Briquettes with phase change thermal conduction structure and electronic component testing apparatus

Abstract

A kind of compression block with phase change heat conduction structure and electronic component testing equipment with the compression block, electronic component testing equipment further includes down pressure generating device, temperature control module, test seat and controller, compression block includes block, liquid transport structure and phase change fluid, block includes vacuum chamber and multiple support columns, support column is arranged in vacuum chamber, and the two ends of each support column are respectively supported in the opposite inner surface in vacuum chamber, liquid transport structure is arranged on the inner surface of vacuum chamber and multiple support columns, temperature control module is arranged between down pressure generating device and compression block, in response to block heating, phase change fluid occurs first phase change at high temperature side and second phase change at low temperature side, controller controls down pressure generating device and drives compression block to contact and apply down pressure to electronic component in test seat.

Description

Technical Field

[0001] The invention relates to a pressure block for applying pressure and temperature control, particularly to a pressure block with a phase change heat conduction structure, and to an electronic component testing device incorporating the pressure block. Background Technology

[0002] With the rapid evolution of semiconductor manufacturing technology, the functionality and computing power of individual chips continue to improve, further driving the widespread application of high-density interconnect packaging technologies (such as CoWoS, Fan-Out, MCM / SiP, etc.). Under this trend, the area and number of contacts on chips have increased significantly. For example, the area of ​​some high-end processing chips has exceeded 100 square centimeters, and the number of contacts (or microbumps) on them can reach thousands or even tens of thousands.

[0003] During chip mass production or design verification, functional and performance testing is typically performed using chip testing equipment. To ensure that the chip can form a stable and low-impedance electrical contact with the miniature spring probes inside the test socket, vertical pressure must be applied from above to evenly press each chip contact onto the probes. This pressure is usually provided by a pressure block positioned above the chip and driven by a pressure testing mechanism, causing the pressure block to press the chip downwards.

[0004] Existing pressure blocks are mostly made of metal materials with high thermal conductivity (such as copper or aluminum) and are solid in structure. This design is mainly due to the fact that the pressure block needs to withstand the vertical load from the testing equipment, especially when dealing with large-sized chips. To ensure uniform pressure across the entire area, the total pressure applied often reaches hundreds of kilograms. Therefore, the pressure block must have excellent mechanical strength and hardness to prevent deformation, bending, or cracking.

[0005] Besides its mechanical support function, the chip clamp also plays a role in thermal management. Since the clamp directly contacts the chip surface, it serves as a thermal interface for heating or cooling, used for chip temperature control to simulate real-world operating environments or prevent chip overheating during testing. However, with increasing pressure resistance, traditional chip clamps have had to be thickened or enlarged in their structural design to maintain sufficient rigidity and support. This leads to an increase in the clamp's thermal mass, thereby reducing its thermal response rate and conduction efficiency. Furthermore, the heat diffusion effect of a solid metal structure is limited. When localized hot spots exist on the chip surface, the solid metal clamp cannot quickly achieve uniform temperature, potentially causing overheating in high-temperature areas and affecting the accuracy and reliability of the test.

[0006] Especially with the increasing prevalence of advanced packaging technologies, the internal functional modules of chips are becoming more densely distributed and non-homogeneous, making localized power consumption concentrations more pronounced. Therefore, improving the thermal response rate and temperature uniformity of the compaction block while meeting high mechanical strength requirements has become a major challenge for existing technologies. Utility Model Content

[0007] In view of this, in some embodiments, a press block with a phase change heat conduction structure is provided, comprising a block body, a liquid transport structure, and a phase change fluid. The block body includes a vacuum chamber and a plurality of support columns. The support columns are disposed in the vacuum chamber, and the two ends of each support column respectively abut against the opposite inner surfaces of the vacuum chamber. The liquid transport structure is disposed on the inner surface of the vacuum chamber and the plurality of support columns. The phase change fluid is disposed in the vacuum chamber. In response to the high-temperature side of the block being heated, the phase change fluid absorbs heat and undergoes a first phase change. The phase change fluid moves to the low-temperature side of the block by convection, releases heat energy and undergoes a second phase change, and then flows back to the high-temperature side through the liquid transport structure.

[0008] In one embodiment of the above-mentioned press block with phase change heat conduction structure, the block body includes a closed bottom frame and a support cover. The closed bottom frame includes an inner ring frame, and the support cover includes an outer ring flange. When the support cover is closed on the closed bottom frame, the outer ring flange abuts against the inner ring frame, and the plurality of support columns abut against the support cover.

