A heat shrink film machine
By introducing a heat dissipation structure consisting of a semiconductor cooling chip and an air-cooling system into the heat shrink film machine, the problem of excessively high product surface temperature was solved, enabling rapid cooling and efficient production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 扬州志同机械有限公司
- Filing Date
- 2025-07-16
- Publication Date
- 2026-07-14
AI Technical Summary
Existing heat shrink film machines produce products with high surface temperatures, leading to packaging deformation, label detachment, and affecting the quality stability of cosmetics. Furthermore, their low cooling efficiency prolongs the production cycle.
The product is rapidly cooled by using a semiconductor refrigeration chip combined with an air-cooling system. The heat dissipation structure cools the heat-sealed product quickly, and the product is cooled by using the cooling surface of the semiconductor refrigeration chip to cool the air and the air-cooling system.
This technology enables rapid cooling of products, improves cooling efficiency, prevents packaging deformation and label detachment, and shortens the production cycle.
Smart Images

Figure CN224491749U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of cosmetic packaging technology, specifically a heat shrink film machine. Background Technology
[0002] In the cosmetic packaging industry, heat shrink film machines are widely used for sealing the outer packaging of products. Their working principle involves heating the heat shrink film placed outside the cosmetic packaging box, causing it to shrink and tightly wrap the product, achieving the purposes of dustproofing, moisture protection, aesthetics, and product fixation.
[0003] Traditional heat shrink film machines typically include a flat belt conveyor and a heating device. After the packaging box is heated and shrunk, it is sent out by the conveyor.
[0004] However, existing technologies have the following problems: the surface temperature of products processed by heat shrink film machines is high. If these products are directly introduced into subsequent packaging or stacking processes, it may lead to packaging deformation, label detachment, and even affect the quality stability of the cosmetics themselves. Furthermore, high-temperature products are prone to prolonged production cycles and reduced production efficiency due to insufficient heat dissipation during transportation. Currently common natural cooling methods are inefficient, while ordinary fan cooling methods struggle to achieve rapid and uniform cooling, especially when processing large batches of products, where insufficient cooling becomes even more pronounced.
[0005] Therefore, we propose a heat shrink film machine. Utility Model Content
[0006] (a) Technical problems to be solved
[0007] To address the shortcomings of existing technologies, this utility model provides a heat shrink film machine with a cooling structure, which facilitates rapid cooling of heat-sealed products and improves cooling efficiency, effectively solving the problems in the background technology.
[0008] (II) Technical Solution
[0009] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a heat shrink film machine, including a flat belt conveyor, wherein a heat shrink film machine is installed in the middle of the upper end of the flat belt conveyor, and a heat dissipation structure is provided at the material feeding end of the upper outer surface of the flat belt conveyor. The heat dissipation structure includes a top box plate, a first fixed side plate, a second fixed side plate, a first cold air outlet, a concave protective cover, a first blower, a second blower, a ventilation slot, an air inlet, an air outlet, a semiconductor cooling chip, and a second cold air outlet. The first fixed side plate is fixed between the right end of the lower outer surface of the top box plate and one side of the upper part of the frame of the flat belt conveyor, and the second fixed side plate is fixed between the left end of the lower outer surface of the top box plate and the other side of the upper part of the frame of the flat belt conveyor. An air chamber is formed inside the lower end of the second fixed side plate and the first fixed side plate.
[0010] Preferably, there are four sets of second cold air outlets, which are located at the four corners of the lower outer surface of the top panel, and the second cold air outlets are connected to the inner cavity of the top panel.
[0011] Preferably, the ventilation slots are formed on the left and right sides of the upper outer surface of the second fixed side plate and the first fixed side plate, and the ventilation slots are located below the second cold air outlet. The first cold air outlet is formed at the lower end of the inner wall of the first fixed side plate and the second fixed side plate. The bottom of the ventilation slots is connected to the upper part of the air chamber, and the first cold air outlet is connected to one side of the air chamber.
[0012] Preferably, the air inlet is located at the middle of the upper part of the outer surface of one side of the first fixed side plate, and the air inlet extends to the outer surface of the other side of the first fixed side plate. The air outlet is located at the middle of the upper part of the outer surface of one side of the second fixed side plate, and the air outlet extends to the outer surface of the other side of the second fixed side plate. The thermoelectric cooling chip is fixed to the lower end of the top box plate, and the cooling surface of the thermoelectric cooling chip is located at the bottom of the inner cavity of the top box plate. The concave protective cover is fixed to the upper part between the first fixed side plate and the second fixed side plate, and the heating surface of the thermoelectric cooling chip is located at the upper part of the concave protective cover.
