A ceramic plate hole filling electroplating device

Abstract

The utility model relates to the technical field of ceramic plate hole filling electroplating, and specifically discloses a ceramic plate hole filling electroplating device. The ceramic plate hole filling electroplating device comprises a groove body provided with an opening on the top surface, an anode plate, an anode plate fixing assembly, two ceramic plate hangers and a driving assembly; the anode plate is located in the groove body and is connected with the groove body through the anode plate fixing assembly; the two ceramic plate hangers are arranged on the two sides of the anode plate and can be slidably connected with the groove body in a direction parallel to the anode plate; the driving assembly drives the two ceramic plate hangers to reciprocally move relative to the groove body. The ceramic plate hole filling electroplating device can improve the efficiency and effect of hole filling electroplating, and has a simple structure and low cost.

Description

Technical Field

[0001] This utility model relates to the field of ceramic plate hole-filling electroplating technology, and in particular to a ceramic plate hole-filling electroplating device. Background Technology

[0002] Because ceramics possess excellent thermal conductivity, heat resistance, and insulation properties, as well as a low coefficient of thermal expansion and good chemical stability, ceramic plates are used as packaging substrates. In the fabrication of ceramic circuit boards, a via-filling electroplating technique is typically employed to fill the vias of the ceramic plate with conductive material to achieve the connection between the various circuit layers.

[0003] Patent CN221588731U discloses a ceramic via-filling electroplating apparatus based on HTCC, which uses a horizontal nozzle assembly and a vertical nozzle assembly to perform horizontal and vertical via-filling electroplating on the workpiece. However, since spray electroplating is mostly used to achieve high-speed local deposition, it is not suitable for via-filling electroplating of ceramic plates with large coverage areas, and the production cost is relatively high. Summary of the Invention

[0004] The purpose of this invention is to provide a ceramic plate hole-filling electroplating device that can improve the efficiency and effect of hole-filling electroplating, and has a simple structure and low cost.

[0005] To achieve this objective, the present invention adopts the following technical solution: A ceramic plate hole-filling electroplating apparatus includes a tank with an opening on the top surface, an anode plate, an anode plate fixing assembly, two ceramic plate hangers, and a drive assembly. The anode plate is located in the tank and is connected to the tank via the anode plate fixing assembly; two ceramic plate hangers are respectively disposed on both sides of the anode plate and can slide to connect to the tank in a direction parallel to the anode plate; the driving assembly drives the two ceramic plate hangers to reciprocate relative to the tank.

[0006] Furthermore, the anode plate fixing assembly includes a copper plate and two oppositely arranged connecting plates, with both ends of the copper plate respectively snapped into slots opened on the top surface of the connecting plates; the connecting plates are connected to the groove body; and the anode plate is connected to the copper plate.

[0007] Furthermore, the slot is narrower at the top and wider at the bottom.

[0008] Furthermore, the ceramic plate hanger includes a sliding rod and a hanger body connected to the sliding rod for fixing the ceramic plate; the sliding rod is slidably connected to the groove, and the same end of the two sliding rods is connected to the drive assembly, while the other end is in rolling contact with a support assembly disposed on the outside of the groove.

[0009] Furthermore, the hanger body has a connecting ear sleeved on the sliding rod, and the connecting ear is locked to the sliding rod by a locking member.

[0010] Furthermore, the driving assembly includes an L-shaped sliding plate and a driving component. The sliding plate is slidably connected to the groove, and the driving component drives the sliding plate to slide relative to the groove. The same end of the two sliding rods is connected to the sliding plate.

[0011] Furthermore, the sliding plate has two elongated adjustment holes, and one sliding rod is located in one of the adjustment holes; guide holes corresponding to the adjustment holes are provided on both opposite sides of the groove; the sliding rod is slidably disposed in the two corresponding guide holes.

[0012] Furthermore, the supporting assembly includes a connecting shaft and two guide supports sleeved on the connecting shaft; both ends of the connecting shaft are connected to the groove, and the guide supports are coaxially connected to the connecting shaft through rolling bearings.

[0013] Furthermore, a limiting groove is formed on the outer periphery of the guide support member in the circumferential direction, and the sliding rod is located in the limiting groove.

[0014] Furthermore, the side of the tank is provided with a water outlet that communicates with the inside of the tank, and the water outlet is connected to a circulating water pump, the outlet of which is connected to the inside of the tank.

