A new type of compatible multi IC running shuttle

Abstract

The utility model discloses a novel operation material shuttle compatible with multiple ICs, which comprises a material shuttle, guide pins, which are evenly arranged on the upper end of the material shuttle and have four in number, shuttle inserts, which are arranged on the upper end of the material shuttle and have four in number and are arranged between the guide pins, and hard top columns, which are crosswise arranged on the outer side of the shuttle inserts and have four in number. Through the above structure, the material shuttle is provided with a floating structure at different stations. The floating structure plays a compatible role in the operation of multiple ICs with different thicknesses at the same time. The floating structure is an independent station, and the size and depth of the cavity can be changed to meet the needs of various packaged ICs. The ICs with different packaging or different thicknesses can be quickly and effectively transported synchronously.

Description

Technical Field

[0001] This utility model relates to the field of shuttle technology, and in particular to a novel shuttle compatible with multiple ICs. Background Technology

[0002] In the integrated circuit (IC) manufacturing process, the IC transportation process places extremely high demands on the adaptability and transportation efficiency of the material shuttle. Currently, the IC material shuttles used in the industry generally have significant limitations in their structural design: traditional material shuttles mostly have fixed cavity structures at their workstations, and the size and depth of the cavity are pre-set during production, which can only accommodate IC products of a single specification (same package type and same thickness).

[0003] When production demands involve the simultaneous transport of multiple ICs with different package types (such as DIP, SOP, QFP, etc.) or different thicknesses, the drawbacks of traditional fixed-cavity feed chutes become fully apparent. To transport ICs of different sizes, companies need to customize dedicated feed chutes for each size. This not only significantly increases the procurement costs of production equipment and inventory management costs, but also requires frequent feed chutes replacement when switching production specifications, severely reducing the continuous operating efficiency of the production line.

[0004] In addition, there are a few existing technologies that attempt to achieve multi-specification adaptability shuttle designs, but these designs mostly adopt an overall adjustment structure (such as adjusting the cavity depth as a whole through bolts), which cannot be independently adjusted for a single station. Utility Model Content

[0005] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide a new type of shuttle compatible with multiple ICs, which can quickly and effectively transport ICs with different packages or ICs of different sizes and thicknesses simultaneously.

[0006] This utility model also provides a novel operating shuttle compatible with multiple ICs, comprising:

[0007] Shuttle;

[0008] Four guide pins are evenly distributed on the upper end of the feed shuttle.

[0009] Four shuttle inserts are provided at the upper end of the shuttle and are positioned between the guide pins.

[0010] Four rigid top posts are arranged crosswise on the outside of the shuttle insert.

[0011] According to the present invention, a novel shuttle compatible with multiple ICs is provided, wherein the lower end of the shuttle insert is fixedly connected to a guide slope.

[0012] According to the present invention, a novel operating shuttle compatible with multiple ICs is provided, wherein a slot is provided between the shuttle insert and the shuttle.

[0013] According to the present invention, a novel shuttle compatible with multiple ICs is provided, wherein four third hexagon socket screws are threadedly connected to the inner side of the shuttle insert, a positioning pin is provided at the lower end of the third hexagon socket screw, a first hexagon socket screw is threadedly connected to the outer side of the positioning pin, and a limit groove is provided between the third hexagon socket screws and the shuttle insert.

[0014] According to the present invention, a novel operating shuttle compatible with multiple ICs is provided, wherein a buffer spring is sleeved on the outside of the third internal hexagon screw.

[0015] According to the present invention, a novel operating shuttle compatible with multiple ICs is provided. Two screws are symmetrically arranged at the upper end of the shuttle. A flat washer is sleeved on the outside of the screw. A compression spring is compressed at the lower end of the flat washer. The lower end of the compression spring is in contact with the inside of the shuttle.

[0016] According to the present invention, a novel operating shuttle compatible with multiple ICs is provided, wherein two second hexagon socket screws are symmetrically threaded on the inner side of the hard top post, and the second hexagon socket screws and the shuttle are threaded together.

[0017] According to the present invention, a novel operating shuttle compatible with multiple ICs is provided, wherein a washer is fitted on the outside of the second internal hexagonal screw.

[0018] Beneficial effects:

[0019] The shuttle is equipped with a floating structure at different workstations. The floating structure is compatible with the simultaneous operation of multiple ICs of different thicknesses. The floating structure is an independent workstation that can change the cavity size and depth to meet the needs of ICs with different packages. It can quickly and effectively transport ICs of different packages or ICs of different sizes and thicknesses synchronously. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0021] Figure 1 This is an exploded view of a novel operating shuttle compatible with multiple ICs according to this utility model.

[0022] Figure 2 This is a top view of a novel operating shuttle compatible with multiple ICs according to this utility model;

[0023] Figure 3 This is a front view of a shuttle insert for a novel operating shuttle compatible with multiple ICs according to this utility model.

[0024] Figure 4 This is a top view of a slot for a novel shuttle compatible with multiple ICs, according to the present invention.

