Inductor with gradient heat dissipation structure
By creating a 45° horizontal array of grooves and a coating design on the surface of the inductor body, the problem of poor heat dissipation under high frequency and high power conditions is solved, achieving more efficient heat dissipation and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU NANCI TECH CO LTD
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-24
AI Technical Summary
Traditional inductors have poor heat dissipation performance in high-frequency, high-power operating environments, resulting in a rapid temperature rise that affects performance and lifespan.
Multiple horizontally arrayed grooves at 45° angles are formed on the surface of the inductor body to create a gradient heat dissipation structure. Combined with aluminum nitride, graphene or nano-ceramic coatings and a metal heat dissipation substrate, the heat dissipation path and radiation area are optimized.
It significantly improves the thermal radiation coefficient and heat dissipation efficiency, reduces temperature rise, and enhances the stability and lifespan of the inductor.
Smart Images
Figure CN224554118U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of inductors, and in particular to an inductor with a gradient heat dissipation structure. Background Technology
[0002] As electronic devices evolve towards miniaturization and high integration, the miniaturization and high-density mounting of surface mount devices (SMDs) have become key technological requirements. Inductors serve as core components for power conversion and signal filtering.
[0003] Traditional molded inductors employ a solid copper substrate and epoxy resin encapsulation, relying primarily on natural convection for heat dissipation. However, this method results in a low thermal emissivity due to its smooth surface, and heat tends to accumulate within the encapsulation layer. Under high-frequency operation, eddy current losses cause significant temperature rises. This leads to poor heat dissipation, especially in high-frequency, high-power environments where the inductor temperature can rise rapidly, impacting its performance and lifespan. Summary of the Invention
[0004] This invention aims to at least partially solve one of the problems in related technologies. Therefore, one objective of this invention is to provide an inductor with a gradient heat dissipation structure, which effectively increases the heat dissipation area and thermal radiation coefficient, allowing heat to dissipate more quickly, reducing the inductor's temperature rise, and improving the inductor's stability and lifespan.
[0005] An inductor with a gradient heat dissipation structure includes an inductor body, the surface of which is provided with a plurality of grooves, the plurality of grooves being arranged in a horizontal array along the surface, and the opening angle of the grooves being 45°.
[0006] Furthermore, the depth of the groove ranges from 0.15 mm to 3 mm.
[0007] Furthermore, the width of the groove ranges from 0.5 mm to 1 mm.
[0008] Furthermore, the spacing between two adjacent grooves ranges from 0.5 mm to 2.4 mm.
[0009] Furthermore, the surface of the inductor body forms a gradient multi-level groove structure, which includes a first-level groove and a second-level groove. The first-level groove is arranged in a horizontal array, and the second-level groove extends in a direction perpendicular to the first-level groove, forming a three-dimensional cross network with the first-level groove.
[0010] Furthermore, the depth of the second-level groove ranges from 0.5 mm to 3 mm.
[0011] Furthermore, the opening angle of the second-stage groove ranges from 60° to 90°.
[0012] Furthermore, the spacing between two adjacent second-level grooves is 1mm to 3mm.
[0013] Furthermore, the surface of the groove is provided with a heat dissipation coating, the material of which is aluminum nitride, graphene, or nano-ceramics.
[0014] Furthermore, a metal heat dissipation substrate is provided at the bottom of the inductor body, and the substrate is connected to the inductor body by welding or sintering.
[0015] The technical solutions provided in this application have the following advantages compared with the prior art:
[0016] This application features multiple grooves formed on the surface of the inductor body, arranged in a horizontal array along the surface, with each groove having an opening angle of 45°. This groove structure breaks away from the traditional smooth surface, creating a three-dimensional heat dissipation surface. By increasing the surface area, it improves emissivity and reduces thermal resistance. Compared to traditional planar structures, this increases the radiation area, improves heat conduction efficiency, and significantly enhances the thermal emissivity, accelerating heat dissipation. The 45° opening angle, combined with the horizontal array layout, guides airflow along the groove surface, enhancing natural convection heat dissipation and preventing heat accumulation inside the encapsulation layer. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of an embodiment of an inductor with a gradient heat dissipation structure according to this application;
[0018] Figure 2 This is a schematic diagram of another embodiment of the inductor with a gradient heat dissipation structure according to this application.