[0009] In one embodiment of the pressure block with the phase change heat conduction structure described above, the closed bottom frame includes a columnar extension; the support cover includes a through hole; when the support cover is closed on the closed bottom frame, the columnar extension passes through the through hole; the columnar extension has a temperature sensing channel for accommodating a temperature sensor.

[0010] In one embodiment of the above-mentioned press block with phase change heat conduction structure, a heat-conducting plate and a plurality of heat exchange plates are further included. The heat-conducting plate is disposed on the low-temperature side of the block, and the plurality of heat exchange plates are disposed on the heat-conducting plate.

[0011] In some embodiments, an electronic component testing device is provided, including a pressure generating device, a pressure block with a phase change heat conduction structure, a temperature control module, a test seat, and a controller. The pressure block with the phase change heat conduction structure is connected to the pressure generating device. The pressure block includes a block body, a liquid transport structure, and a phase change fluid. The block body includes a vacuum chamber and multiple support columns. The multiple support columns are disposed within the vacuum chamber, and the two ends of each support column respectively abut against opposite inner surfaces within the vacuum chamber. The liquid transport structure is disposed on the inner surface of the vacuum chamber. The phase change fluid is disposed within the vacuum chamber. The control module is located between the pressure generating device and the pressure block. The test seat corresponds to the pressure block and is suitable for housing electronic components. The controller is electrically connected to the pressure generating device, the temperature control module, and the test seat. The controller controls the pressure generating device to drive the pressure block to contact and apply downward pressure to the electronic components in the test seat. In response to the side of the block that contacts the electronic components being heated, the phase change fluid absorbs heat and undergoes a first phase change. It moves to the side of the block that is connected to the temperature control module by convection, releases heat energy and undergoes a second phase change, and then flows back to the side of the block that contacts the electronic components through the liquid transport structure.

[0012] In one embodiment of the above-mentioned electronic component testing equipment, the temperature control module includes a temperature-controlled fluid supply device and a temperature-controlled fluid chamber; the controller is electrically connected to the temperature-controlled fluid supply device to supply a temperature-controlled fluid to the temperature-controlled fluid chamber; the temperature-controlled fluid chamber is disposed between the pressure generating device and the pressure block.

[0013] In one embodiment of the above-mentioned electronic component testing equipment, the pressure block further includes a heat-conducting plate and a plurality of heat exchange plates. The heat-conducting plate serves as a side wall of the temperature-controlled fluid chamber, and the plurality of heat exchange plates are disposed on the heat-conducting plate and located within the temperature-controlled fluid chamber.

[0014] In one embodiment of the above-mentioned electronic component testing equipment, the block includes a closed bottom frame and a support cover. The closed bottom frame includes an inner ring frame, and the support cover includes an outer ring flange. When the support cover is closed on the closed bottom frame, the outer ring flange abuts against the inner ring frame, and the plurality of support columns abut against the support cover.

[0015] In one embodiment of the above-mentioned electronic component testing equipment, the closed bottom frame includes a columnar extension; the support cover includes a through hole; when the support cover is closed on the closed bottom frame, the columnar extension passes through the through hole; the columnar extension has a temperature sensing channel for accommodating a temperature sensor.

[0016] In one embodiment of the above-mentioned electronic component testing equipment, the liquid transport structure includes a first permeation structure and a second permeation structure; the first permeation structure is disposed in the vacuum chamber on the side adjacent to the temperature control module, and the second permeation structure is disposed in the vacuum chamber on the side adjacent to the electronic component; the first permeation structure includes a plurality of first pores, and the second permeation structure includes a plurality of second pores, wherein the diameter of the first pores is larger than the diameter of the second pores.

[0017] In summary, in some embodiments, dynamic thermal management is achieved through the gas-liquid phase change circulation mechanism of the phase change fluid in a closed vacuum chamber. The operating principle is as follows: when the electronic components generate heat, the phase change fluid in the high-temperature side absorbs latent heat and vaporizes, and then flows to the low-temperature side by density difference. After condensation and heat release, it accelerates backflow through the gradient capillary structure to form a self-sustaining heat conduction cycle. This innovative structure combines a support column matrix and a heterogeneous pore transport layer to simultaneously achieve (1) optimization of the two-way heat transfer path of the phase change fluid in a vacuum environment; (2) rapid fluid regeneration driven by capillary action; and (3) anti-deformation design with multi-point stress dispersion, thereby significantly reducing the heat transfer impedance and improving the overall thermal conductivity and structural stability of the press block. It effectively solves the problems of thermal saturation and mechanical fatigue of traditional solid press blocks, and has the substantial effect of improving the working stability of electronic components and extending the service life of equipment.

