An optical module

Abstract

The present disclosure provides an optical module, a first lens is located on an outgoing light path of a receiving optical fiber adapter, a displacement prism is located on an outgoing light path of the first lens, a beam splitter is located on an outgoing light path of the displacement prism, a second lens is located on an outgoing light path of the beam splitter, a turning prism is located on an outgoing light path of the second lens, and a light receiving chip is located on an outgoing light path of the turning prism. The displacement prism is used to change the displacement of the optical signal, but does not change the transmission direction of the optical signal. The beam splitter and the first lens are respectively located on two sides of the displacement prism, so that the optical signal emitted by the first lens can be incident to the beam splitter after the displacement of the displacement prism is changed. The beam splitter is closer to the middle of the circuit board than the first lens, so that the receiving light path of the light receiving component is offset to the middle of the circuit board after the displacement prism, and the distance between the light receiving chip and the edge of the circuit board is increased. The first enclosure is formed with a storage gap, and the light receiving chip is arranged at the storage gap to protect the light receiving chip.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing. Utility Model Content

[0003] This disclosure provides an optical module that increases the distance between the optical receiving chip and the edge of the circuit board.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] Circuit board;

[0006] An optical receiving component, located on the circuit board, is used to receive optical signals;

[0007] The optical receiving component includes:

[0008] The first optical receiving component includes:

[0009] Receive fiber optic adapter;

[0010] The first lens is located on the output optical path of the receiving fiber optic adapter;

[0011] A displacement prism is located in the light output path of the first lens and is used to change the displacement of the light signal, but does not change the transmission direction of the light signal.

[0012] The beam splitter is located in the light output path of the displacement prism; the beam splitter and the first lens are respectively located on both sides of the displacement prism; the beam splitter is closer to the center of the circuit board than the first lens.

[0013] The second lens is located in the output optical path of the beam splitter;

[0014] A deflection prism, located in the light-emitting path of the second lens, is used to change the transmission direction of the light signal;

[0015] The optical receiving chip is located in the light output path of the deflecting prism;

[0016] The first enclosure has a storage opening; the storage opening faces the second lens, and the light receiving chip is disposed at the storage opening.

[0017] The above technical solution has the following beneficial effects: This disclosure provides an optical module, including a circuit board and an optical receiving component. The optical receiving component is located on the circuit board and is used to receive optical signals. The optical receiving component includes a first optical receiving assembly, which includes a receiving fiber optic adapter, a first lens, a displacement prism, a beam splitter, a second lens, a deflection prism, and an optical receiving chip. The first lens is located in the output optical path of the receiving fiber optic adapter so that the first lens can receive the optical signal emitted by the receiving fiber optic adapter. The displacement prism is located in the output optical path of the first lens so that the displacement prism can receive the optical signal collimated by the first lens. The displacement prism is used to change the displacement of the optical signal but does not change the transmission direction of the optical signal, so that the receiving optical path of the optical receiving component is shifted towards the center of the circuit board after passing through the displacement prism. The beam splitter is located in the output optical path of the displacement prism so that the beam splitter can receive the optical signal emitted by the displacement prism. The beam splitter splits the received optical signal into multiple beams. The second lens is located in the output optical path of the beam splitter so that the second lens can receive the optical signal after the beam splitter. The second lens can converge the received optical signal. A deflecting prism is located in the light path of the second lens to receive the converged light signal. The deflecting prism changes the transmission direction of the light signal from horizontal to right to vertical downwards. A light-receiving chip is located in the light path of the deflecting prism to receive the light signal emitted from it. A displacement prism does not change the transmission direction of the light signal. The beam splitter and the first lens are located on opposite sides of the displacement prism, allowing the light signal emitted from the first lens to be incident on the beam splitter after being displaced by the displacement prism. The beam splitter is closer to the center of the circuit board than the first lens, causing the light path of the light receiving component to shift towards the center of the circuit board after passing through the displacement prism, increasing the distance between the light-receiving chip and the edge of the circuit board. The first light-receiving assembly also includes a first enclosure with a notch facing the second lens. The light-receiving chip is positioned at the notch to protect it.

[0018] In some embodiments, an optical module is provided, wherein the displacement prism includes:

[0019] The first reflecting surface is located in the light-emitting path of the first lens;

[0020] The second reflective surface is located on the reflected light path of the first reflective surface, closer to the center of the circuit board than the first reflective surface, and is arranged parallel to the first reflective surface.

[0021] The above technical solution has the following beneficial effects: The displacement prism includes a first reflecting surface and a second reflecting surface. The first reflecting surface is located in the light output path of the first lens, so that the first reflecting surface can receive the light signal collimated by the first lens. The first reflecting surface can reflect the received light signal. The second reflecting surface is located in the reflected light path of the first reflecting surface, so that the second reflecting surface can receive the light signal reflected by the first reflecting surface. The second reflecting surface can reflect the received light signal. The second reflecting surface is closer to the center of the circuit board than the first reflecting surface, so that the receiving light path of the light receiving component is shifted towards the center of the circuit board after passing through the displacement prism. The second reflecting surface and the first reflecting surface are arranged parallel to each other, so that the transmission direction of the light signal remains unchanged.

[0022] In some embodiments, an optical module is provided, wherein the first optical receiving component further includes:

[0023] The first support plate includes:

[0024] A first support portion is provided along the length of the circuit board to support the receiving fiber optic adapter and the first lens;

[0025] The second support is provided along the width direction of the circuit board, and one end is connected to the first support to support the displacement prism;

[0026] The third support portion is arranged along the length of the circuit board and connected to the other end of the second support portion, supporting the beam splitter and the second lens; the third support portion is closer to the middle of the circuit board than the first support portion;

[0027] A second support plate is provided on which the first support plate is mounted; the coefficient of thermal expansion of the second support plate is between the coefficient of thermal expansion of the first support plate and the coefficient of thermal expansion of the circuit board.

[0028] The third support plate supports the optical receiving chip.

[0029] The above technical solution has the following beneficial effects: The first optical receiving component further includes a first support plate and a second support plate, with the second support plate disposed on the first support plate to support it. The first support plate is bonded to the circuit board, and the second support plate is bonded to the first support plate. The coefficient of thermal expansion of the second support plate is between that of the first support plate and the circuit board, which can increase the connection stability between the circuit board and the second support plate. The first support plate includes a first support portion, a second support portion, and a third support portion. The first support portion is disposed along the length direction of the circuit board, the second support portion is disposed along the width direction of the circuit board, and the third support portion is disposed along the width direction of the circuit board. One end of the second support portion is connected to the first support portion, and the other end of the second support portion is connected to the third support portion. The first support portion supports the receiving optical fiber adapter and the first lens, the second support portion supports the displacement prism, and the third support portion supports the beam splitter and the second lens. The third support portion is closer to the center of the circuit board than the first support portion, so that the beam splitter is closer to the center of the circuit board than the first lens. The first optical receiving component also includes a third support plate, which supports the optical receiving chip to increase the height of the optical receiving chip so that the optical receiving chip is located at the focal point of the second lens, thereby improving the receiving efficiency and accuracy of the optical receiving chip.

