Waterproof and sandproof resistor based on silicone adhesive packaging

Abstract

The application relates to a waterproof and sandproof resistor based on a silicone glue encapsulation, and relates to the technical field of electronic component encapsulation, which comprises a shell, the inside of the shell is provided with an encapsulation mechanism, the encapsulation mechanism comprises a quartz sand layer, the outside of the quartz sand layer is fixedly connected in the inside of the shell, the outside of the quartz sand layer is coated with a silicone glue layer, the top end of the shell is provided with a heat dissipation assembly, the heat dissipation assembly comprises a plurality of heat dissipation fins, the outside of the heat dissipation fins is fixedly connected to the outside of the shell, the proximal sides of two heat dissipation fins are provided with flow-through grooves, and the inside of the quartz sand layer is fixedly connected with a wire. The application has the effects that the silicone glue layer is poured outside the quartz sand layer through a glue pouring process, the elasticity and high-temperature resistance of the silicone glue layer are utilized, waterproof and sandproof protection of the resistor is realized, and the effect of preventing the quartz sand layer from flowing out is achieved.

Description

Technical Field

[0001] This application relates to the field of electronic component packaging technology, and in particular to a waterproof and sandproof resistor based on silicone sealant encapsulation. Background Technology

[0002] In the field of electronic component packaging technology, resistors operating in high-humidity environments must possess reliable waterproof performance to adapt to scenarios such as outdoor equipment, marine systems, home appliances, and medical instruments. The industry enhances their resistance to water vapor and acids / alkalis through packaging design, material optimization, and structural innovation to meet long-term reliability requirements.

[0003] The main structure of a waterproof resistor is based on a traditional resistor but with enhanced sealing design. Its core consists of a resistor body made of resistance wire, ceramic substrate, and metal leads, and a waterproof encapsulation layer made of temperature- and aging-resistant materials such as epoxy resin. Some also have auxiliary protective structures such as a metal shell or ceramic coating. Its working principle is that the encapsulation layer tightly adheres to the resistor body, forming a sealed barrier to prevent the intrusion of moisture, dust, and other impurities. Simultaneously, thanks to the high and low temperature resistance and aging-resistant properties of the encapsulation material, while ensuring the resistor body performs its electrical functions such as current limiting and voltage division, it guarantees long-term stable operation in harsh environments, avoiding faults such as electrode oxidation and short circuits caused by sealing problems.

[0004] In existing technologies, with the increasingly complex application environments of electronic devices, harsh conditions such as high humidity and dust place higher demands on the sealing performance of resistors. Traditional resistors using epoxy resin as the encapsulation material are prone to thermal shrinkage during long-term use due to repeated temperature changes, leading to delamination from the resistor body and gaps in the encapsulation layer, severely affecting the resistor's sealing performance. This not only allows moisture, dust, and other impurities to penetrate the resistor's interior, interfering with its normal operation, but also shortens its lifespan and adversely affects the overall stability of electronic devices. Therefore, a waterproof and sandproof resistor based on silicone sealant encapsulation is proposed to address these problems. Utility Model Content

[0005] The purpose of this application is to provide a waterproof and sandproof resistor based on silicone sealant encapsulation, which aims to improve the problem in the prior art where traditional epoxy resin encapsulated resistors delaminate due to heat shrinkage during long-term use, resulting in gaps in the encapsulation layer, poor sealing, and allowing moisture, dust and other impurities to enter the interior, affecting the normal operation and service life of the resistor.

[0006] The waterproof and sandproof resistor based on silicone encapsulation provided in this application adopts the following technical solution: A waterproof and sandproof resistor based on silicone sealant encapsulation includes a housing, an encapsulation mechanism inside the housing, the encapsulation mechanism including a quartz sand layer, the outside of the quartz sand layer being fixedly connected to the inside of the housing, the outside of the quartz sand layer being coated and connected with a silicone sealant layer, and a heat dissipation component being provided at the top of the housing. Through the above technical solution, the quartz sand layer provides a stable insulating foundation for the resistor, and the silicone sealant layer utilizes its elasticity and high temperature resistance to achieve waterproof and sandproof protection, while preventing the quartz sand layer from being lost. The encapsulation mechanism and heat dissipation components work together to ensure that the resistor works stably in complex environments.

