keyboard module

Abstract

The utility model provides a keyboard module, including base plate subassembly and key component. Base plate subassembly includes base plate, light guide plate and a plurality of light emitting components. Light guide plate includes a plurality of openings, and a plurality of light emitting components are located in corresponding a plurality of openings. The base plate includes a circuit layer and a base plate light-reflecting layer. The light emitting component includes a plurality of contact pads, which are connected to the circuit layer, and part of the base plate light-reflecting layer is located between two adjacent contact pads. The key component is connected to the base plate subassembly. The keyboard module of the case can reduce the cost.

Description

Technical Field

[0001] This utility model relates to a module, and more particularly to a keyboard module. Background Technology

[0002] Modern keyboards typically include multiple backlighting components and multiple keys. The backlighting components illuminate the keys, enhancing the keyboard's aesthetics. However, because the backlighting angle of current components is relatively small, the number of backlighting components must correspond to the number of keys, meaning the number of backlighting components must be greater than or equal to the number of keys to provide sufficient light for all keys. This results in higher keyboard costs. Utility Model Content

[0003] This invention provides a keyboard module that can reduce costs.

[0004] This invention discloses a keyboard module comprising a substrate assembly and key assemblies. The substrate assembly includes a substrate, a light guide plate, and multiple light-emitting components. The light guide plate includes multiple openings, within which the light-emitting components are located. The substrate includes a circuit layer and a substrate reflective layer. Each light-emitting component includes multiple pads connected to the circuit layer, with portions of the substrate reflective layer located between adjacent pads. The key assemblies are connected to the substrate assembly.

[0005] In one embodiment of the present invention, the substrate assembly includes a back plate, a plurality of light-emitting components are located between the substrate and the back plate, a button assembly is connected to the back plate, and the extension of the back plate has a plurality of openings, the orthographic projection of the plurality of openings onto the substrate is aligned with the orthographic projection of the corresponding plurality of light-emitting component substrates.

[0006] In one embodiment of the present invention, the light-emitting component includes a light-emitting body and a component reflective layer. The light-emitting body includes a top surface and a bottom surface opposite to each other. The component reflective layer is connected to the top surface, and a plurality of pads are disposed on the bottom surface.

[0007] In one embodiment of the present invention, the substrate assembly includes a cover plate, the cover plate includes a cover plate reflective layer, and a plurality of light-emitting components are located between the substrate and the cover plate reflective layer, and the light-emitting components are located between the cover plate reflective layer and the substrate reflective layer.

[0008] In one embodiment of the present invention, the cover plate includes a cover plate body and a cover plate light-shielding layer. The cover plate reflective layer and the cover plate light-shielding layer are respectively disposed on opposite sides of the cover plate body, and the cover plate reflective layer is located between the cover plate light-shielding layer and the substrate reflective layer.

[0009] In one embodiment of the present invention, the cover plate includes a cover plate body and a cover plate light-shielding layer. The cover plate light-shielding layer is disposed on the cover plate body, and the cover plate reflective layer is disposed on the cover plate light-shielding layer. The cover plate reflective layer is located between the cover plate light-shielding layer and the substrate reflective layer.

[0010] In one embodiment of the present invention, the cover plate includes a cover plate body and a cover plate light-shielding layer, a cover plate reflective layer is disposed on the cover plate body, the cover plate light-shielding layer is disposed on the cover plate reflective layer, and the cover plate reflective layer is located between the cover plate light-shielding layer and the substrate reflective layer.

[0011] In one embodiment of the present invention, the substrate includes a substrate light-shielding layer, and the circuit layer is located between the substrate reflective layer and the substrate light-shielding layer.

[0012] In one embodiment of the present invention, the substrate reflective layer includes a first reflective layer and a second reflective layer. The first reflective layer is disposed on the circuit layer and a portion of the first reflective layer is located between two adjacent pads among a plurality of pads. The circuit layer is located between the first reflective layer and the second reflective layer.

[0013] In one embodiment of the present invention, the substrate reflective layer includes a third reflective layer, which is located between the first reflective layer and the circuit layer.

