Polishing pad conditioner and polishing apparatus

Abstract

A polishing pad conditioner and polishing apparatus, wherein the polishing pad conditioner comprises a conditioning disc adapted to contact a polishing pad to condition the polishing pad; a conditioning disc mechanical arm located on a side of the conditioning disc facing away from the polishing pad, the conditioning disc mechanical arm being adapted to drive the conditioning disc to move; and a laser detection module fixed to the conditioning disc mechanical arm, the laser detection module being adapted to emit and receive a probe light to determine a position of the conditioning disc. The position of the conditioning disc is determined by the laser detection module, so as to determine whether the conditioning disc is in contact with the polishing pad. When it is determined that the conditioning disc is not in contact with the polishing pad, i.e. the conditioning disc has not polished the surface of the polishing pad, the position of the conditioning disc is adjusted in time so that the conditioning disc is lowered to be in contact with the surface of the polishing pad, thereby ensuring that the polishing pad is conditioned by the conditioning disc before polishing a wafer, so as to improve the activity of the surface of the polishing pad and improve the polishing effect of the polishing pad on the wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a polishing pad dresser and polishing equipment. Background Technology

[0002] Chemical mechanical polishing (CMP) is a step in semiconductor manufacturing. It combines chemical etching with mechanical removal. The chemical components in the polishing slurry first react slightly with the material to be removed from the wafer surface, softening it. Then, the polishing head applies pressure and moves relative to the polishing pad, physically removing the reactants to achieve the leveling effect.

[0003] However, current grinding equipment still has shortcomings. Utility Model Content

[0004] The problem solved by this invention is how to improve the grinding pad dresser to determine the position of the dressing disc, ensure that the dressing disc is in contact with the grinding pad, and guarantee the dressing of the grinding pad by the dressing disc.

[0005] To address the aforementioned problems, this utility model provides a polishing pad dressing device, comprising: a dressing disc adapted to contact the polishing pad for dressing; a dressing disc robotic arm located on the side of the dressing disc opposite to the polishing pad, the robotic arm being adapted to drive the dressing disc to move; and a laser detection module fixed to the dressing disc robotic arm, the laser detection module being adapted to emit and receive detection light to determine the position of the dressing disc.

[0006] Optionally, the trimming disc robotic arm is adapted to drive the trimming disc to move along a direction perpendicular to the surface of the grinding pad; the laser detection module includes: a light source emitter adapted to emit the detection light; and a light source receiver adapted to receive the detection light; the trimming disc is located between the light source emitter and the light source receiver, and when the trimming disc is lowered to its lowest position, the detection light passes through one side surface of the trimming disc toward the trimming disc robotic arm.

[0007] Optionally, the projection of the probe light path between the light source emitter and the light source receiver onto the polishing pad at least partially overlaps with the projection of the trimming disk onto the polishing pad.

[0008] Optionally, the trimming disc robotic arm includes an alignment section, the projection of the alignment section on the polishing pad at least partially overlapping the projection of the trimming disc on the polishing pad; at least one of the light source emitter and the light source receiver is fixedly connected to the alignment section.

[0009] Optionally, the trimming disc robotic arm further includes an extension, the projection of the extension on the grinding pad not overlapping the projection of the trimming disc on the grinding pad, and the alignment portion is provided at one end of the extension along the extension direction.

[0010] Optionally, the laser detection module further includes: a bracket, the bracket connecting the light source emitter and the trimming disc robotic arm; the bracket also connects the light source receiver and the trimming disc robotic arm.

[0011] Optionally, the polishing pad dresser further includes: a lifting column having one end and another end in a direction perpendicular to the surface of the dressing disc; one end of the lifting column is adapted to be connected to the dressing disc, and the other end of the lifting column is adapted to be connected to the dressing disc robotic arm; the lifting column is adapted to move in a direction toward the surface of the polishing pad to move the dressing disc in a direction toward the polishing pad; the lifting column is adapted to move in a direction away from the surface of the polishing pad to move the dressing disc in a direction away from the polishing pad; the projection of the probe light path between the light source emitter and the light source receiver onto the polishing pad does not overlap with the projection of the lifting column onto the polishing pad.