[0015] The beneficial effects of this utility model are as follows: The ceramic plate filling electroplating device of this utility model uses an anode plate fixing assembly to fix the anode plate and a ceramic plate hanger to fix the ceramic plate to be processed. During the electroplating process, the driving assembly drives the two ceramic plate hangers to move back and forth relative to the tank, which can drive the ceramic plate to move back and forth, so that the electroplating position of the ceramic plate continuously contacts the new plating solution, thereby improving the efficiency and effect of filling electroplating. Moreover, the device has a simple structure and low cost. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a ceramic plate hole-filling electroplating device provided by this utility model.

[0017] Figure 2 This is a structural diagram of the connecting plate.

[0018] Figure 3 This is a structural diagram of the supporting component. Detailed Implementation

[0019] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0020] like Figures 1 to 3 As shown, a ceramic plate hole-filling electroplating device includes a tank 1 with an opening on the top surface, an anode plate 2, an anode plate fixing assembly 3, two ceramic plate hangers 4, and a driving assembly 5. The anode plate 2 is located inside the tank 1 and is connected to the tank 1 through the anode plate fixing assembly 3. The two ceramic plate hangers 4 are respectively disposed on both sides of the anode plate 3 and can slide and connect to the tank 1 in a direction parallel to the anode plate 3. The driving assembly 5 can drive the two ceramic plate hangers 4 to move back and forth relative to the tank 1.

[0021] Specifically, in this embodiment, the anode plate fixing assembly 3 includes a copper plate 31 and two oppositely arranged connecting plates 32. The two ends of the copper plate 31 are respectively engaged in slots 321 formed on the top surface of the connecting plates 32; the connecting plates 32 are connected to the groove 1; and the anode plate 2 is connected to the copper plate 31. The material of the anode plate 2 can be selected as needed.

[0022] Preferably, the slot 321 is narrower at the top and wider at the bottom. The minimum width of the slot 321 is slightly less than the thickness of the copper plate 31, and the maximum width of the slot 321 is equal to the thickness of the copper plate 31, to ensure a stable connection of the copper plate 31. Furthermore, an insulating layer can be provided on the inner surface of the slot 321 to ensure safety.

[0023] In this embodiment, the ceramic plate hanger 4 includes a sliding rod 41 and a hanger body 42 connected to the sliding rod 41 and used to fix the ceramic plate. The sliding rod 41 is slidably connected to the groove 1, and the same end of the two sliding rods 41 is connected to the drive assembly 5, while the other end is in rolling contact with the support assembly 6 disposed on the outside of the groove 1.

[0024] The hanger body 42 has a connecting lug that is sleeved on the sliding rod 41, and the connecting lug is locked to the sliding rod 41 by a locking member. In this embodiment, the locking member is preferably a locking screw.

[0025] In this embodiment, the driving assembly 5 includes an L-shaped sliding plate 51 and a driving component. The sliding plate 51 is slidably connected to the groove 1, and the driving component drives the sliding plate 51 to slide relative to the groove 1. The same end of the two sliding rods 41 is connected to the sliding plate 51. In this embodiment, the driving component is preferably a cylinder.

[0026] Furthermore, the sliding plate 51 has two elongated adjustment holes 52, and a sliding rod 41 is located in one adjustment hole 52; guide holes 11 corresponding to the adjustment holes 52 are provided on both opposite sides of the groove 1; the sliding rod 41 is slidably disposed in the corresponding two guide holes 11.

[0027] In this embodiment, the supporting component 6 includes a connecting shaft 61 and two guide supports 62 sleeved on the connecting shaft 61; wherein, the two ends of the connecting shaft 61 are connected to the groove 1, and the guide supports 62 are coaxially connected to the connecting shaft 61 through rolling bearings 63.

[0028] Furthermore, a limiting groove 621 is formed on the outer periphery of the guide support 62 in the circumferential direction, and the sliding rod 41 is located in the limiting groove 621.

[0029] In this embodiment, a water outlet 12 communicating with the interior of the tank 1 is provided on the side of the tank body 1. The water outlet 12 is connected to a circulating water pump. The outlet of the circulating water pump is connected to the interior of the tank body 1 through a first pipe to circulate the plating solution in the tank body 1, thereby improving the fluidity of the plating solution in the tank body 1 and reducing the temperature of the plating solution. A positioning plate 7 is provided on the tank body 1 for positioning and placing the first pipe.

