A flexible vacuum chuck for sucking a wafer

Abstract

The utility model discloses a kind of flexible vacuum chuck for sucking wafer, it is related to vacuum chuck technical field, including carrier connecting piece, first vacuum pipeline, second vacuum pipeline, movable block, connecting assembly, suction cup assembly and mounting groove, first vacuum pipeline is set in one side of carrier connecting piece, second vacuum pipeline is set in the other side of carrier connecting piece, multiple movable blocks are respectively set in the two sides of one end of carrier connecting piece, connecting assembly is fixed in one end of carrier connecting piece, suction cup assembly is set in one end opposite of two movable blocks, mounting groove is opened in the other end of carrier connecting piece.The utility model is set by movable block, connecting assembly and the setting mode of suction cup assembly cooperation, suction cup assembly can be self-adapting the horizontal plane angle of wafer, realize flexible fit, reduce the damage of rigid contact to wafer, reduce the risk of extrusion deformation, improve the stability of wafer handling.

Description

Technical Field

[0001] This utility model relates to the field of vacuum chuck technology, and in particular to a flexible vacuum chuck for picking up wafers. Background Technology

[0002] In the semiconductor manufacturing and microelectronics industries, wafer handling and manipulation are critical links in the production process. Wafer adsorption technology involves many process steps such as etching, deposition, and photolithography. As a high-precision and high-value substrate, wafers place strict requirements on the stability and safety of handling equipment.

[0003] Traditional rigid mechanical vacuum chuck structures have many problems in practical applications. During the pick-up process, the rigid contact makes it difficult for the rigid vacuum chuck to fully adhere to the wafer, leading to deviation in the pick-up process or even failure to pick up the wafer. This increases production and time costs, and consequently affects the wafer yield. At the same time, when the rigid vacuum chuck contacts the wafer, it is easy to squeeze and deform the wafer, which seriously affects the quality of the wafer and subsequent processing technology, and affects the stability and reliability of wafer handling. Utility Model Content

[0004] The purpose of this invention is to provide a flexible vacuum chuck for picking up wafers, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a flexible vacuum chuck for picking up wafers, comprising:

[0006] Transporter connectors;

[0007] A first vacuum conduit is disposed on one side of the transporter connector;

[0008] The second vacuum pipe is disposed on the other side of the transporter connector;

[0009] Movable blocks, wherein multiple movable blocks are respectively disposed on both sides of one end of the conveyor connector;

[0010] A connecting component is fixed to one end of the transporter connector, and a plurality of movable blocks are movably connected to both ends of the connecting component;

[0011] A suction cup assembly, wherein the suction cup assembly is disposed at one end of two movable blocks facing away from each other;

[0012] The mounting slot is located at the other end of the transporter connector.

[0013] Preferably, the first vacuum pipe is fixed to the outer wall of one of the movable blocks, and the second vacuum pipe is fixed to the outer wall of the other movable block.

[0014] Preferably, the connection component includes:

[0015] A connecting block, which is fixed to one end of the transporter connector;

[0016] Movable slots, multiple movable slots are respectively formed at both ends of the connecting block, and the movable slots are used for the movement of the movable block;

[0017] A compression spring is fixed to the middle of the inner wall of the movable groove.

[0018] Preferably, one end of the compression spring is fixedly connected to the middle of the movable block, and the two compression springs are arranged opposite each other in the middle of the connecting block.

[0019] Preferably, the suction cup assembly includes:

[0020] The suction cup body is fixed to one end of the movable block;

[0021] A connecting groove is formed at one end of the suction cup body;

[0022] A ventilation slot is provided in the middle of the suction cup body. One of the ventilation slots communicates with the inner cavity of the first vacuum pipe, and the other ventilation slot communicates with the inner cavity of the second vacuum pipe.

[0023] Radial grooves, wherein a plurality of radial grooves are radially formed on the inner wall of the connecting groove.

