please see Figure 20 , Figure 20 yes Figure 18BThe diagram shows a partial cross-sectional view of the speaker 20 taken along line HH. It is understood that this is for ease of illustration. Figure 20 The structure of the speaker 20 is omitted, for example... Figure 20 The magnetic conductor is not shown.

[0186] In some embodiments, the first circuit board 26 is fixedly connected to and electrically connected to the third electrical connector 253. Exemplarily, the first connecting portion 261 of the first circuit board 26 may be fixedly connected to and electrically connected to the third electrical connector 253. In some examples, the second sub-connecting portion 2612 of the first connecting portion 261 may be fixedly connected to and electrically connected to the third electrical connector 253.

[0187] For example, at least a portion of the fifth pad 2661 may be disposed opposite to the third connection surface 2533 of the third electrical connector 253. The fifth pad 2661 may be fixedly connected to and electrically connected to the third connection surface 2533 of the third electrical connector 253.

[0188] For example, the speaker 20 may further include a third conductive element 283. A portion of the third conductive element 283 may be located between the fifth pad 2661 and the third connecting surface 2533, and fixedly connected to the fifth pad 2661 and the third connecting surface 2533. A portion of the third conductive element 283 may pass through the third through hole 2663 of the first connecting portion 261. A portion of the third conductive element 283 may be fixedly connected to the sixth pad 2662.

[0189] It is understandable that the third conductive element 283 can fill the gap between the fifth pad 2661 and the third connecting surface 2533 to achieve electrical connection between the fifth pad 2661 and the third connecting surface 2533, thereby achieving electrical connection between the first circuit board 26 and the third electrical connector 253.

[0190] In this embodiment, the third conductive element 283 can extend from the first surface 2613 of the first connecting portion 261 to the second surface 2614 of the first connecting portion 261, which helps to improve the connection strength between the first circuit board 26 and the third electrical connector 253. The third conductive element 283 can extend from the fifth pad 2661 through the third through-hole 2663 to the sixth pad 2662, facilitating the connection between the third conductive element 283 and the third electrical connector 253, the fifth pad 2661, and the sixth pad 2662. In other embodiments, the first conductive element 281 can also extend from the first pad 2641 around the outside of the first connecting portion 261 to the second pad 2642.

[0191] In this embodiment, the first circuit board 26 can be fixedly connected to the third electrical connector 253 by soldering, and is electrically connected to the third electrical connector 253. In this case, the third conductive element 283 can be a solder joint. It is understood that the soldering methods between the first circuit board 26 and the third electrical connector 253 include, but are not limited to, soldering, laser soldering, hot bar soldering, and resistance soldering. In some other embodiments, the first circuit board 26 can be fixedly connected to the third electrical connector 253 by adhesive bonding, and is electrically connected to the third electrical connector 253. In this case, the third conductive element 283 can be conductive adhesive.

[0192] Similarly, the first circuit board 26 is fixedly connected to the fourth electrical connector 254 and electrically connected to the fourth electrical connector 254. For example, the first connecting portion 261 of the first circuit board 26 can be fixedly connected to the fourth electrical connector 254 and electrically connected to the fourth electrical connector 254. In some examples, the second sub-connecting portion 2612 of the first connecting portion 261 can be fixedly connected to the fourth electrical connector 254 and electrically connected to the fourth electrical connector 254.

[0193] For example, at least a portion of the seventh pad 2664 may be disposed opposite to the fourth electrical connection 254. The speaker 20 may also include a fourth conductive element 284 (see [link to documentation]). Figure 18B A portion of the fourth conductive element 284 may be located on the seventh pad 2664 (see [link]). Figure 17B The seventh pad 2664 is fixedly connected to the fourth electrical connector 254 and the fourth electrical connector 254. A portion of the fourth conductive element 284 may pass through the fourth through hole 2666 (see [link]). Figure 17A and Figure 17B A portion of the fourth conductive element 284 can be fixedly connected to the eighth pad 2665. In this embodiment, the fourth conductive element 284 can be a solder joint, conductive adhesive, etc.

