Glass edge residue removal assembly and cutting device
By designing a glass edge adhesive removal component and using an antistatic brush to remove adhesive residue, the problems of signal interference and cleaning risks in optical positioning systems were solved, achieving efficient and safe adhesive residue removal and optimizing semiconductor processing technology.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANTONG TONGFU MICROELECTRONICS CO LTD
- Filing Date
- 2025-06-27
- Publication Date
- 2026-07-21
AI Technical Summary
During semiconductor processing, adhesive residue on the glass edges can cause signal interference in optical positioning systems. Existing technologies suffer from unsatisfactory cleaning results and the risk of glass breakage.
Design a glass edge adhesive removal component, including a mounting bracket and a cleaning component. The cleaning component is an anti-static brush that can remove adhesive residue when the wafer rotates circumferentially. The adhesive residue is thrown out by centrifugal force, avoiding the risk of contamination from manual handling and washing.
It effectively improves the signal interference problem of the optical positioning system, avoids the risk of contamination and breakage during the removal of adhesive residue, and optimizes the process.
Smart Images
Figure CN224538677U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor packaging technology, and more specifically, to a glass edge adhesive removal assembly and cutting device. Background Technology
[0002] In the semiconductor industry, it is common practice to temporarily bond silicon wafers (SI wafers) to glass substrates using adhesives, followed by edge trimming of the bonded SI glass edges. However, adhesive residue often remains at the outer edge of the glass during the trimming process. This residue is detected by the optical system during subsequent optical positioning, causing signal interference and resulting in a 15-20% error rate, thus hindering automated production. Conventional deburring methods include manual deburring and high-pressure water cleaning. However, in practical applications, the former carries the risk of contact contamination and breakage, while the latter suffers from unsatisfactory cleaning results. Utility Model Content
[0003] This application provides at least one glass edge adhesive removal component and cutting device. The glass edge adhesive removal component can remove adhesive residue generated on the outer edge of the glass to improve the signal interference problem when the optical positioning system identifies the glass edge, and at the same time avoid the risk of contamination and breakage during the adhesive residue removal process.
[0004] In a first aspect, embodiments of this application provide a glass edge adhesive removal assembly, comprising:
[0005] A mounting bracket is mounted on a cutting device used to cut the edge of a wafer, which is bonded to glass with bonding adhesive.
[0006] A cleaning component, disposed on the mounting bracket, is configured to remove adhesive residue generated during the cutting process at the outer edge of the glass during circumferential rotation of the wafer.
[0007] In one alternative embodiment, the cleaning component is an antistatic brush.
[0008] In one alternative embodiment, the cleaning component includes a brush handle and bristles, the brush handle being disposed on the mounting bracket and parallel to the axis of the wafer, and the bristles being disposed on the surface of the brush handle.
[0009] In one alternative implementation, the brush bar is configured to rotate circumferentially relative to the wafer.
[0010] In one alternative embodiment, there is a gap between the brush rod and the glass.
[0011] In one alternative implementation, it further includes:
[0012] A telescopic rod, the axis of which is parallel to the axis of the wafer, one end of which is connected to the mounting bracket and the other end of which is connected to the cleaning component;
[0013] A drive motor is mounted on the mounting frame and connected to the telescopic rod, and the drive motor is used to drive the telescopic rod to extend and retract.
[0014] In one alternative implementation, it further includes:
[0015] A distance measuring device is disposed on the mounting bracket and electrically connected to the controller of the drive motor. The distance measuring device is used to measure the distance from the distance measuring device to the glass surface, so that the drive motor controls the extension and retraction of the telescopic rod according to the distance.
[0016] In one alternative embodiment, the projection of the cleaning element overlaps with the projection of the glass along the axial direction of the wafer.
[0017] In one optional embodiment, the portion of the cleaning component that overlaps with the glass occupies 10%-20% of the projected area of the cleaning component.
[0018] Secondly, embodiments of this application also provide a cutting device, including the glass edge residue removal assembly described above.
[0019] The above-mentioned technical solution of this application has the following beneficial technical effects:
[0020] The glass edge adhesive removal assembly of this application embodiment has a cleaning component that can remove adhesive residue generated at the outer edge of the glass when the wafer rotates circumferentially, thereby improving the signal interference problem caused by the optical positioning system when identifying the glass edge. At the same time, it can avoid the risks of contamination and breakage during manual handling and water washing to remove adhesive residue, and is conducive to optimizing the process.
[0021] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.