[0014] In one embodiment of the present invention, the substrate reflective layer includes a plurality of opening groups, and a plurality of pads of the light-emitting component pass through the corresponding opening groups to connect to the circuit layer, wherein the area of ​​the opening group is smaller than the area of ​​the corresponding opening.

[0015] In one embodiment of the present invention, the circuit layer includes a circuit substrate, patterned circuits and a fill layer. The patterned circuits are disposed on the circuit substrate and enclose multiple non-circuit areas, and the fill layer is disposed on the multiple non-circuit areas.

[0016] In one embodiment of the present invention, the orthographic projection of at least a portion of the button assembly onto the substrate is misaligned with the orthographic projection of the plurality of light-emitting components onto the substrate.

[0017] Based on the above, since the substrate reflective layer of this invention is used to reflect the light emitted by the light-emitting components, the reflective layer located between adjacent pads of the light-emitting components can increase the light reflection efficiency, thereby reflecting more light to the light guide plate and providing sufficient light to the key components. This reduces the number of light-emitting components and lowers the cost of the keyboard module.

[0018] To make the above-mentioned features and advantages of this utility model more apparent and understandable, specific embodiments are described below, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0019] Figure 1 This is a top view of a keyboard module according to an embodiment of the present invention;

[0020] Figure 2A yes Figure 1 A cross-sectional view of the keyboard module;

[0021] Figure 2B yes Figure 1 Another cross-sectional view of the keyboard module;

[0022] Figure 3 yes Figure 2A A magnified view of a portion of the keyboard module;

[0023] Figure 4 yes Figure 3 Top view of the keyboard module;

[0024] Figure 5 yes Figure 2A Top view of the circuit layer;

[0025] Figure 6 This is a cross-sectional view of a keyboard module according to another embodiment of the present invention;

[0026] Figure 7 This is a cross-sectional view of a substrate assembly according to another embodiment of the present invention;

[0027] Figure 8 This is a cross-sectional view of a substrate assembly according to another embodiment of the present invention;

[0028] Figure 9 This is a cross-sectional view of a substrate assembly according to another embodiment of the present invention;

[0029] Figure 10 This is a cross-sectional view of a substrate assembly according to another embodiment of the present invention. Detailed Implementation

[0030] Figure 1 This is a top view of a keyboard module according to an embodiment of the present invention. Figure 2A yes Figure 1 A cross-sectional view of the keyboard module. Figure 2B yes Figure 1 Another cross-sectional view of the keyboard module. Figure 3 yes Figure 2A A magnified view of a portion of the keyboard module. Figure 4 yes Figure 3 The top view of the keyboard module. Figure 5 yes Figure 2A This is a top view of the circuit layer. Some components and structures are omitted here, and the thickness of each component is not drawn to scale for ease of component description. Please also refer to... Figures 1 to 5The keyboard module 10 includes a substrate assembly 100 and a key assembly 200. The substrate assembly 100 includes a substrate 110, a light guide plate 120, and multiple light-emitting components 130. The light guide plate 120 includes multiple openings 121, and the multiple light-emitting components 130 are located within corresponding openings 121. The substrate 110 includes a circuit layer 111 and a substrate reflective layer 112. The light-emitting components 130 include multiple pads 131 connected to the circuit layer 111, and a portion of the substrate reflective layer 112 is located between adjacent pads 131. The key assembly 200 is connected to the substrate assembly 100. The key assembly 200 includes multiple keys 201. The keyboard module 10 is a backlit keyboard, and the light-emitting components 130 provide light L to the keys 201.

[0031] by Figure 1 Taking a light-emitting component 130 between two buttons 201 as an example, Figure 3 The diagram schematically illustrates the reflection path of light L after it is emitted by the light-emitting component 130. The light guide plate 120 guides the light L to a specific location (e.g., below the two buttons 201) and causes the light L to exit from that location. In this embodiment, the substrate reflective layer 112 reflects the light L. The substrate reflective layer 112, located between two adjacent pads 131 of the light-emitting component 130, increases the reflection efficiency of the light L, allowing more light L to be reflected to the light guide plate 120, thus improving reflection efficiency. Therefore, a single light-emitting component 130 can provide light to two or more surrounding buttons 201 via the substrate reflective layer 112 and the light guide plate 120, reducing the number of light-emitting components 130 in the keyboard module 10 and thus lowering costs.

