A semi-automatic tinning machine
By introducing a waste solder cutting mechanism and a solder scraping mechanism into a semi-automatic soldering machine, automated cutting of solder tips or solder balls is achieved, solving the problems of low efficiency and safety hazards associated with manual cutting, and improving production efficiency and product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN WANGGAO IND CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-17
AI Technical Summary
Existing semi-automatic soldering machines require manual trimming of solder tips or balls after the wires are dipped in solder, resulting in high labor intensity, inconsistent production quality, low efficiency, and safety hazards.
A waste tin cutting mechanism was designed, comprising a waste tin furnace, a cutting assembly, and an opening and closing assembly, to achieve automated cutting. The collection and processing of waste tin are optimized through a moving mechanism and a tin scraping mechanism.
It significantly improved production efficiency, eliminated safety hazards, ensured consistent cutting quality, reduced labor intensity, and optimized human resource allocation.
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Figure CN224508655U_ABST