[0023] Figure 1 A schematic diagram of the structure of a cutting device provided in an embodiment of this application is shown;
[0024] Figure 2 It shows Figure 1 Top view of the cutting device in the middle;
[0025] Figure 3 It shows Figure 1 A schematic diagram of the glass edge adhesive removal component;
[0026] In the picture:
[0027] 1. Cutting device; 110. Grinding wheel; 120. Glass edge adhesive removal assembly; 121. Mounting bracket; 122. Cleaning component; 122a. Brush rod; 122b. Brush bristles; 123. Telescopic rod; 124. Drive motor; 125. Distance measuring device; 2. Wafer; 3. Glass; 4. Bonding adhesive. Detailed Implementation
[0028] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present application.
[0029] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0030] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0031] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0033] refer to Figures 1 to 3 The glass edge adhesive removal assembly 120 provided in this application embodiment includes a mounting bracket 121 and a cleaning component 122. The mounting bracket 121 is mounted on a cutting device 1, which has a grinding wheel 110 for cutting the edge of a wafer 2. The wafer 2 is bonded to a glass 3 by bonding adhesive 4. The cleaning component 122 is disposed on the mounting bracket 121 and located at the edge of the wafer 2. The cleaning component 122 is configured to remove adhesive residue generated at the outer edge of the glass 3 during the cutting process when the wafer 2 rotates circumferentially.
[0034] During the cutting process of the glass edge by the cutting device 1, when the cutting device 1 cuts the bonding adhesive 4, adhesive residue will be generated at the outer edge of the glass 3. This adhesive residue can be optically identified, causing signal interference to the optical positioning system when identifying the edge of the glass 3. By installing a glass edge adhesive removal component 120 on the cutting device 1, these adhesive residues can be broken by the cleaning element 122 of the glass edge adhesive removal component 120 when the wafer 2 rotates circumferentially, and then thrown out under the action of centrifugal force, thereby improving the signal interference problem caused by the optical positioning system when identifying the edge of the glass 3.
[0035] In some embodiments, the cleaning component 122 may be an anti-static brush. That is, when the wafer 2 rotates circumferentially, the glass edge adhesive removal component 120 can remove adhesive residue from the outer edge of the glass 3 using the anti-static brush, while avoiding the generation of static electricity by the brush when removing adhesive residue, which could cause electrostatic breakdown. Of course, in other embodiments, the cleaning component 122 may also have other structures, such as a scraper.
[0036] In some embodiments, the cleaning component 122 includes a brush handle 122a and brush bristles 122b. The brush handle 122a is disposed on the mounting bracket 121, and the brush bristles 122b are disposed on the surface of the brush handle 122a. The spacing of the brush bristles 122b may be 0.5-1.0 mm, and their length 5-10 mm. Simultaneously, in order to remove solidified adhesive residue, the brush should have a certain degree of hardness and strength, such as a Shore hardness of 70-90A for the brush bristles 122b. Of course, the arrangement of the anti-static brush can be selected according to actual conditions and is not limited to the methods discussed above.
[0037] In some embodiments, the axis of the brush handle 122a is parallel to the axes of the wafer 2 and the glass 3. That is, the axis of the cleaning component 122 is parallel to the axes of the wafer 2 and the glass 3. Of course, the axis of the brush handle 122a can be selected according to the actual situation and is not limited to the manner discussed above.
[0038] In some embodiments, the brush arm 122a is configured to rotate circumferentially relative to the wafer 2. For example, the brush arm 122a can be mounted on the mounting bracket 121 by a rotating motor. In use, the rotating motor drives the brush arm 122a to rotate circumferentially, thereby causing the cleaning element 122 to rotate circumferentially relative to the wafer to brush away adhesive residue at the outer edge of the glass 3, thus improving cleaning efficiency. In specific configurations, the rotation direction of the brush arm 122a can be the same as or opposite to the rotation direction of the wafer 2.
[0039] In some embodiments, there is a gap between the brush rod 122a and the glass 3. For example, the gap between the brush rod 122a and the glass 3 can be 30 μm. This arrangement can prevent the brush rod 122a from contacting the surface of the glass 3, which would cause excessive friction between the cleaning component 122 and the glass 3, preventing rotation and even causing product damage.
[0040] In some embodiments, the glass edge adhesive removal assembly 120 further includes a telescopic rod 123 and a drive motor 124. The axial direction of the telescopic rod 123 is parallel to the axial direction of the wafer 2. One end of the telescopic rod 123 is connected to the mounting bracket 121, and the other end is connected to the cleaning component 122 (brush rod 122a). The drive motor 124 is disposed on the mounting bracket 121 and connected to the telescopic rod 123, and is used to drive the telescopic rod 123 to extend and retract. In use, by controlling the extension and retraction of the telescopic rod 123 through the drive motor 124, the height of the cleaning component 122 can be adjusted, thereby adjusting the gap between the cleaning component 122 and the glass 3 to ensure the cleaning effect of the cleaning component 122.