[0032] like Figure 2A and Figure 3 As shown, the light-emitting component 130 includes a light-emitting body 132 and a component reflective layer 133. The light-emitting body 132 includes a top surface 134 and a bottom surface 135 facing each other. The component reflective layer 133 is connected to the top surface 134, and a plurality of pads 131 are disposed on the bottom surface 135. The component reflective layer 133 is used to reflect the light L emitted by the light-emitting body 132. The conventional light-emitting component without the component reflective layer 133 has a light emission angle of approximately 138 degrees. In this embodiment, the light-emitting component 130 with the component reflective layer 133 has a light emission angle greater than 150 degrees, for example, 165 degrees. In this embodiment, the number of pads 131 in a single light-emitting component 130 is two. The component reflective layer 133 is a white shell, and the substrate reflective layer 112 includes a white ink layer. In one embodiment, the component reflective layer 133 may be a white ink layer disposed on the top surface 134 of the light-emitting body 132 by means of printing or the like.

[0033] Most of the light L emitted by the light-emitting component 130 is emitted upwards (i.e., away from the substrate 110) and reflected by the component reflective layer 133 and the substrate reflective layer 112, so that it propagates away from the light-emitting body 132 in the light guide plate 120. In this embodiment, the light-emitting component 130 reflects most of the light L to the light guide plate 120 through the component reflective layer 133 and the substrate reflective layer 112 located between the plurality of pads 131, so that a single light-emitting component 130 can provide sufficient light L to the surrounding plurality of buttons 201.

[0034] Figures 1 to 2B The relative positions of different buttons 201, 201', 201'' and light-emitting components 130, 130', 130'' are shown. In this embodiment, the orthographic projection of a portion of the button assembly 200 onto the substrate 110 is misaligned with the orthographic projection of the plurality of light-emitting components 130 onto the substrate 110. Figure 2A For example, the orthographic projections of two buttons 201 of the button assembly 200 onto the substrate 110 are misaligned with the orthographic projection of the light-emitting component 130 onto the substrate 110. That is, the buttons 201 are not located above the light-emitting component 130 in the normal direction of the substrate 110. The orthographic projection of the light-emitting component 130 onto the substrate 110 lies between the orthographic projections of the two buttons 201 onto the substrate 110, without overlapping. The light-emitting component 130 provides light to the two buttons 201. Figure 2B For example, the orthographic projections of the other two buttons 201' of the button assembly 200 onto the substrate 110 partially overlap with the orthographic projection of the light-emitting component 130' onto the substrate 110. That is, a portion of the buttons 201' is positioned above the light-emitting component 130' in the normal direction of the substrate 110. The light-emitting component 130' provides light to the two buttons 201'. Figure 1 As shown, the orthographic projection of button 201'' of button assembly 200 can overlap with the orthographic projection of light-emitting component 130'' onto substrate 110. That is, button 201'' is located above light-emitting component 130'' in the normal direction of substrate 110, and covers light-emitting component 130''. The three light-emitting components 130, 130', and 130'' can have the same structure.

[0035] In other embodiments not shown, the orthographic projection of the button assembly 200 (buttons 201, 201', 201'') onto the substrate 110 may be misaligned with the orthographic projections of all light-emitting components 130, 130', 130'' onto the substrate 110. That is, all buttons 201, 201', 201'' are not located above all light-emitting components 130, 130', 130'' in the normal direction of the substrate 110. In other embodiments not shown, the orthographic projection of the button assembly 200 (buttons 201, 201', 201'') onto the substrate 110 may partially overlap with the orthographic projections of all light-emitting components 130, 130', 130'' onto the substrate 110.