[0019] Figure label:
[0020] 1. An inductor with a gradient heat dissipation structure; 10. Inductor body; 11. Groove; 13. Gradient multi-level groove structure; 131. First-level groove; 133. Second-level groove; 15. Metal heat dissipation substrate; Detailed Implementation
[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0022] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0023] like Figure 1 , Figure 2 As shown, the inductor 1 with a gradient heat dissipation structure provided in this application includes an inductor body 10. The surface of the inductor body 10 is provided with a plurality of grooves 11, which are arranged in a horizontal array along the surface. The opening angle of the grooves 11 is 45°.
[0024] The inductor body 10, as the core of the inductor, carries the electromagnetic induction function and simultaneously upgrades heat dissipation through surface structure optimization. Grooves 11 are evenly distributed laterally along the surface of the inductor body 10, forming regular heat dissipation microstructure units. This layout maximizes the number of grooves 11 per unit area, improving surface area utilization. Compared to a traditional planar surface, the horizontal array theoretically increases the radiation area, laying a geometric foundation for improved thermal radiation efficiency. The 45° angle guides air to flow obliquely along the surface of the grooves 11, avoiding the flow resistance caused by vertical openings and generating convective vortices more easily than horizontal openings, enhancing heat exchange between the air and the surface of the grooves 11.
[0025] The groove 11 structure breaks away from the traditional flat surface, forming a three-dimensional heat dissipation surface, which can increase the radiation area, significantly improve the thermal radiation coefficient, and accelerate the dissipation of heat to the external environment.
[0026] The 45° opening angle, combined with the horizontal array layout, can guide air to flow in a directional manner along the surface of the groove 11, enhancing the natural convection heat dissipation effect and preventing heat from accumulating inside the encapsulation layer.
[0027] Furthermore, the depth of the groove 11 ranges from 0.15 mm to 3 mm.
[0028] A minimum depth of 0.15mm can form a microstructured surface, improving the thermal radiation coefficient; a maximum depth of 3mm can increase the depth of the three-dimensional heat dissipation channel, making the heat conduction path more efficient. A depth not exceeding 3mm can avoid excessively weakening the mechanical strength of the inductor body 10 and prevent structural damage during high-frequency vibration or welding processes.
[0029] Furthermore, the depth design of the groove 11 also takes into account the feasibility and cost-effectiveness of the manufacturing process. The minimum depth of 0.15mm ensures machining accuracy, making the groove 11 structure easy to manufacture and with stable quality. The maximum depth of 3mm, on the other hand, reduces material removal and lowers production costs while ensuring heat dissipation. This design, which comprehensively considers heat dissipation performance, mechanical strength, and production costs, makes the inductor provided in this application have higher cost-effectiveness and reliability in practical applications.
[0030] Furthermore, the width of the groove 11 ranges from 0.5 mm to 1 mm.
[0031] A width of 0.5-1mm ensures smooth airflow within the groove 11 while avoiding a reduction in the number of heat dissipation channels per unit area due to excessive width, thus ensuring efficient natural convection cooling. This width range is suitable for mainstream etching, stamping, and other processing techniques, reducing mass production costs. The width of the groove 11 ranges from 0.5mm to 1mm. This width design ensures both heat dissipation efficiency and structural stability and manufacturing feasibility. A minimum width of 0.5mm ensures effective formation of heat dissipation channels, while a maximum width of 1mm avoids reduced heat dissipation efficiency and weakened mechanical strength due to excessive width.
[0032] Furthermore, the spacing between two adjacent grooves 11 ranges from 0.5 mm to 2.4 mm.
[0033] By limiting the spacing of the grooves 11, interference in heat conduction between adjacent grooves 11 due to excessive array density is avoided, while ensuring sufficient heat dissipation channel density, thus achieving precise control of heat dissipation performance. A minimum spacing of 0.5mm maximizes the number of grooves 11 per unit area, improving surface area utilization; a maximum spacing of 2.4mm avoids overlap of the thermal boundary layer between adjacent grooves 11, preventing a decrease in heat dissipation efficiency. A reasonable spacing ensures that each groove 11 independently performs its heat dissipation function, avoiding localized temperature increases due to overlapping heat conduction. The spacing between two adjacent grooves 11 ranges from 0.5mm to 2.4mm. A reasonable spacing design helps optimize the balance between heat dissipation effect and mechanical strength. Too small a spacing may lead to an overly fragile structure, while too large a spacing may reduce heat dissipation efficiency.
