A direct current power supply device

Abstract

The utility model relates to power supply equipment technical field, concretely relates to a direct current power supply equipment, including detachable connection's casing A and casing B, the symmetrical heat dissipation hole of casing A's lateral wall is set up, and the through hole is also set up on the rear side outer wall of casing A, and the component and spare part installed in the inside of casing A, the semiconductor refrigeration board is positioned in the component one side position in the inside of casing A and is set up, and the hot end of semiconductor refrigeration board sets up in the component one side close and keeps the adhesion, and the cold end of semiconductor refrigeration board sets up in the component one side far away, and the guide groove on the semiconductor refrigeration board is set up, is used for the communication heat dissipation hole and through hole. Through the semiconductor refrigeration board and the corresponding setting of the bladder body set up, the inside is carried out high -efficient cooling when power supply equipment uses, and also can isolate external air when not using, avoid dust into equipment inside influence subsequent use.

Description

Technical Field

[0001] This utility model relates to the field of power supply equipment technology, specifically to a DC power supply device. Background Technology

[0002] A DC power supply is a device that maintains a constant voltage and current in a circuit. In actual use, due to the generation of current inside, its internal temperature will rise during operation. Therefore, heat dissipation holes are usually provided on the casing of the power supply device. However, since there are usually many electronic components inside the power supply device, it is necessary to avoid external dust from affecting the internal components. The heat dissipation holes, which are always open, can easily allow external dust to enter the power supply device and affect its performance. In view of this, we propose a DC power supply device. Utility Model Content

[0003] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a DC power supply device that can effectively solve the problem that the internal temperature of the existing power supply device will rise during operation. Therefore, heat dissipation holes are usually provided on the outer shell of the power supply device. However, since there are usually many electronic components inside the power supply device, it is necessary to avoid external dust from affecting the internal components. The heat dissipation holes, which are always open, can easily allow external dust to enter the power supply device and affect its performance.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] This utility model provides a DC power supply device, including a detachably connected housing A and a housing B. Heat dissipation holes are symmetrically opened on the side wall of housing A, and a through hole is also opened on the rear outer wall of housing A.

[0006] And components installed inside housing A. A semiconductor cooling plate is provided inside housing A on one side of the components, with the hot end of the semiconductor cooling plate located close to the components and in contact with them, and the cold end of the semiconductor cooling plate located away from the components.

[0007] And guide grooves formed on the semiconductor cooling plate to connect heat dissipation holes and through holes.

[0008] Furthermore, it also includes a connector located at the middle of the upper end of housing A, the connector being electrically connected to the component via a connecting post; and a movable plate movably connected to the outer wall of the component, the lower end of the movable plate contacting the outer wall of the bladder located on the inner wall of housing A.

[0009] Furthermore, it also includes a contact piece disposed at the end of the movable plate, the contact piece corresponding to the position of the connecting post; and a spring disposed between the contact piece and the middle of the component, the upper end of the spring being connected to the contact piece, and the lower end of the spring being connected to the top surface of the component.

[0010] Furthermore, it also includes a cavity opened inside the shell A, the capsule being fixedly installed on the inner wall of the cavity, and the interior of the capsule being filled with gas that expands when heated; and a frame fixedly installed on the outer wall of the capsule, the frame having a strip groove, the strip groove being offset from the through hole.

[0011] Furthermore, it also includes multiple connection holes formed on the semiconductor cooling plate, the positions of which correspond to the positions of the heat dissipation holes, and the guide grooves are kept in communication with the connection holes.

[0012] Furthermore, it also includes a thin film disposed on the semiconductor cooling plate, wherein the position of the thin film in the vertical direction corresponds to the position of the frame.

[0013] Beneficial effects

[0014] The technical solution provided by this utility model, compared with the known public technology, has the following advantages:

[0015] Beneficial effects:

[0016] This invention utilizes a semiconductor cooling plate and a corresponding bladder to efficiently cool the internal components of the power supply device during use, and also isolates it from external air when not in use, preventing dust from entering the device and affecting its subsequent operation. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of the power supply device of this utility model;

[0019] Figure 2 This is a schematic diagram of the overall exploded structure of the power supply equipment of this utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the housing A of this utility model when separated from the components;

[0021] Figure 4 This is a schematic diagram of the semiconductor cooling plate and the movable plate of this utility model when separated.