[0025] Legend:

[0026] 1. Shuttle; 2. Guide pin; 3. Screw; 4. Flat washer; 5. Compression spring; 6. Locating pin; 7. First socket head cap screw; 8. Hard top post; 9. Second socket head cap screw; 10. Washer; 11. Buffer spring; 12. Third socket head cap screw; 13. Shuttle insert; 14. Guide slope; 15. Limiting slot; 16. Slot. Detailed Implementation

[0027] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0028] Reference Figure 1-4 This utility model embodiment discloses a novel operating shuttle compatible with multiple ICs, comprising:

[0029] Shuttle 1;

[0030] Guide pins 2 are evenly arranged on the upper end of shuttle 1, and there are four of them;

[0031] Shuttle insert 13, four of which are located on the upper end of shuttle 1 and are positioned between guide pins 2;

[0032] The hard top posts 8 are arranged crosswise on the outside of the shuttle insert 13, and there are four of them.

[0033] The lower end of the shuttle insert 13 is fixedly connected to a guide slope 14.

[0034] A slot 16 is provided between the shuttle insert 13 and the shuttle 1.

[0035] The inner side of the shuttle insert 13 is connected to four third hexagon socket screws 12. The lower end of the third hexagon socket screws 12 is provided with a locating pin 6. The outer side of the locating pin 6 is connected to a first hexagon socket screw 7. A limit groove 15 is provided between the third hexagon socket screws 12 and the shuttle insert 13.

[0036] Specifically, the third hex socket screw 12, together with the locating pin 6 and the first hex socket screw 7, is used to install the shuttle insert 13.

[0037] A buffer spring 11 is fitted on the outside of the third internal hex screw 12.

[0038] Two screws 3 are symmetrically arranged on the upper end of the shuttle 1. A flat washer 4 is sleeved on the outside of the screw 3. A compression spring 5 is compressed at the lower end of the flat washer 4. The lower end of the compression spring 5 is in contact with the inside of the shuttle 1.

[0039] Specifically, screw 3, together with compression spring 5, is used to install and fix shuttle 1.

[0040] The hard top post 8 has two second internal hexagon screws 9 symmetrically connected to the inner side, and the second internal hexagon screws 9 and the shuttle 1 are connected by threads.

[0041] Specifically, the second internal hex screw 9 is used to install and lock the hard top post 8.

[0042] The second internal hex screw 9 has a washer 10 fitted on its outer side.

[0043] Specifically, washer 10 is used together with second internal hex screw 9 to support the installation.

[0044] Working principle: The shuttle 1 is equipped with a floating structure at different workstations. The floating structure enables the shuttle 1 to operate multiple ICs of different thicknesses at the same time. The floating structure is an independent workstation that can change the cavity size and depth to meet the needs of ICs with different packages. It can quickly and effectively transport ICs of different packages or ICs of different sizes and thicknesses synchronously.

[0045] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A novel operating shuttle compatible with multiple ICs, characterized in that, include: Shuttle (1); Four guide pins (2) are evenly arranged on the upper end of the shuttle (1); Shuttle inserts (13) are provided at the upper end of the shuttle (1) and there are four of them, and they are provided between the guide pins (2); Four hard top posts (8) are arranged crosswise on the outside of the shuttle insert (13).

2. The novel operating shuttle compatible with multiple ICs according to claim 1, characterized in that, The lower end of the shuttle insert (13) is fixedly connected to a guide slope (14).

3. A novel operating shuttle compatible with multiple ICs according to claim 1, characterized in that, A slot (16) is provided between the shuttle insert (13) and the shuttle (1).

4. A novel operating shuttle compatible with multiple ICs according to claim 1, characterized in that, The inner side of the shuttle insert (13) is threaded with four third hexagon socket screws (12), and the lower end of the third hexagon socket screws (12) is provided with a positioning pin (6). The outer side of the positioning pin (6) is threaded with a first hexagon socket screw (7), and a limit slot (15) is provided between the third hexagon socket screws (12) and the shuttle insert (13).

5. A novel operating shuttle compatible with multiple ICs according to claim 4, characterized in that, A buffer spring (11) is fitted on the outside of the third internal hex screw (12).

6. A novel operating shuttle compatible with multiple ICs according to claim 1, characterized in that, Two screws (3) are symmetrically arranged on the upper end of the shuttle (1). A flat washer (4) is fitted on the outside of the screw (3). A compression spring (5) is compressed at the lower end of the flat washer (4). The lower end of the compression spring (5) is in close contact with the inside of the shuttle (1).

7. A novel operating shuttle compatible with multiple ICs according to claim 1, characterized in that, The inner side of the hard top post (8) is symmetrically threaded with two second internal hexagon screws (9), and the second internal hexagon screws (9) and the feed shuttle (1) are threaded together.

8. A novel operating shuttle compatible with multiple ICs according to claim 7, characterized in that, The second internal hex screw (9) has a washer (10) on its outer side.

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