Microelectronic assembly module

Abstract

The utility model relates to a kind of microelectronic assembly module in the microelectronic module technical field, including cushion block, support platform and pedestal, the surface of support platform and pedestal is respectively equipped with the clamping block and open slot for auxiliary connection, open slot is non-through structure, clamping block is installed on the surface of pedestal by clamping spring and rubber flexible rod;The structure is adopted to the recessed structure of open slot and is clamped, cooperate the clamping block of protruding structure and be clamped together, to increase the connection stability of microelectronic assembly module, reduce the situation that fall or disconnect during connection process appears;Open slot using the non-through groove structure of setting, for connecting external corresponding structure, install and fix pedestal, cooperate clamping block, clamping spring and rubber flexible rod, constitute the elastic reset mechanism of clamping block, so that clamping block plays the effect of self-locking after insertion, form mechanical self-locking mechanism by the design, effectively prevent module from loosening due to vibration or impact in use process.

Description

Technical Field

[0001] This utility model relates to the field of microelectronic module technology, and in particular to a microelectronic component module. Background Technology

[0002] Microelectronic components are integrated units composed of multiple tiny electronic elements, such as integrated circuits, transistors, resistors, capacitors, and related circuits, typically used to perform specific functions. These components can be independent functional units or part of a larger system, while modules assemble microelectronic components into a whole or framework to facilitate the installation or connection of the microelectronic components.

[0003] Most existing microelectronic modules use simple plug-in or screw-fixing methods for connection. The traditional plug-in connection lacks a locking mechanism, which can easily lead to detachment or poor contact under vibration or impact. While screw fixing is more secure, it is cumbersome and time-consuming to operate, and repeated disassembly and assembly can easily cause the screws to strip or the holes to wear. In addition, misalignment can easily occur during insertion, resulting in inaccurate docking or poor contact. In complex environments, such as vehicle-mounted or industrial sites, the connection is prone to loosening or even detachment due to vibration, requiring additional locking or fixing devices, which increases structural complexity and manufacturing costs. To address these issues, the inventors have proposed a microelectronic component module to solve the aforementioned technical problems of increasing its connection stability. Utility Model Content

[0004] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the aforementioned problems.

[0005] A microelectronic component module includes a pad, a support platform, and a base. One end of the base abuts against the surface of the support platform. The support platform is located between the pad and the base. A soft rubber top block is connected to the surface of the pad. A plurality of electronic connection elements for connecting external electronic components are connected to the surface of the pad. A plurality of connection holes for mating and mounting the electronic connection elements are opened on the surface of the soft rubber top block. The support platform and the base are respectively equipped with a locking block and an opening slot for auxiliary connection. The opening slot is a non-through structure. The locking block is installed on the surface of the base by locking spring and rubber flexible rod.

[0006] This structure employs a recessed, slotted design for locking, working in conjunction with a raised locking block to further secure the module. This increases the stability of the microelectronic component module connection and reduces the risk of it falling out or disconnecting during the connection process. The pad serves as the bottom support structure, securing the soft rubber top block and electronic connecting components. The support platform, located between the pad and the base, provides cushioning and support. The base, as the upper main body of the module, ensures overall stability. A non-through grooved opening allows for the installation and fixation of the base when connecting to corresponding external structures. Together with the locking block, locking spring, and rubber flexible rod, this forms an elastic reset mechanism for the locking block, enabling it to self-lock after insertion. This mechanical self-locking mechanism effectively prevents the module from loosening due to vibration or impact during use.

[0007] Furthermore, the surface of the base is provided with a mating groove for placing the card block. The mating groove and the card block are provided with a clearance fit. The interior of the mating groove is provided with a spring mounting hole for use with the snap-fit ​​spring and the rubber flexible rod. The rubber flexible rod is located inside the snap-fit ​​spring, and one end extends into the interior of the spring mounting hole.

[0008] The clearance fit design between the groove and the locking block allows the locking block to move within a certain range, ensuring that it can accurately enter the external connection matching groove. In addition, this design can absorb a certain amount of assembly error, improve the fault tolerance of installation, and the locking spring and rubber soft rod play a buffering role, reducing the impact force of rigid connection.

[0009] Furthermore, the surface of the soft rubber top block is equipped with guide posts, which pass through the soft rubber top block, pad block, support platform and base in sequence. A support rod is provided between the soft rubber top block and the support platform to increase the connection stability. The interior of the soft rubber top block, pad block, support platform and base are all provided with mounting grooves for matching the guide posts and support rods.

[0010] The design of the guide pillars and mounting slots avoids offset or misalignment, improving the accuracy of repeated assembly of the module. The support rod is located between the soft rubber top block and the support platform, providing additional mechanical support and preventing the soft rubber top block from deforming due to uneven force. In high-frequency insertion and removal and vibration environments, this design can effectively maintain the overall rigidity and stability of the module and extend its service life.

