A telescopic arm type wafer transfer device

Abstract

The utility model discloses a telescopic arm formula wafer transmission device, including the connecting bottom plate, is equipped with the motion board through motor assembly on the connecting bottom plate, is equipped with the work board on the motion board, is provided with the bearing assembly for placing the wafer main body on the work board, and the work board and the connecting bottom plate still are provided with transmission assembly at the end away from the bearing assembly. The utility model is in view of the one -way transport of wafer in vacuum cavity, adopts telescopic arm formula structure, and through transmission ratio amplification, saves the space and avoids the tedious movement, subtracts the position adjusting mechanism of atmospheric external wafer, integrates in the vacuum interior, directly calibrates the wafer, is more accurate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a telescopic arm type wafer transport device. Background Technology

[0002] Wafer transport devices, such as wafer carriers and wafer carrier transport boxes, are key containers in semiconductor manufacturing processes. They play an important role in protecting, transporting, and storing wafers. They can effectively protect wafers from external impacts and prevent them from being contaminated or oxidized during transport, thereby ensuring the yield of semiconductor manufacturing processes.

[0003] However, in existing wafer delivery technologies, such as Figure 6 As shown, vacuum robots are commonly used for wafer transport, but this type of device has many problems: due to import restrictions and large usage, despite its strong versatility, it has become a key factor restricting the development progress of domestic semiconductor equipment and the competitiveness of complete products; currently available vacuum robots are not only bulky but also have complex motion control, and their large turning radius results in a large space occupation; for unidirectional wafer transport tasks, this design often leads to a waste of time and performance. Utility Model Content

[0004] The purpose of this invention is to provide a telescopic arm type wafer transfer device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a telescopic arm type wafer transfer device, including a connecting base plate, a moving plate provided on the connecting base plate via a motor assembly, a working plate provided on the moving plate, a bearing assembly for placing the wafer body provided on the working plate, and a transmission assembly provided at the end of the working plate and the connecting base plate away from the bearing assembly.

[0006] Preferably, in order to facilitate the placement of the wafer body and subsequent transportation, the support assembly includes an adjustment plate fixedly mounted on the work plate, and a support platform is fixedly mounted at the end of the adjustment plate.

[0007] Preferably, in order to place and transport multiple wafer bodies simultaneously and improve efficiency, the carrier assembly also includes an adjustment plate fixedly mounted on the work plate, with carrier platforms equidistantly provided at the ends of the adjustment plate.

[0008] Preferably, in order to facilitate the movement of the work plate and the transport of the wafer body, the motor assembly includes a lead screw motor fixedly mounted on the connecting base plate, a nut engaged by threads on the lead screw motor, a bearing seat provided at the lead screw end of the lead screw motor, a fixing block matching the work plate provided on one side of the nut, and the moving plate and the work plate are also slidably connected by a first guide rail.

[0009] Preferably, in order to increase the travel distance, the transmission assembly includes two sets of gears fixedly mounted on the motion plate, with a steel belt externally provided between the two gears. The end of the steel belt near the working plate is connected by a first clamping block, and the end of the steel belt near the side wall of the connecting base plate is connected by a second clamping block. The connecting base plate and the motion plate are slidably connected by a second guide rail.

[0010] Preferably, in order to ensure the accuracy of movement and avoid error gaps and creep transmission, a sliding groove is provided on the side wall of the connecting base plate away from the support platform. The first sensor is symmetrically arranged in the sliding groove, and a baffle is slidably arranged in the sliding groove. The end of the baffle is fixedly connected to the moving plate, and the baffle matches the first sensor. A second sensor is provided at the end of the connecting base plate close to the support platform.

[0011] Preferably, in order to facilitate the adjustment of the wafer body and facilitate subsequent transport and use, a base is provided at the bottom of the end of the connecting base plate near the carrier platform, and a lifting block is provided on the base. The lifting block is used to lift and rotate the wafer body.