[0030] In some embodiments, an optical module is provided, wherein the optical receiving component further includes:

[0031] The second light receiving component is arranged side by side with the first light receiving component; the vertical distance between the beam splitter of the first light receiving component and the second light receiving component is less than the vertical distance between the first lens of the first light receiving component and the second light receiving component.

[0032] The above technical solution has the following beneficial effects: the optical receiving component also includes a second optical receiving assembly, which is arranged side by side with the first optical receiving assembly. The vertical distance between the beam splitter of the first optical receiving assembly and the second optical receiving assembly is smaller than the vertical distance between the first lens of the first optical receiving assembly and the second optical receiving assembly, making the structure of the optical receiving component more compact and helping to reduce the overall size of the optical module.

[0033] In some embodiments, an optical module is provided, wherein the first enclosure includes:

[0034] The first enclosure plate is provided along the length of the circuit board;

[0035] The second enclosure is arranged along the width direction of the circuit board, and one end is connected to the first enclosure;

[0036] The third enclosure is arranged along the length of the circuit board and connected to the other end of the second enclosure; the first enclosure, the second enclosure, and the third enclosure are connected in sequence so that the first enclosure forms a storage notch, the length of the storage notch is greater than or equal to the length of the optical receiving chip, and the width of the storage notch is greater than or equal to the width of the optical receiving chip.

[0037] The above technical solution has the following beneficial effects: The first enclosure includes a first enclosure plate, a second enclosure plate, and a third enclosure plate. The first enclosure plate is set along the length direction of the circuit board, the second enclosure plate is set along the width direction of the circuit board, and the third enclosure plate is set along the length direction of the circuit board. One end of the second enclosure plate is connected to the first enclosure plate, and the other end of the second enclosure plate is connected to the third enclosure plate. The first enclosure plate, the second enclosure plate, and the third enclosure plate are connected sequentially to make the first enclosure U-shaped, that is, the first enclosure forms a storage notch. The length dimension of the storage notch is greater than or equal to the length dimension of the optical receiving chip, and the width dimension of the storage notch is greater than or equal to the width dimension of the optical receiving chip, so that the storage slot can completely cover the optical receiving chip and protect the optical receiving chip.

[0038] In some embodiments, an optical module is provided, wherein the first optical receiving component further includes:

[0039] A transimpedance amplifier chip, electrically connected to the optical receiver chip, is disposed at the storage opening of the first enclosure;

[0040] The length of the placement notch is greater than or equal to the sum of the lengths of the optical receiving chip and the transimpedance amplifier chip, and the width of the placement notch is greater than or equal to the sum of the widths of the optical receiving chip and the transimpedance amplifier chip.

[0041] The above technical solution has the following beneficial effects: The first optical receiving component also includes a transimpedance amplifier chip, which is electrically connected to the optical receiving chip, so that the transimpedance amplifier chip can convert the received current signal from the optical receiving chip into a voltage signal. The transimpedance amplifier chip is disposed at the storage notch of the first enclosure to protect it. The length of the storage notch is greater than or equal to the sum of the lengths of the optical receiving chip and the transimpedance amplifier chip, and the width of the storage notch is greater than or equal to the sum of the widths of the optical receiving chip and the transimpedance amplifier chip, so that the storage slot can completely cover the optical receiving chip and the transimpedance amplifier chip, thus protecting them.

[0042] In some embodiments, an optical module is provided, further comprising:

[0043] The light emitting component includes:

[0044] Laser chip array, used to emit optical signals;

[0045] A beam combiner array is located on the output optical path of the laser chip array;

[0046] First optical combiner;

[0047] The second beam combiner is arranged side by side with the first beam combiner;

[0048] An optical fiber adapter array, located on the output optical path of the optical combiner array, includes:

[0049] First transmitting fiber optic adapter;

[0050] The second transmitting fiber optic adapter is arranged side by side with the first transmitting fiber optic adapter;

[0051] A support plate, embedded in a through-hole of the circuit board, has the light-emitting component disposed on its surface, so that the light-emitting component is embedded in the through-hole; the support plate includes:

[0052] The first supporting surface is connected to the bottom surface of the laser chip array;

[0053] The second supporting surface is connected to the bottom surface of the light combiner array;

[0054] The third supporting surface is connected to the bottom surface of the fiber optic adapter array;

[0055] The first limiting part is arranged along the length direction of the circuit board, located at one edge of the second supporting surface, and connected to the side of the first light combiner;

[0056] The second limiting part is arranged along the length direction of the circuit board, located at the other edge of the second supporting surface, and connected to the side of the second light combiner;

[0057] The third limiting part is disposed in the middle of the third supporting surface, with one side connected to the side of the first transmitting fiber optic adapter and the other side connected to the side of the second transmitting fiber optic adapter.

[0058] The above technical solution has the following beneficial effects: The optical module also includes an optical emitting component and a support plate. The support plate is embedded in the through-hole of the circuit board, and the optical emitting component is disposed on the surface of the support plate so that the optical emitting component is embedded in the through-hole. The optical emitting component includes a laser chip array, a beam combiner array, and a fiber optic adapter array. The laser chip array is used to emit optical signals. The beam combiner array is located in the output optical path of the laser chip array so that the beam combiner array can combine multiple optical signals emitted by the laser chip array. The fiber optic adapter array is located in the output optical path of the beam combiner array so that the fiber optic adapter array can receive the optical signals emitted by the beam combiner array. The beam combiner array includes a first beam combiner and a second beam combiner, which are arranged side by side. The fiber optic adapter array includes a first transmitting fiber optic adapter and a second transmitting fiber optic adapter, which are arranged side by side with the first transmitting fiber optic adapter. The support plate includes a first support surface, a second support surface, a third support surface, a first limiting part, a second limiting part, and a third limiting part. The first support surface is connected to the bottom surface of the laser chip array, the second support surface is connected to the bottom surface of the optical combiner array, and the third support surface is connected to the bottom surface of the fiber optic adapter array. The first limiting part is disposed along the length of the circuit board and at one edge of the second support surface. The first limiting part is connected to the side of the first optical combiner to limit the position of the first optical combiner in the width direction of the support plate. The second limiting part is disposed along the length of the circuit board and at the other edge of the second support surface. The second limiting part is connected to the side of the second optical combiner to limit the position of the second optical combiner in the width direction of the support plate. The third limiting part is disposed in the middle of the third support surface. One side of the third limiting part is connected to the side of the first transmitting fiber optic adapter, and the other side of the third limiting part is connected to the side of the second transmitting fiber optic adapter to limit the positions of the first and second transmitting fiber optic adapters in the width direction of the support plate.

