Conductive heat dissipation film for circuit board

Abstract

The utility model discloses a kind of electrically conductive heat dissipation films for circuit board, electrically conductive heat dissipation films for circuit board, including film body, the film body includes conductive copper foil and the conductive glue being located at the bottom of the conductive copper foil, the bottom of the conductive glue is provided with release paper and insulating film, the insulating film is located at the two sides of the conductive glue, and is connected with the release paper, the top of the conductive copper foil is provided with a layer of protective film, the protective film is provided with heat-conducting graphite layer and conductive sponge between the conductive copper foil, the conductive sea is located in the just above of the insulating film, the heat-conducting graphite layer is located at the periphery of the conductive sponge.The utility model structure is simple, convenient to use, shielding property, conductivity and heat dissipation performance are good, can effectively improve the toughness and impact resistance of conductive copper foil simultaneously, so that it is not easy to tear and break, compared with prior art, with good conductivity, heat dissipation, shielding property and shock resistance.

Description

Technical Field

[0001] This utility model relates to the field of electronics, and in particular to a conductive heat dissipation film for circuit boards. Background Technology

[0002] Conductive copper foil is mainly used in various electronic products such as transformers, mobile phones, computers, PDAs, PDPs, LED displays, laptops, tablets, and copiers where electromagnetic shielding is required. The function of conductive copper foil is to eliminate electromagnetic interference (EMI), isolate electromagnetic waves from harming the human body, and prevent unnecessary voltage and current from affecting functionality.

[0003] In recent years, with the rapid upgrading of electronic products, significant structural adjustments have been made, necessitating readjustments to circuit structures and electronic components. This has resulted in substantial shortcomings in internal heat dissipation, electrostatic discharge protection, and shock resistance. For example, our company currently possesses a conductive heat dissipation film for tablet computers, patent application number CN202122222820.3, but its heat dissipation, shock resistance, and structural design no longer meet the requirements of current electronic products. Therefore, we have researched a conductive heat dissipation film for circuit boards. Utility Model Content

[0004] The purpose of this invention is to overcome the above-mentioned problems in the prior art and provide a conductive heat dissipation film for circuit boards. This invention not only has good heat insulation, tensile strength and antistatic effects, but also has good shock resistance.

[0005] To achieve the above-mentioned technical objectives and effects, this utility model is implemented through the following technical solution:

[0006] A conductive heat dissipation film for circuit boards includes a film body comprising a conductive copper foil and a conductive adhesive disposed at the bottom of the conductive copper foil. A release paper and an insulating film are disposed at the bottom of the conductive adhesive. The insulating film is located on both sides of the conductive adhesive and connected to the release paper. A protective film is disposed on the top of the conductive copper foil. A thermally conductive graphite layer and a conductive sponge are disposed between the protective film and the conductive copper foil. The conductive sponge is located directly above the insulating film, and the thermally conductive graphite layer is located around the conductive sponge.

[0007] This technical solution facilitates the conductivity, heat conduction, heat dissipation, insulation, electromagnetic shielding, and shock resistance of the conductive heat dissipation film. The insulating film can be used to avoid local electronic components on the circuit board, while the conductive sponge can not only protect the electronic components on the circuit board with its own elasticity, but also conduct electricity and guide the release of static electricity.

[0008] As a preferred embodiment of this application, a cutting line is provided between the release paper and the protective film, the cutting line dividing the release paper and the protective film into two parts.

[0009] This technical solution helps to peel the release paper and protective film in sections, reducing wrinkling, deformation and breakage of the conductive copper foil caused by peeling.

[0010] As a preferred embodiment of this application, positioning holes are provided on the left and right sides of the protective film.

[0011] This technical solution is adopted to facilitate the positioning of conductive copper foil.

[0012] As a preferred embodiment of this application, the protective film is provided with clearance holes to avoid the conductive sponge.

[0013] This technical solution facilitates the adhesion of the protective film to the conductive copper foil, reducing localized protrusions in the protective film.

[0014] As a preferred embodiment of this application, the thickness of the thermally conductive graphite layer is set to 0.01-0.015 mm.

[0015] This technical solution helps dissipate heat from electronic components and shielding covers on heat dissipation circuit boards.

[0016] As a preferred embodiment of this application, the thickness of the conductive copper foil is set at 0.05-0.1 mm.

[0017] This technical solution helps increase the tension and strength of conductive copper foil, preventing it from wrinkling, deforming, and cracking.

[0018] The beneficial effects of this utility model are:

[0019] This invention has a simple structure and is easy to use. It has good shielding, conductivity and heat dissipation performance, and can effectively improve the toughness and impact resistance of conductive copper foil, making it less prone to tearing and breakage. Compared with existing technologies, it has better conductivity, heat dissipation, shielding and shock resistance.

