High-efficiency cooling table for injection molding processing

Abstract

The utility model discloses a kind of high-efficiency cooling platforms for injection molding processing, which belongs to injection molding processing equipment technical field, including workbench, the upper end of the workbench is fixedly connected with U-shaped support frame, the upper end of the workbench is provided with lower mould;Cooling mechanism, the cooling mechanism includes the liquid storage tank of fixed connection in the lower end of workbench, the lower mould is provided with serpentine cooling pipe, the right end of the serpentine cooling pipe extends to the liquid storage tank, the lower end of the workbench is installed with water pump and air pump, the liquid inlet pipe of the water pump extends to the inner bottom of liquid storage tank.This equipment is aimed at use problem, by being provided with serpentine cooling pipe, rectangular hollow block and semiconductor refrigeration piece, water cooling and air cooling to injection molding article can be realized, and cooling medium can be recycled, and stirring mechanism is also provided, cooling liquid and cold air in liquid storage tank can be stirred, to improve the cooling efficiency of cooling medium in liquid storage tank.

Description

Technical Field

[0001] This utility model relates to the field of injection molding equipment technology, and in particular to a high-efficiency cooling platform for injection molding. Background Technology

[0002] Injection molding is a process in which molten plastic granules are injected into a mold and allowed to cool and solidify to form the desired product. In the field of injection molding, the cooling process after the injection molded parts are formed is crucial, as its cooling efficiency and quality directly affect the production cycle and quality of the product.

[0003] Currently, traditional injection molding cooling methods mostly use single water cooling. This cooling method suffers from uneven cooling and low efficiency, which in turn affects the pass rate of injection molded parts. At the same time, after long-term use, the uneven temperature distribution of the cooling medium can easily lead to a gradual decrease in cooling effect, making it difficult to ensure that the cooling medium is always in a good cooling state. Therefore, in order to solve these problems, designing a high-efficiency cooling platform for injection molding is something we need to consider. Utility Model Content

[0004] The purpose of this utility model is to address the shortcomings of existing technologies by proposing a high-efficiency cooling platform for injection molding. In terms of usage, it is equipped with a serpentine cooling pipe, a rectangular hollow block, and a semiconductor cooling component, which enables water cooling and air cooling of injection molded parts. It also allows for the recycling of the cooling medium and includes a stirring mechanism to agitate the coolant and cold air in the storage tank, thereby improving the cooling efficiency of the cooling medium in the storage tank.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-efficiency cooling platform for injection molding includes a worktable with a U-shaped support frame fixedly connected to its upper end and a lower mold mounted on the upper end of the worktable; a cooling mechanism including a liquid storage tank fixedly connected to the lower end of the worktable, a serpentine cooling pipe disposed inside the lower mold, the right end of the serpentine cooling pipe extending into the liquid storage tank; a water pump and an air pump installed at the lower end of the worktable, the inlet pipe of the water pump extending to the inner bottom of the liquid storage tank, and the outlet pipe of the water pump communicating with the left end of the serpentine cooling pipe; a rectangular hollow block fixedly connected to the inner wall of the right side of the U-shaped support frame, multiple air vents on the left side of the rectangular hollow block, the inlet pipe of the air pump extending to the inner top of the liquid storage tank, and the outlet pipe of the air pump extending into the inner cavity of the rectangular hollow block; and a stirring mechanism for stirring the liquid in the liquid storage tank.

[0007] Preferably, a semiconductor cooling element is fixedly connected to the front side of the liquid storage tank, and the cooling end of the semiconductor cooling element extends into the liquid storage tank.

[0008] Preferably, the agitation mechanism includes a motor installed on the right side of the liquid storage tank, a threaded rod rotatably connected between the inner walls of the left and right sides of the liquid storage tank, the right end of the threaded rod penetrating the inner wall of the right side of the liquid storage tank and fixedly connected to the output shaft of the motor, and an agitation plate threadedly connected to the threaded rod, the agitation plate having multiple agitation holes.

[0009] Preferably, a guide rod is fixedly connected between the inner walls of the left and right sides of the liquid storage tank, the guide rod passing through the stirring plate and slidably connected to the stirring plate.

[0010] Preferably, a hydraulic telescopic rod is installed on the inner top of the U-shaped support frame, and the telescopic end of the hydraulic telescopic rod is fixedly connected to the upper mold.

[0011] Preferably, a controller is provided on the right side of the U-shaped support frame.

[0012] Compared with the prior art, the advantages of this utility model are as follows:

[0013] The system incorporates a cooling mechanism that combines water and air cooling. Coolant flows through a serpentine cooling pipe, exchanging heat with the injection-molded part. Combined with cooling gas sprayed downwards through multiple vents, this highly efficient cooling system provides superior cooling compared to traditional water-only cooling, significantly improving injection molding efficiency. Furthermore, the cooling medium is recyclable, reducing costs. An agitation mechanism is also included, controlling the left-right movement of an agitator to stir the cooling medium. This, along with the circulating cooling of the coolant by a semiconductor refrigeration unit, further enhances the cooling efficiency of the medium itself, ensuring optimal cooling performance. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a high-efficiency cooling platform for injection molding proposed in this utility model;

[0015] Figure 2 This is a partial structural cross-sectional view of the cooling mechanism and the agitation mechanism;

[0016] Figure 3 for Figure 2 Enlarged view of point A.