[0030] Furthermore, the mounting body 42 is provided with a connecting channel that communicates with the through hole of the ceramic plate on which it is hung. This connecting channel is connected to the water inlet of the circulating water pump through a second pipe to promote the circulation of plating solution in the through hole of the ceramic plate and improve the efficiency of hole-filling electroplating.

[0031] This utility model discloses a ceramic plate hole-filling electroplating device. In use, an anode plate fixing assembly 3 fixes an anode plate 2, and a ceramic plate hanger 4 fixes the ceramic plate to be processed. During the electroplating process, a driving assembly 5 drives the two ceramic plate hangers 4 to reciprocate relative to the tank 1, thereby causing the ceramic plate to reciprocate and continuously contact the electroplating position of the ceramic plate with new plating solution. As a result, the device has high processing efficiency, good hole-filling electroplating effect, simple structure, and low cost.

[0032] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A ceramic plate hole-filling electroplating apparatus, characterized in that, It includes a tank (1) with an opening on the top surface, an anode plate (2), an anode plate fixing assembly (3), two ceramic plate hangers (4), and a drive assembly (5); The anode plate (2) is located inside the tank (1) and is connected to the tank (1) through the anode plate fixing assembly (3); the two ceramic plate hangers (4) are respectively disposed on both sides of the anode plate (2) and can slide to connect to the tank (1) in a direction parallel to the anode plate (2); the driving assembly (5) drives the two ceramic plate hangers (4) to move back and forth relative to the tank (1).

2. The ceramic plate hole-filling electroplating apparatus according to claim 1, characterized in that, The anode plate fixing assembly (3) includes a copper plate (31) and two connecting plates (32) arranged opposite to each other. The two ends of the copper plate (31) are respectively snapped into the slots (321) opened on the top surface of the connecting plate (32); the connecting plate (32) is connected to the groove (1); the anode plate (2) is connected to the copper plate (31).

3. The ceramic plate hole-filling electroplating apparatus according to claim 2, characterized in that, The slot (321) is narrower at the top and wider at the bottom.

4. The ceramic plate hole-filling electroplating apparatus according to claim 1, characterized in that, The ceramic plate hanger (4) includes a sliding rod (41) and a hanger body (42) connected to the sliding rod (41) and used to fix the ceramic plate; the sliding rod (41) is slidably connected to the groove (1), and the same end of the two sliding rods (41) is connected to the drive assembly (5), and the other end is in rolling contact with the support assembly (6) located on the outside of the groove (1).

5. The ceramic plate hole-filling electroplating apparatus according to claim 4, characterized in that, The hanging body (42) has a connecting ear sleeved on the sliding rod (41), and the connecting ear is locked to the sliding rod (41) by a locking member.

6. The ceramic plate hole-filling electroplating apparatus according to claim 4, characterized in that, The drive assembly (5) includes an L-shaped sliding plate (51) and a drive member. The sliding plate (51) is slidably connected to the groove (1), and the drive member drives the sliding plate (51) to slide relative to the groove (1). The same end of the two sliding rods (41) is connected to the sliding plate (51).

7. The ceramic plate hole-filling electroplating apparatus according to claim 6, characterized in that, The sliding plate (51) has two elongated adjustment holes (52), and one sliding rod (41) is located in one of the adjustment holes (52); the two opposite sides of the groove (1) are provided with guide holes (11) corresponding to the adjustment holes (52); the sliding rod (41) is slidably disposed in the two corresponding guide holes (11).

8. The ceramic plate hole-filling electroplating apparatus according to claim 4, characterized in that, The supporting component (6) includes a connecting shaft (61) and two guide supports (62) sleeved on the connecting shaft (61); the two ends of the connecting shaft (61) are connected to the groove (1), and the guide supports (62) are coaxially connected to the connecting shaft (61) through rolling bearings (63).

9. The ceramic plate hole-filling electroplating apparatus according to claim 8, characterized in that, The guide support (62) has a circumferential groove (621) on its outer periphery, and the sliding rod (41) is located in the circumferential groove (621).

10. The ceramic plate hole-filling electroplating apparatus according to claim 1, characterized in that, The side of the tank (1) is provided with a water outlet (12) that communicates with the inside of the tank (1). The water outlet (12) is connected to a circulating water pump, and the water outlet of the circulating water pump is connected to the inside of the tank (1).

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