[0007] Preferably, the heat dissipation assembly includes a plurality of heat sinks, the plurality of heat sinks are fixedly connected to the outside of the housing, and a flow groove is provided on the adjacent side of two heat sinks; Through the above technical solutions, the heat sink increases the heat dissipation area, and the flow groove promotes the formation of micro-convection of air, which accelerates heat dissipation and effectively avoids the resistor from being affected by overheating.

[0008] Preferably, a wire is fixedly connected inside the quartz sand layer; Through the above technical solution, the conductor, as the core component for current conduction, is fixed and insulated by the quartz sand layer, ensuring stable current transmission and providing a foundation for the normal operation of the resistor.

[0009] Preferably, the external connection of the wire is fixedly connected to the inside of the silicone sealant layer; Through the above technical solution, the silicone sealant layer provides secondary fixation and sealing protection for the wires, enhancing the stability of the wire connection and further improving the overall waterproof and sandproof effect.

[0010] Preferably, the outer surfaces of the plurality of heat sinks are arranged in an array on the outside of the housing.

[0011] Through the above technical solutions, the arrayed heat sinks dissipate heat more evenly, maximize the use of heat dissipation space, improve overall heat dissipation efficiency, and ensure long-term stable operation of the resistor.

[0012] Preferably, one end of the housing is oblique, and the outer side of the housing has a groove.

[0013] Through the above technical solutions, the slanted design at one end of the housing can reduce the space occupied during installation or use, making it easier to arrange in confined spaces; the external slots can further enhance air circulation, improve heat dissipation efficiency in conjunction with heat dissipation components, and the slots can also serve as auxiliary installation structures to facilitate the fixing or positioning of the housing.

[0014] In summary, this application includes at least one of the following beneficial technical effects: 1. In this utility model, during the assembly of the resistor, a silicone adhesive layer is injected onto the outside of the quartz sand layer through a potting process. The elasticity and high temperature resistance of the silicone adhesive layer are used to achieve waterproof and sandproof protection for the resistor, while preventing the internal quartz sand layer from flowing out. During use, the multiple heat sinks on the outside and the flow grooves between adjacent heat sinks can promote the formation of micro-convection of air in the grooves, thereby efficiently removing heat and ensuring stable operation of the resistor. Attached Figure Description

[0015] Figure 1 This is a three-dimensional schematic diagram of a waterproof and sandproof resistor based on silicone sealant encapsulation proposed in this utility model; Figure 2 This is a schematic diagram of the heat sink structure of a waterproof and sandproof resistor based on silicone sealant encapsulation proposed in this utility model; Figure 3 This is a schematic diagram of the silicone sealant layer of a waterproof and sandproof resistor based on silicone sealant encapsulation proposed in this utility model; Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0016] Legend: 1. Housing; 2. Encapsulation mechanism; 21. Quartz sand layer; 22. Silicone adhesive layer; 23. Heat dissipation component; 231. Heat sink; 232. Flow channel; 3. Wire. Detailed Implementation

[0017] The following is in conjunction with the appendix Figure 1 -Appendix Figure 4 This application will be described in further detail below.

[0018] Example 1: A waterproof and sandproof resistor based on silicone encapsulation, refer to... Figure 1 , Figure 3 and Figure 4 The resistor includes a housing 1, which provides a protective enclosure for the internal components and can withstand the impact and corrosion of the external environment. Inside the housing 1 is a sealing mechanism 2, which seals and secures the core components inside the resistor, while also providing waterproofing and sandproofing. Specifically, the housing 1 provides installation space and external protection for the internal encapsulation mechanism 2. The encapsulation mechanism 2 encapsulates and fixes the core resistor component inside the housing 1, and achieves waterproofing and sandproofing through its own structure, ensuring that the resistor operates normally in complex environments.

[0019] The encapsulation mechanism 2 includes a quartz sand layer 21, which is externally and fixedly connected to the inside of the housing 1. The quartz sand layer 21 has good insulation and stability, providing support and insulation for the wires 3. A silicone adhesive layer 22 is coated and connected to the outside of the quartz sand layer 21. The silicone adhesive layer 22 has elasticity and high-temperature resistance, tightly wrapping the quartz sand layer 21, providing waterproofing and sandproofing, while preventing the internal quartz sand layer 21 from leaking out. A heat dissipation component 23 is provided at the top of the housing 1. The heat dissipation component 23 effectively dissipates the heat generated during resistor operation, preventing overheating from affecting resistor performance. The wires 3 are fixedly connected inside the quartz sand layer 21. The wires 3 are the core component for current conduction in the resistor. The wires 3 are externally and fixedly connected to the inside of the silicone adhesive layer 22, which fixes and protects the wires 3, ensuring stable operation. One end of the housing 1 is beveled, and the outside of the housing 1 has grooves.