[0194] It is understandable that the fourth conductive element 284 can fill the gap between the seventh pad 2664 and the fourth electrical connector 254 to achieve electrical connection between the seventh pad 2664 and the fourth electrical connector 254, thereby achieving electrical connection between the first circuit board 26 and the fourth electrical connector 254.

[0195] In this embodiment, the fourth conductive element 284 can extend from the first surface 2613 of the first connecting portion 261 to the second surface 2614 of the first connecting portion 261, which is beneficial to improving the connection strength between the first circuit board 26 and the fourth electrical connector 254. The fourth conductive element 284 can extend from the seventh pad 2664 through the fourth through hole 2666 to the eighth pad 2665, facilitating the connection between the fourth conductive element 284 and the fourth electrical connector 254, the seventh pad 2664, and the eighth pad 2665. In some other embodiments, the fourth conductive element 284 can also extend from the seventh pad 2664 around the outside of the first connecting portion 261 to the eighth pad 2665.

[0196] In this embodiment, the first electrical connector 251 to the fourth electrical connector 254 can be electrically connected to an external power source of the speaker 20 via the first circuit board 26. Thus, the external power source of the speaker 20 can supply power to the first voice coil 241 via the first circuit board 26, the first electrical connector 251, and the second electrical connector 252, and supply power to the second voice coil 242 via the first circuit board 26, the third electrical connector 253, and the fourth electrical connector 254, thereby enabling the speaker 20 to produce sound. The assembly structure of the speaker 20 is relatively simple, which is beneficial for mass production. In some embodiments, the first voice coil 241 and the second voice coil 242 can be electrically connected to the controller of the electronic device 100 via different wiring inside the first circuit board 26. In this way, the controller of the electronic device 100 can independently control the current of the first voice coil 241 and the second voice coil 242, thereby independently controlling the vibration of the first diaphragm 231 and the second diaphragm 232. For example, the controller of the electronic device 100 can independently control the vibration frequency and amplitude of the first diaphragm 231 and the second diaphragm 232. In some other embodiments, the controller of the electronic device 100 may also synchronously control the first voice coil 241 and the second voice coil 242.

[0197] In this embodiment, the first electrical connector 251 and the second electrical connector 252 can be electrically connected to the first circuit board 26 via the first sub-connection portion 2611, and the third electrical connector 253 and the fourth electrical connector 254 can be electrically connected to the first circuit board 26 via the second sub-connection portion 2612. Compared to a solution where the first to fourth electrical connectors 251 are all soldered to the same component, this embodiment separates the first sub-connection portion 2611 and the second sub-connection portion 2612, allowing the first electrical connector 251 and the second electrical connector 252 to be electrically connected to the first circuit board 26 via the second sub-connection portion 2612. The first sub-connector 2611 can be soldered separately, and the third electrical connector 253 and the fourth electrical connector 254 can be soldered separately to the second sub-connector 2612. This facilitates the assembly of the first circuit board 26 with the first electrical connector 251, the second electrical connector 252, the third electrical connector 253, and the fourth electrical connector 254. On the other hand, it facilitates the separate layout of the traces in the first sub-connector 2611 and the second sub-connector 2612, so that the traces in the first sub-connector 2611 and the second sub-connector 2612 are less likely to interfere with each other.

[0198] Understandably, the maximum low-frequency output capability of speaker 20 depends on the maximum displacement volume (Vdmax) of the speaker diaphragm in one direction. The maximum low-frequency output capability of speaker 20 is positively correlated with Vdmax; increasing Vdmax can improve the maximum low-frequency output capability of speaker 20, thereby improving the sound quality of speaker 20. Furthermore, as shown by Vdmax = Sd * Xmax, the maximum displacement volume (Vdmax) of the speaker diaphragm in one direction is related to the effective radiation area (Sd) and the maximum amplitude (Xmax) of the diaphragm. Increasing Sd or Xmax can increase Vdmax, thereby improving the maximum low-frequency output capability of speaker 20. In this embodiment, by placing the first circuit board 26 on the outside of the frame 21, the first circuit board 26 does not occupy the internal space of the frame 21, allowing for a larger diameter of the first diaphragm 231. This results in a larger total area of ​​the first diaphragm 231, i.e., a larger Sd, which in turn increases the maximum displacement volume (Vdmax) of the first diaphragm 231, enabling the speaker 20 to have better low-frequency maximum output capability. In some embodiments, by setting the plane of the first connecting portion 261 of the first circuit board 26 parallel to the axial direction of the speaker 20, the first connecting portion 261 can be positioned close to the outer surface 213 of the frame 21, which helps to reduce the circumferential size of the speaker 20, thus facilitating the miniaturization of the speaker 20.

