A water gun for cleaning a silicon component of a semiconductor etching apparatus
By designing a water gun with a multi-stage diversion cone and a solenoid valve tube, the problem of existing cleaning equipment being unable to enter the holes of silicon components was solved, achieving a highly efficient cleaning effect on different silicon components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HEFEI SHENGTENG SEMICON TECH CO LTD
- Filing Date
- 2025-07-18
- Publication Date
- 2026-07-24
AI Technical Summary
Existing cleaning equipment cannot effectively enter the pores of silicon components, resulting in poor cleaning performance. Furthermore, it cannot adjust the cleaning area and flow rate according to different sizes of silicon components, leading to incomplete cleaning.
A water gun for cleaning silicon components in a semiconductor etching device was designed, comprising a multi-stage diversion cone and a solenoid valve tube. Through diversion baffles and a single flow channel tube, multi-stage regulation of clean water and one-to-one cleaning are achieved to meet the cleaning needs of different silicon components.
It achieves efficient cleaning of the pore structure of silicon components, and can adjust the cleaning area and flow rate according to needs to ensure cleaning quality and efficiency.
Smart Images
Figure CN224542479U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of silicon component cleaning technology, specifically a water gun for cleaning silicon components in a semiconductor etching device. Background Technology
[0002] Currently, with the rapid development of the global semiconductor industry, there is a high demand for silicon components used in etching, and the technical requirements are also high. However, during the cleaning process of silicon components, due to the structural characteristics of silicon components with holes and a large number of small pores, clean water cannot enter the holes well during the rinsing process, resulting in poor cleaning effect.
[0003] Secondly, the cleaning process also requires deep cleaning of the surface and internal pores of the silicon components to remove the attached residual film and dirt, and to avoid uneven reaction inside the pores, which would cause uneven pore size in the product. However, most of the cleaning water guns currently used are of general specifications. In other words, they cannot achieve the effect of adjusting the rinsing area to suit silicon components of different sizes. This results in larger silicon components taking longer to clean and increasing the chance of incomplete cleaning. Utility Model Content
[0004] This invention provides a water gun for cleaning silicon components in a semiconductor etching apparatus, which solves the problems mentioned in the background art.
[0005] This utility model provides the following technical solution: a water gun for cleaning silicon components of a semiconductor etching device, including an outer spray cylinder, in which a first diversion cone, a second diversion cone, and a third diversion cone are fitted together. The third diversion cone, the second diversion cone, and the first diversion cone are fitted together in pairs along the central axis. A diversion baffle is fitted on one side of the outer spray cylinder, and the diversion baffle can fully fit and cover the water delivery structure composed of the third diversion cone, the second diversion cone, and the first diversion cone.
[0006] The diversion baffle has several third spray holes, several second spray holes, and several first spray holes arranged circumferentially along the third diversion cone, the second diversion cone, and the first diversion cone, respectively. A hollow diversion plate is fitted inside the bottom of the outer spray tube. Solenoid valve tubes are installed between the third diversion cone, the second diversion cone, the first diversion cone, and the hollow diversion plate. A water pipe is connected to the bottom of the hollow diversion plate. A handle assembly is fitted on the outside of the water pipe, and a control component that can be electrically connected to the solenoid valve inside the solenoid valve tube is installed on the surface of the handle assembly.
[0007] Preferably, the diversion baffle is snapped into the interior of one side of the outer spray nozzle, and the outer surface of the port of the outer spray nozzle is provided with a first external thread and a first internal thread sleeve is helically engaged with the first external thread. A limiting ring is provided in the middle of the first internal thread sleeve, which is in close contact with the side of one side of the diversion baffle.
[0008] Preferably, the handle assembly includes a grip cylinder and an auxiliary support plate. The auxiliary support plate is fixed between the bottom of the outer spray cylinder and the top of the grip cylinder, and a plurality of clearance grooves are formed on one side of the grip cylinder from top to bottom.
[0009] Preferably, the control component includes an outer protective shell, a controller, a power module, and a switch. The outer protective shell is fixed to the surface on the other side of the top of the grip cylinder. The controller, power module, and switch are fitted inside the outer protective shell, and a clearance groove for fitting the switch is provided on one side wall of the outer protective shell. The solenoid valve inside the solenoid valve tube is electrically connected to the controller and power module through a wire.
[0010] Preferably, one end of the water pipe is configured as a flange structure, and a sealing ring is nested inside the end face of one end of the water pipe.