[0018] The following detailed description of the features and advantages of this utility model in the embodiments is sufficient to enable anyone skilled in the art to understand the technical content of this utility model and implement it accordingly. Based on the content disclosed in this specification, the scope of the patent application and the drawings, anyone skilled in the art can easily understand the related objectives and advantages of this utility model. Attached Figure Description

[0019] Figure 1 This is a perspective view of an electronic component testing device in some embodiments of the present invention.

[0020] Figure 2 The present invention is illustrated in some embodiments as a block diagram of an electronic component testing device.

[0021] Figure 3 This is a cross-sectional view of an electronic component testing device in some embodiments of the present invention.

[0022] Figure 4 This is a cross-sectional view of a pressure block with a phase change heat conduction structure in some embodiments of the present invention.

[0023] Figure 5 This is a perspective view of a pressure block with a phase change heat conduction structure in some embodiments of the present invention.

[0024] Figure 6This is a perspective view of the heat-conducting plate in a press block with a phase change heat conduction structure in some embodiments of the present invention.

[0025] The attached diagram is described as follows:

[0026] 1: Electronic component testing equipment

[0027] 10: Downward pressure generating device

[0028] 101: Actuator

[0029] 103: Fasteners

[0030] 20: Compactor with a phase change heat conduction structure

[0031] 201: Block

[0032] 202,204: Surface

[0033] 203: Liquid transport structure

[0034] 205: Phase Change Fluid

[0035] 207: Vacuum Chamber

[0036] 209: Support column

[0037] 211, 211a, 211b: Inner surface

[0038] 213: High Temperature Side

[0039] 215: Low Temperature Side

[0040] 217: Closed bottom frame

[0041] 219: Support Cover

[0042] 221: Inner Ring Frame

[0043] 223: Outer ring flange

[0044] 225: Columnar extension

[0045] 227: Through hole

[0046] 229: Temperature Sensing Channel

[0047] 230: Groove

[0048] 231: Heat-conducting plate

[0049] 233: Heat exchange plate

[0050] 235: First Permeation Structure

[0051] 237: Second Permeation Structure

[0052] 30: Temperature control module

[0053] 301: Temperature-controlled fluid supply device

[0054] 303: Temperature-controlled fluid chamber

[0055] 40: Test socket

[0056] 401: Compartment

[0057] 50: Controller

[0058] 60: Temperature sensor

[0059] C: Electronic Components

[0060] C1: Contact surface

[0061] C2: Electrical connection surface

[0062] L1: Plumb line

[0063] L2: Centerline Detailed Implementation

[0064] In some embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the electronic component testing equipment 1 includes a pressure generating device 10, a pressure block 20 (hereinafter referred to as pressure block 20) ​​with a phase change heat conduction structure, a temperature control module 30, a test seat 40, and a controller 50. The pressure block 20 is connected to the pressure generating device 10. The pressure block 20 includes a body 201, a liquid transfer structure 203, and a phase change fluid 205. The body 201 includes a vacuum chamber 207 and a plurality of support columns 209. Each support column 209 is disposed within the vacuum chamber 207, and the two ends of each support column 209 respectively abut against an opposing inner surface 211 within the vacuum chamber 207. The liquid transfer structure 203 is disposed on the inner surface 211 of the vacuum chamber 207. The phase change fluid 205 is disposed within the vacuum chamber 207. The temperature control module 30 is disposed between the pressure generating device 10 and the pressure block 20. The test seat 40 corresponds to the pressure block 20 and is adapted to accommodate an electronic component C. The controller 50 is electrically connected to the pressure generating device 10, the temperature control module 30, and the test socket 40. The controller 50 controls the pressure generating device 10 to drive the pressure block 20 to contact and apply pressure to the electronic components C in the test socket 40.

[0065] During testing of electronic component C, the high-temperature side 213 of block 201 is heated, and the phase change fluid 205 absorbs heat and undergoes a first phase change. The gaseous phase change fluid 205 moves to the low-temperature side 215 of block 201 by convection and releases heat energy, undergoing a second phase change. Finally, the liquid phase change fluid 205 flows back to the side of block 201 that contacts electronic component C (low-temperature side 215) through liquid transport structure 203, and this cycle continues.

