Liquid crystal display module

Abstract

The application provides a liquid crystal display module, comprising a plurality of sub-display modules arranged in a two-dimensional array and spaced apart; each sub-display module has an array substrate and a plurality of first test pads and a plurality of second test pads arranged on the array substrate, and the plurality of first test pads and the plurality of second test pads are electrically connected to the array substrate through first wires; each sub-display module comprises a plurality of first dummy test pads arranged adjacent to the plurality of first test pads, and a plurality of second dummy test pads arranged adjacent to the plurality of second test pads; and the plurality of first dummy test pads are in a floating state and reserve welding points for connecting the first wires, and the plurality of second dummy test pads are in a floating state and reserve welding points for connecting the first wires. The liquid crystal display module can normally test when the test pad is burned and causes poor signal conduction, avoids affecting the subsequent process, and effectively improves the product yield.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a liquid crystal display module. Background Technology

[0002] Liquid crystal displays (LCDs) are widely used in electronic products such as televisions, mobile phones, and automotive displays due to their advantages of low cost, low power consumption, and long lifespan. In the LCD panel manufacturing process, test structure design is a crucial step in ensuring product quality and functionality. Test structures typically include test pads, used at different process stages to perform electrical testing, electrical alignment, and back-end inspection on the substrate and its constituent panels.

[0003] However, the design of the test structure in the existing technology has the following problems: First, process steps such as array testing, fine slit vertical alignment (FSA), and cell testing can easily affect subsequent processes and cause substrate scrap, reducing product yield. Second, for models with a 21:9 aspect ratio, there may be poor electrical contact or abnormal signal input during the back-end cell test. Utility Model Content

[0004] The liquid crystal display module provided in this application aims to solve the problem of test pad damage in existing liquid crystal display modules, which causes substrate scrap and reduces product yield.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a liquid crystal display module, including a plurality of sub-display modules arranged in a two-dimensional array and spaced apart; each sub-display module has an array substrate and a plurality of first test pads and a plurality of second test pads disposed on the array substrate, and the plurality of first test pads and the plurality of second test pads are electrically connected to the array substrate through a first trace; each sub-display module includes:

[0006] Multiple first dummy test pads are arranged adjacent to each other; and the multiple first dummy test pads are in a floating state and have reserved solder points for connecting the first trace;

[0007] Multiple second dummy test pads are arranged adjacent to each other; and the multiple second dummy test pads are in a floating state and have reserved solder points for connecting the first trace.

[0008] In one specific embodiment, the number of the first dummy test pads is the same as the number of the first test pads; the plurality of the first dummy test pads are electrically connected to the second traces respectively, and the second traces are reserved with solder points for connecting the first traces.

[0009] In one specific embodiment, the number of the second dummy test pads is the same as the number of the second test pads; the plurality of second dummy test pads are electrically connected to the third trace respectively, and the third trace is reserved with solder points for connecting the first trace.

[0010] In one specific embodiment, the number of the first dummy test pads is less than the number of the first test pads; and each of the first dummy test pads is reserved with a solder joint for connecting the first trace.

[0011] In one specific embodiment, the number of the second dummy test pads is less than the number of the second test pads; and each of the second dummy test pads is reserved with a solder joint for connecting the first trace.

[0012] In one specific embodiment, each sub-display module includes a display area and a non-display area disposed around the periphery of the display area. The non-display area includes a bonding area close to the display area and a cutting area away from the display area. Multiple flip-chip films are spaced apart on the bonding area along the column direction of the two-dimensional array. Two flip-chip films located at both ends of the column direction are first films, and two flip-chip films close to the first films are second films. Each sub-display module further includes:

[0013] Multiple third test pads are electrically connected to the array substrate via a fourth trace;

[0014] Multiple third dummy test pads are arranged adjacent to the multiple third test pads; each of the third dummy test pads is reserved with a soldering point for connecting the fourth trace.

[0015] In one specific embodiment, a plurality of the third test pads are arranged in a row on the bonding area, and a portion of the plurality of third test pads are disposed on the side of the first film away from the second film, and another portion is disposed on the side of the first film closer to the second film; or

[0016] Multiple third test pads are arranged in multiple rows on the bonding area, and the multiple rows of third test pads are disposed between the first film and the second film.