[0017] In the diagram: 1. Workbench, 2. U-shaped support frame, 3. Lower mold, 4. Liquid storage tank, 5. Snake-shaped cooling pipe, 6. Water pump, 7. Air pump, 8. Rectangular hollow block, 9. Air outlet, 10. Semiconductor cooling component, 11. Motor, 12. Threaded rod, 13. Stirring plate, 14. Stirring hole, 15. Guide rod, 16. Hydraulic telescopic rod, 17. Upper mold, 18. Controller. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Reference Figures 1-3 A high-efficiency cooling platform for injection molding includes a worktable 1, a U-shaped support frame 2 fixedly connected to the upper end of the worktable 1, a lower mold 3 set at the upper end of the worktable 1, a hydraulic telescopic rod 16 installed on the inner top of the U-shaped support frame 2, an upper mold 17 fixedly connected to the telescopic end of the hydraulic telescopic rod 16, an injection hole set at the upper end of the upper mold 17 for injecting injection material (molten plastic) into the lower mold 3 and the upper mold 17, and a controller 18 set on the right side of the U-shaped support frame 2, which can control the normal operation of a water pump 6, an air pump 7, a semiconductor cooling component 10, a motor 11 and the hydraulic telescopic rod 16;

[0020] The system also includes a cooling mechanism, which consists of a liquid storage tank 4 fixedly connected to the lower end of the workbench 1. A liquid inlet pipe is installed on the front side of the liquid storage tank 4 to maintain the coolant level. The liquid storage tank 4 is filled with coolant (the liquid level is slightly higher than the threaded rod 12). A serpentine cooling pipe 5 is installed inside the lower mold 3. When the coolant is pumped through the serpentine cooling pipe 5, it can provide water cooling for the lower mold 3 and the injection molded parts inside. The right end of the serpentine cooling pipe 5 extends into the liquid storage tank 4. A water pump 6 and an air pump 7 are installed at the lower end of the workbench 1. The inlet pipe of the water pump 6 extends to the bottom of the liquid storage tank 4, and the outlet pipe of the water pump 6 is connected to the left end of the serpentine cooling pipe 5. A rectangular hollow block is fixedly connected to the inner right side of the U-shaped support frame 2. 8. A rectangular hollow block 8 is located on the right side of the lower mold 3. Multiple air outlets 9 are provided on the left side of the rectangular hollow block 8. By starting the air pump 7, the cooling gas in the liquid storage tank 4 can be pumped into the rectangular hollow block 8 and sprayed out through the multiple air outlets 9 to achieve air cooling of the lower mold 3 and the injection molded parts inside. The air inlet pipe of the air pump 7 extends to the inner top of the liquid storage tank 4, and the air outlet pipe of the air pump 7 extends into the inner cavity of the rectangular hollow block 8. A semiconductor cooling component 10 is fixedly connected to the front side of the liquid storage tank 4. The semiconductor cooling component 10 is composed of a semiconductor cooling chip and a heat dissipation fan. This is the prior art. The cooling end of the semiconductor cooling component 10 extends into the liquid storage tank 4, which can circulate and cool the coolant in the liquid storage tank 4 to ensure the cooling effect of the coolant.

[0021] The system also includes a stirring mechanism for agitating the liquid in the storage tank 4. The stirring mechanism includes a motor 11 mounted on the right side of the storage tank 4. The motor 11 is a motor whose rotation direction can be changed. A threaded rod 12 is rotatably connected between the inner walls of the left and right sides of the storage tank 4. The right end of the threaded rod 12 passes through the inner wall of the right side of the storage tank 4 (a bearing with sealing function is provided at the penetration point) and is fixedly connected to the output shaft of the motor 11. A stirring plate 13 is threadedly connected to the threaded rod 12. The stirring plate 13 has multiple stirring holes 14. By controlling the left and right movement of the stirring plate 13, the coolant and cooling gas in the storage tank 4 can be agitated, thereby improving the cooling efficiency of these cooling media and ensuring the cooling effect of the cooling media. A guide rod 15 is fixedly connected between the inner walls of the left and right sides of the storage tank 4. The guide rod 15 passes through the stirring plate 13 and is slidably connected to the stirring plate 13.

[0022] In this utility model, during use, the controller 18 controls the hydraulic telescopic rod 16 to move the upper mold 17 down until the upper mold 17 and the lower mold 3 are tightly fitted together. Then, the molten plastic is injected into the cavity between the upper mold 17 and the lower mold 3 through the injection hole in the upper mold 17 to complete the injection molding operation.

