Suction device and thimble mechanism

Abstract

The utility model provides a kind of adsorption device and ejector pin mechanism, the adsorption device includes the main body structure formed by first main body part and second main body part, both extend along adsorption direction;It is equipped with adsorption hole in the end of first main body part away from second main body part;First through-hole, along first main body part axis is arranged in first main body part and is communicated with it;Negative pressure passage, along second main body part axis is arranged in second main body part and is communicated with first through-hole;Adsorption component, deformably be arranged in adsorption hole, at least part of adsorption component exposes the end surface of first main body part and is in contact with the inner side wall of adsorption hole, when adsorbing, adsorption component first contact with annular part, by making negative pressure passage in negative pressure state, to make annular part compress tightly on adsorption component, to realize adsorption;Solved the problem that lift pin cannot effectively adsorb Taiko wafer edge in prior art and causes wafer to deviate in the process of carrying.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit equipment manufacturing, and more specifically, to an adsorption device and a pin mechanism. Background Technology

[0002] In the field of integrated circuit equipment manufacturing, wafer handling and transport is a crucial process. Traditionally, wafers are thinned by back-side grinding, resulting in a more uniform overall thickness. This allows for a relatively standard design when using lift pins to pick up and move wafers. The hard surface of the lift pins contacts the wafer, creating good airtightness and ensuring the stability and safety of the wafer during transport.

[0003] However, with technological advancements, a new wafer structure called "Taiko" emerged, characterized by retaining a ring-shaped region of approximately 3mm at the wafer edge, while the central portion was thinned. This design helps enhance the mechanical strength of the wafer, reduces the risk of warpage during the thinning process, and thus improves chip manufacturing quality.

[0004] However, the difference in thickness between the edge and the center of the Taiko wafer presents a new challenge for lift pin adsorption. Traditional lift pin designs, lacking adaptability to the Taiko wafer structure, often fail to create an effective vacuum when adsorbing the wafer edge, leading to wafer misalignment or instability during transport.

[0005] To complicate matters further, in order to maintain the flatness of the wafer during the adsorption process, the lift pin is usually made of a rigid material. However, when the rigid lift pin comes into contact with the edge of the rigid wafer, the slight unevenness between the two will cause gaps, which will affect the vacuum adsorption effect. In this case, the traditional lift pin is inadequate and cannot meet the adsorption requirements of Taiko wafers. Utility Model Content

[0006] The main purpose of this invention is to provide an adsorption device and a lifting pin mechanism to solve the problem that the lift pin in the prior art cannot effectively adsorb the edge of the Taiko wafer, which leads to the wafer shifting during the handling process.

[0007] To achieve the above objectives, according to one aspect of the present invention, an adsorption device is provided for adsorbing a wafer, wherein the wafer has an annular portion at its outer periphery. The adsorption device includes: a main body structure, comprising a first main body portion and a second main body portion detachably connected; both the first and second main body portions extend along a first direction, which is the adsorption direction; an adsorption hole is disposed at the end of the first main body portion away from the second main body portion; a first through hole is disposed within the first main body portion along the axis of the first main body portion and communicates with the adsorption hole; a negative pressure channel is disposed within the second main body portion along the axis of the second main body portion and communicates with the first through hole; and an adsorption component is deformably disposed within the adsorption hole, at least a portion of which protrudes from the end face of the first main body portion and abuts against the inner wall of the adsorption hole. During adsorption, the adsorption component first contacts the annular portion, and by placing the negative pressure channel in a negative pressure state, the annular portion is pressed against the adsorption component to achieve adsorption.

[0008] Furthermore, the adsorption device also includes a second through hole, which is disposed within the first main body along the axis of the first main body. The second through hole is connected to the adsorption hole and the first through hole respectively. The diameter of the second through hole is smaller than the diameter of the adsorption hole, so that a stepped surface is formed between the second through hole and the adsorption hole, and the adsorption component is disposed on the stepped surface.

[0009] Furthermore, the axial cross-section of the adsorption pore is trapezoidal, and the end of the adsorption pore near the second main body is the lower base of the trapezoid.

[0010] Furthermore, the adsorption component is annular, with a wire diameter of L1 and a pore depth of L2; wherein, the relationship between L1 and L2 satisfies 0.9*L1>L2.