[0017] In one specific embodiment, a plurality of the third test pads are arranged in a row on the cutting area.

[0018] In one specific embodiment, the first test pad and the first dummy test pad are disposed on the non-display areas on opposite sides of the sub-display module along the first direction;

[0019] The second test pad and the second dummy test pad are disposed in the non-display area on one side of the sub-display module along the second direction;

[0020] The third test pad and the third dummy test pad are disposed in the non-display area of ​​the sub-display module on the other side away from the second test pad along the second direction, and the third test pad and the third dummy test pad are disposed close to both ends of the sub-display module along the first direction;

[0021] Wherein, the first direction is the column direction of the two-dimensional array, and the second direction is the row direction of the two-dimensional array.

[0022] In one specific embodiment, the first dummy test pad is in a floating state and remains electrically connected to the array substrate; or the first dummy test pad is electrically connected to the first trace, and at least a portion of the first test pad is disconnected from the array substrate; and / or

[0023] The second dummy test pad is in a floating state and remains electrically connected to the array substrate; or the second dummy test pad is electrically connected to the first trace, and at least a portion of the second test pad is disconnected from the array substrate; and / or

[0024] The third dummy test pad is in a floating state and is electrically connected to the array substrate; or the third dummy test pad is electrically connected to the fourth trace and at least part of the third test pad is disconnected from the array substrate.

[0025] The beneficial effects of this application embodiment are as follows: Unlike the prior art, this application embodiment provides a liquid crystal display module, including an array substrate and a plurality of sub-display modules disposed on the array substrate in a two-dimensional array and spaced apart; each sub-display module has a plurality of first test pads and a plurality of second test pads, and the plurality of first test pads and the plurality of second test pads are electrically connected to the array substrate through a first trace; each sub-display module includes a plurality of first dummy test pads disposed adjacent to the plurality of first test pads, and a plurality of second dummy test pads disposed adjacent to the plurality of second test pads; and the plurality of first dummy test pads are in a floating state and have reserved solder points for connecting the first traces, and the plurality of second dummy test pads are in a floating state and have reserved solder points for connecting the first traces. By setting a first dummy test pad and a second dummy test pad that are normally floating on the array substrate, when the first test pad and / or the second test pad are burned and cause poor signal conduction, the floating first dummy test pad and / or the second dummy test pad can be connected to the test circuit trace, thereby replacing the burned first test pad and / or the second test pad. This allows the liquid crystal display module to be tested normally, avoids affecting subsequent processes, and effectively improves product yield. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the liquid crystal display module provided in the first embodiment of this application;

[0027] Figure 2 This is a schematic diagram of the structure of the liquid crystal display module provided in the second embodiment of this application;

[0028] Figure 3a This is a schematic diagram of the structure of the liquid crystal display module provided in the third embodiment of this application;

[0029] Figure 3b for Figure 3a A magnified view of a portion of point A in the liquid crystal display module shown;

[0030] Figure 4 for Figure 3a The diagram shows the structure of the liquid crystal display module after it has been divided into sub-display modules.

[0031] Figure 5 This is a schematic diagram of the structure of the liquid crystal display module after it has been divided into sub-display modules according to the fourth embodiment of this application;

[0032] Figure 6 This is a schematic diagram of the structure of the liquid crystal display module provided in the fifth embodiment of this application after being divided into sub-display modules.

[0033] Explanation of icon numbers:

[0034] 1-Array substrate; 2-Sub-display module; 3-First trace; 4-Second trace; 5-Third trace; 6-Fourth trace; 7-First thin film; 8-Second thin film; 21-First test pad; 22-Second test pad; 23-Third test pad; 24-First dummy test pad; 25-Second dummy test pad; 26-Third dummy test pad; 210-Display area; 220-Non-display area; 2210-Bonding area; 2220-Cutting area. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0036] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0037] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0038] In existing technologies, the design of test structures has the following problems: First, in process steps such as array testing, fine slit vertical alignment (FSA), and cell testing, the non-uniformity of the metal film layer or process deviations, as well as the limitations of the testing equipment, can easily lead to test pad damage or burns, affecting subsequent processes, causing substrate scrap, and reducing product yield. Second, for models with a 21:9 aspect ratio, during the back-end cell test, the bending of the substrate glass prevents the pin clamps from fully aligning with the test pads, resulting in poor electrical contact or abnormal signal input. Finally, for high-resolution and high-refresh-rate models, due to the large number of flip-chip films and signals, there is insufficient space to place the cell test pads near the left and right sides of the bonding area (commonly known as the "shoulder" position).