[0034] Furthermore, such as Figure 2 As shown, the surface of the inductor body 10 forms a gradient multi-level groove structure 13. The gradient multi-level groove structure 13 includes a first-level groove 131 and a second-level groove 133. The first-level groove 131 is arranged in a horizontal array, and the second-level groove 133 extends in a direction perpendicular to the first-level groove 131 and forms a three-dimensional cross network with the first-level groove 131.
[0035] The first-level horizontal groove 11 increases the surface radiation area, while the second-level vertically extending groove 11 forms a three-dimensional intersection with the first level, constructing a composite heat dissipation channel of "lateral radiation + vertical flow guidance," thereby improving heat conduction efficiency. The shallow first-level groove 131 preferentially dissipates surface heat, while the deep second-level groove 133 accelerates the conduction of internal heat to the outside, avoiding excessive temperature gradients within the encapsulation layer. The surface of the inductor body 10 further forms a gradient multi-level groove structure 13 to enhance heat dissipation. The gradient multi-level groove structure 13 includes a first-level groove 131 and a second-level groove 133. The first-level grooves 131 are arranged in a horizontal array, and the second-level grooves 133 extend in a direction perpendicular to the first-level grooves 131, forming a three-dimensional intersecting network with the first-level grooves 131. This multi-level structure further increases the heat dissipation area and forms a complex heat dissipation channel, effectively improving heat dissipation efficiency.
[0036] Furthermore, the depth of the second-level groove 133 ranges from 0.5 mm to 3 mm.
[0037] A depth of 0.5-3 mm allows the second-stage recess 133 to penetrate the shallow layer of the encapsulation layer and directly contact the internal heat source (such as the copper substrate), accelerating the conduction of core heat to the surface. The greater depth of the second stage compared to the first stage creates a gradient heat dissipation mechanism of "shallow radiation - deep conduction," avoiding functional overlap between different heat dissipation channels. The depth of the second-stage recess 133 ranges from 0.5 mm to 3 mm, the opening angle ranges from 60° to 90°, and the spacing between two adjacent second-stage recesses 133 is 1 mm to 3 mm. These parameters are designed to optimize the heat dissipation effect and mechanical strength of the second-stage recess 133, while simultaneously creating a synergistic heat dissipation effect with the first-stage recess 131.
[0038] Furthermore, the opening angle of the second-stage groove 133 ranges from 60° to 90°.
[0039] An opening angle of 60°-90° can guide air to flow in a direction perpendicular to the inductor surface, forming an orthogonal coupling with the horizontal convection of the first-stage groove 131, thereby enhancing the heat exchange efficiency in three-dimensional space. An opening angle below 90° avoids the formation of sharp edges, reduces stress concentration during processing, and facilitates forming using processes such as stamping and molding.
[0040] Furthermore, the opening angle range of 60° to 90° ensures effective contact area between the second-stage recess 133 and the air, thereby maximizing heat dissipation. This design not only improves heat dissipation performance but also takes into account production efficiency and cost-effectiveness, making the entire inductor structure more economical and practical.
[0041] Furthermore, the spacing between two adjacent second-level grooves 133 is 1 mm to 3 mm.
[0042] A spacing of 1-3mm allows for the arrangement of an appropriate number of second-level grooves 133 per unit area, ensuring sufficient vertical airflow paths while avoiding overlapping heat conduction between channels due to excessive density. This spacing range complements the spacing of the first-level grooves 131 (0.5-2.4mm), ensuring the uniformity of the three-dimensional cross network and avoiding heat dissipation blind spots.
[0043] Furthermore, the 1-3mm spacing design also takes into account the overall mechanical strength of the inductor. Appropriate spacing effectively reduces structural weakening caused by excessive secondary grooves 133, ensuring the stability and reliability of the inductor during long-term use. This spacing, in conjunction with the spacing of the primary grooves 131, forms an inductor heat dissipation system that is both highly efficient and structurally robust, providing strong support for inductors in high-power-density, high-efficiency applications.