[0066] To further explain, the heat transfer principle of the pressure block 20 mainly includes three stages: First stage, liquid evaporation: When the phase change fluid 205 absorbs heat from the electronic component C on the high-temperature side 213, a first phase change occurs, i.e., it changes from liquid to gas. This phase change process absorbs a large amount of heat, thus effectively carrying away the heat generated by the electronic component C. Second stage, vapor convection heat transfer: After evaporation, the phase change fluid 205 becomes gaseous. However, because the gaseous phase change fluid 205 has a lower density, it naturally rises, thus carrying heat away from the high-temperature side 213. Third stage, gaseous condensation: When the gaseous phase change fluid 205 rises and contacts the low-temperature side 215 (such as the inner top surface) of the vacuum chamber 207, the gaseous phase change fluid 205 transfers heat to the low-temperature side 215, cools down, and condenses into a liquid. At this time, the liquid phase change fluid 205 flows back to the vicinity of the low-temperature side 215 through the liquid transfer structure 203, forming a cycle and continuously carrying away heat.

[0067] The pressure generating device 10 can perform a pressure action according to a consistent actuation signal. When the pressure action is performed, the pressure generating device 10 can move toward the electronic component C within the test holder 40 to apply pressure evenly to the electronic component C. The actuation signal can be sent by the controller 50 to the pressure generating device 10 after the electronic component C is moved to the test holder 40. In some embodiments, such as Figure 1 As shown, the pressing trajectory of the pressure generating device 10 is located on a plumb line L1, which coincides with a center line L2 of the electronic component C. Therefore, when the pressure generating device 10 drives the pressure block 20 to contact the electronic component C, the pressure generating device 10 can apply downward pressure evenly to the electronic component C. In some embodiments, the pressure generating device 10 includes an actuator 101 and a fixing member 103. The actuator 101 can receive an actuation signal and perform a pressing action. The fixing member 103 connects the actuator 101 and the pressure block 20, so that when the actuator 101, in conjunction with the fixing member 103, performs a pressing action, the pressure block 20 can be made to contact the electronic component C evenly.

[0068] When the electronic component C is driven, the heat it generates can be conducted to the pressure block 20 to maintain the electronic component C within a suitable operating temperature range. The electronic component C can be, for example, but not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), an Application-Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), and a Tensor Processing Unit (TPU). The electronic component C has a contact surface C1 and an electrical connection surface C2. The contact surface C1 and the electrical connection surface C2 are located on opposite sides of the electronic component C. Therefore, when the electronic component C is placed on the test socket 40, the electrical connection surface C2 can be electrically connected to the test socket 40, and the pressure block 20 can contact the contact surface C1.

[0069] The block 201 and liquid transport structure 203 of the pressure block 20 are made of a material with high hardness and high thermal conductivity. The Vickers hardness (HV) of the block 201 can be between 130 and 190, and the thermal conductivity can be above 5000 W / mK (watts per meter per Kelvin). When the pressure block 20 contacts the electronic component C, the heat generated by the electronic component C can be conducted to the block 201 and the liquid transport structure 203. In some embodiments, the area of ​​a surface 202 of the block 201 that contacts the electronic component C is greater than or equal to the area of ​​the contact surface C1. Here, the block 201 can contact the entire contact surface C1, so that the heat generated by the electronic component C can be conducted to the pressure block 20 through the contact surface C1.

[0070] The phase change fluid 205 undergoes a first phase change upon heating at the high-temperature side 213, which can refer to the phase change fluid 205 changing from a liquid to a gaseous state. The phase change fluid 205 undergoes a second phase change upon releasing heat at the low-temperature side 215, which can refer to the phase change fluid 205 changing from a gaseous state to a liquid state. The phase change fluid 205 can be, for example, but not limited to, water, alcohols (such as methanol or ethanol), or acetone. The phase change fluid 205 can be circulated within the vacuum chamber 207 according to the operating temperature of the electronic component C, allowing for the two-phase change reaction between liquid and gaseous states, so that the heat energy generated by the electronic component C can be uniformly conducted to the bulk body 201.

[0071] A liquid transport structure 203 is disposed on the inner surface 211. When the phase change fluid 205 changes from a gaseous fluid to a liquid fluid, the liquid transport structure 203 can guide the liquid fluid to flow back to the high-temperature side 213 more quickly, thereby promoting the two-phase change cycle of the phase change fluid 205. The liquid transport structure 203 can be a sintered structure of metal powder. When the liquid fluid comes into contact with the sintered structure, the liquid fluid is guided to the high-temperature side 213 by the capillary action of the sintered structure. The sintered structure can be formed by first placing metal powder on the inner surface 211, and then sintering the metal powder to form a porous sintered structure that adheres to the inner surface 211. The liquid transport structure 203 can also be a microgroove, a metal mesh, or a fiber (such as metal fiber or non-metallic fiber with good thermal conductivity). For example, a metal mesh can be attached to the inner surface 211 or fibers can be sprayed and fixed to the inner surface 211.

