Adjustable overflow valve for semiconductor vacuum equipment

Abstract

The utility model discloses a kind of overflow valves of adjustable semiconductor vacuum equipment, including valve body and the bonnet of setting in the air outlet side of valve body, further include with the bonnet fixed connection adjusting screw, with the adjusting screw thread cooperation adjusting nut, and compression spring;Adjusting screw rotatably installed on valve body, the limiting structure that is limited adjusting nut rotation is equipped in valve body, compression spring is arranged between adjusting nut and valve body;By rotating adjusting screw, the adjusting nut of being limited rotation is driven axial movement, change the compression amount of compression spring, realize the regulation of overflow valve opening pressure.The utility model integrates the valve body structure of screw nut anti-following rotation adjusting mechanism and optimized air passage design, solve the technical problem that traditional overflow valve cannot be accurately and reliably regulated opening pressure on site.

Description

Technical Field

[0001] This utility model belongs to the field of vacuum chamber pressure control technology in semiconductor production, and particularly relates to an overflow valve for adjustable semiconductor vacuum equipment. Background Technology

[0002] Traditional relief valves cannot precisely adjust the opening pressure when used in semiconductor vacuum equipment, resulting in a large deviation in the opening pressure during actual operation.

[0003] In the field of semiconductor vacuum equipment, overflow valves are used to control the pressure of vacuum pipelines and ensure system stability. Traditional overflow valves present challenges in adjusting the opening pressure: firstly, the lack of a user-operable dynamic adjustment mechanism makes it impossible to precisely adjust the opening pressure on-site in semiconductor vacuum equipment; secondly, their adjustment accuracy relies on pre-set components, making it difficult to achieve minute calibration at the 1 torr level. This results in large deviations in the opening pressure of the overflow valve under actual operating conditions, making it unsuitable for high-precision vacuum environments. Summary of the Invention

[0004] Purpose of the invention: In order to overcome the shortcomings of the existing technology, this utility model provides an adjustable overflow valve for semiconductor vacuum equipment, which integrates a screw and nut anti-rotation adjustment mechanism and an optimized airflow channel design valve body structure, solving the technical problem that traditional overflow valves cannot be precisely and reliably adjusted on-site for opening pressure.

[0005] Technical solution: To achieve the above objectives, this utility model provides an adjustable overflow valve for semiconductor vacuum equipment, comprising a valve body and a valve cover disposed on the outlet side of the valve body, and further comprising an adjusting screw fixedly connected to the valve cover, an adjusting nut threadedly engaged with the adjusting screw, and a compression spring.

[0006] The adjusting screw is rotatably mounted on the valve body, and the valve body is provided with a limiting structure to restrict the rotation of the adjusting nut. The compression spring is disposed between the adjusting nut and the valve body.

[0007] The opening pressure of the relief valve is adjusted by rotating the adjusting screw to drive the axial movement of the adjusting nut, which is restricted from rotation.

[0008] Furthermore, a self-lubricating bushing is provided between the adjusting screw and the valve body, and the adjusting screw passes through the self-lubricating bushing and can rotate circumferentially and slide axially relative to the valve body.

[0009] Furthermore, the limiting structure is a hexagonal stroke groove formed in the valve body, and the adjusting nut is a hexagonal nut that mates with the hexagonal stroke groove.

[0010] Furthermore, the valve body is provided with a through-hole airflow channel, which extends along the axial direction of the valve body, and the outlet end of the through-hole airflow channel corresponds to the valve cover.

[0011] Furthermore, the hexagonal stroke groove is located at the center of the valve body, and several through-hole airflow channels are arranged in a circular array around the hexagonal stroke groove.

[0012] Furthermore, a polytetrafluoroethylene gasket is provided between the adjusting nut and the compression spring.

[0013] Furthermore, an O-ring is provided at the mating surface between the valve cover and the valve body.

[0014] Furthermore, it also includes a filter module, which includes a filter screen and a retaining spring, wherein the filter screen is fixed to the air inlet of the valve body by the retaining spring.

[0015] Beneficial effects: This utility model drives the axial movement of the limited nut by rotating the adjusting screw, directly and linearly changing the compression amount of the compression spring, thereby realizing the continuous and adjustable opening pressure, solving the technical problem that traditional overflow valves cannot accurately and reliably adjust the opening pressure on site. Attached Figure Description

[0016] Figure 1 This is a half-sectional structural diagram of the overflow valve of this utility model;

[0017] Figure 2 This is a schematic diagram of the valve body of the overflow valve of this utility model. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings.