[0011] Furthermore, the support platform is equipped with a return spring inside to assist the guide post in resetting and rebounding. The guide post structure is symmetrically installed at the left and right ends of the soft rubber top block.

[0012] The reset spring is located inside the support platform. After the guide post is subjected to external force, the spring force will restore the guide post to its initial position. Combined with the symmetrical installation structure, the force on the guide post is more even, avoiding the offset or deformation caused by force on one side. This further improves the connection stability and durability of the module. Because the guide post is symmetrically installed, the wear on both sides tends to be consistent, which extends the service life of the overall component and reduces the risk of early failure caused by wear on one side.

[0013] By embedding the reset spring inside the support platform, external space is saved, making the entire module design more compact and improving space utilization. This compact design is suitable for use in miniaturized electronic devices with limited space in this microelectronic component module.

[0014] Furthermore, the surface of the base is provided with a wire groove, and the inside of the wire groove is connected to a cable for power connection with external electronic components. Using wire connection helps to reduce electromagnetic interference (EMI). In high-frequency signal transmission environment, using cable transmission can simplify the signal and prevent interference.

[0015] Compared with the prior art, the beneficial effects of this utility model are: this structure adopts an open slot concave structure for snap-fit, and at the same time works with the protruding structure snap-fit ​​block to tighten it, thereby increasing the connection stability of the microelectronic component module and reducing the occurrence of falling off or disconnection during the connection process.

[0016] The open slot with a non-through groove structure is used to install and fix the base when connecting to the corresponding external structure. Together with the locking block, locking spring and rubber soft rod, it forms an elastic reset mechanism for the locking block, so that the locking block has a self-locking effect after insertion. This design forms a mechanical self-locking mechanism, which effectively prevents the module from loosening due to vibration or impact during use. Attached Figure Description

[0017] Figure 1 This is a front view of a microelectronic component module;

[0018] Figure 2 This is a rear view of a microelectronic component module;

[0019] Figure 3 It is an activity state diagram of a microelectronic component module;

[0020] Figure 4 This is an exploded view from below of a microelectronic component module;

[0021] Figure 5 This is a 3D view of a microelectronic component module;

[0022] In the diagram: pad-1, support platform-2, base-3, soft rubber top block-4, electronic connection element-5, connection hole-6, locking block-7, opening slot-8, snap-fit ​​spring-9, rubber flexible rod-10, mating groove-11, spring mounting hole-12, guide post-13, support rod-14, mounting groove-15, reset spring-16, wire groove-17, cable-18. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0024] For this embodiment, please refer to Figures 1-5 The specific implementation of the microelectronic component module includes a pad 1, a support platform 2 and a base 3. One end of the base 3 abuts against the surface of the support platform 2. The support platform 2 is located between the pad 1 and the base 3. A soft rubber top block 4 is connected to the surface of the pad 1. Several electronic connection elements 5 for connecting external electronic components are connected to the surface of the pad 1. Several connection holes 6 are opened on the surface of the soft rubber top block 4 to be installed in conjunction with the electronic connection elements 5. The support platform 2 and the base 3 are respectively equipped with a locking block 7 and an opening slot 8 for auxiliary connection. The opening slot 8 is a non-through structure. The locking block 7 is installed on the surface of the base 3 by a locking spring 9 and a rubber soft rod 10.

[0025] This structure uses a concave structure with an opening slot 8 for snap-fit, and works in conjunction with a protruding snap-fit ​​block 7 to tighten it, thereby increasing the connection stability of the microelectronic component module and reducing the possibility of it falling off or breaking during the connection process. The pad block 1 serves as the bottom support structure to fix the soft rubber top block 4 and the electronic connection element 5. The support platform 2 is located between the pad block 1 and the base 3, which plays a role in buffering and supporting. The base 3 serves as the upper main body of the overall module and plays a role in overall stability. By setting the opening slot 8 with a non-through groove structure, the base 3 is installed and fixed when connecting to the corresponding external structure. Together with the snap-fit ​​block 7, snap-fit ​​spring 9 and rubber soft rod 10, it forms an elastic reset mechanism for the snap-fit ​​block 7, so that the snap-fit ​​block 7 has a self-locking effect after insertion. This design forms a mechanical self-locking mechanism, which effectively prevents the module from loosening due to vibration or impact during use.

[0026] The base 3 has a mating groove 11 for placing the card block 7 on its surface. The mating groove 11 and the card block 7 are provided with a clearance fit. The mating groove 11 has a spring mounting hole 12 inside for use with the snap-fit ​​spring 9 and the rubber flexible rod 10. The rubber flexible rod 10 is located inside the snap-fit ​​spring 9 and one end extends into the inside of the spring mounting hole 12.