[0036] like Figure 3 and Figure 4 As shown, substrate 110 includes a substrate light-shielding layer 113, and circuit layer 111 is located between substrate reflective layer 112 and substrate light-shielding layer 113. Substrate light-shielding layer 113 is used to shield light from the external environment. The color of substrate light-shielding layer 113 can be black. Substrate reflective layer 112 includes multiple aperture groups 114, and multiple pads 131 of light-emitting component 130 pass through the corresponding aperture groups 114 and are connected to circuit layer 111. The total area of ​​aperture groups 114 is smaller than the area of ​​the corresponding opening 121. In this embodiment, one aperture group 114 has multiple apertures 1141, and the number of apertures 1141 corresponds to the number of pads 131 of a single light-emitting component 130, which is two. In this embodiment, the shape of the apertures 1141 in aperture group 114 corresponds to the shape of the pads 131 and is rectangular, and the area of ​​the apertures 1141 is larger than the area of ​​the corresponding pads 131. In one embodiment not shown, the shape of the opening 1141 may be circular or any polygon, and the area of ​​the opening 1141 may be equal to the area of ​​the pad 131.

[0037] like Figure 5 As shown, the circuit layer 111 includes a circuit substrate 1111, patterned circuits 1112, and a fill layer 1113. The patterned circuits 1112 are disposed on the circuit substrate 1111 and enclose multiple non-circuit regions R, and the fill layer 1113 is disposed on the multiple non-circuit regions R. The fill layer 1113 is used to fill the height difference between the patterned circuits 1112 and the circuit substrate 1111, so that the stress of the circuit layer 111 is more uniform and the structural strength of the circuit layer 111 is improved, so as to avoid the deformation of the circuit layer 111 under high temperature and high humidity environment (for example, the circuit substrate 1111 bulges or wrinkles). The material of the patterned circuits 1112 includes, but is not limited to, copper and silver paste. In this embodiment, the fill layer 1113 can be disposed on the circuit substrate 1111 by printing or other methods, and the fill layer 1113 is formed into a mesh, but is not limited to this.

[0038] like Figure 4 As shown, the light guide plate 120 has multiple light guide areas 122 and multiple buttons 201. Figure 2A The projection of the light guide plate 120 corresponds to multiple light guide regions 122, and the light guide regions 122 include multiple openings. Figure 4Multiple openings in the light guide region 122 are schematically represented by dots. The back plate 140 includes multiple holes (not shown) corresponding to the multiple light guide regions 122. Light L can be emitted outward through the multiple openings in the light guide region 122 and the multiple holes in the back plate 140, causing the parts in the keyboard module 10 corresponding to the multiple keys 201 to emit light. The opening 121 of the light guide plate 120 is located between two light guide regions 122. Since the distance between the light-emitting component 130 and different positions in the light guide region 122 is different, the density of openings at different positions in the light guide region 122 is different in order to make the light L emit light uniformly from the light guide region 122. Specifically, the density of openings in the light guide region 122 adjacent to the light-emitting component 130 is lower, and the density of openings in the light guide region 122 farther away from the light-emitting component 130 is higher.

[0039] The substrate assembly 100 also includes a cover plate 150 and a back plate 140. A plurality of light-emitting components 130 are located between the substrate 110 and the cover plate 150, and the plurality of light-emitting components 130, the cover plate 150, and the light guide plate 120 are located between the substrate 110 and the back plate 140. The back plate 140 includes a connected back plate body 143 and an extension 141, the extension 141 extending from the back plate body 143 toward the substrate 110. A button assembly 200 is connected to the back plate body 143 of the back plate 140. The cover plate 150 is connected to the extension 141 of the back plate 140. The extension 141 has a plurality of clearance holes 142, the orthographic projection of the plurality of clearance holes 142 onto the substrate 110 being aligned with the orthographic projection of the corresponding plurality of light-emitting components 130 onto the substrate 110, the plurality of clearance holes 142 being used to avoid the light-emitting components 130. For example, when the thickness of the light-emitting component 130 is greater than the distance between the surface of the light guide plate 120 and the circuit layer 111, the light-emitting component 130 can protrude from the light guide plate 120 and be partially located within the clearance hole 142. In this way, the thickness of the light-emitting component 130 is not limited by the distance between the surface of the light guide plate 120 and the circuit layer 111.