[0059] In some embodiments, an optical module is provided, further comprising:

[0060] A first protective housing, covering the light-emitting component, includes:

[0061] First base plate;

[0062] The first side plate is connected to the first base plate at the bottom and to the circuit board at the top.

[0063] The second side plate is connected to the first base plate at the bottom, connected to the circuit board at the top, and connected to one end of the first side plate at one end.

[0064] The third side plate is connected to the first base plate at the bottom, to the circuit board at the top, and to the other end of the first side plate at one end.

[0065] The fourth side plate is connected to the first base plate at the bottom, to the support plate at the top, and to the other end of the second side plate at one end, and to the other end of the third side plate at the other end, forming:

[0066] The first clearance gap is used to avoid the first transmitting fiber optic adapter;

[0067] The second clearance gap is used to avoid the second transmitting fiber optic adapter;

[0068] The top of the fourth side plate protrudes beyond the tops of the first side plate, the second side plate, and the third side plate.

[0069] The above technical solution has the following beneficial effects: The optical module also includes a first protective housing, which covers the optical emitting component to protect it. The first protective housing includes a first base plate, a first side plate, a second side plate, a third side plate, and a fourth side plate. The bottom of the first side plate is connected to the first base plate, and the top of the first side plate is connected to the circuit board. The bottom of the second side plate is connected to the first base plate, and the top of the second side plate is connected to the circuit board. The bottom of the third side plate is connected to the first base plate, and the top of the third side plate is connected to the circuit board. One end of the second side plate is connected to one end of the first side plate, and the other end of the second side plate is connected to one end of the third side plate. The bottom of the fourth side plate is connected to the first base plate, and the top of the fourth side plate is connected to the support plate. One end of the fourth side plate is connected to the other end of the second side plate, and the other end of the fourth side plate is connected to the other end of the third side plate. The fourth side plate forms a first clearance notch and a second clearance notch. The first clearance notch is used to avoid the first transmitting fiber optic adapter, and the second clearance notch is used to avoid the second transmitting fiber optic adapter, thereby better protecting the optical emitting component. The circuit board protrudes from the support plate, and the top of the fourth side plate protrudes from the top of the first side plate, the second side plate, and the third side plate, increasing the area between the first protective shell and the circuit board and the support plate, and improving the connection stability between the first protective shell and the circuit board and the support plate.

[0070] In some embodiments, an optical module is provided, further comprising:

[0071] The second protective housing is placed over the light receiving component.

[0072] The above technical solution has the following beneficial effects: the optical module also includes a second protective housing, which covers the optical receiving component to protect the optical receiving component.

[0073] In some embodiments, an optical module is provided, wherein there is a gap between the second supporting surface and the third supporting surface, and the bottom surface of the gap is recessed into the third supporting surface.

[0074] The above technical solution has the following beneficial effects: there is a gap between the second support surface and the third support surface, and the bottom surface of the gap is recessed into the third support surface to accommodate the glue that overflows during the mounting of the fiber optic adapter array. Attached Figure Description

[0075] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0076] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments;

[0077] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0078] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0079] Figure 4 An exploded view of an optical module according to some embodiments;

[0080] Figure 5a An internal structure breakdown of an optical module according to some embodiments Figure 1 ;

[0081] Figure 5b This is an internal structural diagram of an optical module according to some embodiments;

[0082] Figure 5c An internal structure breakdown of an optical module according to some embodiments Figure 2 ;

[0083] Figure 6a Partial breakdown of the internal structure of an optical module according to some embodiments Figure 1 ;

[0084] Figure 6b Partial breakdown of the internal structure of an optical module according to some embodiments Figure 2 ;

[0085] Figure 6c Partial breakdown of the internal structure of an optical module according to some embodiments Figure 3 ;

[0086] Figure 6d Partial breakdown of the internal structure of an optical module according to some embodiments Figure 4;

[0087] Figure 7a This is an exploded view of a first optical receiving component provided according to some embodiments;

[0088] Figure 7b A partial view of a first optical receiving component provided according to some embodiments;

[0089] Figure 8 This is a structural diagram of a first protective housing provided according to some embodiments;

[0090] Figure 9 A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 1 ;

[0091] Figure 10 This is a structural diagram of a second protective housing provided according to some embodiments;

[0092] Figure 11 A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 2 . Detailed Implementation

[0093] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0094] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0095] In optical communication technology, information is loaded onto light to generate optical signals, which are then used to transmit information between information processing devices. Connections are established between these devices via optical transmission equipment. Optical power loss is minimal during transmission through this equipment, allowing for long-distance transmission with relatively low power loss. Light boasts extremely high transmission speeds, and the cost of optical transmission equipment, such as fiber optic cables, is lower than that of electrical transmission equipment like copper wires. Using optical signals to transmit information offers advantages such as long-distance transmission, high speed, and low cost.

[0096] Information processing equipment typically includes switches, servers, optical network units (ONUs), optical distribution networks (ODNs), optical line terminals (OLTs), gateways, routers, mobile phones, computers, tablets, televisions, etc.; optical transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can recognize and process electrical signals, while optical transmission equipment can transmit optical signals. Therefore, an optical module is needed between the optical transmission equipment and the information processing equipment to perform the conversion between optical and electrical signals.

[0097] In some embodiments, the optical signal input and / or optical signal output of the optical module are connected to an optical fiber, and the electrical signal input and / or electrical signal output of the optical module are connected to a switch; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the switch; a second electrical signal from the switch is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0098] Information processing equipment connected to optical modules is also known as the host computer for optical modules. In access network transmission scenarios, the host computer for optical modules is usually an ONU, ODN, or OLT; in data center transmission scenarios, the host computer for optical modules is usually a Switch or Server.

[0099] Figure 1 This is a schematic diagram of the structure of an optical module access switch according to some embodiments. For example... Figure 1 As shown, switch 100 has multiple optical module interfaces. Multiple optical modules are inserted into the switch through these interfaces, establishing electrical signal communication between the optical modules and the switch. Optical fiber 101 is connected to the optical modules, establishing optical signal communication between the optical fiber and the optical modules. One end of optical fiber 101 is connected to the optical module, and the other end of optical fiber 101 (…) Figure 1 (not shown) connects to another optical module ( Figure 1 (Not shown in the image), another optical module accesses the server ( Figure 1 (not shown in the image) or another switch ( Figure 1 (Not shown in the image).