[0020] Specifically, the quartz sand layer 21 provides support and insulation for the wire 3 inside the housing 1. The silicone adhesive layer 22 coated on the outside tightly wraps the quartz sand layer 21 to prevent it from flowing out and to achieve waterproofing and sandproofing, while fixing and protecting the wire 3. The heat dissipation component 23 at the top of the housing 1 dissipates the heat generated by the resistor operation.

[0021] Reference Figures 2 to 4 The heat dissipation assembly 23 includes multiple heat sinks 231, which are externally fixed to the exterior of the housing 1. The heat sinks 231 increase the contact area between the resistor and the air, accelerating heat dissipation. A flow channel 232 is provided on the adjacent side of two heat sinks 231. The flow channel 232 facilitates the formation of micro-convection currents within it, enhancing airflow and thus more efficiently removing heat from the heat sinks 231. The multiple heat sinks 231 are arranged in an array on the exterior of the housing 1. This distribution ensures uniform heat dissipation and further improves the heat dissipation effect.

[0022] Specifically, multiple heat sinks 231 are fixed to the outside of the housing 1 to increase the contact area with the air. The flow grooves 232 between adjacent heat sinks 231 promote the formation of micro-convection of air. The arrayed heat sinks 231 make the heat dissipation more uniform and efficiently remove the heat generated by the resistor operation.

[0023] Working principle: During assembly, a silicone adhesive layer 22 is injected into the outside of the quartz sand layer 21 using a potting process. The silicone adhesive layer 22 is elastic, high temperature resistant, and can play a role in waterproofing, sandproofing, and preventing the internal quartz sand layer 21 from flowing out. When the resistor is in use, it is supported by multiple external heat sinks 231. A flow groove 232 is set on the adjacent side of two heat sinks 231, which makes the structure conducive to the formation of small convection of air in the grooves, thus carrying away heat.

[0024] The method for preparing a waterproof and sandproof resistor involves placing the resistor element to be encapsulated horizontally and applying adhesive to the first side of the housing 1. The adhesive application process ensures that the silicone adhesive layer 22 completely covers the body of the quartz sand layer 21 and the root of its lead wire 3. The liquid silicone adhesive layer 22 on the first side is then cured to form a first insulating encapsulation layer. The treated resistor element is then flipped so that its unencapsulated second side faces upward. The second side of the resistor element is then subjected to repeated adhesive application and curing processes, so that the newly added liquid silicone adhesive layer 22 is tightly bonded to the quartz sand layer 21 on the second side and the inner edge of the housing 1, together forming a complete and seamless insulating encapsulation.

[0025] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. A waterproof and sandproof resistor based on silicone sealant encapsulation, comprising a housing (1), characterized in that: The housing (1) is provided with an encapsulation mechanism (2); The encapsulation mechanism (2) includes a quartz sand layer (21), the outside of which is fixedly connected to the inside of the housing (1), and the outside of which is coated with a silicone adhesive layer (22). A heat dissipation component (23) is provided at the top of the housing (1).

2. A waterproof and sandproof resistor based on silicone sealant encapsulation according to claim 1, characterized in that: The heat dissipation assembly (23) includes a plurality of heat sinks (231), the plurality of heat sinks (231) are fixedly connected to the outside of the housing (1), and a flow groove (232) is provided on the adjacent side of two heat sinks (231).

3. A waterproof and sandproof resistor based on silicone sealant encapsulation according to claim 1, characterized in that: The quartz sand layer (21) is internally fixed with a wire (3).

4. A waterproof and sandproof resistor based on silicone encapsulation according to claim 3, characterized in that: The external connection of the wire (3) is fixedly connected to the inside of the silicone adhesive layer (22).

5. A waterproof and sandproof resistor based on silicone encapsulation according to claim 2, characterized in that: Multiple heat sinks (231) are arranged in an array on the outside of the housing (1).

6. A waterproof and sandproof resistor based on silicone sealant encapsulation according to claim 1, characterized in that: One end of the housing (1) is oblique, and the outside of the housing (1) has a groove.

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