[0040] also, Figure 2A and Figure 3The circuit layer 111, substrate reflective layer 112, and substrate light-shielding layer 113 are schematically shown as single layers, but they may each be single or multiple layers. In other embodiments not shown, the substrate reflective layer 112 may include a substrate (not shown) and a white ink layer disposed on the substrate by printing or other methods. The substrate material may include polyimide (PI). The substrate may be connected to the circuit layer 111 by an adhesive layer (not shown). The substrate light-shielding layer 113 may be a black polyimide (PI) layer. The total thickness of the substrate 110 may be approximately 0.085 mm. In other embodiments not shown, the substrate light-shielding layer 113 may be a black polyethylene terephthalate (PET) substrate. The total thickness of the substrate 110 may be approximately 0.097 mm. In other embodiments not shown, the substrate reflective layer 112 may be a white ink layer printed on the circuit layer 111. The substrate light-shielding layer 113 may include a substrate (not shown) and a black ink layer printed on the substrate. The substrate material may include PI or PET. The total thickness of the substrate 110 may be approximately 0.097 mm. The circuit layer 111, the substrate reflective layer 112, and the substrate light-shielding layer 113 of the substrate 110 may be a combination of the above embodiments.

[0041] The components of the substrate assembly 100 (e.g., extension 141, cover plate 150, light guide plate 120, and substrate 110) can be connected by an adhesive layer. The button 201 of the button assembly 200 may have a scissor-switch structure, but is not limited thereto. The button 201 may have any known structure and may be connected to the back plate 140 in any known manner.

[0042] Figure 6 This is a cross-sectional view of a keyboard module according to another embodiment of the present invention. Please also refer to... Figure 2A and Figure 6 The keyboard module 10a of this embodiment is similar to that of the previous embodiment, except that the extension 141a of the back plate 140a of the substrate assembly 100a in this embodiment does not have an opening corresponding to the light-emitting component 130. The top of the light-emitting component 130 is flush with the surface of the light guide plate 120. The keyboard module 10a of this embodiment has similar functions to those of the previous embodiment, and will not be described again here.

[0043] Figure 7 This is a cross-sectional view of a substrate assembly according to another embodiment of the present invention, with some components omitted here (e.g., Figure 2A Back panel 140). Please also refer to Figure 3 and Figure 6The substrate assembly 100b in this embodiment is similar to that in the previous embodiment, except that the cover plate 150b in this embodiment includes a cover plate reflective layer 151, a cover plate light-shielding layer 152, and a cover plate body 153. The light-emitting component 130b does not include the component reflective layer 133. The cover plate reflective layer 151 is located between the cover plate light-shielding layer 152 and the light guide plate 120. The light-emitting body 132 of the light-emitting component 130b is located between the cover plate reflective layer 151 and the substrate reflective layer 112. The cover plate reflective layer 151 is used to reflect the light L emitted by the light-emitting component 130b, replacing the component reflective layer 133. The light L emitted by the light-emitting component 130b is reflected between the cover plate reflective layer 151 and the substrate reflective layer 112 and transmitted to the light guide plate 120. The cover plate light-shielding layer 152 is used to shield the light from the external environment.

[0044] In this embodiment, the cover plate reflective layer 151 and the cover plate light-shielding layer 152 are respectively disposed on two sides 154 and 155 of the cover plate body 153. The cover plate reflective layer 151 is located between the cover plate light-shielding layer 152 and the substrate reflective layer 112. The cover plate body 153 is a light-transmitting film. The cover plate reflective layer 151 and the cover plate light-shielding layer 152 are located in the light guiding area 122 ( Figure 4 The portion of the cover plate 150b has a corresponding opening to allow light L to pass through it. In this embodiment, the reflective layer 151 is a white ink layer printed on the surface 154 facing the light-emitting component 130b, and the light-shielding layer 152 is a black ink layer printed on the surface 155 facing away from the light-emitting component 130b. The substrate assembly 100b in this embodiment has similar functions to those in the aforementioned embodiments, and will not be described again here.