[0100] In some embodiments, the optical fiber 101 and the optical module 200 are detachably connected; in other embodiments, the optical fiber 101 and the optical module 200 are non-detachably connected.

[0101] The switch 100 is configured to provide data electrical signals to the optical module 200, or receive data electrical signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0102] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0103] Figure 2 This is a partial structural diagram of a switch according to some embodiments. To clearly show the connection relationship between the optical module 200 and the switch 100, Figure 2 Only the structure of the switch 100 related to the optical module 200 is shown. (Example) Figure 2 As shown, in some embodiments, the switch 100 further includes a PCB circuit board 102 disposed in the receiving cavity, and a cage 103 disposed on the surface of the PCB circuit board 102; the optical module 200 is inserted into the cage 103 and fixed by the cage 103.

[0104] In some embodiments, a heat sink 104 is provided on the cage 103 to dissipate heat for the optical module; in some embodiments, the heat sink 104 has protruding structures such as fins to increase the heat dissipation area.

[0105] In some embodiments, an electrical connector is provided inside the cage 103, which is configured to access the electrical interface of the optical module 200.

[0106] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the cage 103 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 103 and then diffused through the heat sink 104.

[0107] In some embodiments, the optical module 200 is inserted into the cage 103 of the switch 100, and the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 103, thereby establishing an electrical signal connection between the optical module 200 and the switch 100.

[0108] In some embodiments, the optical interface of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0109] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical interface and the other is an optical interface. In some embodiments, the shell forms an opening that serves as both an electrical interface and an optical interface.

[0110] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0111] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0112] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0113] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0114] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0115] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0116] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the switch 100.

[0117] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0118] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0119] In some implementations, the gold fingers are located on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers are set on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is large.

[0120] In some implementations, the gold fingers of the circuit board extend from the electrical interface and are inserted into the electrical connector of the switch 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0121] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0122] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the switch 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0123] Figure 5a An internal structure breakdown of an optical module according to some embodiments Figure 1 . Figure 5b This is an internal structural diagram of an optical module according to some embodiments. Figure 5c An internal structure breakdown of an optical module according to some embodiments Figure 2 .like Figure 5a , Figure 5b and Figure 5c As shown, in some embodiments, the optical module may include an optical emitting component 400. The optical emitting component 400 is used to emit optical signals.

[0124] In some embodiments, the light emitting component 400 may be disposed on the circuit board 300. For example, the light emitting component 400 may be disposed on the upper surface of the circuit board 300.

[0125] In some embodiments, the light emitting component 400 may be embedded in the through hole 310 of the circuit board 300.

[0126] In some embodiments, the optical module may include a support plate 920. A light emitting component 400 may be disposed on the support plate 920. The support plate 920 may be embedded in a through hole 310 so that the light emitting component 400 can be embedded in the through hole 310 of the circuit board 300.

[0127] In some embodiments, the optical module may include an optical receiving component 500. The optical receiving component 500 is used to receive optical signals. The optical receiving component 500 may be located at one end of the optical emitting component 400. The optical receiving component 500 may be disposed on the circuit board 300. For example, the optical receiving component 500 may be disposed on the lower surface of the circuit board 300.

[0128] In some embodiments, the optical module may include a first protective housing 910. The first protective housing 910 may be disposed over the light emitting component 400 to protect the light emitting component 400.

[0129] In some embodiments, the optical module may include a second protective housing 930. The second protective housing 930 may be disposed over the optical receiving component 500 to protect the optical receiving component 500.

[0130] Figure 6a Partial breakdown of the internal structure of an optical module according to some embodiments Figure 1 . Figure 6b Partial breakdown of the internal structure of an optical module according to some embodiments Figure 2 .like Figure 6a and Figure 6b As shown, the light emitting component 400 is disposed on the support plate 920, and the support plate 920 is embedded in the through hole 310 of the circuit board 300.

[0131] like Figure 6a and Figure 6b As shown, in some embodiments, the light receiving component 500 may include a first light receiving assembly 510.

[0132] In some embodiments, the light receiving component 500 may include a second light receiving component 520. The second light receiving component 520 may be arranged side by side with the first light receiving component 510 along the width direction of the circuit board 300.

[0133] In some embodiments, the optical receiving component 500 may include a first enclosure 530. The first enclosure 530 may be located around the optical receiving chip and the transimpedance amplifier chip of the first optical receiving component 510 to protect the optical receiving chip and the transimpedance amplifier chip of the first optical receiving component 510.

[0134] In some embodiments, the light receiving component 500 may include a second enclosure 540. The second enclosure 540 may be located around the light receiving chip and the transimpedance amplifier chip of the second light receiving component 520 to protect the light receiving chip and the transimpedance amplifier chip of the second light receiving component 520.

[0135] Figure 6c Partial breakdown of the internal structure of an optical module according to some embodiments Figure 3 .like Figure 6c As shown, in some embodiments, the light emitting component 400 may include a laser chip array 410. The laser chip array 410 may include at least two laser chips, enabling it to emit at least two optical signals. For example, the laser chip array 410 may include eight laser chips arranged in parallel, enabling it to emit eight optical signals.

[0136] In some embodiments, the laser chip array 410 may include a first sub-laser chip array 411, which may include four laser chips arranged in parallel, so that the first sub-laser chip array 411 can emit four optical signals.

[0137] In some embodiments, the laser chip array 410 may include a second sub-laser chip array 412, which may include four laser chips arranged in parallel, so that the second sub-laser chip array 412 can emit four optical signals.

[0138] In some embodiments, the light emitting component 400 may include a first lens array 420. The first lens array 420 may be located in the light output path of the laser chip array 410 so that the first lens array 420 can receive the light signal emitted by the laser chip array 410. The first lens array 420 may be a collimating lens array, which can collimate the received light signal.

[0139] In some embodiments, the first lens array 420 may include a first sub-lens array 421, which may be located in the light output path of the first sub-laser chip array 411, so that the first sub-lens array 421 can receive the light signal emitted by the first sub-laser chip array 411 and collimate the received light signal.

[0140] In some embodiments, the first lens array 420 may include a second sub-lens array 422, which may be located in the light output path of the second sub-laser chip array 412, so that the second sub-lens array 422 can receive the light signal emitted by the second sub-laser chip array 412 and collimate the received light signal.