[0019] like Figure 1 As shown, an adjustable overflow valve for semiconductor vacuum equipment includes a valve body 1 and a valve cover 2 disposed on the outlet side of the valve body 1. It also includes an adjusting screw 3 fixedly connected to the valve cover 2, an adjusting nut 4 threadedly engaged with the adjusting screw 3, and a compression spring 5. The adjusting screw 3 is rotatably mounted on the valve body 1. A limiting structure restricting the rotation of the adjusting nut 4 is provided inside the valve body 1. The compression spring 5 is disposed between the adjusting nut 4 and the valve body 1. By rotating the adjusting screw 3, the limited-rotation adjusting nut 4 is driven to move axially, changing the compression of the compression spring 5 and thus adjusting the opening pressure of the overflow valve. By rotating the adjusting screw 3 to drive the limited-rotation nut 4 to move axially, the compression of the compression spring 5 is directly and linearly changed, thereby achieving continuous and adjustable opening pressure. This solves the technical problem that traditional overflow valves cannot precisely and reliably adjust the opening pressure on-site.

[0020] The general operating principle is as follows: when the pressure exceeds 760 torr (standard atmospheric pressure) and reaches the design opening pressure of 770-900 torr, the valve cover 2 controlled by the compression spring 5 is automatically opened by air to relieve pressure. Moreover, through the rotatable adjusting screw 3 with valve cover 2, the tension of the compression spring can be manually and precisely adjusted, and the starting pressure threshold can be continuously fine-tuned, solving the technical pain point of traditional relief valves being difficult to adjust precisely and reliably.

[0021] The more specific adjustment principle is as follows:

[0022] Clockwise rotation: increases spring compression → increases tension → raises the takeoff pressure threshold.

[0023] Rotating counterclockwise: reduces spring compression → reduces tension → lowers the takeoff pressure threshold.

[0024] Adjustment precision: 1 torr unit for fine adjustment. This is achieved by matching the screw thread pitch with the spring constant. Specifically, the thread of the adjusting screw 3 is a fine thread, which allows for more precise fine adjustment.

[0025] A self-lubricating bushing 6 is provided between the adjusting screw 3 and the valve body 1. The adjusting screw 3 passes through the self-lubricating bushing 6 and can rotate circumferentially and slide axially relative to the valve body 1, thereby significantly reducing the friction between the adjusting screw 3 and the valve body 1, making the rotation operation more effortless and smoother, and the valve cover 2 opening and closing more sensitively, avoiding wear and improving service life.

[0026] It is worth noting that, such as Figure 2 As shown, the limiting structure is a hexagonal stroke groove 7 formed in the valve body 1, and the adjusting nut is a hexagonal nut that cooperates with the hexagonal stroke groove 7. This effectively and reliably restricts the circumferential rotation of the adjusting nut 4, ensuring that the rotational motion of the adjusting screw 3 can be completely converted into the pure axial movement of the adjusting nut 4, preventing adjustment inaccuracies caused by rotation, and is a key structural guarantee for achieving precise adjustment.

[0027] like Figure 1 and Figure 2 As shown, the valve body 1 is provided with a through-hole airflow channel 8, which extends along the axial direction of the valve body 1, and the outlet end of the through-hole airflow channel 8 corresponds to the valve cover 2, providing a clear and unobstructed low-resistance pressure relief path. This ensures that when the pressure exceeds the limit, the airflow can quickly push open the valve cover 2 through the through-hole airflow channel 8 to relieve pressure, thus ensuring the response speed and pressure relief efficiency of the overflow valve.

[0028] More specifically, the hexagonal stroke groove 7 is located at the center of the valve body 1, and several through-hole airflow channels 8 are arranged in a circular array around the hexagonal stroke groove 7, which realizes the balance of the internal structure of the valve body, makes the airflow distribution uniform, avoids local eddies or pressure unevenness, and at the same time ensures the strength and functionality of the valve body.

[0029] A polytetrafluoroethylene gasket 9 is provided between the adjusting nut 4 and the compression spring 5, which eliminates hard contact between metals, provides good sealing and stress buffering, prevents wear of the end face of the compression spring 5 by the adjusting nut 4 during the adjustment process, and ensures smoother and more accurate pressure transmission.

[0030] The valve body 1 has different diameter reducing flanges 10 at its inlet and outlet, which enhances adaptability and allows the valve body to be easily connected to vacuum pipelines of different diameters, thus expanding its application range. The inlet (inlet side) of the valve body 1 is connected to the vacuum pipeline, and the outlet (outlet side) of the valve body 1 is on the atmospheric side.

[0031] An O-ring 11 is provided at the mating surface between the valve cover 2 and the valve body 1 to provide a static seal, ensuring reliable isolation between the inside of the valve body and the atmospheric environment under non-pressure relief conditions, and maintaining the sealing performance of the vacuum system.