[0011] Preferably, one side of the flow divider is connected to a single-channel pipe that can be synchronously covered with the second nozzle, the third nozzle, and the first nozzle. The surface of one end of the first internal threaded sleeve is provided with a second external thread, and the second internal threaded sleeve is helically engaged with the second internal threaded sleeve through the second external thread. During the helical engagement of the second internal threaded sleeve and the first internal threaded sleeve, the inner side of the middle part of the second internal threaded sleeve is gradually fitted onto one end of the single-channel pipe until it is pressed and limited.
[0012] Preferably, the single-channel tube is specifically configured as a tapered structure, and a transition ring plate that can fit and connect with the inner wall of the second internal threaded sleeve is fitted on the outer side of the other end of the single-channel tube.
[0013] This utility model has the following beneficial effects:
[0014] 1. This utility model is a multi-functional cleaning structure assembled by a first diversion cone, a second diversion cone, a third diversion cone, a diversion baffle, three solenoid valve pipes, and multiple first spray holes, multiple second spray holes, and multiple third spray holes arranged inside the diversion baffle. After being used in combination with an external spray cylinder and water pipe, it can control the cleaning area of the clean water in multiple stages, and can also adjust the clean water rinsing flow rate by increasing the flow channel, thus fully solving the problems existing in the prior art.
[0015] 2. In response to the need for one-to-one cleaning of the hole structure of silicon components, this utility model can simultaneously cover the second, third, and first spray holes inside the diversion partition with a single-channel pipe. Then, the second internal threaded sleeve is fitted with the single-channel pipe and then threadedly connected to the first internal threaded sleeve to form an integrated structure assembly. Subsequently, in the cleaning process, the clean water output from the diversion partition can clean the inner hole structure of the silicon component one-to-one through the single channel inside the single-channel pipe, meeting different usage needs in actual use and optimizing the overall performance of the device. Attached Figure Description
[0016] Figure 1 This is a three-dimensional schematic diagram of the first embodiment of the structure of this utility model;
[0017] Figure 2 This is a left view schematic diagram of the first embodiment of the structure of this utility model;
[0018] Figure 3 This is a cross-sectional schematic diagram of the external spray nozzle of this utility model.
[0019] Figure 4 This is a three-dimensional schematic diagram of the second embodiment of the structure of this utility model;
[0020] Figure 5 This is a cross-sectional schematic diagram of the single-channel pipe structure of this utility model;
[0021] Figure 6 The structure of this utility model Figure 5 Enlarged diagram of point A in the middle.
[0022] In the diagram: 1. External spray nozzle; 2. Water pipe; 3. First diversion cone; 4. Second diversion cone; 5. Third diversion cone; 6. Diversion baffle; 7. First spray hole; 8. Second spray hole; 9. Third spray hole; 10. Hollow diversion plate; 11. Solenoid valve pipe; 12. Relief groove; 13. Grip sleeve; 14. First internal threaded sleeve; 15. Control component; 16. Auxiliary support plate; 17. Second internal threaded sleeve; 18. Single flow channel pipe. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] Example 1
[0025] Please see Figures 1-3A water gun for cleaning silicon components in a semiconductor etching device includes an outer spray nozzle 1. Inside the outer spray nozzle 1, a first diversion cone 3, a second diversion cone 4, and a third diversion cone 5 are installed. The third diversion cone 5, the second diversion cone 4, and the first diversion cone 3 are installed in pairs along the central axis. A diversion baffle 6 is installed on one side of the outer spray nozzle 1, and the diversion baffle 6 can fully fit and cover the water delivery structure composed of the third diversion cone 5, the second diversion cone 4, and the first diversion cone 3.
[0026] The diversion baffle 6 is snapped into the inside of one side of the outer spray cylinder 1, and the outer surface of the port of one side of the outer spray cylinder 1 is provided with a first external thread and a first internal thread sleeve 14 is screwed into the first external thread. A limiting ring is provided in the middle of the first internal thread sleeve 14 and is in close contact with the side of one side of the diversion baffle 6. Thus, while ensuring the connection strength between the diversion baffle 6 and the outer spray cylinder 1, the convenience of disassembling and replacing the diversion baffle 6 from the outer spray cylinder 1 can also be maintained.
[0027] Inside the diversion baffle 6, several third spray holes 9, several second spray holes 8, and several first spray holes 7 are arranged along the circumference of the third diversion cone 5, the second diversion cone 4, and the first diversion cone 3, respectively. A hollow diversion plate 10 is fitted inside the bottom of the outer spray tube 1. Solenoid valve tubes 11 are installed between the third diversion cone 5, the second diversion cone 4, the first diversion cone 3 and the hollow diversion plate 10. A water pipe 2 is connected to the bottom of the hollow diversion plate 10. One end of the water pipe 2 is set as a flange structure to facilitate assembly and connection with the output structure of the subsequent existing pumping equipment. A sealing ring is nested inside the end face of the water pipe 2 to ensure the sealing effect of the connection between the water pipe 2 and the output structure of the subsequent existing pumping equipment. A handle assembly is fitted on the outside of the water pipe 2, and a control component 15 that can be electrically connected to the solenoid valve inside the solenoid valve tube 11 is installed on the surface of the handle assembly.