[0141] In some embodiments, the light emitting component 400 may include a beam combiner array 430. The beam combiner array 430 may be located in the light output path of the first lens array 420, so that the beam combiner array 430 can receive multiple light signals emitted from the first lens array 420 and combine the multiple light signals.

[0142] In some embodiments, the beam combiner array 430 may include a first beam combiner 431. The first beam combiner 431 may be located in the output optical path of the first sub-lens array 421, so that the first beam combiner 431 can receive multiple optical signals emitted from the first sub-lens array 421 and combine the multiple optical signals into one optical signal.

[0143] In some embodiments, the beam combiner array 430 may include a second beam combiner 432. The second beam combiner 432 may be located in the output optical path of the second sub-lens array 422, so that the second beam combiner 432 can receive multiple optical signals emitted from the second sub-lens array 422 and combine the multiple optical signals into one optical signal.

[0144] In some embodiments, the light emitting component 400 may include a second lens array 440. The second lens array 440 may be located in the light output path of the beam combiner array 430, so that the second lens array 440 can receive the light signal emitted by the beam combiner array 430. The second lens array 440 may be a converging lens array, so that the second lens array 440 can converge the received light signal.

[0145] In some embodiments, the second lens array 440 may include a first converging lens 441. The first converging lens 441 may be located in the light output path of the first beam combiner 431, so that the first converging lens 441 can receive the light signal emitted by the first beam combiner 431 and converge the received light signal.

[0146] In some embodiments, the second lens array 440 may include a second converging lens 442. The second converging lens 442 may be located in the light output path of the second beam combiner 432, so that the second converging lens 442 can receive the light signal emitted by the second beam combiner 432 and converge the received light signal.

[0147] In some embodiments, the optical emitting component 400 may include an optical fiber adapter array 450. The optical fiber adapter array 450 may be located in the optical output path of the second lens array 440, so that the optical fiber adapter array 450 can receive the optical signal converged by the second lens array 440.

[0148] In some embodiments, the fiber optic adapter array 450 may include a first transmitting fiber optic adapter 451. The first transmitting fiber optic adapter 451 may be located in the output optical path of the first converging lens 441 so that the first transmitting fiber optic adapter 451 can receive the optical signal converged by the first converging lens 441.

[0149] In some embodiments, the fiber optic adapter array 450 may include a second transmitting fiber optic adapter 452. The second transmitting fiber optic adapter 452 may be located in the output optical path of the second converging lens 442 so that the second transmitting fiber optic adapter 452 can receive the optical signal converged by the second converging lens 442.

[0150] In some embodiments, the support plate 920 may include a first support surface 922. The first support surface 922 may be located at one end of the support plate 920. The laser chip array 410 and the first lens array 420 may be placed on the first support surface 922.

[0151] In some embodiments, the support plate 920 may include a second support surface 923. The beam combiner array 430 and the second lens array 440 may be placed on the second support surface 923.

[0152] In some embodiments, the second support surface 923 protrudes from the first support surface 922 so that the central axis of the laser chip array 410, the central axis of the first lens array 420, the central axis of the beam combiner array 430, and the central axis of the second lens array 440 are aligned at the same height, thereby ensuring the stability and accuracy of the optical signal during transmission.

[0153] In some embodiments, the edge of the second support surface 923 may be provided with a first limiting portion 927. The second limiting portion 926 may be connected to the side of the first light combiner 431 to limit the position of the first light combiner 431 in the width direction of the support plate 920.

[0154] In some embodiments, a second limiting portion 926 may be provided at the edge of the second supporting surface 923. The second limiting portion 926 may be connected to the side of the second light combiner 432 to define the position of the second light combiner 432 in the width direction of the supporting plate 920.

[0155] In some embodiments, the support plate 920 may include a third support surface 924. The third support surface 924 may be located at the other end of the support plate 920. The fiber optic adapter array 450 may be placed on the third support surface 924.

[0156] In some embodiments, the second support surface 923 protrudes from the third support surface 924 so that the central axis of the second lens array 440 is aligned with the central axis of the fiber optic adapter array 450, thereby ensuring the stability and accuracy of the optical signal during transmission.

[0157] The fiber optic adapter array 450 can be positioned in front of the second support surface 923 to define the position of the fiber optic adapter array 450 in the length direction of the support plate.

[0158] In some embodiments, a third limiting portion 925 may be provided on the third supporting surface 924. One side of the third limiting portion 925 may be in contact with the side of the first transmitting fiber optic adapter 451, and the other side of the third limiting portion 925 may be in contact with the side of the second transmitting fiber optic adapter 452, so as to define the position of the fiber optic adapter array 450 in the width direction of the supporting plate.

[0159] In some embodiments, there is a gap between the third support surface 924 and the second support surface 923. The bottom surface of the gap may be recessed into the third support surface to accommodate adhesive overflow during the mounting of the fiber optic adapter array. The bottom surface of the gap may be recessed into the second support surface to accommodate adhesive overflow during the mounting of the second lens array.

[0160] In some embodiments, the support plate 920 may include a fourth support surface 921. The fourth support surface 921 may be in contact with the lower surface of the circuit board 300 so that the support plate 920 can support the circuit board 300.

[0161] Figure 6d Partial breakdown of the internal structure of an optical module according to some embodiments Figure 4 .like Figure 6d As shown, in some embodiments, the first enclosure 530 may include a first enclosure plate 531, which may be arranged along the length of the circuit board 300.

[0162] In some embodiments, the first enclosure 530 may include a second enclosure plate 532. The second enclosure plate 532 may be disposed along the width direction of the circuit board 300. One end of the second enclosure plate 532 may be connected to a second end of the first enclosure plate 531.

[0163] In some embodiments, the first enclosure 530 may include a third enclosure plate 533. The third enclosure plate 533 may be disposed along the length of the circuit board 300. A first end of the third enclosure plate 533 may be connected to the other end of the second enclosure plate 532.

[0164] The first enclosure 531, the second enclosure 532, and the third enclosure 533 are connected in sequence to make the first enclosure 530 U-shaped, that is, the first enclosure 530 forms a storage notch 534. The storage notch 534 can hold the optical receiving chip 519 and the transimpedance amplifier chip 5191 of the first optical receiving component 510, so as to protect the optical receiving chip 519 and the transimpedance amplifier chip 5191 of the first optical receiving component 510.