[0012] Preferably, in order to facilitate the identification and positioning of the adjusted wafer body and ensure the accuracy of the adjustment, a calibrator is provided on the side of the connecting base plate near the support stage. The calibrator emits a beam sensor, and the beam sensor identifies and positions the wafer body through the notch notch.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] For unidirectional transport of wafers within a vacuum chamber, a telescopic arm structure is adopted. By amplifying the transmission ratio, space is saved and cumbersome movements are avoided. The wafer position adjustment mechanism outside the atmosphere is eliminated and integrated inside the vacuum chamber for direct wafer calibration, resulting in greater accuracy.

[0015] The adjustment plate of the carrier component is fixed to the working plate, and a carrier platform is set at the end to facilitate the placement of the wafer body. The carrier platform is equipped with pads to provide impact cushioning and increase friction, ensuring the stable placement of the wafer body, preventing slippage, and providing a good foundation for subsequent transportation.

[0016] A base is installed at the bottom of the connecting base plate near the support stage. A lifting block is installed on the base plate. The lifting block can lift and rotate the wafer body, which facilitates the adjustment and positioning of the wafer body to meet the needs of subsequent processing. A calibrator is installed on the side of the connecting base plate near the support stage. The calibrator emits a beam sensor to identify and position the wafer body. It can accurately determine the position of the wafer body, ensure the accuracy of adjustment, and provide accurate position information for subsequent processing and transmission. Attached Figure Description

[0017] Figure 1This is a schematic diagram of the structure of a telescopic arm type wafer transport device and a wafer body proposed in this utility model;

[0018] Figure 2 This is one of the structural schematic diagrams of a telescopic arm type wafer transfer device proposed in this utility model;

[0019] Figure 3 This is the second structural schematic diagram of a telescopic arm type wafer transfer device proposed in this utility model;

[0020] Figure 4 This is the third schematic diagram of the structure of the telescopic arm type wafer transfer device proposed in this utility model;

[0021] Figure 5 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0022] Figure 6 This is a schematic diagram of a vacuum robotic wafer transport structure.

[0023] In the diagram: 101, lead screw motor; 102, nut; 103, fixing block; 104, first guide rail; 105, bearing seat; 106, wafer body; 107, second guide rail; 201, connecting base plate; 202, moving plate; 203, working plate; 301, gear; 302, steel strip; 303, first clamping block; 304, second clamping block; 401, bearing platform; 402, adjusting plate; 501, first sensor; 502, slide groove; 503, baffle; 504, second sensor; 601, lifting block; 602, base; 701, calibrator; 702, beam sensor. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Example 1

[0026] Please see Figures 1-4This utility model provides an embodiment of a telescopic arm type wafer transfer device, including a connecting base plate 201, a moving plate 202 provided on the connecting base plate 201 via a motor assembly, a working plate 203 provided on the moving plate 202, and a bearing assembly for placing a wafer body 106 on the working plate 203. The bearing assembly includes an adjusting plate 402 fixedly provided on the working plate 203, a bearing platform 401 fixedly provided at the end of the adjusting plate 402, and a pad provided on the bearing platform 401 for impact cushioning and increasing friction to fix the wafer body 106, ensuring stable placement and preventing slippage. A transmission assembly is also provided at the end of the working plate 203 and the connecting base plate 201 away from the bearing assembly.

[0027] Please see Figures 1-4 To facilitate unidirectional transport of the wafer body 106, a telescopic structure is adopted, amplifying the transmission ratio, saving space and avoiding cumbersome movements. The motor assembly includes a lead screw motor 101 fixedly mounted on the connecting base plate 201. The lead screw motor 101 is threadedly engaged with a nut 102. A bearing seat 105 is provided at the end of the lead screw of the lead screw motor 101. A fixing block 103 matching the working plate 203 is provided on one side of the nut 102. When the nut 102 cooperates with the fixing block 103, the working plate 203 can move unidirectionally on the moving plate 202 under the guidance and limitation of the first guide rail 104 and the bearing seat 105. The moving plate 202 and the working plate 203 are also slidably connected by the first guide rail 104. The first guide rail 104 has two sections, mainly consisting of guide rails and guide rail slider assemblies, ensuring the stability of the working plate 203's movement on the moving plate 202 and playing a guiding and limiting role. In order to increase the movement distance, The transmission ratio is 1:2, with the motor moving X distance and the working plate 203 moving 2X distance. The transmission assembly includes two sets of gears 301 fixedly mounted on the moving plate 202. A steel belt 302 is externally provided between the two gears 301, which can mesh with the gears 301. The steel belt 302 is selected to avoid air release and particulate contamination in the vacuum. The end of the steel belt 302 near the working plate 203 is connected by the first clamping block 303, and the end of the steel belt 302 near the side wall of the connecting base plate 201 is connected to... Connected by the second clamping block 304, when the working plate 203 moves, under the action of the first clamping block 303, the steel belt 302 moves, and the two sets of gears 301 rotate. Through the transmission of the gears 301, the second clamping block 304 on the other side of the steel belt 302 moves. With the cooperation of the second guide rail 107, the moving plate 202 can move on the connecting plate. The connecting base plate 201 and the moving plate 202 are slidably connected through the second guide rail 107, which has the same structure as the first guide rail 104.