[0012] Optionally, the dressing disc robotic arm includes: a gas pipe, through which the abrasive pad dresser extracts gas to drive the dressing disc to move in the direction toward the abrasive pad; and through which the abrasive pad dresser introduces gas to drive the dressing disc to move in the direction away from the abrasive pad.

[0013] Optionally, the dressing disc robotic arm further includes a connecting part located on the side of the dressing disc away from the grinding pad, and the gas pipe is connected to the connecting part.

[0014] Optionally, the laser detection module further includes: a processing element, the processing element being adapted to determine whether the trimming disc is in a preset position based on whether the laser detection module receives a probe light; when the polishing pad trimmer introduces gas through the gas pipe to drive the trimming disc to move in a direction away from the polishing pad, and the trimming disc is in an upward state, the laser detection module cannot receive a probe light and determines that the trimming disc is not in the preset position; when the polishing pad trimmer extracts gas through the gas pipe to drive the trimming disc to move in a direction toward the polishing pad, and the trimming disc descends to its lowest position, the laser detection module receives a probe light and determines that the trimming disc is in the preset position.

[0015] Accordingly, the present invention also provides a grinding device, comprising: a grinding pad conditioner as described in any of the above claims; and a grinding pad, wherein the grinding pad conditioner is located on the grinding pad.

[0016] Compared with the prior art, the technical solution of this utility model has the following advantages:

[0017] In the polishing pad dressing device of this utility model, the laser detection module is fixed to the dressing disk robotic arm. The laser detection module is adapted to emit and receive detection light to determine the position of the dressing disk. By determining the position of the dressing disk through the laser detection module, it is determined whether the dressing disk is in contact with the polishing pad. If it is determined that the dressing disk is not in contact with the polishing pad, that is, the dressing disk cannot polish the surface of the polishing pad, the position of the dressing disk is adjusted in time so that the dressing disk descends to contact the surface of the polishing pad. This ensures that the surface of the polishing pad has been dressed by the dressing disk before polishing the wafer, thereby improving the surface activity of the polishing pad and thus improving the polishing effect of the polishing pad on the wafer.

[0018] In an optional embodiment of this invention, the trimming disk robotic arm is adapted to drive the trimming disk to move along a direction perpendicular to the surface of the polishing pad; the laser detection module includes: a light source emitter adapted to emit the probe light; and a light source receiver adapted to receive the probe light; the trimming disk is located between the light source emitter and the light source receiver, and when the trimming disk is lowered to its lowest position, the probe light passes through one side surface of the trimming disk toward the trimming disk robotic arm. By determining that the light source receiver has received the probe light, it is determined that the trimming disk has been lowered to its lowest position, thereby determining that the trimming disk is in contact with the polishing pad, ensuring that the surface of the polishing pad has been trimmed by the trimming disk before polishing the wafer, and that the surface of the polishing pad has a certain degree of activity, resulting in a better polishing effect on the wafer.

[0019] In an optional embodiment of this utility model, the laser detection module further includes: a processing element, which is adapted to determine whether the trimming disc is in a preset position based on whether the laser detection module receives a detection light; when the polishing pad trimmer introduces gas through the gas pipe to drive the trimming disc to move in a direction away from the polishing pad, and the trimming disc is in an upward state, the laser detection module cannot receive a detection light and determines that the trimming disc is not in the preset position; when the polishing pad trimmer extracts gas through the gas pipe to drive the trimming disc to move in a direction toward the polishing pad, and the trimming disc descends to the lowest position, the laser detection module receives a detection light and determines that the trimming disc is in the preset position. The processing element determines whether the trimming disk is in a preset position by whether the laser detection module receives a probe light. When the laser detection module does not receive a probe light, it determines that the trimming disk is in the raised position, and the trimming disk is not in contact with the polishing pad, so the trimming disk cannot trim the polishing pad. When the laser detection module receives a probe light, it determines that the trimming disk has descended to the lowest position, that is, the trimming disk is in contact with the polishing pad, and the trimming disk can trim the polishing pad. Attached Figure Description

[0020] Figure 1 A top view schematic diagram of an abrasive pad dressing device;

[0021] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure of the grinding pad dresser at the Y1Y2 position;

[0022] Figure 3 This is a top view schematic diagram of the abrasive pad dressing device according to some embodiments of this utility model;