[0011] Furthermore, the first main body includes a connecting post disposed at one end relatively close to the second main body. The outer wall surface of the connecting post is provided with an external thread. The end of the second main body relatively close to the first main body is provided with a connecting groove. The inner wall surface of the connecting groove is provided with an internal thread that mates with the external thread. The connecting post can extend into the connecting groove along the adsorption direction to connect with the second main body through the connecting groove.

[0012] Furthermore, at least one set of detachable gaskets is provided between the first main body and the second main body. Each gasket is provided with a through hole, the diameter of which is larger than the diameter of the connecting post. The connecting post of the first main body passes through the through hole and enters the connecting groove to press at least one set of gaskets onto the second main body to adjust the gap between the first main body and the second main body.

[0013] Furthermore, the second main body is provided with a tightening part, which has a tightening plane. The adsorption device also includes a tightening member that works in conjunction with the tightening part to tighten the second main body.

[0014] Furthermore, the adsorption component is a sealing ring, and the diameter of the sealing ring is smaller than the width L3 of the annular portion along the wafer diameter direction.

[0015] According to another aspect of the present invention, a pin mechanism is provided, which has the above-mentioned adsorption device. The pin mechanism includes an annular support body, from which a plurality of mounting bodies extend radially. The plurality of mounting bodies are evenly distributed around the annular support body. A plurality of adsorption devices are respectively disposed at the end of each mounting body away from the annular support body. The adsorption devices are disposed in a one-to-one correspondence with the mounting bodies. Adsorption pipes are disposed inside the annular support body and the mounting bodies and are connected to the negative pressure channels of each adsorption device.

[0016] Furthermore, the bottom of the adsorption device is threadedly connected to the mounting body, and an anti-loosening nut is provided between the bottom of the adsorption device and the mounting body. There are three adsorption devices and three mounting bodies.

[0017] By applying the technical solution of this utility model, the main structure is designed in a form where the first main body and the second main body are detachably connected. This allows for the replacement of adsorption components of different sizes simply by disassembling the first main body and the second main body and replacing the first main body. This enables the replacement of adsorption components of different sizes to accommodate wafers of different sizes, thereby avoiding a complex disassembly and assembly process and reducing maintenance time and costs.

[0018] The deformable nature of the adsorption component, and the fact that at least part of the adsorption component is exposed on the end face of the first main body, allows the adsorption component to be finely adjusted according to the shape and size of the annular portion of the wafer during adsorption to achieve close contact. This ensures that even if there are minor unevennesses on the wafer, a good seal can be formed, thereby achieving stable adsorption and reducing the risk of wafer falling off due to poor sealing during handling.

[0019] By setting a connecting first through hole and a negative pressure channel inside the first main body and the second main body, the negative pressure state of each adsorption point can be precisely controlled, which improves the adsorption efficiency and ensures the safety and accuracy of the wafer during the handling process. Attached Figure Description

[0020] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0021] Figure 1 A partial structural schematic diagram of the wafer in an embodiment of this application is shown;

[0022] Figure 2 A cross-sectional view of an adsorption device according to an embodiment of this application is shown;

[0023] Figure 3 An embodiment of this application is shown. Figure 2 Enlarged view of point A in the diagram;

[0024] Figure 4 A schematic diagram of a wafer being adsorbed by an adsorption device according to an embodiment of this application is shown;

[0025] Figure 5 A schematic diagram of the ejector mechanism according to an embodiment of this application is shown;

[0026] Figure 6 A front view of the ejector mechanism according to an embodiment of this application is shown.

[0027] The above figures include the following reference numerals:

[0028] 1. Wafer; 101. Ring portion; 102. Wafer body; 2. Main structure; 201. First main body portion; 2012. Connecting body; 2011. Connecting post; 202. Second main body portion; 3. Adsorption hole; 4. First through hole; 5. Negative pressure channel; 6. Adsorption component; 7. Second through hole; 8. Tightening part; 9. Ring support body; 10. Mounting body. Detailed Implementation

[0029] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0030] As described in the background section, traditional lift pin designs often fail to form an effective vacuum when adsorbing the edges of Taiko wafers due to a lack of adaptability to the wafer structure. This results in the wafers being prone to shifting or becoming unstable during transport. Therefore, the main objective of this application is to provide an adsorption device and a ejector pin mechanism thereon to solve the problem that the lift pin, i.e., the lifting pin, cannot effectively adsorb the edges of Taiko wafers, leading to wafer shifting during transport.