[0039] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0040] See Figure 1 , Figure 1 This is a schematic diagram of the structure of the liquid crystal display module provided in the first embodiment of this application. This application provides a liquid crystal display module, which is an intermediate product in the manufacturing process of liquid crystal display panels. It is used to form liquid crystal display panels after undergoing processes such as electrical testing, electrical alignment, back-end inspection, and cutting.

[0041] like Figure 1 As shown, the liquid crystal display module may include multiple sub-display modules 2, which are arranged in a two-dimensional array and spaced apart to avoid mutual interference and improve reliability.

[0042] Each sub-display module 2 has an array substrate 1 and a plurality of first test pads 21 and a plurality of second test pads 22 disposed on the array substrate 1. The plurality of first test pads 21 and the plurality of second test pads 22 are electrically connected to the array substrate 1 through a first trace 3 to ensure that the signal can be effectively transmitted.

[0043] Specifically, the first test pad 21 can be an array test pad, used to perform circuit testing on the array substrate 1 to ensure that there are no abnormalities in the metal lines. The second test pad 22 can be an FSA photoalignment pad, used to precisely align and solidify the liquid crystal molecules in the liquid crystal display module after the array substrate 1 and the glass cover are molded together, so that the liquid crystal molecules form a pretilt angle.

[0044] Each sub-display module 2 may further include multiple first dummy test pads 24 and multiple second dummy test pads 25. The multiple first dummy test pads 24 are arranged adjacent to multiple first test pads 21, and are in a floating state with reserved solder joints for connecting to the first trace 3. It can be understood that the floating state means that under normal circumstances, i.e., when the first test pad 21 is not burned or damaged, the multiple first dummy test pads 24 are disconnected from the first trace 3. However, when the first test pad 21 of the sub-display module 2 is burned or damaged, the solder joints of the multiple first dummy test pads 24 can be soldered to electrically connect the multiple first dummy test pads 24 to the first trace 3, and disconnect the multiple first test pads 21 from the first trace 3.

[0045] In other words, when the first dummy test pad 24 is in a floating state, the first test pad 21 remains electrically connected to the array substrate 1; while when the first dummy test pad 24 is electrically connected to the first trace 3, at least part of the first test pad 21 is disconnected from the array substrate 1. It should be noted that the process of the first dummy test pad 24 changing from a floating state to being electrically connected to the first trace 3 is irreversible.

[0046] Multiple second dummy test pads 25 are arranged adjacent to multiple second test pads 22, and the multiple second dummy test pads 25 are in a floating state with reserved solder joints for connecting to the first trace 3. It can be understood that when the second test pad 22 is not burned or damaged, the multiple second dummy test pads 25 are in a floating state, that is, the multiple second dummy test pads 25 are disconnected from the first trace 3. When the second test pad 22 is burned or damaged, the solder joints of the multiple second dummy test pads 25 can be soldered to make the multiple second dummy test pads 25 electrically connected to the first trace 3, and to disconnect the multiple second test pads 22 from the first trace 3.

[0047] In other words, when the second dummy test pad 25 is in a floating state, the second test pad 22 remains electrically connected to the array substrate 1; while when the second dummy test pad 25 is electrically connected to the first trace 3, at least part of the second test pad 22 is disconnected from the array substrate 1. Similarly, the process of the second dummy test pad 25 changing from a floating state to being electrically connected to the first trace 3 is irreversible.

[0048] Thus, by setting a first dummy test pad 24 and a second dummy test pad 25 that are normally floating on the array substrate 1, when the first test pad 21 and / or the second test pad 22 are burned, resulting in poor signal conduction, the first dummy test pad 24 and / or the second dummy test pad 25 in the floating state can be connected to the test circuit trace, thereby replacing the burned first test pad 21 and / or the second test pad 22. This allows the liquid crystal display module to be tested normally, avoids affecting subsequent processes, and effectively improves product yield.

