Liquid cooling heat dissipation system for electronic device and electronic device

By introducing a liquid cooling system into electronic devices, using a micro-pump to drive the circulation of liquid cooling fluid, and combining it with a cooling module to achieve active heat dissipation, the problem that passive cooling of VC cannot meet the high-performance requirements is solved, and a balance between lightweight design and efficient heat dissipation is achieved.

CN224521436UActive Publication Date: 2026-07-17SHENGZHOU TIANMAI HEAT CONDUCTION TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENGZHOU TIANMAI HEAT CONDUCTION TECH CO LTD
Filing Date
2025-08-06
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In existing highly integrated and thin electronic devices such as mobile phones, VC passive heat dissipation is difficult to cope with the demand for continuous high performance and occupies too much space, leading to a conflict between decreased space utilization and soaring power consumption.

Method used

A liquid cooling system is adopted, which connects to the heat-generating components through the first liquid cooling plate. A micro pump drives the liquid cooling medium to circulate in the fluid channel, and combined with the cooling module, it achieves active heat dissipation. The flow rate and temperature are adjusted to match the power consumption requirements, avoiding excessive space occupation.

Benefits of technology

It achieves a balance between the thinness and lightness of electronic devices and heat dissipation, resulting in efficient heat dissipation, improved space utilization, and the solution to the space and power consumption conflict problem in existing technologies.

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Abstract

The utility model discloses a liquid cooling heat dissipation system for electronic equipment, and the electronic equipment includes the casing and the heating component, and the inside of casing is equipped with the accommodation cavity, and the heating component sets up in the accommodation cavity, and the liquid cooling heat dissipation system includes: first liquid cooling board sets up in the accommodation cavity, and is connected with the heating component, and first liquid cooling board is equipped with first liquid inlet and first liquid outlet and the first cavity that links first liquid inlet and first liquid outlet, and refrigeration module sets up in the accommodation cavity, and is away from the heating component, and refrigeration module is equipped with second liquid inlet and second liquid outlet and the second cavity that links second liquid inlet and second liquid outlet, and micro -pump has the liquid inlet end and the liquid outlet end of intercommunication, and the liquid inlet end of micro -pump is linked with first liquid inlet, and the liquid outlet end of micro -pump is linked with second liquid inlet, and first liquid outlet and second liquid outlet are linked together, so that first cavity and second cavity form the fluid channel, and the fluid channel is equipped with the liquid cooling working medium.
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Claims

1. A liquid cooling system for an electronic device, the electronic device comprising a housing (100) and a heat-generating element (200), wherein the housing (100) has an internal cavity (101), and the heat-generating element (200) is disposed within the cavity (101), characterized in that, The liquid cooling system includes: The first liquid cooling plate (1) is disposed in the receiving cavity (101) and connected to the heating element (200); the first liquid cooling plate (1) is provided with a first liquid inlet (11) and a first liquid outlet (12) and a first cavity (131) connecting the first liquid inlet (11) and the first liquid outlet (12). A cooling module (2) is disposed in the receiving cavity (101) and away from the heating element (200). The cooling module (2) is provided with a second liquid inlet and a second liquid outlet, as well as a second cavity connecting the second liquid inlet and the second liquid outlet. The micro pump (3) has a liquid inlet and a liquid outlet connected together. The liquid inlet of the micro pump (3) is connected to the first liquid inlet (11) of the first liquid cooling plate (1), and the liquid outlet of the micro pump (3) is connected to the second liquid inlet of the refrigeration module (2). The first liquid outlet (12) of the first liquid cooling plate (1) is connected to the second liquid outlet of the refrigeration module (2) so that the first cavity (131) and the second cavity form a fluid channel, and the fluid channel is provided with liquid cooling working fluid.

2. The liquid cooling heat dissipation system of claim 1, wherein, The refrigeration module (2) includes: The second liquid cooling plate (21) is provided with the second cavity and the second liquid inlet and the second liquid outlet communicating with the second cavity. One side of the second liquid cooling plate (21) is disposed in the receiving cavity (101). A semiconductor cooler (22) has a cold end and a hot end arranged opposite each other along the thickness direction, and the cold end of the semiconductor cooler (22) is arranged on the other side of the second liquid cooling plate (21); A heat dissipation assembly is disposed on the hot end of the semiconductor cooler (22).