[0031] Example 1:

[0032] like Figures 1 to 6 As shown, to address the aforementioned problems, this application first provides an adsorption device for adsorbing wafer 1, wherein the outer edge of wafer 1 is provided with an annular portion 101, and the adsorption device includes:

[0033] The main structure 2 includes a first main body part 201 and a second main body part 202 that are detachably connected; both the first main body part 201 and the second main body part 202 extend along a first direction, which is the adsorption direction;

[0034] Adsorption holes 3 are provided at the end of the first main body 201 that is away from the second main body 202;

[0035] The first through hole 4 is disposed inside the first main body 201 along the axis of the first main body 201 and communicates with the adsorption hole 3.

[0036] The negative pressure channel 5 is disposed within the second main body 202 along the axis of the second main body 202 and communicates with the first through hole 4;

[0037] The adsorption component 6 is deformably disposed inside the adsorption hole 3. At least a portion of the adsorption component 6 is exposed above the end face of the first main body 201. At least a portion of the adsorption component 6 abuts against the inner sidewall of the adsorption hole 3. During the adsorption process of the adsorption component 6, the adsorption component 6 first contacts the annular portion 101. By making the negative pressure channel 5 in a negative pressure state, the annular portion 101 is pressed onto the adsorption component 6 to achieve adsorption.

[0038] Regarding the above, the specific structure, working principle, and corresponding technical effects will be explained in detail below with reference to the accompanying drawings:

[0039] Figure 1 This is a partial structural diagram of wafer 1. Wafer 1 includes a wafer body 102 and an annular portion 101 located at the outer edge of the wafer body 102. It can be seen that, along the direction perpendicular to the upper surface of wafer 1, the thickness of the annular portion 101 is greater than the thickness of the wafer body 102. Specifically, the thickness of the annular portion 101 is in the sub-millimeter range, while the thickness of the wafer body 102 is in the micrometer range.

[0040] like Figure 2 and Figure 3 As shown, the adsorption device includes a first main body 201 and a second main body 202 that are detachably connected. The first main body 201 and the second main body 202 are arranged and extend along a first direction. In this embodiment, the first direction is the adsorption direction, which is vertical when the adsorption device is in normal working condition. The detachable first main body 201 and second main body 202 allow for replacement of the adsorption component 6 by simply replacing the first main body 201, thus enabling the replacement of the adsorption component 6 to accommodate wafers 1 of different sizes.

[0041] An adsorption hole 3 is provided at the end of the first main body 201 away from the second main body 202. A first through hole 4 is provided in the first main body 201, which communicates with the adsorption hole 3 of the first main body 201. The first through hole 4 is arranged along the axis of the first main body 201. A negative pressure channel 5 is provided in the second main body 202, which communicates with the first through hole 4. An adsorption component 6 is deformably provided in the adsorption hole 3. When the adsorption component 6 is in its natural state, at least part of the end face of the first main body 201 is exposed, and at least part of the adsorption component 6 abuts against the inner sidewall of the adsorption hole 3.

[0042] When adsorbing wafer 1, the side of the adsorption component 6 away from the adsorption hole 3 first contacts the annular portion 101. Then, a vacuum is applied to the negative pressure channel 5 using a vacuum pump or vacuum machine, so that the inside of the negative pressure channel 5 is in a negative pressure state. Since the negative pressure channel 5 is connected to both the first through hole 4 and the adsorption hole 3, when the inside of the negative pressure channel 5 is in a negative pressure state, the first through hole 4 and the adsorption hole 3 will also be in a negative pressure state simultaneously. Furthermore, because one side of the adsorption component 6 is in contact with the annular portion 101, the adsorption component 6 deforms under the action of negative pressure, thereby adsorbing wafer 1 onto the adsorption component 6. Specifically, in this embodiment, the adsorption component 6 can be a sealing ring, a soft suction nozzle, or other easily deformable materials.

[0043] When the wafer 1 is adsorbed, before adsorption, the adsorption component 6 is in a natural state, and at least part of the end face of the adsorption component 6 extends beyond the end face of the first main body 201, so that it can deform when it comes into contact with the annular portion 101 of the wafer 1 to adapt to the thickness of the edge of the wafer 1.