[0013] Preferably, there are two sets of the first blowers. The two sets of first blowers are fixed on the left and right sides of the upper outer surface of the top box plate, and the air outlet of the first blower extends into the upper part of the inner cavity of the top box plate. The second blower is fixed on the upper part of the outer surface of one side of the first fixed side plate, and the air outlet of the second blower is connected to the air inlet.
[0014] Preferably, the rated power of the semiconductor cooling chip is 200-400W, the operating temperature range of the cooling surface is 5-15℃, and the temperature of the heating surface is not higher than 80℃.
[0015] (III) Beneficial Effects
[0016] Compared with the prior art, this utility model provides a heat shrink film machine, which has the following beneficial effects:
[0017] 1. This heat shrink film machine, through the combination of semiconductor cooling chip and air cooling system, can quickly cool down the heat-shrinked product, significantly shorten the cooling time, and improve production efficiency.
[0018] 2. This heat shrink film machine has a heat dissipation structure that is directly installed at the unloading end of the flat belt conveyor, without requiring additional production line space, which facilitates the upgrading and transformation of existing equipment and reduces transformation costs. Attached Figure Description
[0019] Figure 1This is a schematic diagram of the overall structure of a heat shrink film machine according to the present invention.
[0020] Figure 2 This is a schematic diagram of the heat dissipation structure in a heat shrink film machine according to the present invention.
[0021] Figure 3 This is a partial structural diagram of the heat dissipation structure in a heat shrink film machine according to the present invention.
[0022] Figure 4 This is a schematic diagram of the bottom structure of the top box plate in a heat shrink film machine according to the present invention.
[0023] In the diagram: 1. Flat belt conveyor; 2. Heat shrink film machine; 3. Heat dissipation structure; 4. Top panel; 5. First fixed side panel; 6. Second fixed side panel; 7. First cold air outlet; 8. Concave protective cover; 9. First blower; 10. Second blower; 11. Ventilation slot; 12. Air inlet; 13. Air outlet; 14. Semiconductor cooling chip; 15. Second cold air outlet. Detailed Implementation
[0024] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0025] This embodiment is a heat shrink film machine.
[0026] like Figure 1-4 As shown, the device includes a flat belt conveyor 1, a heat shrink film machine 2 installed in the middle of the upper end of the flat belt conveyor 1, and a heat dissipation structure 3 provided at the material feeding end of the upper outer surface of the flat belt conveyor 1. The heat dissipation structure 3 includes a top box plate 4, a first fixed side plate 5, a second fixed side plate 6, a first cold air outlet 7, a concave protective cover 8, a first blower 9, a second blower 10, a ventilation slot 11, an air inlet 12, an air outlet 13, a semiconductor cooling chip 14, and a second cold air outlet 15. The first fixed side plate 5 is fixed between the right end of the lower outer surface of the top box plate 4 and one side of the upper part of the frame of the flat belt conveyor 1. The second fixed side plate 6 is fixed between the left end of the lower outer surface of the top box plate 4 and the other side of the upper part of the frame of the flat belt conveyor 1. Air chambers are opened inside the lower ends of the second fixed side plate 6 and the first fixed side plate 5.
[0027] There are four sets of second cold air outlets 15, located at the four corners of the lower outer surface of the top panel 4, and connected to the inner cavity of the top panel 4. Ventilation slots 11 are located on the left and right sides of the upper outer surface of the second fixed side panel 6 and the first fixed side panel 5, below the second cold air outlets 15. First cold air outlets 7 are located at the lower end of the inner wall of the first fixed side panel 5 and the second fixed side panel 6. The bottom of the ventilation slots 11 is connected to the upper part of the air chamber, and the first cold air outlets 7 are connected to one side of the air chamber. An air inlet 12 is located in the middle of the upper part of the outer surface of one side of the first fixed side panel 5, extending to the other outer surface of the first fixed side panel 5. An air outlet 13 is located in the middle of the upper part of the outer surface of one side of the second fixed side panel 6, extending to the second fixed side panel. On the other outer surface of plate 6, a thermoelectric cooler 14 is fixed to the lower end of the top plate 4, and the cooling surface of the thermoelectric cooler 14 is located at the bottom of the inner cavity of the top plate 4. A concave protective cover 8 is fixed to the upper part between the first fixed side plate 5 and the second fixed side plate 6, and the heating surface of the thermoelectric cooler 14 is located at the upper part of the concave protective cover 8. There are two sets of first blowers 9, which are fixed on the left and right sides of the upper outer surface of the top plate 4, and the air outlet of the first blower 9 extends into the upper part of the inner cavity of the top plate 4. A second blower 10 is fixed to the upper part of the outer surface of one side of the first fixed side plate 5, and the air outlet of the second blower 10 is connected to the air inlet 12. The rated power of the thermoelectric cooler 14 is 200-400W, the working temperature range of the cooling surface is 5-15℃, and the temperature of the heating surface is not higher than 80℃.