[0023] Figure 4 This is a cross-sectional structural diagram of the abrasive pad dressing device in some embodiments of this utility model at the Y1Y2 position;

[0024] Figure 5 This is a cross-sectional structural diagram of the abrasive pad dressing device in some embodiments of this utility model at the Y1Y2 position;

[0025] Figure 6 This is a cross-sectional structural diagram of the abrasive pad dressing device in some embodiments of this utility model at the X1X2 position;

[0026] Figure 7 This is a top view schematic diagram of the abrasive pad dressing device according to other embodiments of this utility model;

[0027] Figure 8 This is a cross-sectional structural diagram of the abrasive pad trimmer of some other embodiments of the present invention at the Y1Y2 position;

[0028] Figure 9 This is a top view schematic diagram of the abrasive pad dressing device according to some embodiments of the present invention;

[0029] Figure 10 This is a cross-sectional structural diagram of the abrasive pad dressing device at position Y1Y2, according to some embodiments of this utility model. Detailed Implementation

[0030] As can be seen from the background technology, current polishing pad dressers still have shortcomings. The reasons for these shortcomings are analyzed below:

[0031] Please refer to Figure 1 A polishing pad dressing device includes: a dressing disc 100 adapted to contact a polishing pad 101 to dress the polishing pad 101; and a dressing disc robotic arm 102 located on the side of the dressing disc 100 opposite to the polishing pad 101, the dressing disc robotic arm 102 being adapted to drive the dressing disc 100 to move.

[0032] The trimming disc robotic arm 102 is adapted to drive the trimming disc 100 to move on the surface of the polishing pad 101.

[0033] The dressing disc robotic arm 102 is also adapted to drive the dressing disc 100 to move along a direction perpendicular to the surface of the grinding pad 101.

[0034] The trimming disc robotic arm 102 includes: a gas pipe (not shown), through which the abrasive pad trimmer extracts gas to drive the trimming disc 100 to move toward the abrasive pad 101; and through which the abrasive pad trimmer introduces gas to drive the trimming disc 100 to move away from the abrasive pad 101.

[0035] Before grinding the wafer, the surface of the grinding pad 101 needs to be trimmed using a trimming disc 100 to ensure that the surface of the grinding pad 101 is active.

[0036] Please refer to Figure 2 However, when there is air leakage inside the dressing disk 100, or mechanical interference, causing compressed air to be introduced into the gas pipe, the dressing disk 100 does not press down onto the polishing pad 101. Since the surface 101 of the polishing pad is not dressed by the dressing disk 100, the surface activity of the polishing pad 101 is low. This results in an unsatisfactory polishing effect on the wafer surface when the polishing pad 101 polishes it, ultimately leading to wafer scrap.

[0037] The current polishing pad dresser does not have a module to detect the position of the dressing disk 100, and cannot detect the relative positional relationship between the dressing disk 100 and the polishing pad 101 (i.e. whether the dressing disk 100 has descended to the surface of the polishing pad 101). Therefore, it is impossible to determine whether the dressing disk 100 has dressed the polishing pad 101 before polishing the wafer, which is not conducive to the polishing pad 101 polishing the surface of the wafer.

[0038] To solve the aforementioned technical problem, this utility model provides a polishing pad dressing device, comprising: a dressing disc adapted to contact a polishing pad for dressing the polishing pad; a dressing disc robotic arm located on the side of the dressing disc opposite to the polishing pad, the dressing disc robotic arm being adapted to drive the dressing disc to move; and a laser detection module fixed to the dressing disc robotic arm, the laser detection module being adapted to emit and receive detection light to determine the position of the dressing disc.

[0039] In the polishing pad dresser of this utility model, the laser detection module is fixed to the dressing disk robotic arm. The laser detection module is adapted to emit and receive detection light to determine the position of the dressing disk. By determining the position of the dressing disk through the laser detection module, it is determined whether the dressing disk is in contact with the polishing pad. If it is determined that the dressing disk is not in contact with the polishing pad, that is, the dressing disk has not polished the surface of the polishing pad, the position of the dressing disk is adjusted in time so that the dressing disk descends to contact the surface of the polishing pad. This ensures that the surface of the polishing pad has been dressed by the dressing disk before polishing the wafer, thereby improving the surface activity of the polishing pad and thus improving the dressing effect of the polishing pad on the wafer.