[0044] As can be seen, in this application, when the adsorption component 6 is in its natural state, part of its structure is exposed at the end face of the first main body 201 and contacts the annular portion 101 of the wafer 1, thereby being able to closely fit the edge of the wafer 1. Even if there are minor unevenness or steps at the edge, the gap can be eliminated by the deformation of the adsorption component 6 itself, ensuring that the wafer 1 can be firmly adsorbed when a vacuum is drawn to form a negative pressure, thereby avoiding the situation where the wafer 1 shifts or falls off due to unstable adsorption during transportation.

[0045] Because the inner wall of the adsorption hole 3 is in contact with the adsorption component 6, the positioning during the adsorption process can be more precise. During the adsorption process of the adsorption component 6, the radial compression and axial extension of the adsorption component 6 can eliminate the gap between the adsorption component 6 and the annular part 101 in time, thereby ensuring that the wafer 1 can be stably adsorbed on the adsorption component 6.

[0046] This application employs a design where the first main body 201 and the second main body 202 are detachably connected, which not only facilitates the assembly and disassembly of the adsorption device but also simplifies the maintenance process. When it is necessary to adjust or replace the adsorption component 6, it is not necessary to disassemble the entire adsorption device; only the first main body 201 needs to be disassembled, which greatly saves time and costs.

[0047] When the vacuum pumping component (not shown in the figure) acts on the negative pressure channel 5, the entire adsorption system forms a closed negative pressure environment. Since the first through hole 4 is connected to the adsorption hole 3 and the negative pressure channel 5, when a negative pressure is formed inside the negative pressure channel 5, this state is immediately transmitted to the first through hole 4 and the adsorption hole 3, and then acts on the adsorption component 6. The adsorption component 6 deforms, thereby adsorbing the wafer 1 onto the adsorption component 6.

[0048] Under negative pressure, the adsorption component 6 fits tightly against the annular portion 101 of the wafer 1. The deformation of the adsorption component 6 eliminates the gaps at the contact surface, forming an effective vacuum adsorption interface. At this time, the wafer 1 is firmly adsorbed onto the adsorption component 6, ensuring a stable position during subsequent handling.

[0049] When it is necessary to release the wafer, simply restore the normal air pressure of the negative pressure channel 5, and the wafer 1 can be safely released from the adsorption hole 3.

[0050] It can be seen that by making the inside of the negative pressure channel 5 a negative pressure state, the annular part 101 of the wafer 1 can be tightly adsorbed by the adsorption component 6. Even if a small gap is generated between the annular part 101 and the adsorption component 6, the gap can be eliminated by the elastic properties of the adsorption component 6 itself, thereby ensuring the stability of the wafer 1 on the adsorption component 6.

[0051] Furthermore, such as Figure 3 As shown, the adsorption device also includes a second through hole 7, which is disposed in the first main body 201 along the axis of the first main body 201. The second through hole 7 is connected to the adsorption hole 3 and the first through hole 4 respectively. The diameter of the second through hole 7 is smaller than the diameter of the adsorption hole 3, so that a stepped surface is formed between the second through hole 7 and the adsorption hole 3. The adsorption component 6 is disposed on the stepped surface.

[0052] As can be seen, in this application, by connecting the adsorption hole 3 and the first through hole 4 through the second through hole 7, the adsorption hole 3 can be placed in a negative pressure environment. Furthermore, the diameter of the second through hole 7 is smaller than the diameter of the adsorption hole 3, so a stepped surface is formed between the second through hole 7 and the adsorption hole 3, thereby enabling the adsorption component 6 to be stably placed on the stepped surface. At the same time, the diameter of the first through hole 4 is larger than the diameter of the second through hole 7 and smaller than the diameter of the adsorption hole 3.

[0053] Therefore, the stepped surface between the second through hole 7 and the adsorption hole 3 provides a better mounting base for the adsorption component 6, forming a natural positioning edge. This positioning edge not only ensures the correct position of the adsorption component 6 in its natural state but also limits its displacement under stress, thus preventing positional changes during wafer 1 adsorption and maintaining adsorption stability.

[0054] like Figure 3 As shown, the axial cross-section of the adsorption hole 3 is trapezoidal, and the end of the adsorption hole 3 near the second main body 202 is the lower base of the trapezoid. The transverse cross-section of the adsorption hole 3 is circular, and the area of ​​the cross-section of the adsorption hole 3 gradually increases along the adsorption direction to form a frustum-shaped adsorption hole 3. This structure ensures that the adsorption component 6 will not slip out of the adsorption hole 3, thereby ensuring the stability of the installation position of the adsorption component 6.