[0165] The length of the notch 534 is greater than or equal to the sum of the lengths of the optical receiving chip 519 and the transimpedance amplifier chip 5191 of the first optical receiving component 510, and the width of the notch 534 is greater than or equal to the sum of the widths of the optical receiving chip 519 and the transimpedance amplifier chip 5191 of the first optical receiving component 510, so that the notch 534 can completely cover the optical receiving chip 519 and the transimpedance amplifier chip 5191 of the first optical receiving component 510, thereby preventing the optical receiving chip 519 and the transimpedance amplifier chip 5191 from being interfered with or damaged by the external environment.

[0166] Figure 7aThis is an exploded view of a first optical receiving component provided according to some embodiments. Figure 7b This is a partial view of a first optical receiving component according to some embodiments. Figure 7a and Figure 7b As shown, in some embodiments, the first optical receiving component 510 may include an optical receiving chip 519. The optical receiving chip 519 can convert the received optical signal into an electrical signal. The optical receiving chip 519 may be located on the circuit board 300.

[0167] In some embodiments, the first optical receiving component 510 may include a transimpedance amplifier chip 5191. The transimpedance amplifier chip 5191 may be electrically connected to the optical receiving chip 519 so that the transimpedance amplifier chip 5191 can receive the current signal converted by the optical receiving chip 519. The transimpedance amplifier chip 5191 can convert the current signal into a voltage signal. The transimpedance amplifier chip 5191 may be located on the circuit board 300.

[0168] In some embodiments, the light receiving chip 519 and the transimpedance amplifier chip 5191 may be located on the same surface of the circuit board 300 to reduce the wire bonding distance between the light receiving chip 519 and the transimpedance amplifier chip 5191.

[0169] In some embodiments, the first optical receiving component 510 may include a receiving fiber optic adapter 513.

[0170] In some embodiments, the first optical receiving component 510 may include a first lens 514. The first lens 514 may be located in the output optical path of the receiving fiber optic adapter 513 so that the first lens 514 can receive the optical signal emitted by the receiving fiber optic adapter 513. The first lens 514 may be a collimating lens so that the first lens 514 can collimate the received optical signal to obtain collimated light.

[0171] In some embodiments, the first light receiving component 510 may include a displacement prism 515. The displacement prism 515 may be located in the light output path of the first lens 514 so that the displacement prism 515 can receive the light signal collimated by the first lens 514. The displacement prism 515 can change the displacement of the light signal, but does not change the transmission direction of the light signal.

[0172] In some embodiments, the displacement prism 515 may include a first reflecting surface 5151. The first reflecting surface 5151 may be located in the light output path of the first lens 514 so that the first reflecting surface 5151 can receive the light signal collimated by the first lens 514.

[0173] The first reflecting surface 5151 can reflect the received light signal.

[0174] In some embodiments, the displacement prism 515 may include a second reflecting surface 5152. The second reflecting surface 5152 may be located in the reflected light path of the first reflecting surface 5151, so that the second reflecting surface 5152 can receive the light signal reflected by the first reflecting surface 5151. The second reflecting surface 5152 can reflect the received light signal.

[0175] In some embodiments, the first reflecting surface 5151 and the second reflecting surface 5152 are arranged in parallel so that the transmission direction of the light signal remains unchanged after it undergoes two reflections inside the displacement prism 515, and only the displacement changes.

[0176] In some embodiments, the second reflective surface 5152 is closer to the center of the circuit board 300 than the first reflective surface 5151, so that the received light path of the first light receiving component 510 is shifted toward the center of the circuit board 300 after passing through the displacement prism 515.

[0177] In some embodiments, the first light receiving component 510 may include a beam splitter 516. The beam splitter 516 may be located in the light output path of the displacement prism 515 so that the beam splitter 516 can receive the light signal emitted by the displacement prism 515. For example, the beam splitter 516 may be located in the light reflection path of the second reflecting surface 5152, such that the beam splitter 516 is closer to the center of the circuit board 300 relative to the first lens 514.

[0178] Beam splitter 516 may include an inlet port facing the first lens 514, so that collimated light enters beam splitter 516 through the inlet port. Beam splitter 516 can split a collimated beam into multiple collimated beams. Beam splitter 516 may include an outlet port through which multiple collimated beams can exit.

[0179] The optical signal emitted by the optical fiber adapter 513 is transmitted horizontally, and the optical signal of the incident light receiver chip 519 is transmitted vertically. In some embodiments, the first optical receiver component 510 may include a deflection prism 518 so that the optical signal transmitted horizontally is emitted vertically downward after passing through the deflection prism 518.

[0180] In some embodiments, the beam splitter 516 and the first lens 514 are located on opposite sides of the displacement prism 515. The displacement prism 515 does not change the transmission direction of the light signal, so that the light signal emitted from the first lens 514 can be incident on the beam splitter 516 after the displacement prism 515 changes its displacement.

[0181] In some embodiments, the beam splitter 516 is closer to the center of the circuit board 300 than the first lens 514, so that the received light path of the first light receiving component 510 is shifted toward the center of the circuit board 300 after passing through the displacement prism 515, thereby increasing the distance between the light receiving chip 519 and the edge of the circuit board 300.

[0182] In some embodiments, the first light receiving component 510 may include a second lens 517. The second lens 517 may be a converging lens to converge collimated light. The light receiving chip 519 may be located in the light output path of the second lens 517 so that the light receiving chip 519 can receive the light signal converged by the second lens 517.

[0183] In some embodiments, the second lens 517 may be located in the light-emitting path of the deflection prism 518 so that the second lens 517 can receive the collimated light emitted by the deflection prism 518. For example, the second lens 517 may be connected to the light-emitting surface of the deflection prism 518.

[0184] In some embodiments, the deflection prism 518 may be located in the light-emitting path of the second lens 517. For example, the light-incident surface of the deflection prism 518 is connected to the second lens 517.

[0185] The second lens 517 is connected to the deflection prism 518 to reduce the distance between the second lens 517 and the deflection prism 518, so that the light signal emitted by the deflection prism 518 can be received and focused more effectively by the second lens 517.

[0186] In some embodiments, the second lens 517 and the deflection prism 518 can be integrally formed, which not only simplifies the structure of the first light receiving component 510, but also effectively improves the alignment accuracy between optical elements.

[0187] In some embodiments, the second lens 517 and the deflection prism 518 may be bonded together to improve the optical coupling efficiency and mechanical stability between them. The bonding material may be selected from materials with high light transmittance, low coefficient of thermal expansion, and good mechanical strength to ensure optimal optical and mechanical performance.

[0188] In some embodiments, the light receiving chip 519 may be located at the focal point of the second lens 517, so that the light receiving chip 519 can more effectively receive the light signal converged by the second lens 517, thereby improving the reception efficiency and accuracy of the light signal.