[0023] After completing the above operations, the injection-molded part needs to be cooled and solidified. At this time, the water pump 6 is started by the controller 18. The inlet pipe of the water pump 6 draws coolant from the bottom of the storage tank 4. The coolant enters the serpentine cooling pipe 5 through the outlet pipe of the water pump 6. During the flow of the coolant in the serpentine cooling pipe 5, it exchanges heat with the lower mold 3 and the injection-molded part inside to achieve water cooling of the injection-molded part. Afterwards, the coolant will flow back to the storage tank 4 from the right end of the serpentine cooling pipe 5. At the same time as water cooling, the air pump 7 can be started, so that the air inlet pipe of the air pump 7 enters from the top of the storage tank 4. Cooling gas is extracted and enters the rectangular hollow block 8 through the air outlet pipe of the air pump 7. The cooling gas is then sprayed to the left through multiple air outlets 9 to air-cool the lower mold 3 and the injection molded parts inside. After the injection molded parts have cooled, the hydraulic telescopic rod 16 is controlled to move the upper mold 17 upward, so that the cooled and formed injection molded parts can be removed from the lower mold 3. The whole cooling process is relatively convenient. Through the combination of water cooling and air cooling, efficient cooling of injection molded parts can be achieved. Compared with traditional single water cooling, the cooling effect is better, which improves the actual injection molding efficiency. Moreover, the overall structure is simple and practical.

[0024] It is worth mentioning that during the cooling process, the cooling end of the semiconductor cooling device 10 can circulate and cool the coolant in the liquid storage tank 4 to ensure that the coolant always maintains a low temperature and ensures its cooling effect. At the same time, the controller 18 controls the motor 11 to start, which drives the threaded rod 12 to rotate, which can drive the stirring plate 13 to move left and right. During the movement, the stirring plate 13, together with its multiple stirring holes 14, can stir the coolant and cooling gas in the liquid storage tank 4, thereby improving the cooling efficiency of these cooling media and further ensuring the cooling effect of the cooling media.

[0025] It should be noted that the water pump 6, air pump 7, semiconductor cooling component 10, motor 11 and hydraulic telescopic rod 16 in this utility model are all common knowledge in the field. Their working principles are known technologies. The appropriate model is selected according to actual use. Therefore, the control method and wiring layout of the water pump 6, air pump 7, semiconductor cooling component 10, motor 11 and hydraulic telescopic rod 16 will not be explained in detail.

[0026] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high-efficiency cooling platform for injection molding, characterized in that, include: Workbench (1), with a U-shaped support frame (2) fixedly connected to the upper end of the workbench (1), and a lower mold (3) provided at the upper end of the workbench (1). The cooling mechanism includes a liquid storage tank (4) fixedly connected to the lower end of the workbench (1), a serpentine cooling pipe (5) is provided in the lower mold (3), the right end of the serpentine cooling pipe (5) extends into the liquid storage tank (4), a water pump (6) and an air pump (7) are installed at the lower end of the workbench (1), the inlet pipe of the water pump (6) extends to the bottom of the liquid storage tank (4), the outlet pipe of the water pump (6) is connected to the left end of the serpentine cooling pipe (5), a rectangular hollow block (8) is fixedly connected to the inner wall of the right side of the U-shaped support frame (2), a plurality of air outlet holes (9) are opened on the left side of the rectangular hollow block (8), the inlet pipe of the air pump (7) extends to the top of the liquid storage tank (4), and the outlet pipe of the air pump (7) extends into the inner cavity of the rectangular hollow block (8). A stirring mechanism is used to stir the liquid in the storage tank (4).

2. The high-efficiency cooling platform for injection molding according to claim 1, characterized in that, A semiconductor cooling element (10) is fixedly connected to the front side of the liquid storage tank (4), and the cooling end of the semiconductor cooling element (10) extends into the liquid storage tank (4).

3. The high-efficiency cooling platform for injection molding according to claim 1, characterized in that, The stirring mechanism includes a motor (11) installed on the right side of the liquid storage tank (4). A threaded rod (12) is rotatably connected between the inner walls of the left and right sides of the liquid storage tank (4). The right end of the threaded rod (12) passes through the inner wall of the right side of the liquid storage tank (4) and is fixedly connected to the output shaft of the motor (11). A stirring plate (13) is threadedly connected to the threaded rod (12). A plurality of stirring holes (14) are provided on the stirring plate (13).

4. The high-efficiency cooling platform for injection molding according to claim 3, characterized in that, A guide rod (15) is fixedly connected between the inner walls of the left and right sides of the liquid storage tank (4). The guide rod (15) passes through the stirring plate (13) and is slidably connected to the stirring plate (13).

5. The high-efficiency cooling platform for injection molding according to claim 1, characterized in that, A hydraulic telescopic rod (16) is installed on the inner top of the U-shaped support frame (2), and the telescopic end of the hydraulic telescopic rod (16) is fixedly connected to the upper mold (17).

6. The high-efficiency cooling platform for injection molding according to claim 1, characterized in that, A controller (18) is provided on the right side of the U-shaped support frame (2).

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