[0022] Figure label:

[0023] 100. Housing A; 101. Cavity; 102. Heat dissipation hole; 103. Through hole; 110. Connector; 111. Connecting post; 120. Component;

[0024] 200. Shell B;

[0025] 300, Semiconductor cooling plate; 301, Connecting hole; 302, Guide groove; 310, Thin film;

[0026] 400, Movable plate; 410, Contact piece; 420, Spring; 430, Encapsulation body; 440, Frame body; 441, Strip groove. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0028] The present invention will be further described below with reference to the embodiments.

[0029] Example:

[0030] See attached document Figure 1-4 As shown, a DC power supply device includes a detachably connected housing A100 and housing B200, and a cavity 101 opened inside the housing A100. Heat dissipation holes 102 are symmetrically opened on the side wall of the housing A100, and a through hole 103 is also opened on the rear outer wall of the housing A100. A component 120 is installed inside the housing A100. When the power supply device mentioned in this application is installed, and the mounting surfaces of the corresponding housing A100 and housing B200 are in contact, the outer wall of the corresponding component 120 overlaps with the inner wall of the housing B200. It should be noted that at this time, the inner wall of the cavity 101 includes not only the inner wall of the housing A100 but also the interior of the housing B200. When the corresponding component 120 is in operation, the heat generated will be located inside the cavity 101.

[0031] Correspondingly, the heat dissipation holes 102 allow the cavity 101 to remain connected to the external air. However, it should be noted that in this application, a semiconductor cooling plate 300 is also provided inside the housing A100 on one side of the component 120. The hot end of the semiconductor cooling plate 300 is located close to the component 120 and is in close contact with it, while the cold end of the semiconductor cooling plate 300 is located away from the component 120. The semiconductor cooling plate 300 is arranged in a wrapping shape to wrap the component 120. Its purpose is to effectively collect the heat of the component 120 in operation, and at the same time, to isolate the component 120 from direct contact with the external air, so as to avoid dust affecting the component 120.

[0032] Regarding the heat dissipation solution, this application also includes a bladder 430 disposed on the inner wall of the housing A100. The bladder 430 is fixedly installed on the inner wall of the cavity 101, and the interior of the bladder 430 is filled with a gas that expands when heated. When the component 120 is running, the temperature inside the cavity 101 rises, and the gas inside the bladder 430 expands and comes into direct contact with the hot end of the semiconductor cooling plate 300. At this time, the temperature of the cold end of the semiconductor cooling plate 300 decreases, and the cold end of the semiconductor cooling plate 300 comes into direct contact with the outside air, thereby making the temperature of the gas entering the cavity 101 from the heat dissipation hole 102 lower, thus achieving efficient cooling of the interior of the cavity 101.

[0033] Regarding the gas flow method, and the frame 440 fixedly installed on the outer wall of the capsule 430, the frame 440 has a strip groove 441, which is offset from the through hole 103. It also includes multiple connection holes 301 on the semiconductor cooling plate 300, the positions of which correspond to the positions of the heat dissipation holes 102. A guide groove 302 communicates with the connection holes 301, and the guide groove 302 connects the heat dissipation holes 102 and the through hole 103. When the power supply device starts running, the external air is located between the semiconductor cooling plate 300 and the inner walls on both sides of the cavity 101. Through multiple connection holes 301 opened on the outer wall of the semiconductor cooling plate 300, the position of the connection holes 301 is aligned with the position of the heat dissipation holes 102. When the temperature of the air entering the cavity 101 decreases, in conjunction with the guide grooves 302 opened on the outer wall of the semiconductor cooling plate 300, the low-temperature gas will flow along the guide grooves 302 and flow from the outer wall of the component 120, thereby improving the heat exchange efficiency of the component 120 and achieving efficient cooling.