[0189] In some embodiments, the deflection prism 518 may include an incident surface. The incident surface may face the beam splitter 516 so that multiple collimated beams are incident on the deflection prism 518 through the incident surface.

[0190] In some embodiments, the deflecting prism 518 may include a reflective surface. One end of the reflective surface may be connected to the other end of the connecting surface. The reflective surface may face the incident light surface so that it can receive collimated light entering the deflecting prism 518 via the incident light surface. The reflective surface can reflect the incident light signal, thereby changing the transmission direction of the light signal from the horizontal direction to the vertical direction.

[0191] In some embodiments, the deflecting prism 518 may include a light-emitting surface. One end of the light-emitting surface may be connected to the other end of the reflective surface. The other end of the light-emitting surface may be connected to the other end of the incident surface. The light-emitting surface may face the reflective surface so that the light signal reflected by the reflective surface can be emitted through the light-emitting surface. The light-emitting surface may face the light receiving chip 519 so that the light receiving chip 519 can receive the light signal emitted through the light-emitting surface.

[0192] In some embodiments, the first optical receiving component 510 may include a first support plate 511. The material of the first support plate 511 may be glass. The first support plate 511 may be disposed on the circuit board 300. The first support plate 511 may be provided with a receiving fiber optic adapter 513, a first lens 514, a displacement prism 515, a beam splitter 516, and a second lens 517, which not only makes the optical axis of the horizontally transmitted optical signal flush with the central axis of each device, but also reduces the loss of the optical signal during transmission and improves the transmission efficiency and stability of the optical signal.

[0193] In some embodiments, the first support plate 511 may include a first support portion 5111. The first support portion 5111 may be disposed along the length direction of the circuit board 300. The first support portion 5111 may house the receiving fiber optic adapter 513 and the first lens 514.

[0194] In some embodiments, the first support plate 511 may include a second support portion 5112. The second support portion 5112 may be disposed along the width direction of the circuit board 300. One end of the second support portion 5112 may be connected to the first support portion 5111. A displacement prism 515 may be disposed on the second support portion 5112.

[0195] In some embodiments, the first support portion 5111 and the second support portion 5112 can be arranged vertically so that the first support plate 511 composed of the first support portion 5111 and the second support portion 5112 is L-shaped, which can reduce the space occupied by the first support plate 511 on the circuit board 300.

[0196] In some embodiments, the first support plate 511 may include a third support portion 5113. The third support portion 5113 may be disposed along the length direction of the circuit board 300. The third support portion 5113 may be connected to the other end of the second support portion 5112. The third support portion 5113 may be provided with a beam splitter 516 and a second lens 517.

[0197] In some embodiments, the second support portion 5112 and the third support portion 5113 can be arranged vertically so that the first support plate 511 composed of the second support portion 5112 and the third support portion 5113 is L-shaped, which can reduce the space occupied by the first support plate 511 on the circuit board 300.

[0198] The second lens 517 is connected to the light-incident surface of the deflection prism 518, so that the deflection prism 518 can be set on the first support plate 511, thereby making the central axis of the second lens 517 and the central axis of the deflection prism 518 at the same height.

[0199] The coefficient of thermal expansion of circuit board 300 differs significantly from that of the first support plate 511, resulting in low connection stability between the circuit board 300 and the first support plate 511. To improve the connection stability between circuit board 300 and the first support plate 511, in some embodiments, the first optical receiving component 510 may include a second support plate 512. The second support plate 512 may be disposed on circuit board 300, and the first support plate 511 may be disposed on the second support plate 512. The coefficient of thermal expansion of the second support plate 512 is between that of circuit board 300 and the first support plate 511, resulting in higher connection stability between circuit board 300, the second support plate 512, and the first support plate 511. For example, the material of the second support plate 512 may be aluminum nitride (AlN).

[0200] In some embodiments, the second support plate 512 can be arranged along the length direction of the circuit board 300, and the top surface of the second support plate 512 can be in contact with the other end of the second support portion 5112 of the first support plate 511 and the bottom surface of the third support portion 5113, so that the second support plate 512 can support the first support plate 511 and reduce the space occupied by the first light receiving component 510 on the circuit board 300.

[0201] In some embodiments, the first light receiving component 510 may include a third support plate 5192. A light receiving chip 519 may be disposed on the third support plate 5192 to increase the height of the light receiving chip 519, so that the light receiving chip 519 is located at the focal point of the second lens 517, thereby improving the receiving efficiency and accuracy of the light receiving chip 519.

[0202] The structure of the first optical receiving component 510 is the same as that of the second optical receiving component 520, and will not be described again here.

[0203] In some embodiments, the vertical distance d1 between the beam splitter 516 of the first light receiving component 510 and the second light receiving component 520 is less than the vertical distance d2 between the first lens 514 of the first light receiving component 510 and the second light receiving component 520, so as to shorten the distance between the light receiving chip 519 of the first light receiving component 510 and the light receiving chip of the second light receiving component 520, making the structure of the light receiving component more compact, thereby reducing the volume of the entire optical module.

[0204] Figure 8This is a structural diagram of a first protective housing provided according to some embodiments. Figure 9 A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 1 .like Figure 8 and Figure 9 As shown, in some embodiments, the first protective housing 910 may include a first base plate 911.

[0205] In some embodiments, the first protective housing 910 may include a first side plate 912. The bottom of the first side plate 912 is connected to the first base plate 911. The top of the first side plate 912 may be in contact with the upper surface of the circuit board 300.

[0206] In some embodiments, the first protective housing 910 may include a second side plate 913. The bottom of the second side plate 913 is connected to the first base plate 911. One end of the second side plate 913 is connected to one end of the first side plate 912. The top of the second side plate 913 may contact and connect with the upper surface of the circuit board 300.

[0207] In some embodiments, the first protective housing 910 may include a third side plate 914. The bottom of the third side plate 914 is connected to the first base plate 911. One end of the third side plate 914 is connected to the other end of the first side plate 912. The top of the third side plate 914 may contact the upper surface of the circuit board 300.

[0208] In some embodiments, the first protective housing 910 may include a fourth side plate 915. The bottom of the fourth side plate 915 is connected to the first base plate 911. One end of the fourth side plate 915 is connected to the other end of the second side plate 913, and the other end of the fourth side plate 915 is connected to the other end of the third side plate 914. The fourth side plate 915 may be in contact with the top surface of the support plate 920.

[0209] The top surface of the support plate 920 is higher than the upper surface of the circuit board 300. The fourth side plate 915 protrudes from the first side plate 912, the second side plate 913 and the third side plate 914, increasing the area between the first protective housing 910 and the circuit board 300 and the support plate 920, and improving the connection stability between the first protective housing 910 and the circuit board 300 and the support plate 920.