[0055] Furthermore, the adsorption hole 3 in this application adopts a trapezoidal cross-section design, which reduces the need for additional fixing components (such as retaining rings, clamps, etc.), simplifies the overall structure of the adsorption device, and reduces the complexity of the device.

[0056] Furthermore, the adsorption component 6 is annular, the wire diameter of the adsorption component 6 is L1, and the pore depth of the adsorption pore 3 is L2; ​​wherein, the relationship between L1 and L2 satisfies 0.9*L1>L2.

[0057] like Figure 3 As shown, in this embodiment, the adsorption component 6 is preferably a sealing ring. To ensure that the sealing ring remains in close contact with the annular portion 101 after compression when negative pressure is introduced into the adsorption hole 3, the sealing ring needs to be exposed on the end face of the first main body portion 201 in its natural state. However, the compression rate of a conventional sealing ring is about 10%, so when selecting a sealing ring, it is necessary to satisfy 0.9*L1>L2.

[0058] Preferably, in this embodiment, the diameter of the sealing ring L1 is 1.2 mm and the depth of the adsorption hole 3 L2 is 1 mm, satisfying 0.9*1.2>1.

[0059] Furthermore, such as Figure 3 As shown, the first main body 201 includes a connecting post 2011 disposed at one end relatively close to the second main body 202. The outer wall surface of the connecting post 2011 is provided with an external thread. The end of the second main body 202 relatively close to the first main body 201 is provided with a connecting groove. The inner wall surface of the connecting groove is provided with an internal thread that cooperates with the external thread. The connecting post 2011 can extend into the connecting groove along the adsorption direction to connect with the second main body 202 through the connecting groove.

[0060] Specifically, such as Figure 3As shown, the first main body 201 includes a connecting body 2012 and a connecting post 2011. An adsorption hole 3 is provided on the connecting body 2012. The connecting post 2011 and the connecting body 2012 are integrally formed. The diameter of the connecting post 2011 is smaller than the diameter of the connecting body 2012. An external thread is provided on the outer wall surface of the connecting post 2011. A connecting groove is provided at the end of the second main body 202 that is relatively close to the first main body 201. An internal thread that mates with the external thread is provided on the inner wall surface of the connecting groove. When installing the first main body 201 and the second main body 202, the connecting post 2011 is inserted into the connecting groove, and the first main body 201 or the second main body 202 is rotated to complete the installation of the first main body 201 and the second main body 202.

[0061] In this application, the connecting post 2011 and the connecting body 2012 can be manufactured integrally to increase the connection strength between them. The outer wall of the connecting post 2011 is provided with external threads, while one end of the second body 202 is provided with an internally threaded connecting groove. This threaded connection design not only simplifies the installation process of the first body 201 and the second body 202, but also allows for quick operation during installation and disassembly, reducing the time cost of device maintenance and assembly. During installation and disassembly, only the two parts need to be rotated to achieve installation and disassembly, without the need for additional fastening tools or complicated steps, thus improving efficiency.

[0062] Furthermore, the diameter of the connecting post 2011 in this application is smaller than the diameter of the connecting body 2012. This design ensures connection strength while lowering the overall center of gravity of the device, thereby improving the stability of the adsorption device during operation. The smaller diameter connecting post 2011 provides more precise positioning and a more secure connection when inserted into the connecting groove of the second main body 202.

[0063] Meanwhile, since the connecting post 2011 and the second main body 202 are connected by threads, when the adsorption component 6 needs to be replaced to adapt to wafers 1 of different sizes, it is not necessary to disassemble the entire device. Only the connecting post 2011 needs to be unscrewed to replace the first main body 201, without disassembling the entire device, which increases work efficiency.

[0064] Furthermore, such as Figure 3 and Figure 4 As shown, at least one set of removable gaskets is provided between the first main body 201 and the second main body 202 (the gaskets are in...). Figure 3 and Figure 4(Not shown in the image) Each gasket is provided with a through hole, the diameter of which is larger than the diameter of the connecting post 2011. The connecting post 2011 of the first main body 201 passes through the through hole and enters the connecting groove to press at least one set of gaskets onto the second main body 202 to adjust the gap between the first main body 201 and the second main body 202.