[0049] Continue reading Figure 1 In a specific embodiment, the number of first dummy test pads 24 and first test pads 21 can be the same. Each of the multiple first dummy test pads 24 is electrically connected to a second trace 4, and the second trace 4 has reserved solder points for connecting to the first trace 3. Specifically, the multiple first dummy test pads 24 are connected in parallel with the multiple first test pads 21 via the second trace 4.

[0050] When the first test pad 21 is not burned or damaged, the second trace 4 is in a floating state, that is, the second trace 4 is disconnected from the first trace 3; when the first test pad 21 is burned or damaged, the second trace 4 can be electrically connected to the first trace 3 by welding the solder joints of the second trace 4, and the multiple first test pads 21 can be disconnected from the first trace 3.

[0051] It is understandable that by connecting multiple first dummy test pads 24 to the first trace 3 via the second trace 4, after any one or more first test pads 21 are burned or damaged by explosion, the electrical connection between the first test pads 21 and the first trace 3 can be directly disconnected, and the corresponding set of first dummy test pads 24 can be electrically connected to the first trace 3. In this way, it is not necessary to position the first test pads 21 and the first dummy test pads 24, which effectively simplifies the process.

[0052] like Figure 1 As shown, the number of second dummy test pads 25 and second test pads 22 can be the same. Multiple second dummy test pads 25 are electrically connected to the third trace 5, which has reserved solder points for connecting to the first trace 3. Specifically, multiple second dummy test pads 25 are connected in series with the first trace 3 via the third trace 5.

[0053] When the second test pad 22 is not burned or damaged, the third trace 5 is in a floating state, that is, the third trace 5 is disconnected from the first trace 3; when the second test pad 22 is burned or damaged, the third trace 5 can be electrically connected to the first trace 3 by welding the solder joints of the third trace 5, and the multiple second test pads 22 can be disconnected from the first trace 3.

[0054] Similarly, by connecting multiple second dummy test pads 25 to the first trace 3 via the third trace 5, after any one or more second test pads 22 are burned or damaged by explosion, the electrical connection between the group of second test pads 22 and the first trace 3 can be directly disconnected, and all the corresponding group of second dummy test pads 25 can be electrically connected to the first trace 3. In this way, it is not necessary to position the second test pads 22 and the second dummy test pads 25, which effectively simplifies the process.

[0055] See Figure 2 , Figure 2 This is a schematic diagram of the structure of the liquid crystal display module provided in the second embodiment of this application. The structure of the liquid crystal display module provided in the second embodiment of this application is basically the same as that of the liquid crystal display module provided in the first embodiment. The difference is that in the second embodiment, the number of first dummy test pads 24 can be less than the number of first test pads 21; and each first dummy test pad 24 is reserved with a soldering point for connecting the first trace 3. It can be understood that by reducing the number of first dummy test pads 24 and making each first dummy test pad 24 electrically connected to the first trace 3 individually, a burnt or damaged first test pad 21 can be replaced, thereby avoiding the problem of complex wiring caused by an excessive number of first dummy test pads 24.

[0056] Specifically, when the first test pad 21 is not burned or damaged, all the first dummy test pads 24 are in a floating state, that is, the first dummy test pads 24 are disconnected from the first trace 3, and the first test pad 21 remains electrically connected to the array substrate 1. However, when the first test pad 21 is burned or damaged, at least one of the solder joints of the first dummy test pad 24 can be soldered to make at least one of the first dummy test pads 24 electrically connected to the first trace 3, and to disconnect the first test pad 21 that has been burned or damaged from the array substrate 1.

[0057] In a specific embodiment, the number of second dummy test pads 25 can also be less than the number of second test pads 22; and each second dummy test pad 25 is reserved with a solder joint for connecting to the first trace 3. In this way, by reducing the number of second dummy test pads 25 and allowing each second dummy test pad 25 to be electrically connected to the first trace 3 individually, in place of a second test pad 22 that has been burned or damaged, the problem of complex wiring caused by an excessive number of second dummy test pads 25 is avoided.