[0032] At the mating surface between valve cover 2 and valve body 1, the sealing structure can be further optimized. For example, a double-seal structure can be adopted, consisting of a main O-ring on the inner side and a secondary O-ring on the outer side, thereby further improving sealing performance and enhancing leak prevention. When valve cover 2 is closed, an annular sealed cavity, i.e., an annular leak detection cavity, is naturally formed between the two sealing rings. This annular leak detection cavity can be equipped with an interface for connecting to an external leak detector via a gas duct. This design creates a redundant safety barrier in its construction. Even if the main sealing ring fails due to long-term use, the secondary sealing ring can still provide an effective seal, significantly improving the safety and reliability of the product. At the same time, by monitoring the pressure or gas composition in the annular leak detection cavity with a leak detector, online diagnosis and early warning of the sealing status of the main sealing ring can be achieved, facilitating timely maintenance by users. This transforms safety protection from post-event handling to pre-event prevention, greatly improving the convenience and safety of equipment operation and maintenance.

[0033] This utility model also includes a filter module, which includes a filter screen 12 and a retaining spring 13. The filter screen 12 is fixed to the air inlet of the valve body 1 by the retaining spring 13, which intercepts particulate contaminants in the vacuum pipeline from the source, prevents them from entering the valve body cavity, avoids scratches, blockages or affecting the operation of the regulating mechanism and the resulting pressure drift, thereby improving the working reliability and life of the entire relief valve.

[0034] This utility model also has the following advantages:

[0035] (1) Ease of operation: On-site engineers only need a hex wrench to make on-site adjustments without disassembling or replacing parts.

[0036] (2) Precision control: 1 torr level threshold adjustment to meet the vacuum stability requirements of semiconductor process (±0.1% accuracy).

[0037] (3) Improved reliability: The anti-rotation design reduces component wear and extends service life.

[0038] (4) Self-lubricating bushings reduce metal friction and are suitable for high-frequency adjustment.

[0039] (5) Compatibility: It is compatible with various vacuum chambers (single chamber 1 valve) and cryogenic pump regeneration systems (single pump 2 valves).

[0040] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. An adjustable overflow valve for a semiconductor vacuum device, comprising a valve body (1) and a valve cover (2) disposed on the outlet side of the valve body (1), characterized in that: It also includes an adjusting screw (3) fixedly connected to the valve cover (2), an adjusting nut (4) threadedly engaged with the adjusting screw (3), and a compression spring (5); The adjusting screw (3) is rotatably mounted on the valve body (1). The valve body (1) is provided with a limiting structure to restrict the rotation of the adjusting nut (4). The compression spring (5) is located between the adjusting nut (4) and the valve body (1). By rotating the adjusting screw (3), the adjusting nut (4) whose rotation is restricted is driven to move axially, thereby changing the compression amount of the compression spring (5) and realizing the adjustment of the opening pressure of the relief valve.

2. The adjustable overflow valve for semiconductor vacuum equipment according to claim 1, characterized in that: A self-lubricating bushing (6) is provided between the adjusting screw (3) and the valve body (1). The adjusting screw (3) passes through the self-lubricating bushing (6) and can rotate circumferentially and slide axially relative to the valve body (1).

3. The adjustable overflow valve for semiconductor vacuum equipment according to claim 1, characterized in that: The limiting structure is a hexagonal stroke groove (7) formed in the valve body (1), and the adjusting nut is a hexagonal nut that cooperates with the hexagonal stroke groove (7).

4. The adjustable overflow valve for semiconductor vacuum equipment according to claim 3, characterized in that: The valve body (1) is provided with a through hole airflow channel (8), which extends along the axial direction of the valve body (1), and the outlet end of the through hole airflow channel (8) corresponds to the valve cover (2).

5. The adjustable overflow valve for semiconductor vacuum equipment according to claim 4, characterized in that: The hexagonal stroke groove (7) is located at the center of the valve body (1), and several through-hole airflow channels (8) are arranged in a circular array around the hexagonal stroke groove (7).

6. The overflow valve for an adjustable semiconductor vacuum device according to claim 1, characterized in that: A polytetrafluoroethylene gasket (9) is provided between the adjusting nut (4) and the compression spring (5).

7. The adjustable overflow valve for semiconductor vacuum equipment according to claim 1, characterized in that: An O-ring (11) is provided at the joint surface between the valve cover (2) and the valve body (1).

8. The overflow valve for an adjustable semiconductor vacuum device according to claim 1, characterized in that: It also includes a filter module, which includes a filter screen (12) and a retaining ring (13). The filter screen (12) is fixed to the air inlet of the valve body (1) by the retaining ring (13).

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