[0034] Furthermore, this application also includes a movable plate 400 movably connected to the outer wall of component 120, the lower end of which contacts the outer wall of the bladder 430 disposed on the inner wall of housing A100. When the gas inside the bladder 430 expands due to heat, the corresponding frame 440 slides on the inner wall of cavity 101. When the power supply is not in use, the corresponding frame 440 blocks the through hole 103. When the bladder 430 expands, it moves the position of the corresponding frame 440, at which point the strip groove 441 overlaps with the through hole 103. The overlapping part serves as a channel for gas flow, thereby achieving complete airflow between the power supply and the outside air, improving the heat dissipation efficiency of the power supply. When the power supply is not in use, the blocking of the frame 440 reduces the amount of outside air entering the interior of cavity 101, reducing the impact of dust on component 120.

[0035] As one implementation, this application also includes a connector 110 located at the middle of the upper end of the housing A100, the connector 110 being electrically connected to the component 120 via a connecting post 111; a contact piece 410 located at the end of the movable plate 400, the contact piece 410 corresponding to the connecting post 111; and a spring 420 located between the contact piece 410 and the middle of the component 120, the upper end of the spring 420 being connected to the contact piece 410, and the lower end of the spring 420 being connected to the top surface of the component 120. When the power supply is in use, the bladder 430 expands, thereby moving the movable plate 400. When the heat dissipation effect inside the power supply is poor and the temperature continues to rise to a certain value, the contact piece 410 on the movable plate 400 will be in a non-contact state with the outer wall of the connecting post 111, at which point the power supply is disconnected from external devices, serving as a power protection measure.

[0036] Furthermore, this application also includes a thin film 310 disposed on the thermoelectric cooling plate 300, with the position of the thin film 310 corresponding to the position of the frame 440 in the vertical direction. Through the thin film 310, when gas flows between the two thermoelectric cooling plates 300 and at the position of the frame 440, the pressure difference inside and outside the thermoelectric cooling plate 300 causes the thin film 310 to bulge, improving gas flow and thus enhancing the heat dissipation effect.

[0037] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of this utility model.

Claims

1. A DC power supply device, characterized in that, include: The housing A (100) and housing B (200) are detachably connected. Heat dissipation holes (102) are symmetrically opened on the side wall of housing A (100), and through holes (103) are also opened on the rear outer wall of housing A (100). And components (120) installed inside housing A (100), a semiconductor cooling plate (300) is provided inside housing A (100) on one side of component (120), and the hot end of semiconductor cooling plate (300) is located close to component (120) and kept in contact, and the cold end of semiconductor cooling plate (300) is located away from component (120); And a guide groove (302) formed on the semiconductor cooling plate (300) for connecting the heat dissipation hole (102) and the through hole (103).

2. The DC power supply device according to claim 1, characterized in that, It also includes a connector (110) located at the middle of the upper end of the housing A (100), the connector (110) being electrically connected to the component (120) via a connecting post (111); In addition, a movable plate (400) is movably connected to the outer wall of the component (120), and the lower end of the movable plate (400) contacts the outer wall of the bladder (430) provided on the inner wall of the housing A (100).

3. A DC power supply device according to claim 2, characterized in that, It also includes a contact piece (410) located at the end of the movable plate (400), the contact piece (410) corresponding to the position of the connecting post (111); In addition, a spring (420) is provided between the contact piece (410) and the component (120), with the upper end of the spring (420) connected to the contact piece (410) and the lower end of the spring (420) connected to the top surface of the component (120).

4. A DC power supply device according to claim 3, characterized in that, It also includes a cavity (101) opened inside the shell A (100), a capsule (430) fixedly installed on the inner wall of the cavity (101), and the inside of the capsule (430) is filled with a gas that expands when heated; And a frame (440) fixedly installed on the outer wall of the bladder (430), the frame (440) having a strip groove (441) and the strip groove (441) being offset from the through hole (103).

5. A DC power supply device according to claim 4, characterized in that, It also includes multiple connection holes (301) opened on the semiconductor cooling plate (300), the positions of the connection holes (301) correspond to the positions of the heat dissipation holes (102), and the guide groove (302) is connected to the connection holes (301).

6. A DC power supply device according to claim 5, characterized in that, It also includes a thin film (310) disposed on the semiconductor cooling plate (300), and in the vertical direction, the position of the thin film (310) corresponds to the position of the frame (440).

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