[0040] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0041] Please refer to Figures 3 to 6 , Figure 4 and Figure 5 for Figure 3 A schematic diagram of the cross-sectional structure at position Y1Y2. Figure 6 for Figure 3 A cross-sectional structural diagram at positions X1 and X2, where... Figure 4 This is a cross-sectional structural diagram showing the adjustment disc 200 when it is lowered to its lowest position. Figure 5 This is a cross-sectional structural diagram of the dressing disc 200 in its rising phase. The grinding pad dressing device includes a dressing disc 200, which is adapted to contact the grinding pad 201 to dress the grinding pad 201.

[0042] The polishing pad 201 is a flexible or semi-rigid material layer disposed on the rotating platform of a polishing machine. It is used to carry polishing fluid and directly contact the surface of the workpiece being processed, achieving surface planarization or polishing of the workpiece through mechanical friction and chemical action. Specifically, in some embodiments of this utility model, the polishing pad 201 is used to polish the surface of a wafer.

[0043] The dressing disc 200 is a tool used to dress the grinding pad 201, restoring the surface morphology and grinding performance of the grinding pad 201 through mechanical friction or cutting action.

[0044] Please refer to Figures 3 to 6 The polishing pad dresser includes a dressing disc robotic arm 202, which is located on the side of the dressing disc 200 away from the polishing pad 201 and is adapted to drive the dressing disc 200 to move.

[0045] The dressing disc robotic arm 202 is adapted to drive the dressing disc 200 to move on the surface of the grinding pad 201. The dressing disc robotic arm 202 drives the dressing disc 200 to move on the surface of the grinding pad 201 to repair surface distortion caused by surface wear of the grinding pad 201; and the dressing disc robotic arm 202 drives the dressing disc 200 to move on the surface of the grinding pad 201 to activate the abrasive grains of the grinding pad 201 and maintain the cutting ability of the grinding pad 201.

[0046] The dressing disc robotic arm 202 is also adapted to drive the dressing disc 200 to move in a direction perpendicular to the surface of the polishing pad 201. Specifically, the dressing disc robotic arm 202 is adapted to drive the dressing disc 200 to move in a direction toward the surface of the polishing pad 201, and the dressing disc robotic arm 202 is adapted to drive the dressing disc 200 to move in a direction away from the surface of the polishing pad 201.

[0047] When the dressing disc 200 is in working condition, i.e., when the dressing disc 200 needs to dress the surface of the polishing pad 201, the dressing disc robotic arm 202 drives the dressing disc 200 to move in the direction toward the surface of the polishing pad 201, so that the dressing disc 200 is lowered to the lowest position and in contact with the surface of the polishing pad 201; when the dressing disc 200 is not in working condition, i.e., when the dressing disc 200 does not need to dress the surface of the polishing pad 201, the dressing disc robotic arm 202 drives the dressing disc 200 to move in the direction away from the surface of the polishing pad 201, so that the dressing disc 200 is raised and separated from the surface of the polishing pad 201.

[0048] Please refer to Figures 3 to 6The trimming disc robotic arm 202 includes an alignment part 2021, the projection of the alignment part 2021 on the polishing pad 201 at least partially overlaps with the projection of the trimming disc 200 on the polishing pad 201.

[0049] Specifically, in some embodiments of this utility model, the projection of the alignment portion 2021 onto the polishing pad 201 does not exceed the range of the projection of the trimming disc 200 onto the polishing pad 201.

[0050] Please continue to refer to this. Figures 3 to 6 The trimming disc robotic arm 202 further includes an extension 2022, the projection of the extension 2022 on the grinding pad 201 does not overlap with the projection of the trimming disc 200 on the grinding pad 201, and the alignment part 2021 is provided at one end of the extension 2022 along the extension direction.

[0051] Specifically, in some embodiments of this utility model, such as Figure 3 As shown, one end of the alignment portion 2021 is connected to the extension portion 2022 extending along the X direction.

[0052] Please refer to Figures 3 to 6 The trimming disc robotic arm 202 includes: a gas pipe (not shown), through which the abrasive pad trimmer extracts gas to drive the trimming disc 200 to move toward the abrasive pad 201; and through which the abrasive pad trimmer introduces gas to drive the trimming disc 200 to move away from the abrasive pad 201.