[0199] In this embodiment, the second connection portion 262 of the first circuit board 26 is disposed on the side of the first diaphragm 231 facing away from the magnetic circuit assembly 22 of the frame 21. This allows the second connection portion 262 of the first circuit board 26 to make reasonable use of the space on the side of the first diaphragm 231 away from the frame 21, thus preventing the second connection portion 262 from occupying excessive space in the circumferential direction of the speaker 20. This helps to reduce the circumferential size of the speaker 20, thereby facilitating the miniaturization of the speaker 20. In some embodiments, by setting the plane of the second connection portion 262 of the first circuit board 26 perpendicular to the axial direction of the speaker 20, the second connection portion 262 does not occupy excessive space in the axial direction of the speaker 20, which helps to reduce the axial size of the speaker 20, thereby facilitating the miniaturization of the speaker 20. Furthermore, the first circuit board 26 is a flexible circuit board, and at least a portion of the first circuit board 26 can be bent. For example, the third connecting portion 263 of the first circuit board 26 can be bent, so that the shape of the first circuit board 26 can be adjusted according to the shape of the housing 27 to fit the housing 27, thereby helping to reduce the circumferential size of the speaker 20 and thus facilitating the miniaturization of the speaker 20. Secondly, the shape of the first circuit board 26 can be designed according to actual needs, and the structure of the speaker 20 can be flexibly adjusted according to actual needs.

[0200] Furthermore, in this embodiment, a circuit board is used as the electrical connector between the electrical connector and the external power supply. The circuit board has good corrosion resistance, which makes it less likely for the electrical connection between the electrical connector and the external power supply to fail, thus improving the reliability of the speaker 20.

[0201] It is understandable that there can be only one first circuit board 26, and the first electrical connector 251 to the fourth electrical connector 254 can be electrically connected to external components of the speaker 20 through the same first circuit board 26. The structure of the speaker 20 is relatively simple.

[0202] Please see Figure 21A , Figure 21A yes Figure 2 The speaker 20 shown is a schematic diagram of its structure in some other embodiments.

[0203] In some embodiments, the number of first circuit boards 26 may also be multiple, and the first connecting portion 261 of at least one of the multiple first circuit boards 26 may be connected to the first electrical connector 251 (see [link]). Figure 10B ), second electrical connector 252 (see Figure 10B A fixed connection is made, and the first electrical connector 251 and the second electrical connector 252 are electrically connected. The first connection portion 261 of at least one of the plurality of first circuit boards 26 can be connected to the third electrical connector 253 (see [link]). Figure 10B), Fourth electrical connector 254 (see Figure 10B It is fixedly connected and electrically connected to the third electrical connector 253 and the fourth electrical connector 254.

[0204] It is understandable that the first electrical connector 251 and the second electrical connector 252 can be electrically connected to the external components of the speaker 20 through a first circuit board 26, and the third electrical connector 253 and the fourth electrical connector 254 can be electrically connected to the external components of the speaker 20 through another first circuit board 26. On the one hand, this facilitates the assembly between the first circuit board 26 and the first electrical connector 251, the second electrical connector 252, the third electrical connector 253 and the fourth electrical connector 254; on the other hand, the wiring in different first circuit boards 26 can be arranged independently, and the wiring in different first circuit boards 26 is less likely to interfere with each other, which is beneficial for the individual control of the first diaphragm 231 and the second diaphragm 232.