[0028] The handle assembly includes a grip cylinder 13 and an auxiliary support plate 16. The auxiliary support plate 16 is fixed between the bottom of the outer spray cylinder 1 and the top of the grip cylinder 13. Several clearance grooves 12 are provided on one side of the grip cylinder 13 from top to bottom to improve the comfort of gripping. The control component 15 includes an outer protective shell, a controller, a power module, and a switch. The outer protective shell is fixed on the surface of the other side of the top of the grip cylinder 13. The controller, power module, and switch are housed in the outer protective shell. A clearance groove is provided on one side wall of the outer protective shell to accommodate the switch. The solenoid valve inside the solenoid valve tube 11 is electrically connected to the controller and power module through wires, thereby facilitating the automatic adjustment of the three solenoid valve tubes 11.
[0029] In use, the output structure of the existing pumping equipment is connected to one end of the water pipe 2. When a specific silicon component needs to be cleaned, the pumping equipment is started, and the pumping equipment pumps clean water to the water pipe 2. Then, the water enters the hollow diversion plate 10 through the water pipe 2. Then, according to the size of the silicon component to be cleaned, the first diversion cone 3, the combination of the first diversion cone 3 and the second diversion cone 4, the combination of the first diversion cone 3, the second diversion cone 4, and the third diversion cone 5 are selected. The solenoid valves inside the three solenoid valve pipes 11 are adjusted to open or close accordingly through the control component 15. The following takes a smaller silicon component with a deeper internal hole structure as an example.
[0030] The pumping equipment is started, and the pumping equipment pumps clean water to water pipe 2, which then enters the hollow diversion plate 10 through water pipe 2. At the same time, the solenoid valve inside the solenoid valve pipe 11 corresponding to the first diversion cone 3 is opened by the control component 15. The clean water inside the hollow diversion plate 10 then enters the first diversion cone 3 through the open solenoid valve pipe 11. Then, it is sprayed onto the silicon component through several third spray holes 9 set inside the first diversion cone 3 to achieve the cleaning effect of high pressure gun and high flow rate, thereby ensuring the cleaning quality of the silicon component.
[0031] When the subsequent diversion baffle 6 becomes blocked or damaged, unscrew the first internal threaded sleeve 14 and separate the first internal threaded sleeve 14 from the outer spray cylinder 1. Then, the diversion baffle 6 can be separated from the inside of the outer spray cylinder 1. After that, the new diversion baffle 6 is used to cover the first diversion cone 3, the second diversion cone 4, and the third diversion cone 5 again. Then, the first internal threaded sleeve 14 is reset and locked.
[0032] Example 2
[0033] Please see Figures 4-6 One side of the flow divider 6 is connected to a single-channel pipe 18 that can be synchronously covered with the second nozzle 8, the third nozzle 9, and the first nozzle 7. The surface of one end of the first internal threaded sleeve 14 is provided with a second external thread, and the second internal threaded sleeve 17 is helically engaged with the second internal threaded sleeve 17 through the second external thread. During the helical engagement between the second internal threaded sleeve 17 and the first internal threaded sleeve 14, the inner side of the middle part of the second internal threaded sleeve 17 is gradually fitted onto one end of the single-channel pipe 18 until it is pressed and limited. The single-channel pipe 18 is specifically configured as a tapered structure, and the outer side of the other end of the single-channel pipe 18 is fitted with a transition ring plate that can be fitted and connected to the inner wall of the second internal threaded sleeve 17.
[0034] When in use, considering the need to clean each hole structure one by one, the single flow channel tube 18 can be used to simultaneously cover the second spray hole 8, the third spray hole 9, and the first spray hole 7 inside the flow divider 6. Then, the second internal thread sleeve 17 is fitted onto the single flow channel tube 18 and then threadedly connected to the first internal thread sleeve 14. During the spiral engagement of the second internal thread sleeve 17 and the first internal thread sleeve 14, the inner side of the middle part of the second internal thread sleeve 17 is gradually fitted onto one end of the single flow channel tube 18 until it is pressed to the limit, ensuring the stability of the single flow channel tube 18 in subsequent use.