[0053] When the dressing disc 200 is in working condition, that is, when the dressing disc 200 needs to dress the surface of the polishing pad 201, gas is drawn out through the gas pipe to drive the dressing disc 200 to move in the direction toward the polishing pad 201, so that the dressing disc 200 is lowered to the lowest position and in contact with the surface of the polishing pad 201; when the dressing disc 200 is not in working condition, that is, when the dressing disc 200 does not need to dress the surface of the polishing pad 201, gas is introduced through the gas pipe to drive the dressing disc 200 to move in the direction away from the polishing pad 201, so that the dressing disc 200 is raised and separates from the surface of the polishing pad 201.

[0054] Please continue to refer to this. Figures 3 to 6 The trimming disc robotic arm 202 further includes a connecting part 2023, which is located between the alignment part 2021 and the trimming disc 200.

[0055] The connecting part 2023 is connected to the gas pipe. The rising and falling of the dressing disc 200 is achieved by evacuating or filling the connecting part 2023 through the gas pipe. Specifically, the dressing disc 200 is driven to move towards the grinding pad 201 by evacuating the gas from the connecting part 2023 through the gas pipe; and the dressing disc 200 is driven to move away from the grinding pad 201 by introducing gas into the connecting part 2023 through the gas pipe.

[0056] Specifically, in some embodiments of this utility model, such as Figure 4 and Figure 5 As shown, the surface of the connecting portion 2023 facing the alignment portion 2021 is in contact with the alignment portion 2021.

[0057] Specifically, in some embodiments of this utility model, when the dressing disc 200 moves in the direction toward the polishing pad 201 and the dressing disc 200 is lowered to its lowest position, the surface of the connecting portion 2023 facing the polishing pad 201 contacts the polishing pad 201. The lowest position is the position where the distance between the dressing disc 200 and the surface of the polishing pad 201 is the smallest. When the dressing disc 200 moves in the direction away from the polishing pad 201, the surface of the connecting portion 2023 facing the polishing pad 201 separates from the polishing pad 201.

[0058] Please continue to refer to this. Figures 3 to 6 The projection of the connecting part 2023 on the polishing pad 201 does not exceed the range of the projection of the dressing disc 200 on the polishing pad 201.

[0059] Please continue to refer to this. Figures 3 to 6 In some embodiments of this utility model, the grinding pad dressing device includes: a lifting column 203, the lifting column 203 having one end and another end in a direction perpendicular to the surface of the dressing disc 200, one end of the lifting column 203 being adapted to be connected to the dressing disc 200, and the other end of the lifting column 203 being adapted to be connected to the connecting portion 2023.

[0060] The lifting column 203 is adapted to move in a direction toward the surface of the abrasive pad 201 and the lifting column 203 is adapted to move in a direction away from the surface of the abrasive pad 201.

[0061] When gas is extracted from the interior of the connecting portion 2023 through the gas pipe to drive the dressing disc 200 to move toward the grinding pad 201, the lifting column 203 moves toward the side toward the grinding pad 201, so that the dressing disc 200 connected to one end of the lifting column 203 moves toward the surface of the grinding pad 201; when gas is introduced into the interior of the connecting portion 2023 through the gas pipe to drive the dressing disc 200 to move away from the grinding pad 201, the lifting column 203 moves toward the side away from the grinding pad 201, so that the dressing disc 200 connected to one end of the lifting column 203 moves away from the surface of the grinding pad 201.

[0062] Please refer to Figures 3 to 6 The polishing pad trimmer includes a laser detection module, which is fixed to the trimming disc robotic arm 202. The laser detection module is adapted to emit and receive detection light to determine the position of the trimming disc 200.

[0063] The laser detection module includes: a light source emitter 204, which is adapted to emit the detection light; and a light source receiver 205, which is adapted to receive the detection light.

[0064] By determining that the light source receiver 205 has received the probe light, it is determined that the trimming disk 200 has been lowered to its lowest position, thereby determining that the trimming disk 200 is in contact with the polishing pad 201. This ensures that the surface of the polishing pad 201 has been trimmed by the trimming disk 200 before polishing the wafer, and that the surface of the polishing pad 201 has a certain degree of activity, resulting in a better polishing effect on the wafer.