[0205] Please refer to the following: Figure 21B and Figure 21C , Figure 21B yes Figure 2 The diagram shown is a structural schematic of the speaker 20 in some other embodiments. Figure 21C yes Figure 21B The speaker 20 shown is a partial exploded view in some embodiments. Exemplary, Figure 21B and Figure 21C The speaker 20 in the illustrated embodiment may include most of the technical content of the previous embodiment. The following mainly describes the differences between the two, and the most common aspects of the two will not be repeated.

[0206] In some embodiments, the first electrical connector 251 and the second electrical connector 252 can be arranged circumferentially along the speaker 20. The third electrical connector 253 and the fourth electrical connector 254 can be arranged circumferentially along the speaker 20. The first electrical connector 251 and the third electrical connector 253 can be arranged axially along the speaker 20. The second electrical connector 252 and the fourth electrical connector 254 can be arranged axially along the speaker 20. In this way, the first electrical connector 251, the second electrical connector 252, the third electrical connector 253, and the fourth electrical connector 254 can be arranged more compactly, so that the size of the first connection portion 261 of the first circuit board 26 can be smaller and the structure can be simpler, which is beneficial to the assembly of the first circuit board 26.

[0207] Understandable, Figure 21B and Figure 21CThe speaker 20 shown has its first electrical connector 251, second electrical connector 252, third electrical connector 253, and fourth electrical connector 254 all fixedly connected to the first connection portion 261 of the same first circuit board 26. In some other embodiments, at least two of the first electrical connector, second electrical connector 252, third electrical connector 253, and fourth electrical connector 254 may be connected to different first circuit boards 26.

[0208] It should be understood that Figure 21C This illustration only shows one arrangement of the first electrical connector 251, the second electrical connector 252, the third electrical connector 253, and the fourth electrical connector 254. In other embodiments, the first electrical connector 251, the second electrical connector 252, the third electrical connector 253, and the fourth electrical connector 254 can also be arranged in other ways. For example, the first electrical connector 251 and the second electrical connector 252 can be arranged along the axial direction of the speaker 20, and the first electrical connector 251 and the third electrical connector 253 can be arranged along the circumference of the speaker 20. The specific arrangement of the first electrical connector 251 to the fourth electrical connector 254 can be adjusted according to actual needs, and this application does not impose strict limitations on it.

[0209] The specific structure of the speaker 20 has been described above with reference to the accompanying drawings. The following section will describe the electronic device 100 including the speaker 20 with reference to the accompanying drawings. It is understood that the electronic device 100 may include the speaker 20 in any of the embodiments described above.

[0210] Please refer to the following: Figure 22 and Figure 23 , Figure 22 yes Figure 1 The diagram shows a partial exploded view of the structure of the electronic device 100 in some embodiments. Figure 23 yes Figure 1 The diagram shows a partial cross-sectional view of the electronic device 100 in some embodiments. Exemplary, Figure 22 and Figure 23 Only a portion of the structure of the electronic device 100 is shown, such as the casing 10, speaker 20, motherboard 30, etc.

[0211] In some embodiments, the electronic device 100 may include a housing 10, a speaker 20, a motherboard 30, and a second circuit board 40. The housing 10 may be the housing 10 described above. The motherboard 30 may be the motherboard 30 described above. The second circuit board 40 may be a flexible circuit board.

[0212] In some embodiments, the speaker 20 may be located within the housing 10 and fixedly connected to the housing 10. Exemplarily, the speaker 20 may be fixedly connected to the housing 10 by adhesive dispensing 50. In other embodiments, the speaker 20 may be fixedly connected to the housing 10 by welding or other means. Exemplarily, the sound outlet 101 communicates with the interior of the housing 10, so that sound emitted by the speaker 20 can be propagated to the exterior of the electronic device 100 through the sound outlet 101. Exemplarily, the second diaphragm 232 of the speaker 20 may face the sound outlet 101.

[0213] For example, the second connection portion 262 of the first circuit board 26 of the speaker 20 can extend from one side of the through hole 273 of the housing 27 to the other side of the through hole 273 of the housing 27. In this case, the second connection portion 262 can cover a portion of the through hole 273 of the housing 27.