[0058] Specifically, when the second test pad 22 is not burned or damaged, all the second dummy test pads 25 are in a floating state, that is, the second dummy test pads 25 are disconnected from the first trace 3, and the second test pads 22 remain electrically connected to the array substrate 1. However, when the second test pad 22 is burned or damaged, at least one of the solder joints of the second dummy test pad 25 can be soldered to make at least one of the second dummy test pads 25 electrically connected to the first trace 3, and the second test pad 22 that has been burned or damaged is disconnected from the array substrate 1.

[0059] See Figures 3a-3b , Figure 3a This is a schematic diagram of the structure of the liquid crystal display module provided in the third embodiment of this application; Figure 3b for Figure 3a The image shows a partial enlarged view of point A in the liquid crystal display module shown. The structure of the liquid crystal display module provided in the third embodiment of this application is basically the same as that of the liquid crystal display module provided in the second embodiment, the difference being that, as... Figure 3b As shown, in the third embodiment, each sub-display module 2 may further include multiple third test pads 23 and multiple third dummy test pads 26. The multiple third test pads 23 are electrically connected to the array substrate 1 via a fourth trace 6. The third test pads 23 can be cell assembly test pads used to perform cell assembly testing on the liquid crystal cell to evaluate its electrical performance, optical characteristics, and reliability.

[0060] Multiple third dummy test pads 26 are arranged adjacent to multiple third test pads 23, and each third dummy test pad 26 is provided with a solder point for connecting to the fourth trace 6. By setting the third dummy test pads 26, which are normally in a floating state, on the array substrate 1, when the third test pad 23 is burned and causes poor signal conduction, the floating third dummy test pads 26 can be connected to the test circuit traces, thereby replacing the burned third test pad 23. This allows the liquid crystal display module to be tested normally, avoids affecting subsequent processes, and effectively improves product yield.

[0061] Specifically, when the third test pad 23 is not burned or damaged, all the third dummy test pads 26 are in a floating state, meaning the third dummy test pads 26 are disconnected from the fourth trace 6, while the third test pads 23 remain electrically connected to the array substrate 1. However, when the third test pad 23 is burned or damaged, at least one of the solder joints of the third dummy test pad 26 can be soldered to make at least one of the third dummy test pads 26 electrically connected to the fourth trace 6, thus disconnecting the burned or damaged third test pad 23 from the array substrate 1. Similarly, the process of the third dummy test pad 26 changing from a floating state to being electrically connected to the fourth trace 6 is irreversible.

[0062] like Figure 3aAs shown, in a specific embodiment, the first test pad 21 and the first dummy test pad 24 can be disposed on opposite sides of the non-display area 220 of the sub-display module 2 along the first direction Y; the second test pad 22 and the second dummy test pad 25 can be disposed on one side of the non-display area 220 of the sub-display module 2 along the second direction X; wherein, the first direction Y is the column direction of the two-dimensional array, and the second direction X is the row direction of the two-dimensional array. Only one set of the second test pad 22 and the second dummy test pad 25 can be disposed between the two sub-display modules 2, thereby effectively reducing the number of the second test pad 22 and the second dummy test pad 25.

[0063] The third test pad 23 and the third dummy test pad 26 can be disposed in the non-display area 220 of the sub-display module 2 on the side away from the second test pad 22 along the second direction, and the third test pad 23 and the third dummy test pad 26 are disposed close to the two ends of the sub-display module 2 along the first direction Y. This design makes the positions of the test pads reasonable, improves the testing efficiency, reduces space waste, and enhances reliability and maintainability. This layout ensures the high efficiency of signal transmission and equipment testing in different directions, while avoiding mutual interference.

[0064] like Figure 4 As shown, Figure 4 for Figure 3a The diagram shows the structure of a liquid crystal display module divided into sub-display modules. Each sub-display module 2 may include a display area 210 for displaying images and a non-display area 220 disposed around the display area 210. The non-display area 220 includes a bonding area 2210 close to the display area 210 and a cutting area 2220 away from the display area 210. The bonding area 2210 is used to connect driving components (such as flexible circuit boards and driving chips) to the panel electrodes to realize signal transmission and control functions. The cutting area 2220 is used to divide a single panel to avoid damage to the pixels or circuits of the display area 210 during the cutting process.

[0065] Multiple flip-chip films are spaced apart along the column direction of the two-dimensional array on the bonding area 2210; among them, the two flip-chip films located at both ends of the column direction are the first film 7, and the two flip-chip films close to the first film 7 are the second film 8.