[0065] Specifically, a gasket may be provided between the first main body 201 and the second main body 202. When a gasket is provided, the number of gaskets is at least one, and each gasket is provided with a through hole. The diameter of the through hole is larger than the diameter of the connecting post 2011. During installation, the gasket is first placed at the end of the second main body 202 that is close to the first main body 201. Then, the connecting post 2011 of the first main body 201 passes through the through hole of the gasket and enters the connecting groove to complete the installation. By providing a gasket, the gap between the first main body 201 and the second main body 202 can be adjusted.

[0066] In addition, the distance between the first main body 201 and the second main body 202 can be adjusted according to actual needs by increasing or decreasing the number of shims or selecting shims of different thicknesses. When adsorbing wafer 1, the adsorption device is usually provided with three. To ensure the adsorption effect, the end faces of the adsorption device that contact wafer 1 need to be on the same plane. Due to the error in the part processing, it is not easy to make the end faces of the three first main bodies 201 on the same plane. Therefore, the debugging personnel can adjust the height of the end faces of the first main bodies 201 by increasing or decreasing the number of shims, so that the three first main bodies 201 are as close to the same plane as possible to ensure the adsorption effect on wafer 1. Furthermore, the first main body 201 and the second main body 202 in this application are connected by threads. This setting method makes the operation of increasing or decreasing shims more convenient and reduces the overall workload of the debugging personnel.

[0067] Furthermore, the second main body 202 is provided with a tightening part 8, which has a tightening plane. The adsorption device also includes a tightening member that works in conjunction with the tightening part 8 to tighten the second main body 202.

[0068] Specifically, such as Figure 2 , Figure 5 and Figure 6 As shown, a tightening part 8 is provided on the second main body 202. The tightening part 8 has a tightening plane. The tightening part 8 is an opening opened on the second main body 202. In this embodiment, the opening is rectangular, but it can also be other shapes. When in use, the tightening end of the tightening member is brought into contact with the tightening plane to tighten the second main body 202 and the ejector pin mechanism together.

[0069] The rectangular opening of the tightening part 8 is designed to match the tightening end of a tightening component (such as a wrench), providing a larger contact area and a more stable torque transmission path. This ensures uniform force distribution in the second main body 202 during tightening, reduces slippage or loosening between components, and improves the stability and safety of the connection between the adsorption device and the ejector mechanism.

[0070] Furthermore, such as Figure 3 As shown, the adsorption component 6 is a sealing ring, and the diameter of the sealing ring is smaller than the width L3 of the annular portion 101 along the diameter direction of the wafer 1.

[0071] Specifically, such as Figure 1 and Figure 3 As shown, in this embodiment, since the width of the annular portion 101 of wafer 1 is only 3mm, that is, the maximum width in contact with the sealing ring is 3mm, the diameter of the sealing ring should be less than or equal to 3mm. In this embodiment, the diameter of the sealing ring is set to 1.2mm. In addition, the diameter of the sealing ring can also be 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, etc., as long as it is less than 3mm. However, the diameter of the sealing ring should not be too small, and should be greater than or equal to 0.5mm, so as to ensure effective adsorption of the annular portion 101.

[0072] It is evident that by setting the diameter of the adsorption component 6 to a range of less than or equal to 3 mm and greater than or equal to 0.5 mm, it can be ensured that the adsorption component 6 provides sufficient adsorption area when contacting the 3 mm wide annular portion 101, thereby achieving effective adsorption of the wafer 1. Simultaneously, the upper limit of the diameter of the adsorption component 6 also ensures that the adsorption component 6 does not exceed the adsorption area, reducing gas leakage, improving the sealing efficiency of the adsorption, and ensuring that the wafer 1 will not shift or detach due to insufficient adsorption force.

[0073] Example 2:

[0074] like Figures 4 to 6 As shown, this embodiment also provides a ejector mechanism, which includes the adsorption device in Embodiment 1. The ejector mechanism includes an annular support 9, from which a plurality of mounting bodies 10 extend radially. The plurality of mounting bodies 10 are evenly distributed around the annular support 9. A plurality of adsorption devices are respectively disposed at the end of each mounting body 10 away from the annular support 9. The adsorption devices are arranged in a one-to-one correspondence with the mounting bodies 10. Adsorption pipes are provided in the annular support 9 and the mounting bodies 10 and are connected to the negative pressure channels 5 of each adsorption device. The inlet end of the vacuum pump or vacuum machine can be connected to the adsorption pipes in the annular support 9, thereby forming a negative pressure environment inside the negative pressure channels 5 to achieve adsorption of the wafer 1.