[0028] To ensure the accuracy of movement, avoid error gaps and creep transmission, complete the closed-loop control system, and improve the positioning accuracy of the end effector, a sliding groove 502 is provided on the side wall of the connecting base plate 201 away from the support platform 401. A first sensor 501 is symmetrically arranged in the sliding groove 502, and a baffle 503 is slidably arranged in the sliding groove 502. The end of the baffle 503 is fixedly connected to the motion plate 202. The baffle and the first sensor 501 are matched, respectively serving as the motor origin and limit function. The baffle 503 moves with the motion plate 202. A second sensor 504 is provided at the end of the connecting base plate 201 near the support platform 401 to directly measure the movement distance of the end support platform 401. The second sensor 504 can be a distance sensor to directly measure the end displacement stage, avoiding error gaps and creep transmission, completing the closed-loop control system, and improving the positioning accuracy of the end effector.

[0029] Please see Figures 1-4 To facilitate the adjustment and positioning of the wafer body 106 without affecting subsequent processing, a base 602 is provided at the bottom of the connecting base plate 201 near the support stage 401. A lifting block 601 is provided on the base 602 for lifting and rotating the wafer body 106. A calibrator 701 is provided on the side of the connecting base plate 201 near the support stage 401. The calibrator 701 emits a beam sensor 702, which identifies and positions the wafer body 106 through the notch notch.

[0030] For the base 602 and the lifting block 601, the purpose is to lift and rotate the wafer body 106. Specifically, it can be composed of independent lifting and rotation drives stacked together. The lower layer is the lifting mechanism, which is responsible for the lifting action and can be lifted by an electric push rod. The upper layer is the rotation mechanism, which is installed on top of the lifting mechanism and is responsible for the rotation action. The worm gear mechanism is driven by a motor, and the worm outputs low-speed, high-torque rotation with a self-locking function.

[0031] It can also be an integrated drive, using a "lifting and rotating integrated motor" or a "screw + rotating shaft nested structure". The outer shaft is responsible for lifting, such as the screw nut 102 structure, and the inner shaft passes through the center of the outer shaft and is responsible for rotation, which is driven by an independent motor. The two are arranged coaxially. The lifting part: the stability of vertical movement is ensured by linear guide rails or guide columns to avoid shaking; the rotating part: the axial force is borne by thrust bearings and the radial bearings ensure the concentricity of rotation, reduce friction, and improve accuracy.

[0032] As for the base 602 and the lifting block 601, they are sufficient to lift and rotate the wafer body 106. They are not limited to the above structure. They are sufficient to achieve the lifting and rotation functions. They are relatively mature technologies and will not be elaborated here.

[0033] Example 2

[0034] Please see Figure 5 Compared to Embodiment 1, only the carrier component is different, while everything else is the same. The carrier component also includes an adjustment plate 402 fixedly mounted on the work plate 203. The ends of the adjustment plate 402 are provided with carrier platforms 401 at equal intervals. There are two sets of carrier platforms 401, which are superimposed double-layer mechanisms, making it more convenient and efficient to pick up and put down wafers. The number of carrier platforms 401 can also be three, four or other sets, depending on the actual wafer body 106 conveying situation.