[0072] The vacuum chamber 207 remains a closed space under negative pressure, with the internal pressure typically ranging from hundreds to thousands of Pascals (Pa). The high-temperature side 213 and the low-temperature side 215 are located on opposite sides of the vacuum chamber 207. For example... Figure 3 As shown, the high-temperature side 213 is located on the side of the block 201 that contacts the electronic component C, and the low-temperature side 215 is located on the side of the block 201 that connects to the temperature control module 30. Therefore, the high-temperature side 213, compared to the low-temperature side 215, contacts the electronic component C and is subjected to high temperatures when the electronic component C is operating; while the low-temperature side 215 is far from the electronic component C, thus forming a high-temperature side 213 and a low-temperature side 215 with a temperature difference.

[0073] The structural strength of the support column 209 can be determined by the downward pressure generated by the downward pressure generating device 10. That is, the structural strength of the support column 209 can withstand this downward pressure to prevent the block 201 from being deformed due to compression. For example, the two ends of the support column 209 extend towards the high temperature side 213 and the low temperature side 215, respectively, to support the opposing inner surfaces (211a, 211b) inside the vacuum chamber 207. When the downward pressure generating device 10 presses the pressure block 20 against the electronic component C, the two ends of the support column 209 support the inner surfaces (211a, 211b) to prevent the block 201 from being deformed due to compression.

[0074] In some embodiments, the support columns 209 may be evenly distributed within the vacuum chamber 207, so that each support column 209 can receive downward pressure evenly. Here, the support columns 209 may be arranged in a matrix within the vacuum chamber 207. The liquid transport structure 203 may also be disposed on the inner surface 211 of the vacuum chamber 207 and on each support column 209 to increase the area of ​​contact between the liquid fluid and the liquid transport structure 203.

[0075] The temperature control module 30 is used to regulate the overall temperature of the pressure block 20. Specifically, after the heat energy generated by the electronic component C is conducted to the pressure block 20, the pressure block 20 can then conduct the heat energy to the temperature control module 30 for heat exchange. In this way, the temperature control module 30 can maintain the temperature of the low-temperature side 215 lower than the temperature of the high-temperature side 213, so as to facilitate the two-phase change of the phase change fluid 205 between the high-temperature side 213 and the low-temperature side 215.

[0076] The test socket 40 has a receiving portion 401. An electronic component C is housed in the receiving portion 401, and its electrical connection surface C2 is electrically connected to the test socket 40. The contact surface C1 of the electronic component C may be exposed within the receiving portion 401, allowing the block 201 to contact the contact surface C1. Alternatively, the contact surface C1 of the electronic component C may not be exposed within the receiving portion 401, allowing the block 201 to contact the contact surface C1 within the circumferential area of ​​the receiving portion 401.

[0077] The controller 50 may be, for example, but not limited to, a central processing unit (CPU), a graphics processing unit (GPU), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), and a tensor processing unit (TPU). The controller 50 can generate an actuation signal when the electronic component C is placed on the test socket 40. The controller 50 can control the temperature control module 30 to adjust the temperature of the low-temperature side 215 based on the temperature of the low-temperature side 215.

[0078] In some embodiments, such as Figure 4 and Figure 5 As shown, the block 201 includes a closed bottom frame 217 and a support cover 219. The closed bottom frame 217 includes an inner ring frame 221, and the support cover 219 includes an outer ring flange 223. When the support cover 219 is closed on the closed bottom frame 217, the outer ring flange 223 abuts against the inner ring frame 221, and each support post 209 abuts against the support cover 219. Thus, in addition to the support posts 209 abutting against the support cover 219, the block 201 can also maintain the thickness of the pressure block 20 through the structure of the outer ring flange 223 and the inner ring frame 221. In some embodiments, the width of the inner ring frame 221 or the diameter of the support posts 209 can be increased or decreased according to actual needs.