[0066] In a specific embodiment, multiple third test pads 23 can be arranged in a row on the bonding area 2210, with some of the third test pads 23 disposed on the side of the first film 7 away from the second film 8, and others disposed on the side of the first film 7 closer to the second film 8; that is, the multiple third test pads 23 are divided into two groups and respectively disposed on opposite sides of the first film 7 along the first direction Y. Thus, for high-resolution and high-refresh-rate models with a large number of flip-chip films and signals, the above design can avoid the situation where there is insufficient space on the shoulder of the bonding area 2210, making it difficult to place the third test pads 23.

[0067] The panel drive signal lines can also be preferentially positioned at the shoulder to minimize their proximity to the array substrate traces and avoid significant impedance differences. Other common electrode signal lines can be positioned between the flip-chip films.

[0068] like Figure 5 As shown, Figure 5 This is a schematic diagram of the structure of the liquid crystal display module provided in the fourth embodiment of this application after being divided into sub-display modules. The structure of the liquid crystal display module provided in the fourth embodiment of this application is basically the same as that of the liquid crystal display module provided in the third embodiment. The difference is that, in the fourth embodiment, multiple third test pads 23 are arranged in multiple rows on the bonding area 2210, and the multiple rows of third test pads 23 are disposed between the first thin film 7 and the second thin film 8. Specifically, the multiple third test pads 23 can be arranged in two rows between the first thin film 7 and the second thin film 8.

[0069] Thus, during back-end cell assembly testing of 21:9 aspect ratio models, even if the substrate glass is bent, the pin clamp can still align with the test pad, avoiding poor electrical contact or abnormal signal input. Furthermore, for high-resolution and high-refresh-rate models with a large number of flip-chip films and signals, the above design avoids the situation where there is insufficient space at the shoulder of the bonding area 2210, making it difficult to place the third test pad 23.

[0070] Specifically, the width of the connection line between the third test pad 23 and the array substrate trace is greater than or equal to 10 micrometers and less than or equal to 50 micrometers to avoid excessive impedance. Specifically, the width of the connection line can be 10 micrometers, 20 micrometers, 30 micrometers, 40 micrometers, or 50 micrometers.

[0071] like Figure 6 As shown, Figure 6This is a schematic diagram of the structure of the liquid crystal display module after being divided into sub-display modules according to the fifth embodiment of this application. The structure of the liquid crystal display module provided in the fifth embodiment of this application is basically the same as that of the liquid crystal display module provided in the third embodiment. The difference is that in the fifth embodiment, multiple third test pads 23 are arranged in a row on the cutting area 2220. In this way, by setting the third test pads 23 on the cutting area 2220, the problem of insufficient space at the shoulder position of the bonding area 2210, which makes it difficult to place the third test pads 23, is avoided, so as to facilitate the setting of the third test pads 23 when there are many flip-chip films and a large number of signals.

[0072] Specifically, after the first box assembly test is completed and before the bonding process is cut, the cutting machine can make one more cut to cut off the glass in the cutting area 2220 where the third test pad 23 is located, and then the flip-chip film and the circuit board are bonded.

[0073] This application provides a liquid crystal display module, including an array substrate 1 and a plurality of sub-display modules 2 disposed on the array substrate 1 in a two-dimensional array and spaced apart. Each sub-display module 2 has a plurality of first test pads 21 and a plurality of second test pads 22, and the plurality of first test pads 21 and the plurality of second test pads 22 are electrically connected to the array substrate 1 through a first trace 3. Each sub-display module 2 includes a plurality of first dummy test pads 24 disposed adjacent to the plurality of first test pads 21, and a plurality of second dummy test pads 25 disposed adjacent to the plurality of second test pads 22. The plurality of first dummy test pads 24 are in a floating state and have reserved solder points for connecting to the first trace 3, and the plurality of second dummy test pads 25 are in a floating state and have reserved solder points for connecting to the first trace 3. By setting a first dummy test pad 24 and a second dummy test pad 25 that are normally floating on the array substrate 1, when the first test pad 21 and / or the second test pad 22 are burned, resulting in poor signal conduction, the first dummy test pad 24 and / or the second dummy test pad 25 in the floating state can be connected to the test circuit trace, thereby replacing the burned first test pad 21 and / or the second test pad 22. This allows the liquid crystal display module to be tested normally, avoids affecting subsequent processes, and effectively improves product yield.