3. The liquid cooling heat dissipation system of claim 2, wherein, The heat dissipation component includes: A heat spreader (23) has a first region on its surface that is connected to the hot end of the semiconductor cooler (22), and two second regions on the same surface as the first region, the two second regions being distributed on both sides of the first region; Multiple fins (24), one end of each fin (24) is disposed in the second region, and the other end of each fin (24) abuts against the housing (100); Multiple fans (25), one fan (25) is provided near each of the second regions, and the fans (25) are disposed in the receiving cavity (101).

4. The liquid cooling system of claim 2, wherein, The semiconductor cooler (22) includes: A first ceramic substrate (221) is configured as the cold end of the semiconductor cooler (22); The second ceramic substrate (222) is configured as the hot end of the semiconductor cooler (22); Multiple electrical couples (223) are disposed between the first ceramic substrate (221) and the second ceramic substrate (222). One end of each electrical couple (223) is connected to the first ceramic substrate (221), and the other end of each electrical couple (223) is connected to the second ceramic substrate (222).

5. The liquid cooling heat dissipation system of claim 3, wherein, The first liquid cooling plate (1) includes: The substrate (13) is provided with a first sub-inlet (111) and a first sub-outlet (112) disposed opposite to each other along the length direction of the substrate (13), and a first cavity (131) connecting the first sub-inlet (111) and the first sub-outlet (112). The cover plate (14) is provided with a second sub-inlet (121) and a second sub-outlet (122) arranged opposite to each other along the length direction of the cover plate (14); At least one enhanced heat exchange structure (15) is disposed within the first cavity (131); The cover plate (14) is attached to the substrate (13) so that the opening of the first cavity (131) faces the cover plate (14); The first sub-inlet (111) and the second sub-inlet (121) form the first inlet (11) of the first liquid cooling plate (1); the first sub-outlet (112) and the second sub-outlet (122) form the first outlet (12) of the first liquid cooling plate (1).

6. The liquid cooling system of claim 5, wherein, The second liquid cooling plate (21) has the same structural design as the first liquid cooling plate (1); And / or, the thickness of the first liquid cooling plate (1) is 0.4 mm; And / or, the thickness of the second liquid cooling plate (21) is 0.4 mm; And / or, the thickness of the semiconductor cooler (22) is 1.5 to 3 mm; And / or, the thickness of the heat spreader (23) is 0.2 to 0.4 mm; And / or, the height of the fin (24) is 3 mm; And / or, the height of the micropump (3) is 1 mm; And / or, the thickness of the housing (100) is 7-8 mm; And / or, the height of the fan (25) is 1 to 3 mm.

7. The liquid cooling heat dissipation system of claim 5, wherein, The enhanced heat exchange structure (15) includes one of a parallel flow channel, a turbulence column, or a biomimetic structure.

8. The liquid cooling heat dissipation system according to claim 3, characterized in that, The temperature distribution plate (23) includes: The first cover (231) has a steam chamber; The second cover (232) is placed on top of the first cover (231) to form a sealed space in the steam chamber; A liquid-absorbing core (233) is disposed within the vapor chamber of the first cover (231); Multiple support columns (234) are provided, with one end of each support column (234) disposed on the liquid-absorbing core (233) along the height direction, and the other end of each support column (234) abutting against the second cover (232) along the height direction.

9. The liquid cooling heat dissipation system of claim 2, wherein, The first liquid inlet (11) and the first liquid outlet (12) of the first liquid cooling plate (1) are located at the first height of the receiving cavity (101), and the second liquid inlet and the second liquid outlet of the second liquid cooling plate (21) are located at the second height of the receiving cavity (101). The first height is greater than the second height.

10. An electronic device, comprising: The electronic device includes the liquid cooling system according to any one of claims 1-9.