[0044] Furthermore, the surface of the groove 11 is provided with a heat dissipation coating, the material of which is aluminum nitride, graphene, or nano-ceramics.
[0045] Aluminum nitride, graphene, or nano-ceramic coatings can increase surface emissivity, accelerating heat dissipation through radiation. A tight bond between the coating material and the surface of groove 11 reduces air gaps and lowers interfacial thermal resistance in the heat conduction path.
[0046] Furthermore, the thermal coating exhibits excellent chemical stability and corrosion resistance, maintaining its heat dissipation performance in various harsh environments and extending the inductor's lifespan. Through carefully selected coating materials and a scientific structural design, this inductor with a gradient heat dissipation structure not only improves heat dissipation efficiency but also ensures the inductor's long-term stability and reliability, meeting the urgent needs of modern electronic devices for high-performance inductor components.
[0047] Furthermore, such as Figure 2 As shown, the bottom of the inductor body 10 is provided with a metal heat dissipation substrate 15, which is connected to the inductor body 10 by welding or sintering.
[0048] The high thermal conductivity of the metal substrate (such as copper / aluminum) allows for rapid heat dissipation from the bottom of the inductor, avoiding the limitation of heat dissipation only through the surface in traditional structures. Welding or sintering processes enable metallurgical bonding between the substrate and the inductor body 10, reducing contact thermal resistance compared to traditional mechanical connections and ensuring efficient heat transfer.
[0049] Furthermore, the design of the metal heat sink substrate 15 also takes electromagnetic compatibility into account. The metal substrate not only serves as a heat dissipation path but also shields against electromagnetic interference to a certain extent, improving the stability of the inductor components in complex electromagnetic environments. By optimizing the shape and size of the substrate, the self-inductance and mutual inductance of the inductor can be further adjusted to meet the needs of specific circuit designs.
[0050] It is understood that the above embodiments only illustrate preferred embodiments of the present utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present utility model patent. It should be noted that for those skilled in the art, the above technical features can be freely combined, and several modifications and improvements can be made without departing from the concept of the present utility model, all of which fall within the protection scope of the present utility model. Therefore, all equivalent transformations and modifications made within the scope of the claims of the present utility model should fall within the coverage of the claims of the present utility model.
Claims
1. An inductor with a gradient heat dissipation structure, characterized in that, The inductor includes an inductor body, the surface of which has a plurality of grooves arranged in a horizontal array along its surface, and the opening angle of the grooves is 45°.
2. The inductor with a gradient heat dissipation structure according to claim 1, characterized in that, The depth of the groove ranges from 0.15 mm to 3 mm.
3. The inductor with a gradient heat dissipation structure according to claim 1, characterized in that, The width of the groove ranges from 0.5 mm to 1 mm.
4. An inductor with a gradient heat dissipation structure according to claim 1, characterized in that, The spacing between two adjacent grooves ranges from 0.5 mm to 2.4 mm.
5. An inductor with a gradient heat dissipation structure according to claim 1, characterized in that, The surface of the inductor body forms a gradient multi-level groove structure, which includes a first-level groove and a second-level groove. The first-level groove is arranged in a horizontal array, and the second-level groove extends in a direction perpendicular to the first-level groove, forming a three-dimensional cross network with the first-level groove.
6. An inductor with a gradient heat dissipation structure according to claim 5, characterized in that, The depth of the second-level groove ranges from 0.5 mm to 3 mm.
7. An inductor with a gradient heat dissipation structure according to claim 5, characterized in that, The opening angle of the second-stage groove ranges from 60° to 90°.
8. An inductor with a gradient heat dissipation structure according to claim 5, characterized in that, The distance between two adjacent second-level grooves is 1mm to 3mm.
9. An inductor with a gradient heat dissipation structure according to claim 1, characterized in that, The surface of the groove is provided with a heat dissipation coating, which is made of aluminum nitride, graphene, or nano-ceramics.
10. An inductor with a gradient heat dissipation structure according to claim 1, characterized in that, The bottom of the inductor body is provided with a metal heat dissipation substrate, which is connected to the inductor body by welding or sintering.