[0079] In some embodiments, before the support cover 219 is fitted onto the closed bottom frame 217, metal powder can be first applied to the inner surface 211 and each support pillar 209 supporting the cover 219, and the metal powder is sintered to form a liquid transport structure 203. One side of the support cover 219 forms an inner surface 211b located on the high-temperature side 213, and the other side is used to contact the electronic component C. After the liquid transport structure 203 is sintered, the support cover 219 is fitted onto the closed bottom frame 217 and vacuum treatment is performed to form a vacuum chamber 207 between the closed bottom frame 217 and the support cover 219. In some embodiments, the closed bottom frame 217 has at least one connecting hole (not shown). After the support cover 219 is fitted onto the closed bottom frame 217, phase change fluid 205 can be filled through the connecting hole, and air can be extracted to form a vacuum state. The connecting hole is then sealed to form a vacuum chamber 207 that is normally in a vacuum state.

[0080] In some embodiments, the closed base frame 217 includes a columnar extension 225. The support cover 219 includes a through hole 227. When the support cover 219 is closed onto the closed base frame 217, the columnar extension 225 passes through the through hole 227. In some embodiments, the width of the columnar extension 225 (…) Figure 5 The length of the X-axis is substantially the same as the diameter of the through hole 227 to seal the gap between the columnar extension 225 and the through hole 227, thereby maintaining the airtightness of the vacuum chamber 207. In some embodiments, the gap between the columnar extension 225 and the through hole 227 may also be sealed by welding.

[0081] In some embodiments, such as Figure 4 and Figure 5 As shown, the columnar extension 225 has a temperature sensing channel 229. The temperature sensing channel 229 is used to house a temperature sensor 60. The temperature sensor 60 is used to contact the high-temperature side 213 to measure the temperature of the electronic component C. A portion of the temperature sensing channel 229 is disposed in the columnar extension 225, and another portion communicates with the outside of the block 201 from another surface 204 of the block 201. The temperature sensing channel 229 disposed on the surface 204 can be formed as a groove 230 (e.g., Figure 5 As shown, the temperature sensor 60 can be housed within this groove 230. When the block 201 is connected to the temperature control module 30, the temperature sensor 60 can avoid contact with the temperature control module 30, allowing the block 201 to make flat contact with the temperature control module 30.

[0082] In some embodiments, such as Figure 3As shown, the temperature control module 30 includes a temperature-controlled fluid supply device 301 and a temperature-controlled fluid chamber 303. The controller 50 is electrically connected to the temperature-controlled fluid supply device 301 to supply a temperature-controlled fluid to the temperature-controlled fluid chamber 303. The temperature-controlled fluid chamber 303 is located between the pressure generating device 10 and the pressure block 20. The temperature-controlled fluid can absorb the heat energy conducted from the pressure block 20 to the temperature control module 30 within the temperature-controlled fluid chamber 303. The temperature-controlled fluid can be, for example, water, alcohols (such as methanol or ethanol), or acetone. The temperature-controlled fluid supply device 301 can supply temperature-controlled fluid to the temperature-controlled fluid chamber 303 and force the temperature-controlled fluid to be discharged. Then, after the temperature-controlled fluid completes heat exchange outside the temperature control module 30, the temperature-controlled fluid supply device 301 inputs the cooled temperature-controlled fluid back into the temperature-controlled fluid chamber 303, repeating this cycle to control the temperature of the pressure block 20.

[0083] In some embodiments, such as Figure 6 As shown, the pressure block 20 also includes a heat-conducting plate 231 and multiple heat exchange plates 233. The heat-conducting plate 231 is disposed on the low-temperature side 215 of the block 201, serving as a side wall of the temperature-controlled fluid chamber 303 (which may refer to the side wall with the inner surface 211a). Multiple heat exchange plates 233 are disposed on the heat-conducting plate 231 and located within the temperature-controlled fluid chamber 303. The temperature control module 30 can be connected to the heat-conducting plate 231, so that the space between the temperature control module 30 and the heat-conducting plate 231 forms the temperature-controlled fluid chamber 303. The block 201 can conduct heat energy to the heat exchange plates 233. When the temperature-controlled fluid supply device 301 inputs temperature-controlled fluid into the temperature-controlled fluid chamber 303, the temperature-controlled fluid can exchange heat with the heat exchange plates 233, keeping the heat exchange plates 233 at a low temperature.