[0027] The clearance fit design between the groove 11 and the locking block 7 allows the locking block 7 to move within a certain range, ensuring that it can accurately enter the external connection matching groove. In addition, this design can absorb a certain assembly error and improve the fault tolerance of the installation. The locking spring 9 and the rubber soft rod 10 play a buffering role, reducing the impact force of the rigid connection.

[0028] The surface of the soft rubber top block 4 is equipped with a guide post 13, which passes through the soft rubber top block 4, the pad block 1, the support platform 2 and the base 3 in sequence. A support rod 14 is provided between the soft rubber top block 4 and the support platform 2 to increase the connection stability. The interior of the soft rubber top block 4, the pad block 1, the support platform 2 and the base 3 are all provided with mounting grooves 15 that are used to match the guide post 13 and the support rod 14.

[0029] The design of the guide post 13 and mounting groove 15 avoids offset or misalignment, improving the accuracy of repeated assembly of the module. The support rod 14, located between the soft rubber top block 4 and the support platform 2, provides additional mechanical support, preventing deformation of the soft rubber top block due to uneven force. Under high-frequency insertion / removal and vibration environments, this design effectively maintains the overall rigidity and stability of the module, extending its service life. When a force is applied to the soft rubber top block 4, one end of the soft rubber top block 4 can move towards the support platform 2. Figure 3 As shown.

[0030] The support platform 2 is equipped with a reset spring 16 for assisting the guide post 13 in resetting and rebounding. The guide post 13 is symmetrically installed at the left and right ends of the soft rubber top block 4.

[0031] The reset spring 16 is located inside the support platform 2. After the guide post 13 is subjected to external force, the spring force can restore the guide post 13 to its initial position. Combined with the symmetrical installation structure, the force on the guide post 13 is more even, avoiding the problem of displacement or deformation caused by force on one side. This further improves the connection stability and durability of the module. Since the guide post 13 is symmetrically installed, the wear degree on both sides tends to be consistent, which extends the service life of the overall component and reduces the risk of early failure caused by wear on one side.

[0032] By embedding the reset spring 16 inside the support platform 2, external space is saved, making the entire module design more compact and improving space utilization. This compact design is suitable for use in miniaturized electronic devices with limited space in this microelectronic component module.

[0033] The surface of the base 3 is provided with a wire groove 17, and the inside of the wire groove 17 is connected to a cable 18 for power connection with external electronic components. The use of wire connection helps to reduce electromagnetic interference (EMI). In high-frequency signal transmission environment, the use of cable 18 for transmission can simplify the signal and prevent interference.

[0034] The key design feature of this utility model is that the structure uses a concave structure with an open slot 8 for snap-fitting, and works in conjunction with a protruding structure of a snap-fit ​​block 7 to tighten it, thereby increasing the connection stability of the microelectronic component module and reducing the occurrence of falling off or disconnection during the connection process.

[0035] An opening slot 8 with a non-through groove structure is used to install and fix the base 3 when connecting to the corresponding external structure. Together with the locking block 7, locking spring 9 and rubber flexible rod 10, it forms an elastic reset mechanism for the locking block 7, so that the locking block 7 can play a self-locking effect after insertion. This design forms a mechanical self-locking mechanism, which effectively prevents the module from loosening due to vibration or impact during use.

[0036] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A microelectronic component module, comprising a pad, a support platform, and a base, characterized in that: One end of the base abuts against the surface of the support platform. The support platform is located between the pad and the base. A soft rubber top block is connected to the surface of the pad. Several electronic connection elements for connecting external electronic components are connected to the surface of the pad. Several connection holes for matching and installing with the electronic connection elements are opened on the surface of the soft rubber top block. The surfaces of the support platform and the base are respectively equipped with locking blocks and opening slots for auxiliary connection. The opening slots are non-through structures. The locking blocks are installed on the surface of the base by locking springs and rubber flexible rods.

2. A microelectronic component module according to claim 1, characterized in that: The base has a mating groove for placing the locking block on its surface. The mating groove and the locking block are fitted with a clearance. The interior of the mating groove has a spring mounting hole for use with the locking spring and the rubber flexible rod. The rubber flexible rod is located inside the locking spring, and one end extends into the interior of the spring mounting hole.

3. A microelectronic component module according to claim 1, characterized in that: The surface of the soft rubber top block is equipped with guide posts, which pass through the soft rubber top block, pad block, support platform and base in sequence. A support rod is provided between the soft rubber top block and the support platform to increase the connection stability. The interior of the soft rubber top block, pad block, support platform and base are all provided with mounting grooves for matching the guide posts and support rods.

4. A microelectronic component module according to claim 3, characterized in that: The support platform is equipped with a reset spring inside to assist the guide post in resetting and rebounding. The guide post structure is symmetrically installed at the left and right ends of the soft rubber top block.

5. A microelectronic component module according to any one of claims 1-3, characterized in that: The surface of the base is provided with a wire groove, and the inside of the wire groove is connected to a cable for power connection with external electronic components.

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