[0065] The trimming disk 200 is located between the light source emitter 204 and the light source receiver 205. When the trimming disk 200 is lowered to its lowest position, the probe light passes through one side surface of the trimming disk 200 toward the trimming disk robotic arm 202.

[0066] The lowest position refers to the position where the dressing disc 200 is lowered to the point where the distance between the side facing the polishing pad 201 and the surface of the polishing pad 201 is minimal. Specifically, in some embodiments of this utility model, the minimum distance between the side facing the polishing pad 200 and the surface of the polishing pad 201 is 0, that is, the side facing the polishing pad 200 is in contact with the surface of the polishing pad 201.

[0067] When the trimming disk 200 is lowered to its lowest position, the probe light passes through the surface of the trimming disk 200 on one side towards the trimming disk robotic arm 202. By determining that the light source receiver 205 receives the probe light, it is determined that the trimming disk 200 has been lowered to its lowest position, thereby determining that the trimming disk 200 is in contact with the polishing pad 201. This ensures that the surface of the polishing pad 201 has been trimmed by the trimming disk 200 before polishing the wafer, and that the surface of the polishing pad 201 has a certain degree of activity, resulting in a better polishing effect on the wafer.

[0068] The projection of the probe light path between the light source emitter 204 and the light source receiver 205 onto the polishing pad 201 at least partially overlaps with the projection of the trimming disk 200 onto the polishing pad 201.

[0069] The projection of the light path of the detection light onto the polishing pad 201 at least partially overlaps with the projection of the trimming disk 200 onto the polishing pad 201. That is, the projection of the connecting line between the light source emitter 204 and the light source receiver 205 onto the polishing pad 201 at least partially overlaps with the projection of the trimming disk 200 onto the polishing pad 201. This avoids the situation where the position setting of the laser detection module is incorrect, causing the light source receiver 205 to fail to correctly receive the detection light from the light source emitter 204, thereby improving the detection accuracy of the laser detection module.

[0070] Specifically, in some embodiments of this utility model, the light source emitter 204 and the light source receiver 205 are disposed on different sides of the alignment portion 2021. This avoids the situation where the projection of the connecting line between the light source emitter 204 and the light source receiver 205 on the polishing pad 201 does not overlap with the projection of the trimming disk 200 on the polishing pad 201, which could prevent the laser detection module from correctly determining the position of the trimming disk 200, thus improving the detection accuracy of the laser detection module.

[0071] Specifically, in some embodiments of this utility model, at least one of the light source emitter 204 and the light source receiver 205 is fixedly connected to the alignment portion 2021. This avoids the situation where both the light source emitter 204 and the light source receiver 205 are located on the extension portion 2022, and it is impossible to determine whether the trimming disk 200 is in contact with the polishing pad 201 by whether the light source receiver 205 receives the probe light.

[0072] Specifically, in some embodiments of this utility model, the optical path of the probe light between the light source emitter 204 and the light source receiver 205 does not pass through the lifting column 203, so as to avoid the lifting column 203 blocking the probe light emitted by the light source emitter 204, causing the light source receiver 205 to be unable to receive the probe light normally, thereby causing an incorrect judgment of the position of the trimming disk 200. That is, the projection of the connecting line between the light source emitter 204 and the light source receiver 205 on the polishing pad 201 does not overlap with the projection of the lifting column 203 on the polishing pad 201.

[0073] Please refer to Figures 3 to 6 The laser detection module further includes: a bracket 206, which connects the light source emitter 204 to the trimming disc robotic arm 202; the bracket 206 also connects the light source receiver 205 to the trimming disc robotic arm 202.

[0074] Specifically, in some embodiments of this utility model, the light source emitter 204 and the light source receiver 205 are both located in the alignment portion 2021, and the bracket 206 of the light source receiver 204 and the bracket 206 of the light source receiver 205 are collinear.

[0075] Specifically, please refer to some embodiments of this utility model. Figure 5 The trimming disc robotic arm 202 is recessed on one side of the trimming disc 200 along the Y direction; the other side of the trimming disc robotic arm 202 is recessed on the other side of the trimming disc 200 along the Y direction.