[0084] In some embodiments, such as Figure 4 As shown, the liquid transport structure 203 includes a first permeation structure 235 and a second permeation structure 237. The first permeation structure 235 is disposed within the vacuum chamber 207 adjacent to the side of the temperature control module 30 (low-temperature side 215), and the second permeation structure 237 is disposed within the vacuum chamber 207 adjacent to the side of the electronic component C (high-temperature side 213). The first permeation structure 235 includes a plurality of first pores, and the second permeation structure 237 includes a plurality of second pores. The diameter of these first pores is larger than the diameter of these second pores. The larger the pore size, the smaller the flow resistance; that is, the flow resistance of the first permeation structure 235 is smaller than that of the second permeation structure 237. Therefore, the flow resistance of the liquid fluid on the low-temperature side 215 is smaller than that on the high-temperature side 213, which can accelerate the return flow of the liquid fluid to the high-temperature side 213. Even if the thickness of the pressure block 20 is reduced, the efficiency of the two-phase change of the phase change fluid 205 in the vacuum chamber 207 can still be improved through the pore difference between the first permeation structure 235 and the second permeation structure 237.

[0085] To further explain, the second permeation structure 237 located on the high-temperature side 213, due to its small capillary radius, generates greater capillary pressure. This helps to rapidly draw the phase change fluid 205 back from the low-temperature side 215 to the high-temperature side 213 and promotes uniform liquid distribution on the high-temperature side 213, effectively improving evaporation efficiency and heat transfer performance. Additionally, the first permeation structure 235 located on the low-temperature side 215 has a larger capillary radius. Although its capillary force is smaller, its permeability is high, and its fluid flow resistance is low. This helps the condensed liquid to flow smoothly and quickly back to the high-temperature side 213, reducing pressure loss during liquid return.

[0086] In some embodiments, after the pressure block 20 contacts the electronic component C and drives the electronic component C, the temperatures of the high-temperature side 213 and the low-temperature side 215 are measured respectively and compared with those of a known solid pressure block. The comparison results are shown in Table (I) below, where the heat generated by the electronic component C is 20W and the measurement time is 0.5 seconds.

[0087] Table (1):

[0088]

[0089] As shown in Table (I), the temperature difference between the high-temperature side 213 and the low-temperature side 215 of the press block 20 with a phase change heat conduction structure according to certain embodiments is only 0.3°C, compared to the temperature difference of 0.88°C for a known solid press block, indicating that the overall thermal resistance of the system is extremely low. Furthermore, although the high-temperature side 213 and the low-temperature side 215 always maintain a certain temperature difference, this difference is quite small, sufficient to demonstrate excellent heat conduction efficiency and temperature uniformity. In addition, further measurements show that the temperatures of the upper surface (high-temperature side 213) and the lower surface (low-temperature side 215) located within the vacuum chamber 207 are 36.04°C and 36.09°C, respectively, with a temperature difference of only 0.05°C, indicating that the heat transfer effect achieved through phase change within the vacuum chamber 207 is extremely excellent.

[0090] In addition, regarding structural strength, one embodiment uses a C1100 alloy with a hardness (HV) greater than 100 and a tensile strength greater than 280 (N / mm²). 2 The maximum von Mises stress is 7.55 N / mm². 2 Furthermore, when the pressure block 20 is subjected to 100 kgf (2.8 kgf / cm²), 2 Under the downward pressure of ), the maximum deformation is 0.000232 mm, occurring at the four corners of the low-temperature side 215, while the low-temperature side 215 hardly deforms. Therefore, based on the above data, it can be seen that the structural strength of the pressure block 20 in this embodiment is also quite excellent.

[0091] In summary, in some embodiments, dynamic thermal management is achieved through the gas-liquid phase change circulation mechanism of the phase change fluid 205 in the closed vacuum chamber 207. The operating principle is as follows: when the electronic component C generates heat, the phase change fluid 205 in the liquid phase on the high-temperature side 213 absorbs latent heat and vaporizes, and then flows to the low-temperature side 215 by density difference. After condensation and heat release, it accelerates backflow through the gradient capillary structure to form a self-sustaining heat conduction cycle. This innovative structure combines the matrix of support columns 209 with the heterogeneous pore transport layer to simultaneously achieve (1) bidirectional heat transfer path optimization of the phase change fluid 205, (2) rapid fluid regeneration driven by capillary action, and (3) anti-deformation design with multi-point stress dispersion in a vacuum environment. This significantly reduces the heat transfer impedance and improves the overall heat conduction uniformity and structural stability of the press block. It effectively solves the problems of heat saturation and mechanical fatigue of traditional solid press blocks and has the substantial effect of improving the working stability of the electronic component C and extending the service life of the equipment.

[0092] Although the technical content of this utility model has been disclosed above with reference to preferred embodiments, it is not intended to limit this utility model. Any modifications and refinements made by those skilled in the art without departing from the spirit of this utility model should be included within the scope of this utility model. Therefore, the scope of protection of this utility model shall be determined by the appended claims.