[0074] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A liquid crystal display module, comprising a plurality of sub-display modules arranged in a two-dimensional array and spaced apart; Each of the sub-display modules has an array substrate and a plurality of first test pads and a plurality of second test pads disposed on the array substrate, wherein the plurality of first test pads and the plurality of second test pads are electrically connected to the array substrate through a first trace; characterized in that, Each of the sub-display modules includes: Multiple first dummy test pads are arranged adjacent to each other; and the multiple first dummy test pads are in a floating state and have reserved solder points for connecting the first trace; Multiple second dummy test pads are arranged adjacent to each other; and the multiple second dummy test pads are in a floating state and have reserved solder points for connecting the first trace.

2. The liquid crystal display module according to claim 1, characterized in that, The number of the first dummy test pads is the same as the number of the first test pads; the plurality of the first dummy test pads are electrically connected to the second traces respectively, and the second traces are reserved with soldering points for connecting the first traces.

3. The liquid crystal display module according to claim 1, characterized in that, The number of the second dummy test pads is the same as the number of the second test pads; the multiple second dummy test pads are electrically connected to the third trace, and the third trace is reserved with solder points for connecting the first trace.

4. The liquid crystal display module according to claim 1, characterized in that, The number of the first dummy test pads is less than the number of the first test pads; and each of the first dummy test pads has a reserved solder joint for connecting the first trace.

5. The liquid crystal display module according to claim 1, characterized in that, The number of the second dummy test pads is less than the number of the second test pads; and each of the second dummy test pads has a reserved solder joint for connecting the first trace.

6. The liquid crystal display module according to any one of claims 1-5, wherein each sub-display module includes a display area and a non-display area disposed around the periphery of the display area, the non-display area including a bonding area close to the display area and a cutting area away from the display area; a plurality of flip-chip films are disposed at intervals along the column direction of the two-dimensional array on the bonding area; wherein, The two flip-chip films located at both ends of the column direction are the first film, and the two flip-chip films close to the first film are the second film; characterized in that each sub-display module further includes: Multiple third test pads are electrically connected to the array substrate via a fourth trace; Multiple third dummy test pads are arranged adjacent to the multiple third test pads; each of the third dummy test pads is reserved with a soldering point for connecting the fourth trace.

7. The liquid crystal display module according to claim 6, characterized in that, A plurality of the third test pads are arranged in a row on the bonding area, and a portion of the plurality of third test pads are disposed on the side of the first film away from the second film, and another portion is disposed on the side of the first film closer to the second film; or Multiple third test pads are arranged in multiple rows on the bonding area, and the multiple rows of third test pads are disposed between the first film and the second film.

8. The liquid crystal display module according to claim 6, characterized in that, Multiple third test pads are arranged in a row on the cutting area.

9. The liquid crystal display module according to claim 6, characterized in that, The first test pad and the first dummy test pad are disposed on the non-display areas on opposite sides of the sub-display module along the first direction; The second test pad and the second dummy test pad are disposed in the non-display area on one side of the sub-display module along the second direction; The third test pad and the third dummy test pad are disposed in the non-display area of ​​the sub-display module on the other side away from the second test pad along the second direction, and the third test pad and the third dummy test pad are disposed close to both ends of the sub-display module along the first direction; Wherein, the first direction is the column direction of the two-dimensional array, and the second direction is the row direction of the two-dimensional array.

10. The liquid crystal display module according to claim 6, characterized in that, The first dummy test pad is in a floating state and remains electrically connected to the array substrate; or the first dummy test pad is electrically connected to the first trace, and at least a portion of the first test pad is disconnected from the array substrate; and / or The second dummy test pad is in a floating state and remains electrically connected to the array substrate; or the second dummy test pad is electrically connected to the first trace, and at least a portion of the second test pad is disconnected from the array substrate; and / or The third dummy test pad is in a floating state and is electrically connected to the array substrate; or the third dummy test pad is electrically connected to the fourth trace and at least part of the third test pad is disconnected from the array substrate.

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