[0214] In some embodiments, the motherboard 30 can be mounted on the housing 10. For example, the motherboard 30 can be fixedly connected to the housing 10 by adhesive or by fasteners such as bolts or studs. Exemplarily, the motherboard 30 can be located on the side of the second connection portion 262 of the first circuit board 26 away from the first diaphragm 231. In this way, the structure of the electronic device 100 is more reasonable, and it can make reasonable use of the internal space of the electronic device 100, which is beneficial to the arrangement of the internal components of the electronic device 100.

[0215] In some embodiments, the motherboard 30 is electrically connected to the first circuit board 26. Exemplarily, the second circuit board 40 is electrically connected between the motherboard 30 and the first circuit board 26. It is understood that in this embodiment, the first circuit board 26 can be electrically connected to the motherboard 30 via the second circuit board 40. In other embodiments, the first circuit board 26 may also be electrically connected to the motherboard 30 via leads or other electrical connection structures; this application does not impose strict limitations on this.

[0216] For example, the housing 10 may be provided with a communication hole 122. A portion of the first circuit board 26 of the speaker 20 may be exposed relative to the communication hole 122. For example, at least a portion of the second connection portion 262 of the first circuit board 26 may be exposed relative to the communication hole 122. In some other embodiments, a portion of the first circuit board 26 of the speaker 20 may not be exposed relative to the communication hole 122.

[0217] For example, the second circuit board 40 may pass through the through hole 122. One end of the second circuit board 40 is fixedly connected to the first circuit board 26, for example, one end of the second circuit board 40 may be fixedly connected to the second connection portion 262 of the first circuit board 26. The other end of the second circuit board 40 is fixedly connected to the main board 30. In other examples, the second circuit board 40 may also extend to other locations on the speaker 20 to connect to the first circuit board 26.

[0218] In this embodiment, the first circuit board 26 of the speaker 20 can be electrically connected to the main board 30 via the second circuit board 40, thereby enabling electrical connection to other components of the electronic device 100 via the main board 30. For example, the speaker 20 can be electrically connected to the power supply (not shown) of the electronic device 100 via the second circuit board 40 and the main board 30, allowing the power supply of the electronic device 100 to power the speaker 20. The electronic device 100 has a relatively simple structure, and the use of circuit boards to achieve the electrical connection between the first circuit board 26 and the main board 30 results in better reliability of the electrical connection between the first circuit board 26 and the main board 30. Furthermore, the main board 30 can control the speaker 20. For example, the controller (not shown) on the main board 30 can also be used to control the current state of the voice coil, thereby controlling the vibration frequency and amplitude of the first diaphragm 231 and the second diaphragm 232.

[0219] In this embodiment, by setting the plane of the first connecting portion 261 of the first circuit board 26 parallel to the axial direction of the speaker 20, it is beneficial to reduce the circumferential size of the speaker 20. Therefore, when the speaker 20 is installed inside the housing 10 of the electronic device 100, the speaker 20 occupies less space inside the housing 10, which is beneficial not only to the arrangement of other components inside the electronic device 100 but also to the miniaturization of the electronic device 100. By setting the second connecting portion 262 of the first circuit board 26 on the side of the first diaphragm 231 facing away from the magnetic circuit assembly 22 of the frame 21, and by setting the plane of the second connecting portion 262 of the first circuit board 26 perpendicular to the axial direction of the speaker 20, the second connecting portion 262 will not occupy excessive space in the axial direction of the speaker 20. Therefore, when the speaker 20 is installed inside the housing 10 of the electronic device 100, the speaker 20 occupies less space inside the housing 10, which is beneficial not only to the arrangement of other components inside the electronic device 100 but also to the miniaturization of the electronic device 100.

[0220] Furthermore, in this embodiment, the first circuit board 26 is a flexible circuit board, and at least a portion of the first circuit board 26 can be bent. For example, the third connecting portion 263 of the first circuit board 26 can be bent, so that the shape of the first circuit board 26 can be adjusted according to the shape of the housing 27 to fit the housing 27. Thus, when the speaker 20 is installed inside the housing 10 of the electronic device 100, the speaker 20 occupies less space inside the housing 10 of the electronic device 100, which is beneficial not only to the arrangement of other components inside the electronic device 100 but also to the miniaturization of the electronic device 100. Secondly, the shape of the first circuit board 26 can be designed according to actual needs, and the structure of the speaker 20 can be flexibly adjusted according to actual needs. It is understood that in this embodiment, the structure of the first circuit board 26 can be adjusted according to the position of the connecting hole 122 so that the second connecting portion 262 of the first circuit board 26 can be exposed relative to the connecting hole 122, thereby facilitating the electrical connection of the first circuit board 26 to the main board 30 through the second circuit board 40.