[0020] The above description is merely an overview of the technical solution of this utility model. To better understand the technical means of this utility model and to enable its implementation according to the description, the following detailed description uses preferred embodiments of this utility model in conjunction with the accompanying drawings. Specific implementation methods of this utility model are given in detail in the following embodiments and their accompanying drawings. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0022] Figure 1 This is a schematic diagram related to this application.

[0023] Figure 2 This is a schematic diagram of the structure involved in this application.

[0024] The labels in the diagram are as follows: 1. Conductive copper foil; 2. Conductive adhesive; 3. Release paper; 4. Insulating film; 5. Protective film; 6. Thermally conductive graphite layer; 7. Conductive sponge; 8. Cutting line; 501. Clearance hole; 502. Positioning hole. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings:

[0026] Example:

[0027] A conductive heat dissipation film for a circuit board, as shown in the reference. Figure 1 and Figure 2 The system includes a membrane body, which comprises a conductive copper foil 1 and a conductive adhesive 2 disposed at the bottom of the conductive copper foil 1. A release paper 3 and an insulating film 4 are disposed at the bottom of the conductive adhesive 2. The insulating film 4 is located on the left and right sides of the conductive adhesive 2 and is connected to the release paper 3, serving to avoid obstructing certain electronic components on the circuit board. A protective film 5 is disposed on the top of the conductive copper foil 1. A thermally conductive graphite layer 6 and a conductive sponge 7 are disposed between the protective film 5 and the conductive copper foil 1. The conductive sponge 7 is located directly above the insulating film 4, and not only can it protect the electronic components on the circuit board using its elasticity, but it can also conduct electricity and guide the release of static electricity. The thermally conductive graphite layer 6 is located around the conductive sponge 7. In this embodiment, the thickness of the thermally conductive graphite layer 6 is set at 0.12 mm, which helps to dissipate heat from the electronic components and shielding on the heat dissipation circuit board. The thickness of the conductive copper foil 1 is set at 0.1 mm, which increases the tension and strength of the conductive copper foil 1, preventing it from wrinkling, deforming, or opening. In other embodiments, the thickness of the thermally conductive graphite layer 6 is set to 0.01-0.015 mm, while the thickness of the conductive copper foil 1 is set to 0.05-0.1 mm.

[0028] Reference Figure 1 and Figure 2 In this embodiment, a cutting line 8 is provided between the release paper 3 and the protective film 5, and the cutting line 8 divides the release paper 3 and the protective film 5 into two parts for segmented peeling of the release paper 3 and the protective film 5, thereby reducing wrinkling, deformation and breakage of the conductive copper foil 1 caused by peeling.

[0029] Reference Figure 1 and Figure 2To facilitate the installation and positioning of the conductive copper foil 1, positioning holes 502 are provided on both the left and right sides of the protective film 5 in this embodiment.

[0030] Reference Figure 2 To facilitate the adhesion of the protective film 5 to the conductive copper foil 1 and reduce local protrusions in the protective film 5, in this embodiment, the protective film 5 is provided with clearance holes 501 to avoid the conductive sponge 7.

[0031] Specifically, in actual use, first peel off the release paper 3, then position the positioning hole 502 on the protective film 5 of the conductive copper foil 1 with the positioning post on the fixture, and finally, paste the conductive copper foil 1 to the preset position on the circuit board in the fixture, so that the insulating film 4 on the conductive copper foil 1 avoids the electronic component sockets on the circuit board. The protective film 5 on the conductive copper foil 1 is removed when the circuit board is assembled (machined).

[0032] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A conductive heat dissipation film for circuit boards, comprising a film body, characterized in that: The membrane body includes a conductive copper foil (1) and a conductive adhesive (2) disposed at the bottom of the conductive copper foil (1). A release paper (3) and an insulating film (4) are disposed at the bottom of the conductive adhesive (2). The insulating film (4) is located on both sides of the conductive adhesive (2) and connected to the release paper (3). A protective film (5) is disposed on the top of the conductive copper foil (1). A thermally conductive graphite layer (6) and a conductive sponge (7) are disposed between the protective film (5) and the conductive copper foil (1). The conductive sponge (7) is located directly above the insulating film (4), and the thermally conductive graphite layer (6) is located around the conductive sponge (7).

2. The conductive heat dissipation film for circuit boards according to claim 1, characterized in that, A cutting line (8) is provided between the release paper (3) and the protective film (5), and the cutting line (8) divides the release paper (3) and the protective film (5) into two parts.

3. The conductive heat dissipation film for circuit boards according to claim 1, characterized in that, Positioning holes (502) are provided on the left and right sides of the protective film (5).

4. The conductive heat dissipation film for circuit boards according to claim 1, characterized in that, The protective film (5) is provided with a clearance hole (501) to avoid the conductive sponge (7).

5. The conductive heat dissipation film for a circuit board according to claim 1, characterized in that, The thickness of the thermally conductive graphite layer (6) is set at 0.01-0.015 mm.

6. The conductive heat dissipation film for a circuit board according to claim 1, characterized in that, The thickness of the conductive copper foil (1) is set at 0.05-0.1 mm.

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