[0028] It should be noted that this utility model is a heat shrink film machine. The flat belt conveyor 1 and heat shrink film machine 2 described in this article are both existing technologies and can be effectively known to those skilled in the art. Specific details will not be elaborated further. A heat dissipation structure 3 is provided at the end of the flat belt conveyor 1 where the product is fed. A semiconductor cooling chip 14 is provided, with its upper part serving as a cooling surface located at the bottom of the inner cavity of the top panel 4. Air is blown towards the upper part of the semiconductor cooling chip 14 by the operation of the first blower 9, cooling the air. The cooled air passes through the second cold air outlet 15 and the ventilation slot 11, and finally blown towards the product through the first cold air outlet 7, improving cooling efficiency. The lower part of the semiconductor cooling chip 14 serves as a heating surface located at the upper part of the inner cavity of the concave protective cover 8. Air is blown into the concave protective cover 8 by the operation of the second blower 10, carrying away the heat generated by the operation of the semiconductor cooling chip 14 and dissipating the heat from the air outlet 13.
[0029] It should be noted that, in this document, relational terms such as first and second (number one, number two), etc., are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.
Claims
1. A heat shrink film machine, comprising a flat belt conveyor (1), wherein a heat shrink film machine (2) is mounted on the middle of the upper end of the flat belt conveyor (1), characterized in that: The upper outer surface of the flat belt conveyor (1) is provided with a heat dissipation structure (3). The heat dissipation structure (3) includes a top box plate (4), a first fixed side plate (5), a second fixed side plate (6), a first cold air outlet (7), a concave protective cover (8), a first blower (9), a second blower (10), a ventilation slot (11), an air inlet (12), an air outlet (13), a semiconductor cooling chip (14), and a second cold air outlet (15). The first fixed side plate (5) is fixed between the right end of the lower outer surface of the top box plate (4) and one side of the upper part of the frame of the flat belt conveyor (1). The second fixed side plate (6) is fixed between the left end of the lower outer surface of the top box plate (4) and the other side of the upper part of the frame of the flat belt conveyor (1). The lower ends of the second fixed side plate (6) and the first fixed side plate (5) are provided with air chambers.
2. The heat shrink film machine according to claim 1, characterized in that: The number of the second cold air outlets (15) is four sets. The four sets of the second cold air outlets (15) are opened at the four corners of the lower outer surface of the top box plate (4), and the second cold air outlets (15) are connected to the inner cavity of the top box plate (4).
3. A heat shrink film machine according to claim 2, characterized in that: The ventilation slot (11) is opened on the left and right sides of the upper outer surface of the second fixed side plate (6) and the first fixed side plate (5), and the ventilation slot (11) is located below the second cold air outlet (15). The first cold air outlet (7) is opened at the lower end of the inner wall of the first fixed side plate (5) and the second fixed side plate (6). The bottom of the ventilation slot (11) is connected to the upper part of the air chamber, and the first cold air outlet (7) is connected to one side of the air chamber.
4. A heat shrink film machine according to claim 3, characterized in that: The air inlet (12) is located at the middle of the upper part of the outer surface of one side of the first fixed side plate (5), and the air inlet (12) extends to the outer surface of the other side of the first fixed side plate (5). The air outlet (13) is located at the middle of the upper part of the outer surface of one side of the second fixed side plate (6), and the air outlet (13) extends to the outer surface of the other side of the second fixed side plate (6). The semiconductor cooling chip (14) is fixed at the lower end of the top box plate (4), and the cooling surface of the semiconductor cooling chip (14) is located at the bottom of the inner cavity of the top box plate (4). The concave protective cover (8) is fixed at the upper part between the first fixed side plate (5) and the second fixed side plate (6), and the heating surface of the semiconductor cooling chip (14) is located at the upper part of the concave protective cover (8).
5. A heat shrink film machine according to claim 4, characterized in that: The number of the first blowers (9) is two sets. The two sets of first blowers (9) are fixed on the left and right sides of the upper outer surface of the top box plate (4), and the air outlet of the first blower (9) extends into the upper part of the inner cavity of the top box plate (4). The second blower (10) is fixed on the upper part of the outer surface of one side of the first fixed side plate (5), and the air outlet of the second blower (10) is connected to the air inlet (12).
6. A heat shrink film machine according to claim 5, characterized in that: The rated power of the semiconductor cooling chip (14) is 200-400W, the working temperature range of the cooling surface is 5-15℃, and the temperature of the heating surface is not higher than 80℃.