[0075] In this application, multiple adsorption devices are evenly spaced at the end of the mounting body 10 away from the annular support 9, ensuring a uniform distribution of adsorption force on the wafer 1 during handling. This uniformly distributed force reduces the risk of deformation or damage caused by excessive local stress on the wafer 1, improving handling safety and the integrity of the wafer 1.

[0076] Furthermore, this application also incorporates interconnected adsorption channels within the ejector mechanism, enabling the vacuum pump or vacuum unit to simultaneously create a uniform negative pressure environment with all adsorption devices. This design reduces the risk of wafer 1 being unstablely adsorbed due to the failure of a single adsorption point or insufficient adsorption force provided by a single adsorption point, thereby affecting the entire handling process and ensuring the stability of wafer 1's adsorption.

[0077] The independent design of the mounting body 10 allows each adsorption device to independently adjust its contact position with the wafer 1. Even if there are slight differences in size or shape of the wafer 1, the best adsorption effect can be achieved by adjusting the position of each adsorption device.

[0078] Meanwhile, the use of the annular support 9 provides a stable support base, enhances adsorption stability and accuracy, avoids shaking and displacement of wafer 1 during transportation, and ensures the positional accuracy of wafer 1.

[0079] The separate design of the adsorption device and the mounting body 10 in this application allows each adsorption device to be maintained or replaced independently without disassembling the entire ejector mechanism.

[0080] By increasing or decreasing the number of mounting bodies 10, the number of adsorption devices of the ejector mechanism can be adjusted to accommodate wafers 1 of different sizes and thicknesses.

[0081] Furthermore, the bottom of the adsorption device is threadedly connected to the mounting body 10. In order to ensure the stability of the connection between the adsorption device and the ejector mechanism, an anti-loosening nut is also provided between the bottom of the adsorption device and the mounting body 10.

[0082] Specifically, such as Figure 5 As shown, the bottom of each adsorption device is connected to the mounting body 10 by threads. To prevent the adsorption device from loosening and detaching from the mounting body 10, an anti-loosening nut is also provided at the bottom of the adsorption device. By adding an anti-loosening nut at the connection, the friction of the connection is further increased, effectively preventing the threaded connection from loosening due to vibration or external impact.

[0083] like Figure 5 As shown, in this embodiment, preferably there are three adsorption devices and three mounting bodies 10.

[0084] Specifically, three adsorption devices are respectively installed on three mounting bodies 10, which can ensure uniform negative pressure adsorption of wafer 1. This uniform adsorption force can effectively reduce the vibration of wafer 1 during the lifting process, improve the stability and reliability of adsorption, and avoid the problem of wafer 1 displacement or weak adsorption caused by excessively strong or weak local adsorption force.

[0085] Meanwhile, by setting three mounting bodies 10 at equal intervals around the annular support 9, not only is the uniform distribution of the adsorption device ensured, but the overall structural layout of the ejector mechanism is also optimized, and its rigidity is improved.

[0086] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0087] By using the adsorption component 6, which has compressibility and elastic recovery capabilities, this technical solution solves the adsorption problem of thin and stepped edges on Taiko wafers. It ensures that the lift pin can stably and accurately adsorb wafer 1 during wafer 1 handover and handling, avoiding wafer 1 shifting or falling off, and significantly improving handling stability.

[0088] Three adsorption devices are used, each with a threaded anti-loosening nut at the bottom, which is connected to an independent mounting body 10. This not only enhances the stability of the adsorption device, but also simplifies the maintenance and adjustment process through the threaded connection and anti-loosening nut, while ensuring the accuracy of the contact between the adsorption device and the wafer 1 and the reliability of the connection.

[0089] The first main body 201 and the second main body 202 of the technical solution of this application are detachably connected, which enables the replacement of the adsorption component 6 by simply replacing the first main body 201 when it is necessary to adsorb wafers 1 of different sizes, so as to adapt to wafers 1 of different sizes. The operation is simple.

[0090] The technical solution of this application reduces the shaking and damage of wafer 1 during the handling process by using the elastic contact of the adsorption component 6 and the uniform negative pressure adsorption, thereby improving the safety of wafer 1 handling.