[0221] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0222] The above are merely some embodiments of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A loudspeaker (20), characterized in that, The device includes a frame (21), a magnetic circuit assembly (22), a first diaphragm (231), a first voice coil (241), a first electrical connector (251), and a first circuit board (26). The magnetic circuit assembly (22) is fixedly connected to the frame (21). The periphery of the first diaphragm (231) is fixed to the frame (21) and located on one side of the magnetic circuit assembly (22). The magnetic circuit assembly (22) has a first magnetic gap (22a). One end of the first voice coil (241) is fixedly connected to the first diaphragm (231), and the other end is located in the first magnetic gap (22a). The basin stand (21) includes an outer side (213) and an inner side (214) facing away from each other; The first electrical connector (251) is electrically connected to the first voice coil (241), at least a portion of the first electrical connector (251) is embedded in the basket frame (21), and a portion of the first electrical connector (251) is exposed relative to the outer side (213) of the basket frame (21). The first circuit board (26) includes a first connecting part (261) and a second connecting part (262). The first connecting part (261) is fixedly connected to a first electrical connector (251) and electrically connected to the first electrical connector (251). The second connecting part (262) is located on the side of the first diaphragm (231) facing away from the magnetic circuit assembly (22).

2. The loudspeaker (20) according to claim 1, characterized in that, The plane of the first connecting part (261) intersects with the plane of the second connecting part (262).

3. The loudspeaker (20) according to claim 2, characterized in that, The first connecting portion (261) is shown in a plane parallel to the axial direction of the speaker (20), and the plane where the second connecting portion (262) is located is perpendicular to the axial direction of the speaker (20).

4. The loudspeaker (20) according to claim 1, characterized in that, The first circuit board (26) further includes a third connecting part (263), which is electrically connected between the first connecting part (261) and the second connecting part (262), and the third connecting part (263) is deformable.

5. The loudspeaker (20) according to claim 4, characterized in that, The first end (263a) of the third connecting part (263) is connected to the first connecting part (261), and the second end (263b) of the third connecting part (263) is bent relative to the first connecting part (261) towards the first diaphragm (231) and connected to the second connecting part (262).

6. The loudspeaker (20) according to claim 4, characterized in that, The third connecting part (263) includes a third sub-connecting part (2631) and a fourth sub-connecting part (2632), and the third sub-connecting part (2631) and the fourth sub-connecting part (2632) are arranged at intervals; The third sub-connecting part (2631) and the fourth sub-connecting part (2632) are electrically connected between the first connecting part (261) and the second connecting part (262), respectively.

7. The loudspeaker (20) according to claim 4, characterized in that, The loudspeaker (20) also includes a housing (27) which is fixedly connected to the frame (21), and at least a portion of the first diaphragm (231) is located between the housing (27) and the frame (21); The second connecting part (262) is located on the side of the housing (27) opposite to the first diaphragm (231) and is fixedly connected to the housing (27). At least a portion of the third connecting part (263) is disposed opposite to the housing (27).

8. The loudspeaker (20) according to claim 7, characterized in that, The housing (27) includes a top wall (271) and a side wall (272), the side wall (272) surrounding the top wall (271) and bending relative to the top wall (271) toward the first diaphragm (231); The sidewall (272) is fixedly connected to the periphery of the first diaphragm (231), and the top wall (271) is located on the side of the first diaphragm (231) facing away from the magnetic circuit assembly (22); The second connecting part (262) is fixedly connected to the top wall (271), and at least a portion of the third connecting part (263) is disposed opposite to the side wall (272).