[0024] Preferably, the suction cup body is used for wafer bonding and suction, and the movable block is slidably connected to the inner cavity of the adjacent movable slot.

[0025] The technical effects and advantages of this utility model are as follows:

[0026] This invention utilizes a combination of a movable block, a connecting component, and a suction cup assembly. Through the cooperation of the movable block and the compression spring, the suction cup assembly can adapt to the horizontal angle of the wafer, achieving flexible contact and reducing damage to the wafer from rigid contact. The elastic support of the compression spring gives the suction cup a certain degree of extensibility, which can adapt to the slight deformation of the wafer and reduce the risk of extrusion deformation. The symmetrical layout of the first and second vacuum channels enables double-sided handling, increasing efficiency. Furthermore, the suction cup body surface is provided with radial grooves to further increase vacuum adsorption force, improve the stability of wafer handling, and enhance the processing quality and handling reliability of the wafer. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0028] Figure 2 This is a top view structural diagram of the connecting part of the transporter of this utility model.

[0029] Figure 3 This is a front sectional view of the connecting part of the transporter of this utility model.

[0030] In the diagram: 100, transporter connector; 200, first vacuum pipe; 300, second vacuum pipe; 400, movable block; 500, connecting assembly; 501, connecting block; 502, movable groove; 503, compression spring; 600, suction cup assembly; 601, suction cup body; 602, connecting groove; 603, ventilation groove; 604, radial groove; 700, mounting groove. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] This utility model provides, for example Figure 1-3 The diagram shows a flexible vacuum chuck for picking up wafers, comprising a transporter connector 100, a first vacuum channel 200, a second vacuum channel 300, a movable block 400, a connecting assembly 500, a chuck assembly 600, and a mounting groove 700. The mounting groove 700 is located at the other end of the transporter connector 100, facilitating connection between the transporter connector 100 and a wafer transporter via a snap-fit ​​mechanism. The first vacuum channel 200 is located on one side of the transporter connector 100, and the second vacuum channel 300 is located on the other side. The first vacuum channel 200 is fixed to the outer wall of one of the movable blocks 400, and the second vacuum channel 300... 300 is fixed to the outer wall of another movable block 400. The first vacuum pipe 200 and the second vacuum pipe 300 are connected to a vacuum system to provide vacuum suction force. Multiple movable blocks 400 are respectively arranged on both sides of one end of the transporter connector 100. The connecting assembly 500 is fixed to one end of the transporter connector 100. Multiple movable blocks 400 are movably connected to both ends of the connecting assembly 500. The suction cup assembly 600 is arranged at the opposite ends of the two movable blocks 400. Through the movement of the movable blocks 400 at the end of the connecting assembly 500, the suction cup assembly 600 can extend and retract within a certain range, so that the suction cup assembly 600 can flexibly adhere and pick up the wafer.

[0033] The connecting component 500 includes a connecting block 501, a movable groove 502, and a compression spring 503. The connecting block 501 is fixed to one end of the transporter connector 100. Multiple movable grooves 502 are respectively opened at both ends of the connecting block 501. The movable grooves 502 are used for the movement of the movable block 400. The movable block 400 is slidably connected to the inner cavity of the adjacent movable groove 502. The compression spring 503 is fixed to the middle of the inner wall of the movable groove 502. One end of the compression spring 503 is fixedly connected to the middle of the movable block 400. Two compression springs 503 are arranged opposite each other in the middle of the connecting block 501. Through the elasticity of the compression spring 503, the movable block 400 can be elastically pushed, which makes it easy for the suction cup assembly 600 to conform to the horizontal angle of the wafer. This allows the suction cup assembly 600 to pick up the wafer through a flexible structure, reducing rigid contact damage, reducing the possibility of wafer compression deformation, and improving the stability of wafer picking when the wafer transporter is offset.