Claims

1. A compressed block with a phase change heat conduction structure, characterized in that, include: A single body includes a vacuum chamber and a plurality of support columns; the plurality of support columns are disposed in the vacuum chamber, and the two ends of each support column respectively abut against an opposite inner surface of the vacuum chamber; A liquid transport structure is disposed on the inner surface of the vacuum chamber and on the plurality of support pillars; and A phase change fluid is disposed within the vacuum chamber; In response to the heating of a high-temperature side of the block, the phase change fluid absorbs heat and undergoes a first phase change. It then moves to a low-temperature side of the block by convection, releases heat energy, undergoes a second phase change, and flows back to the high-temperature side through the liquid transport structure.

2. The compact with a phase change heat conduction structure as described in claim 1, characterized in that, The block includes a closed bottom frame and a support cover. The closed bottom frame includes an inner ring frame, and the support cover includes an outer ring flange. When the support cover is closed on the closed bottom frame, the outer ring flange abuts against the inner ring frame, and the plurality of support columns abut against the support cover.

3. The press block with a phase change heat conduction structure as described in claim 2, characterized in that, The closed bottom frame includes a columnar extension; the support cover includes a through hole; when the support cover is closed on the closed bottom frame, the columnar extension passes through the through hole; the columnar extension has a temperature sensing channel for accommodating a temperature sensor.

4. The press block with a phase change heat conduction structure as described in claim 1, characterized in that, It also includes a heat-conducting plate and multiple heat exchange plates. The heat-conducting plate is disposed on the low-temperature side of the block, and the multiple heat exchange plates are disposed on the heat-conducting plate.

5. An electronic component testing device, characterized in that, include: A pressure generating device; A pressure block with a phase change heat conduction structure is connected to the pressure generating device; the pressure block includes: A single body includes a vacuum chamber and a plurality of support columns; the plurality of support columns are disposed in the vacuum chamber, and the two ends of each support column respectively abut against an opposite inner surface of the vacuum chamber; A liquid transport structure is disposed on the inner surface of the vacuum chamber; and A phase change fluid is disposed within the vacuum chamber; A temperature control module is installed between the pressure generating device and the pressure block; A test socket, corresponding to the pressure block, the test socket being adapted to accommodate an electronic component; and A controller is electrically connected to the pressure generating device, the temperature control module, and the test socket; The controller controls the pressure generating device to drive the pressure block to contact and apply downward pressure to the electronic component in the test socket; in response to the side of the block that contacts the electronic component being heated, the phase change fluid absorbs heat and undergoes a first phase change, moves to the side of the block that is connected to the temperature control module by convection, releases heat energy and undergoes a second phase change, and flows back to the side of the block that contacts the electronic component through the liquid transport structure.

6. The electronic component testing equipment as described in claim 5, characterized in that, The temperature control module includes a temperature-controlled fluid supply device and a temperature-controlled fluid chamber; the controller is electrically connected to the temperature-controlled fluid supply device to supply a temperature-controlled fluid to the temperature-controlled fluid chamber; the temperature-controlled fluid chamber is disposed between the pressure generating device and the pressure block.

7. The electronic component testing equipment as described in claim 6, characterized in that, The press block also includes a heat-conducting plate and multiple heat exchange plates. The heat-conducting plate serves as one side wall of the temperature-controlled fluid chamber, and the multiple heat exchange plates are disposed on the heat-conducting plate and located within the temperature-controlled fluid chamber.

8. The electronic component testing equipment as described in claim 5, characterized in that, The block includes a closed bottom frame and a support cover. The closed bottom frame includes an inner ring frame, and the support cover includes an outer ring flange. When the support cover is closed on the closed bottom frame, the outer ring flange abuts against the inner ring frame, and the plurality of support columns abut against the support cover.

9. The electronic component testing equipment as described in claim 8, characterized in that, The closed bottom frame includes a columnar extension; the support cover includes a through hole; when the support cover is closed on the closed bottom frame, the columnar extension passes through the through hole; the columnar extension has a temperature sensing channel for accommodating a temperature sensor.

10. The electronic component testing equipment as described in claim 5, characterized in that, The liquid transport structure includes a first permeation structure and a second permeation structure; the first permeation structure is disposed in the vacuum chamber on the side adjacent to the temperature control module, and the second permeation structure is disposed in the vacuum chamber on the side adjacent to the electronic component; the first permeation structure includes a plurality of first pores, and the second permeation structure includes a plurality of second pores, wherein the diameter of the first pores is larger than the diameter of the second pores.

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