[0076] The dimensions of the bracket 206 are adapted to the dimension of one side of the trimming disc robotic arm 202 recessed into the trimming disc 200 along the Y direction, and the dimensions of the bracket 206 are also adapted to the dimension of the other side of the trimming disc robotic arm 202 recessed into the trimming disc 200 along the Y direction. Specifically, in some embodiments of this utility model, the dimension of one side of the trimming disc robotic arm 202 recessed into the trimming disc 200 along the Y direction is equal to the dimension of the other side of the trimming disc robotic arm 202 recessed into the trimming disc 200 along the Y direction.

[0077] For details, please refer to Figure 5 The dimension of the bracket 206 is the length L of the bracket 206, and the length of the bracket 206 is the dimension of the bracket 206 in its extension direction Y, which is parallel to the surface of the abrasive pad 201.

[0078] For details, please continue to refer to [the website / information]. Figure 5The length L of the bracket 206 is greater than the dimension A1 of the trimming disc robotic arm 202 recessed into the trimming disc 200 along the Y direction on one side, and the length L of the bracket 206 is greater than the dimension A2 of the trimming disc robotic arm 202 recessed into the trimming disc 200 along the Y direction on the other side.

[0079] The laser detection module further includes a processing element, which is adapted to determine whether the trimming disk 200 is in a preset position based on whether the laser detection module receives detection light.

[0080] When the polishing pad dresser introduces gas through the gas pipe, driving the dressing disk 200 to move away from the polishing pad 201, and the dressing disk 200 is in an upward state, the laser detection module cannot receive detection light, thus determining that the dressing disk 200 is not in a preset position. When the polishing pad dresser extracts gas through the gas pipe, driving the dressing disk 200 to move towards the polishing pad 201, and the dressing disk 200 descends to its lowest position, the laser detection module receives detection light, thus determining that the dressing disk 200 is in a preset position.

[0081] Specifically, in some embodiments of this utility model, the trimming disc 200 is in a preset position, that is, the trimming disc 200 is lowered to contact the polishing pad 201; the trimming disc 200 is not in a preset position, that is, the trimming disc 200 is in a raised position, and the trimming disc 200 does not contact the polishing pad 201.

[0082] The processing element determines whether the trimming disk 200 is in a preset position by whether the laser detection module receives a probe light. When the laser detection module cannot receive a probe light, it determines that the trimming disk 200 is in the raised position, and the trimming disk 200 is not in contact with the polishing pad 201, so the trimming disk 200 cannot trim the polishing pad 201. When the laser detection module receives a probe light, it determines that the trimming disk 200 has descended to the lowest position, that is, the trimming disk 200 is in contact with the polishing pad 201, so the trimming disk 200 can trim the polishing pad 201.

[0083] The similarities to the foregoing embodiments will not be repeated here. The differences from the foregoing embodiments are as follows, please refer to... Figure 7 and Figure 8 , Figure 8 for Figure 7 A cross-sectional structural diagram at position Y1Y2. The light source emitter 304 and the light source receiver 305 are both located in the alignment portion 2021, and the support 206 of the light source receiver 304 and the support 206 of the light source receiver 305 are not collinear.

[0084] The similarities to the foregoing embodiments will not be repeated here. The differences from the foregoing embodiments are as follows, please refer to... Figure 9 and Figure 10 , Figure 10 for Figure 9 A cross-sectional view of the structure at position Y1Y2. One of the light source emitter 404 and the light source receiver 405 is located in the alignment portion 2021, and the other of the light source emitter 404 and the light source receiver 405 is located in the extension portion 2022.

[0085] Accordingly, this utility model embodiment also provides a grinding device, including: the grinding pad dresser described in this utility model embodiment; and a grinding pad, wherein the grinding pad dresser is located on the grinding pad.

[0086] In summary, the laser detection module is fixed to the trimming disk robotic arm. The laser detection module is adapted to emit and receive probe light to determine the position of the trimming disk. By determining the position of the trimming disk, the laser detection module determines whether the trimming disk is in contact with the polishing pad. If it is determined that the trimming disk is not in contact with the polishing pad, i.e., the trimming disk cannot polish the surface of the polishing pad, the position of the trimming disk is adjusted in a timely manner so that the trimming disk descends to contact the surface of the polishing pad. This ensures that the surface of the polishing pad has been trimmed by the trimming disk before polishing the wafer, thereby improving the surface activity of the polishing pad and thus improving the polishing effect of the polishing pad on the wafer.