[0035] During subsequent cleaning, the pumping equipment is activated to pump clean water to water pipe 2, which then enters the hollow diverter plate 10. Simultaneously, the solenoid valve inside the solenoid valve pipe 11 corresponding to the first diverter cone 3 is opened by the control component 15. The clean water inside the hollow diverter plate 10 then enters the first diverter cone 3 through the open solenoid valve pipe 11. Next, it is sprayed into the single-channel pipe 18 through several third spray holes 9 set inside the first diverter cone 3. Finally, the single channel inside the single-channel pipe 18 cleans the pore structure inside the silicon component one by one, fully meeting different usage requirements.
[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Additionally, in the accompanying drawings of this utility model, the fill patterns are merely for distinguishing layers and do not constitute any other limitation.
[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A water gun for cleaning silicon components in a semiconductor etching apparatus, comprising an outer spray nozzle (1), characterized in that: The outer spray nozzle (1) is fitted with a first diversion cone (3), a second diversion cone (4) and a third diversion cone (5). The third diversion cone (5), the second diversion cone (4) and the first diversion cone (3) are fitted together along the central axis. A diversion baffle (6) is fitted on one side of the outer spray nozzle (1), and the diversion baffle (6) can fully fit and cover the water conveying structure composed of the third diversion cone (5), the second diversion cone (4) and the first diversion cone (3). The diversion baffle (6) is provided with a number of third nozzles (9), a number of second nozzles (8) and a number of first nozzles (7) arranged circumferentially along the third diversion cone (5), the second diversion cone (4) and the first diversion cone (3). The bottom of the outer spray tube (1) is fitted with a hollow diversion plate (10). Solenoid valve tubes (11) are installed between the third diversion cone (5), the second diversion cone (4), the first diversion cone (3) and the hollow diversion plate (10). The bottom of the hollow diversion plate (10) is connected to a water pipe (2). A handle assembly is fitted on the outside of the water pipe (2), and a control component (15) that can be electrically connected to the solenoid valve inside the solenoid valve tube (11) is installed on the surface of the handle assembly.
2. The water gun for cleaning silicon components in a semiconductor etching apparatus according to claim 1, characterized in that: The diversion baffle (6) is snapped into the inside of one side of the outer spray tube (1), and the outer surface of the port of one side of the outer spray tube (1) is provided with a first external thread and a first internal thread sleeve (14) is helically engaged by the first external thread. A limiting ring is provided in the middle of the first internal thread sleeve (14) and is in close contact with the side of one side of the diversion baffle (6).
3. The water gun for cleaning silicon components in a semiconductor etching apparatus according to claim 1, characterized in that: The handle assembly includes a grip cylinder (13) and an auxiliary support plate (16). The auxiliary support plate (16) is fixed between the bottom of the outer spray cylinder (1) and the top of the grip cylinder (13). A plurality of clearance grooves (12) are provided on one side of the grip cylinder (13) from top to bottom.
4. The water gun for cleaning silicon components in a semiconductor etching apparatus according to claim 1, characterized in that: The control component (15) includes an outer protective shell, a controller, a power module and a switch. The outer protective shell is fixed on the surface of the other side of the top of the grip (13). The controller, power module and switch are fitted inside the outer protective shell. A clearance groove for fitting the switch is provided on one side wall of the outer protective shell. The solenoid valve inside the solenoid valve tube (11) is electrically connected to the controller and power module through a wire.
5. The water gun for cleaning silicon components in a semiconductor etching apparatus according to claim 1, characterized in that: The end of the water pipe (2) is set as a flange structure, and a sealing ring is nested inside the end face of the water pipe (2).
6. The water gun for cleaning silicon components in a semiconductor etching apparatus according to claim 2, characterized in that: One side of the diversion baffle (6) is connected to a single-channel pipe (18) that can be synchronously covered with the second nozzle (8), the third nozzle (9), and the first nozzle (7). The surface of one end of the first internal threaded sleeve (14) is provided with a second external thread and is helically engaged with the second internal threaded sleeve (17) through the second external thread. During the helical engagement of the second internal threaded sleeve (17) and the first internal threaded sleeve (14), the inner side of the middle part of the second internal threaded sleeve (17) is gradually fitted onto one end of the single-channel pipe (18) until it is pressed to the limit.
7. The water gun for cleaning silicon components in a semiconductor etching apparatus according to claim 6, characterized in that: The single-channel tube (18) is specifically configured as a tapered structure, and the outer side of the other end of the single-channel tube (18) is fitted with a transition ring plate that can fit and connect with the inner wall of the second internal thread sleeve (17).