[0091] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0092] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0093] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0094] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0095] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0096] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An adsorption device for adsorbing a wafer (1), wherein the wafer (1) has an annular portion (101) at its outer periphery, characterized in that, The adsorption device includes: The main structure (2) includes a first main body part (201) and a second main body part (202) that are detachably connected; the first main body part (201) and the second main body part (202) both extend along a first direction, which is the adsorption direction; An adsorption hole (3) is provided at the end of the first main body (201) away from the second main body (202); The first through hole (4) is disposed in the first main body (201) along the axis of the first main body (201) and communicates with the adsorption hole (3); The negative pressure channel (5) is disposed in the second main body (202) along the axis of the second main body (202) and communicates with the first through hole (4); An adsorption component (6) is deformably disposed within the adsorption hole (3). At least a portion of the adsorption component (6) is exposed above the end face of the first main body (201). At least a portion of the adsorption component (6) abuts against the inner wall of the adsorption hole (3). During adsorption, the adsorption component (6) first contacts the annular portion (101). By placing the negative pressure channel (5) in a negative pressure state, the annular portion (101) is pressed against the adsorption component (6) to achieve adsorption.

2. The adsorption device according to claim 1, characterized in that, The adsorption device further includes a second through hole (7), which is disposed in the first main body (201) along the axis of the first main body (201). The second through hole (7) communicates with the adsorption hole (3) and the first through hole (4) respectively. The diameter of the second through hole (7) is smaller than the diameter of the adsorption hole (3) so that a stepped surface is formed between the second through hole (7) and the adsorption hole (3). The adsorption component (6) is disposed on the stepped surface.

3. The adsorption device according to claim 1, characterized in that, The axial cross section of the adsorption hole (3) is trapezoidal, and the end of the adsorption hole (3) near the second main body (202) is the lower base of the trapezoid.

4. The adsorption device according to claim 1, characterized in that, The adsorption component (6) is annular, the diameter of the adsorption component (6) is L1, and the depth of the adsorption hole (3) is L2; ​​wherein, the relationship between L1 and L2 satisfies 0.9*L1>L2.

5. The adsorption device according to claim 1, characterized in that, The first main body (201) includes a connecting post (2011) disposed at one end relatively close to the second main body (202). The outer wall surface of the connecting post (2011) is provided with an external thread. The second main body (202) is provided with a connecting groove at one end relatively close to the first main body (201). The inner wall surface of the connecting groove is provided with an internal thread that cooperates with the external thread. The connecting post (2011) can extend into the connecting groove along the adsorption direction to connect with the second main body (202) through the connecting groove.

6. The adsorption device according to claim 5, characterized in that, At least one set of detachable gaskets is provided between the first main body (201) and the second main body (202). Each gasket is provided with a through hole. The diameter of the through hole is larger than the diameter of the connecting post (2011). The connecting post (2011) of the first main body (201) passes through the through hole and enters the connecting groove to press at least one set of gaskets onto the second main body (202) to adjust the gap between the first main body (201) and the second main body (202).

7. The adsorption device according to claim 1, characterized in that, The second main body (202) is provided with a tightening part (8), the tightening part (8) has a tightening plane, and the adsorption device further includes a tightening member that cooperates with the tightening part (8) to tighten the second main body (202) by means of the tightening member.

8. The adsorption device according to any one of claims 1 to 7, characterized in that, The adsorption component (6) is a sealing ring, and the diameter of the sealing ring is smaller than the width L3 of the annular portion (101) along the diameter direction of the wafer (1).

9. A pin mechanism, comprising the adsorption device according to any one of claims 1 to 8, characterized in that, The pin mechanism includes an annular support (9), from which a plurality of mounting bodies (10) extend radially. The plurality of mounting bodies (10) are evenly distributed circumferentially along the annular support (9). A plurality of adsorption devices are respectively disposed at the end of each mounting body (10) away from the annular support (9). The adsorption devices are disposed in a one-to-one correspondence with the mounting bodies (10). Adsorption pipes are disposed inside the annular support (9) and the mounting bodies (10) and are connected to the negative pressure channels (5) of each adsorption device.

10. The ejector mechanism according to claim 9, characterized in that, The bottom of the adsorption device is threadedly connected to the mounting body (10), and an anti-loosening nut is provided between the bottom of the adsorption device and the mounting body (10). There are three adsorption devices and three mounting bodies (10).

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