[0087] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. An abrasive pad dressing tool, characterized in that, include: A dressing disc, the dressing disc being adapted to contact a polishing pad to dress the polishing pad; A dressing disc robotic arm, wherein the dressing disc robotic arm is located on the side of the dressing disc opposite to the grinding pad, and the dressing disc robotic arm is adapted to drive the movement of the dressing disc; A laser detection module is fixed to the trimming disk robotic arm. The laser detection module is adapted to emit and receive detection light to determine the position of the trimming disk.

2. The abrasive pad dresser as described in claim 1, characterized in that, The dressing disc robotic arm is adapted to drive the dressing disc to move along a direction perpendicular to the surface of the grinding pad; The laser detection module includes: a light source emitter, which is adapted to emit the detection light; A light source receiver, the light source receiver being adapted to receive the probe light; The trimming disk is located between the light source emitter and the light source receiver. When the trimming disk is lowered to its lowest position, the probe light passes through the trimming disk toward one side surface of the trimming disk robotic arm.

3. The abrasive pad dresser as described in claim 2, characterized in that, The projection of the probe light path between the light source emitter and the light source receiver onto the polishing pad at least partially overlaps with the projection of the trimming disk onto the polishing pad.

4. The abrasive pad dresser as described in claim 2 or 3, characterized in that, The trimming disc robotic arm includes an alignment part, the projection of the alignment part on the grinding pad at least partially overlaps with the projection of the trimming disc on the grinding pad; At least one of the light source emitter and the light source receiver is fixedly connected to the alignment part.

5. The abrasive pad dresser as described in claim 4, characterized in that, The trimming disc robotic arm also includes an extension, the projection of the extension on the grinding pad does not overlap with the projection of the trimming disc on the grinding pad, and the alignment part is provided at one end of the extension along the extension direction.

6. The abrasive pad dresser as described in claim 2, characterized in that, The laser detection module also includes: A support frame connects the light source emitter to the trimming disc robotic arm; The bracket also connects the light source receiver to the trimming disc robotic arm.

7. The abrasive pad dresser as described in claim 2, characterized in that, The grinding pad dresser further includes: a lifting column having one end and another end in a direction perpendicular to the surface of the dressing disc, one end of the lifting column being adapted to be connected to the dressing disc, and the other end of the lifting column being adapted to be connected to the dressing disc robotic arm; The lifting column is adapted to move in a direction toward the surface of the grinding pad so that the dressing disc moves in a direction toward the grinding pad; The lifting column is adapted to move in a direction away from the surface of the grinding pad so that the dressing disc moves in a direction away from the grinding pad; The projection of the probe light path between the light source emitter and the light source receiver onto the polishing pad does not overlap with the projection of the lifting column onto the polishing pad.

8. The abrasive pad dresser as described in claim 1, characterized in that, The dressing disc robotic arm includes: a gas pipe, through which the abrasive pad dresser extracts gas to drive the dressing disc to move in the direction toward the abrasive pad; and through which the abrasive pad dresser introduces gas to drive the dressing disc to move in the direction away from the abrasive pad.

9. The abrasive pad dresser as described in claim 8, characterized in that, The dressing disc robotic arm further includes a connecting part located on the side of the dressing disc away from the grinding pad, and the gas pipe is connected to the connecting part.

10. The abrasive pad dresser as described in claim 8, characterized in that, The laser detection module further includes a processing element, which is adapted to determine whether the trimming disk is in a preset position based on whether the laser detection module receives detection light. When the abrasive pad conditioner introduces gas through the gas pipe to drive the conditioner disk to move in a direction away from the abrasive pad, and the conditioner disk is in an upward state, the laser detection module cannot receive the detection light and determines that the conditioner disk is not in the preset position. When the abrasive pad dresser draws gas through the gas pipe to drive the dressing disk to move toward the abrasive pad, and the dressing disk descends to its lowest position, the laser detection module receives the detection light and determines that the dressing disk is in a preset position.

11. A grinding apparatus, characterized in that, include: Abrasive pad dresser as claimed in any one of claims 1 to 10; A polishing pad, wherein the polishing pad trimmer is located on the polishing pad.

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