[0210] In some embodiments, the fourth side plate 915 may form a first clearance notch 9151. The first clearance notch 9151 may allow passage of the receiving fiber optic adapter 513 connected to the first optical receiving assembly 510.

[0211] In some embodiments, the fourth side plate 915 may form a second clearance notch 9152. The second clearance notch 9152 may allow passage of the receiving fiber optic adapter connected to the second optical receiving assembly 520.

[0212] Figure 10 This is a structural diagram of a second protective housing provided according to some embodiments. Figure 11 A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 2 .like Figure 10 and Figure 11 As shown, in some embodiments, the second protective housing 930 may include a second base plate 931.

[0213] In some embodiments, the second protective housing 930 may include a fifth side plate 932. The bottom of the fifth side plate 932 is connected to the second bottom plate 931, and the top of the fifth side plate 932 is in contact with the lower surface of the circuit board 300, so that the second protective housing 930 and the circuit board 300 form a storage cavity, and a light receiving component 500 may be disposed in the storage cavity to protect the light receiving component 500.

[0214] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: Circuit board; An optical receiving component, located on the circuit board, is used to receive optical signals; The optical receiving component includes: The first optical receiving component includes: Receive fiber optic adapter; The first lens is located on the output optical path of the receiving fiber optic adapter; A displacement prism is located in the light output path of the first lens and is used to change the displacement of the light signal, but does not change the transmission direction of the light signal. The beam splitter is located in the light output path of the displacement prism; the beam splitter and the first lens are respectively located on both sides of the displacement prism; the beam splitter is closer to the center of the circuit board than the first lens. The second lens is located in the output optical path of the beam splitter; A deflection prism, located in the light-emitting path of the second lens, is used to change the transmission direction of the light signal; The optical receiving chip is located in the light output path of the deflecting prism; The first enclosure has a storage opening; the storage opening faces the second lens, and the light receiving chip is disposed at the storage opening.

2. The optical module according to claim 1, characterized in that, The displacement prism includes: The first reflecting surface is located in the light-emitting path of the first lens; The second reflective surface is located on the reflected light path of the first reflective surface, closer to the center of the circuit board than the first reflective surface, and is arranged parallel to the first reflective surface.

3. The optical module according to claim 1, characterized in that, The first optical receiving component further includes: The first support plate includes: A first support portion is provided along the length of the circuit board to support the receiving fiber optic adapter and the first lens; The second support is provided along the width direction of the circuit board, and one end is connected to the first support to support the displacement prism; The third support portion is arranged along the length of the circuit board and connected to the other end of the second support portion, supporting the beam splitter and the second lens; the third support portion is closer to the middle of the circuit board than the first support portion; A second support plate is provided on which the first support plate is mounted; the coefficient of thermal expansion of the second support plate is between the coefficient of thermal expansion of the first support plate and the coefficient of thermal expansion of the circuit board. The third support plate supports the optical receiving chip.

4. The optical module according to claim 1, characterized in that, The optical receiving component further includes: The second light receiving component is arranged side by side with the first light receiving component; the vertical distance between the beam splitter of the first light receiving component and the second light receiving component is less than the vertical distance between the first lens of the first light receiving component and the second light receiving component.

5. The optical module according to claim 1, characterized in that, The first enclosure includes: The first enclosure plate is provided along the length of the circuit board; The second enclosure is arranged along the width direction of the circuit board, and one end is connected to the first enclosure; The third enclosure is arranged along the length of the circuit board and connected to the other end of the second enclosure; the first enclosure, the second enclosure, and the third enclosure are connected in sequence so that the first enclosure forms a storage notch, the length of the storage notch is greater than or equal to the length of the optical receiving chip, and the width of the storage notch is greater than or equal to the width of the optical receiving chip.

6. The optical module according to claim 5, characterized in that, The first optical receiving component further includes: A transimpedance amplifier chip, electrically connected to the optical receiver chip, is disposed at the storage opening of the first enclosure; The length of the placement notch is greater than or equal to the sum of the lengths of the optical receiving chip and the transimpedance amplifier chip, and the width of the placement notch is greater than or equal to the sum of the widths of the optical receiving chip and the transimpedance amplifier chip.

7. The optical module according to claim 1, characterized in that, Also includes: The light emitting component includes: Laser chip array, used to emit optical signals; A beam combiner array is located on the output optical path of the laser chip array; First optical combiner; The second beam combiner is arranged side by side with the first beam combiner; An optical fiber adapter array, located on the output optical path of the optical combiner array, includes: First transmitting fiber optic adapter; The second transmitting fiber optic adapter is arranged side by side with the first transmitting fiber optic adapter; A support plate, embedded in a through-hole of the circuit board, has the light-emitting component disposed on its surface, so that the light-emitting component is embedded in the through-hole; the support plate includes: The first supporting surface is connected to the bottom surface of the laser chip array; The second supporting surface is connected to the bottom surface of the light combiner array; The third supporting surface is connected to the bottom surface of the fiber optic adapter array; The first limiting part is arranged along the length direction of the circuit board, located at one edge of the second supporting surface, and connected to the side of the first light combiner; The second limiting part is arranged along the length direction of the circuit board, located at the other edge of the second supporting surface, and connected to the side of the second light combiner; The third limiting part is disposed in the middle of the third supporting surface, with one side connected to the side of the first transmitting fiber optic adapter and the other side connected to the side of the second transmitting fiber optic adapter.

8. The optical module according to claim 7, characterized in that, Also includes: A first protective housing, covering the light-emitting component, includes: First base plate; The first side plate is connected to the first base plate at the bottom and to the circuit board at the top. The second side plate is connected to the first base plate at the bottom, connected to the circuit board at the top, and connected to one end of the first side plate at one end. The third side plate is connected to the first base plate at the bottom, to the circuit board at the top, and to the other end of the first side plate at one end. The fourth side plate is connected to the first base plate at the bottom, to the support plate at the top, and to the other end of the second side plate at one end, and to the other end of the third side plate at the other end, forming: The first clearance gap is used to avoid the first transmitting fiber optic adapter; The second clearance gap is used to avoid the second transmitting fiber optic adapter; The top of the fourth side plate protrudes beyond the tops of the first side plate, the second side plate, and the third side plate.

9. The optical module according to claim 5, characterized in that, Also includes: The second protective housing is placed over the light receiving component.

10. The optical module according to claim 7, characterized in that, There is a gap between the second supporting surface and the third supporting surface, and the bottom surface of the gap is recessed into the third supporting surface.

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