[0034] Furthermore, the suction cup assembly 600 includes a suction cup body 601, a connecting groove 602, a venting groove 603, and radial grooves 604. The suction cup body 601 is fixed to one end of the movable block 400 and is used for wafer adhesion and suction. The suction cup body 601 is made of flexible rubber. The connecting groove 602 is located at one end of the suction cup body 601, and the venting groove 603 is located in the middle of the suction cup body 601. One venting groove 603 communicates with the inner cavity of the first vacuum pipe 200, and the other venting groove 603 communicates with the inner cavity of the second vacuum pipe 300. Multiple radial grooves 604 are radially arranged on the inner wall of the connecting groove 602. The radial grooves 604 on the surface of the suction cup body 601 further increase the adsorption force on the wafer, ensuring the stability of the wafer during operation. The 601 suction cup is mounted on a wafer transporter. During operation, the wafer transporter moves the suction cup body 601 above the wafer. One of the two symmetrical suction cup bodies 601 then approaches the wafer to pick it up. During the contact process, the movable block 400 can move within the cavity of the movable groove 502. The horizontal angle of the suction cup body 601 is automatically adjusted to conform to the horizontal plane of the wafer, ensuring that the suction cup body 601 is completely in contact with the wafer. After a vacuum is provided through the first vacuum channel 200 or the second vacuum channel 300, the radial grooves 604 on the surface of the suction cup body 601 further increase the vacuum adsorption force of the suction cup body 601, ensuring the stability of the wafer on the suction cup body 601. The flexible vacuum adsorption structure of this application is simple, easy to install and maintain, and has strong applicability. It can be widely used in wafer handling and operation in semiconductor manufacturing, microelectronics and other fields.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A flexible vacuum chuck for picking up wafers, characterized in that, include: Transporter connector (100); A first vacuum conduit (200) is disposed on one side of the transporter connector (100); A second vacuum conduit (300) is provided on the other side of the transporter connector (100); Movable blocks (400), a plurality of said movable blocks (400) are respectively disposed on both sides of one end of the conveyor connector (100); A connecting component (500) is fixed to one end of the transporter connector (100), and a plurality of movable blocks (400) are movably connected to both ends of the connecting component (500); A suction cup assembly (600) is disposed at one end opposite to the two movable blocks (400); Mounting slot (700) is provided at the other end of the transporter connector (100).

2. The flexible vacuum chuck for picking up wafers according to claim 1, characterized in that, The first vacuum pipe (200) is fixed to the outer wall of one of the movable blocks (400), and the second vacuum pipe (300) is fixed to the outer wall of the other movable block (400).

3. A flexible vacuum chuck for picking up wafers according to claim 1, characterized in that, The connection component (500) includes: A connecting block (501) is fixed to one end of the transporter connector (100); Movable slots (502), a plurality of the movable slots (502) are respectively opened at both ends of the connecting block (501), and the movable slots (502) are used for the movement of the movable block (400); Compression spring (503) is fixed to the middle of the inner wall of the movable groove (502).

4. A flexible vacuum chuck for picking up wafers according to claim 3, characterized in that, One end of the compression spring (503) is fixedly connected to the middle of the movable block (400), and the two compression springs (503) are arranged opposite each other in the middle of the connecting block (501).

5. A flexible vacuum chuck for picking up wafers according to claim 3, characterized in that, The suction cup assembly (600) includes: The suction cup body (601) is fixed to one end of the movable block (400); A connecting groove (602) is provided at one end of the suction cup body (601); Ventilation groove (603) is provided in the middle of suction cup body (601), one of the ventilation grooves (603) is connected to the inner cavity of the first vacuum pipe (200), and the other ventilation groove (603) is connected to the inner cavity of the second vacuum pipe (300). Radial grooves (604), a plurality of said radial grooves (604) are radially formed on the inner wall of the connecting groove (602).

6. A flexible vacuum chuck for picking up wafers according to claim 5, characterized in that, The suction cup body (601) is used for wafer bonding and suction, and the movable block (400) is slidably connected to the inner cavity of the adjacent movable groove (502).

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