[0041] In some embodiments, the glass edge adhesive removal assembly 120 further includes a distance measuring device 125, which is disposed on the mounting bracket 121 and electrically connected to the controller of the drive motor 124. The distance measuring device 125 is used to measure the distance from the distance measuring device 125 to the surface of the glass 3, so that the drive motor 124 controls the extension and retraction of the telescopic rod 123 according to the distance. Specifically, the distance measuring device 125 is located directly above the glass 3. The distance measuring device 125 and the drive motor 124 constitute an automatic control unit for the telescopic rod 123, so that the drive motor 124 can control the extension and retraction of the telescopic rod 123 according to the measured distance from the distance measuring device 125 to the surface of the glass 3, so as to maintain a safe distance between the brush rod 122a and the glass 3 during cleaning.
[0042] In some embodiments, the projection of the cleaning element 122 overlaps with the projection of the glass 3 along the circumferential direction of the wafer 2. For example, the overlapping portion of the cleaning element 122 and the glass 3 accounts for 10%-20% of the projected area of the cleaning element 122. This arrangement allows a portion of the brush to contact the outer peripheral surface of the glass 3, enabling the brush to clean the outer peripheral surface of the glass 3 and preventing adhesive residue from adhering to the outer peripheral surface of the glass 3 and affecting optical positioning.
[0043] The glass edge adhesive removal assembly 120 of this application embodiment is disposed in the cutting device 1 and has a cleaning member 122. The cleaning member 122 can remove adhesive residue generated at the outer edge of the glass 3 when the wafer 2 rotates circumferentially, so as to improve the signal interference problem when the optical positioning system identifies the edge of the glass 3. At the same time, it can avoid the risk of contamination and breakage during manual handling and water washing to remove adhesive residue, and is conducive to optimizing the process.
[0044] refer to Figure 1 This application also provides a cutting device 1, including a glass edge adhesive removal assembly 120, which is the glass edge adhesive removal assembly 120 described above. The specific structure of the glass edge adhesive removal assembly 120 has been described in detail above and will not be repeated here.
[0045] The cutting device 1 of this application embodiment includes a glass edge adhesive removal component 120. The glass edge adhesive removal component 120 is disposed in the cutting device 1 and has a cleaning component 122. The cleaning component 122 can remove adhesive residue generated at the outer edge of the glass 3 when the wafer 2 rotates circumferentially, so as to improve the signal interference problem when the optical positioning system identifies the edge of the glass 3. At the same time, it can avoid the risk of contamination and breakage during manual handling and water washing to remove adhesive residue, and is conducive to optimizing the process.
[0046] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.
[0047] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A glass edge adhesive removal assembly, characterized in that, include: A mounting bracket is mounted on a cutting device used to cut the edge of a wafer, which is bonded to glass with bonding adhesive. A cleaning component, disposed on the mounting bracket, is configured to remove adhesive residue generated during the cutting process at the outer edge of the glass during circumferential rotation of the wafer.
2. The glass edge adhesive removal assembly according to claim 1, characterized in that, The cleaning component is an anti-static brush.
3. The glass edge adhesive removal assembly according to claim 2, characterized in that, The cleaning component includes a brush rod and brush bristles. The brush rod is disposed on the mounting bracket and parallel to the axis of the wafer, and the brush bristles are disposed on the surface of the brush rod.
4. The glass edge adhesive removal assembly according to claim 3, characterized in that, The brush bar is configured to rotate circumferentially relative to the wafer.
5. The glass edge adhesive removal assembly according to claim 3, characterized in that, There is a gap between the brush rod and the glass.
6. The glass edge adhesive removal assembly according to claim 5, characterized in that, Also includes: A telescopic rod, the axis of which is parallel to the axis of the wafer, one end of which is connected to the mounting bracket and the other end of which is connected to the cleaning component; A drive motor is mounted on the mounting frame and connected to the telescopic rod, and the drive motor is used to drive the telescopic rod to extend and retract.
7. The glass edge adhesive removal assembly according to claim 6, characterized in that, Also includes: A distance measuring device is disposed on the mounting bracket and electrically connected to the controller of the drive motor. The distance measuring device is used to measure the distance from the distance measuring device to the glass surface, so that the drive motor controls the extension and retraction of the telescopic rod according to the distance.
8. The glass edge adhesive removal assembly according to claim 2, characterized in that, Along the axial direction of the wafer, the projection of the cleaning element partially overlaps with the projection of the glass.
9. The glass edge adhesive removal assembly according to claim 8, characterized in that, The portion of the cleaning component that overlaps with the glass accounts for 10%-20% of the projected area of the cleaning component.
10. A cutting device, characterized in that, Includes the glass edge adhesive removal assembly as described in any one of claims 1-9.