[0035] Working Principle: In use, the wafer body 106 is placed on the support platform 401. In the initial position, the lifting block 601 on the base 602 lifts the wafer body 106 away from the support platform 401, causing it to rotate axially. This is coordinated with the calibrator 701, beam sensor 702, and notch recognition positioning on the wafer body 106. After rotating to the designated position, the rotation stops, and the lifting block 601 lowers the wafer body 106 back onto the support platform 401. When conveying the adjusted wafer body 106, the lead screw motor 101 operates, cooperating with the bearing seat 105, the first guide rail 104, the nut 102, and the fixing block 103 to move the work plate 203 on the moving plate 202. During the movement of the work plate 203, the first clamping block 30... Under the action of 3, the steel belt 302 moves, and the two sets of gears 301 rotate. Through the transmission of the gears 301, the second clamping block 304 on the other side of the steel belt 302 moves. With the cooperation of the second guide rail 107, the moving plate 202 can move on the connecting plate, increasing the movement distance and making the transmission ratio 1:2. The motor moves X distance, and the working plate 203 moves 2X distance. When the moving plate 202 moves, the baffle 503 slides in the slide groove 502. With the cooperation of the two sets of first sensors 501 and second sensors 504, the end displacement stage is directly measured, avoiding error gaps and creep transmission, completing the closed-loop control system, and improving the positioning accuracy of the end actuator. After the conveying is completed, the lead screw motor 101 rotates in the opposite direction, which can move the whole body back to the initial position, so that the next wafer body 106 can be transported.

[0036] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A telescopic arm type wafer transfer device, comprising a connecting base plate (201), characterized in that: A motion plate (202) is provided on the connecting base plate (201) via a motor assembly. A working plate (203) is provided on the motion plate (202). A carrier component for placing the wafer body (106) is provided on the working plate (203). A transmission component is also provided at the end of the working plate (203) and the connecting base plate (201) away from the carrier component.

2. The telescopic arm type wafer transfer device according to claim 1, characterized in that: The supporting component includes an adjustment plate (402) fixedly mounted on the working plate (203), and a support platform (401) is fixedly mounted at the end of the adjustment plate (402).

3. The telescopic arm type wafer transfer device according to claim 1, characterized in that: The supporting component also includes an adjustment plate (402) fixedly mounted on the working plate (203), and the end of the adjustment plate (402) is provided with a support platform (401) at equal intervals.

4. A telescopic arm type wafer transfer device according to any one of claims 1-3, characterized in that: The motor assembly includes a lead screw motor (101) fixedly mounted on a connecting base plate (201). The lead screw motor (101) is threadedly engaged with a nut (102). The lead screw end of the lead screw motor (101) is provided with a bearing seat (105). A fixing block (103) matching the working plate (203) is provided on one side of the nut (102). The moving plate (202) and the working plate (203) are also slidably connected by a first guide rail (104).

5. A telescopic arm type wafer transfer device according to claim 4, characterized in that: The transmission assembly includes two sets of gears (301) fixedly mounted on the moving plate (202). A steel belt (302) is provided outside between the two gears (301). One end of the steel belt (302) near the working plate (203) is connected by a first clamping block (303), and the other end of the steel belt (302) near the side wall of the connecting base plate (201) is connected by a second clamping block (304). The connecting base plate (201) and the moving plate (202) are slidably connected by a second guide rail (107).

6. A telescopic arm type wafer transfer device according to claim 5, characterized in that: A sliding groove (502) is provided on the side wall of the connecting base plate (201) away from the support platform (401). A first sensor (501) is symmetrically arranged in the sliding groove (502). A baffle (503) is slidably arranged in the sliding groove (502). The end of the baffle (503) is fixedly connected to the moving plate (202). The baffle matches the first sensor (501). A second sensor (504) is provided at the end of the connecting base plate (201) near the support platform (401).

7. A telescopic arm type wafer transfer device according to claim 6, characterized in that: The bottom of the connecting base plate (201) near the support platform (401) is provided with a base (602), and a lifting block (601) is provided on the base (602). The lifting block (601) is used to lift and rotate the wafer body (106).

8. A telescopic arm type wafer transfer device according to claim 7, characterized in that: A calibrator (701) is provided on the side of the connecting base plate (201) near the support platform (401). The calibrator (701) emits a beam sensor (702), which identifies and positions itself through the notch on the wafer body (106).

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