9. The loudspeaker (20) according to any one of claims 1 to 8, characterized in that, The first electrical connector (251) includes a first connecting surface (2513), at least a portion of which is exposed relative to the outer side (213) of the basin stand (21). The first connecting portion (261) includes a first surface (2613) and a second surface (2614) disposed opposite to each other, with the first surface (2613) of the first connecting portion (261) facing the first connecting surface (2513). The first circuit board (26) further includes a first pad (2641), a second pad (2642), and a first conductive element (281). The first pad (2641) is exposed on the first surface (2613) of the first connecting portion (261). The second pad (2642) is disposed on the second surface (2614) of the first connecting portion (261). A portion of the first conductive element (281) is fixedly connected to the first pad (2641) and the first connecting surface (2513). A portion of the first conductive element (281) is fixedly connected to the second pad (2642).

10. The loudspeaker (20) according to claim 9, characterized in that, The first connecting part (261) is also provided with a first through hole (2643), and the first through hole (2643) of the first connecting part (261) connects the first pad (2641) and the second pad (2642); A portion of the first conductive element (281) is located between the first pad (2641) and the first connecting surface (2513), and a portion of the first conductive element (281) is disposed in the first through hole (2643) of the first connecting portion (261).

11. The loudspeaker (20) according to any one of claims 1 to 8, characterized in that, The loudspeaker (20) also includes a second diaphragm (232), a second voice coil (242), and a third electrical connector (253); The periphery of the second diaphragm (232) is fixed to the frame (21), the magnetic circuit assembly (22) has a second magnetic gap (22b), one end of the second voice coil (242) is fixedly connected to the second diaphragm (232), and the other end is located in the second magnetic gap (22b); The third electrical connector (253) is electrically connected to the second voice coil (242). At least a portion of the third electrical connector (253) is embedded in the basket frame (21). A portion of the third electrical connector (253) is exposed relative to the outer side (213) of the basket frame (21) and is fixedly connected to the first connecting part (261) and electrically connected to the first connecting part (261).

12. The loudspeaker (20) according to claim 11, characterized in that, The first electrical connector (251) and the third electrical connector (253) are arranged circumferentially along the loudspeaker (20); Alternatively, the first electrical connector (251) and the third electrical connector (253) are arranged along the axial direction of the speaker (20).

13. The loudspeaker (20) according to claim 11, characterized in that, The first connecting part (261) includes a first sub-connecting part (2611) and a second sub-connecting part (2612), the first sub-connecting part (2611) and the second sub-connecting part (2612) are spaced apart and are both connected to the second connecting part (262); The first sub-connection part (2611) is fixedly connected to the first electrical connector (251) and electrically connected to the first electrical connector (251). The second sub-connection part (2612) is fixedly connected to the third electrical connector (253) and electrically connected to the third electrical connector (253).

14. The loudspeaker (20) according to claim 11, characterized in that, The number of the first circuit board (26) is one; Alternatively, there may be multiple first circuit boards (26), at least one of the first circuit boards (26) has a first connecting portion (261) fixedly connected to the first electrical connector (251) and electrically connected to the first electrical connector (251), and at least one other first circuit board (26) has a first connecting portion (261) fixedly connected to the third electrical connector (253) and electrically connected to the third electrical connector (253).

15. The loudspeaker (20) according to any one of claims 1 to 8, characterized in that, The first connecting part (261) is welded to the first electrical connector (251), and the first connecting part (261) is also bonded to the outer side (213) of the basin frame (21).

16. The loudspeaker (20) according to any one of claims 1 to 8, characterized in that, The first circuit board (26) is a flexible circuit board.

17. An electronic device (100), characterized in that, It includes a housing (10) and a speaker (20) as claimed in any one of claims 1 to 16, the speaker (20) being mounted on the housing (10).

18. The electronic device (100) according to claim 17, characterized in that, The electronic device (100) further includes a motherboard (30), which is mounted on the housing (10). The motherboard (30) is located on the side of the second connection portion (262) away from the first diaphragm (231) and is electrically connected to the first circuit board (26).

19. The electronic device (100) according to claim 18, characterized in that, The electronic device (100) further includes a second circuit board (40), which is electrically connected between the motherboard (30) and the first circuit board (26).

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