[0045] Figure 8 This is a cross-sectional view of a substrate assembly according to another embodiment of the present invention; some components are omitted here. Please also refer to... Figure 7 and Figure 8 The substrate assembly 100c of this embodiment is similar to that of the previous embodiment, except that in this embodiment, the cover plate light-shielding layer 152 is disposed on the surface 154 of the cover plate body 153 facing the substrate 110, and the cover plate reflective layer 151 is disposed on the cover plate light-shielding layer 152. The light-emitting component 130c includes a component reflective layer 133. The cover plate reflective layer 151 is used to assist the component reflective layer 133 in reflecting the light L emitted by the light-emitting component 130c. The substrate assembly 100c of this embodiment has similar functions to those of the previous embodiment, and will not be described again here.

[0046] Figure 9 This is a cross-sectional view of a substrate assembly according to another embodiment of the present invention; some components are omitted here. Please also refer to... Figure 7 and Figure 9The substrate assembly 100d in this embodiment is similar to that in the previous embodiment, except that in this embodiment, the cover reflective layer 151 is disposed on the surface 155 of the cover body 153 facing away from the substrate 110, and the cover light-shielding layer 152 is disposed on the cover reflective layer 151. The substrate reflective layer 112d includes a first reflective layer 1121 and a second reflective layer 1122. The first reflective layer 1121 is disposed on the circuit layer 111, and a portion of the first reflective layer 1121 is located between adjacent pads 131 of the light-emitting component 130. The circuit layer 111 is located between the first reflective layer 1121 and the second reflective layer 1122.

[0047] In this embodiment, the substrate light-shielding layer 113 is a black PET substrate, and the second reflective layer 1122 is a white ink layer disposed on the side of the black PET substrate facing the first reflective layer 1121. The first reflective layer 1121 includes a PI substrate and a white ink layer disposed on the PI substrate. The total thickness of the substrate 110d can be approximately 0.107 mm. In other embodiments not shown, the second reflective layer 1122 can be a white PET substrate, and the substrate light-shielding layer 113 can be a black ink layer disposed on the side of the white PET substrate facing away from the first reflective layer 1121. The total thickness of the substrate 110d can be approximately 0.107 mm. In other embodiments not shown, the second reflective layer 1122 can be a white PET substrate, and the substrate light-shielding layer 113 can be a black ink layer disposed on the white PET substrate. The first reflective layer 1121 can be a white ink layer disposed on the circuit layer 111. The total thickness of the substrate 110d can be approximately 0.097 mm. The substrate assembly 100d in this embodiment has similar effects to the aforementioned embodiments, and will not be described again here.

[0048] Figure 10 This is a cross-sectional view of a substrate assembly according to another embodiment of the present invention; some components are omitted here. Please also refer to... Figure 8 and Figure 10 The substrate assembly 100e in this embodiment is similar to that in the previous embodiment, except that the reflective layer 112e in this embodiment includes a reflective substrate 1124, a first reflective layer 1121, and a third reflective layer 1123. The third reflective layer 1123 is located between the first reflective layer 1121 and the circuit layer 111. The first reflective layer 1121 is disposed on the circuit layer 111, and a portion of the first reflective layer 1121 is located between the two pads 131 of the light-emitting component 130. The first reflective layer 1121 and the third reflective layer 1123 are disposed on opposite sides of the reflective substrate 1124, and the aperture group 114e penetrates the reflective substrate 1124, the first reflective layer 1121, and the third reflective layer 1123.

[0049] In other embodiments not shown, the substrate reflective layer may not include a reflective substrate 1124. The third reflective layer 1123 may be a white PET substrate, and the first reflective layer 1121 may be a white ink layer disposed on the white PET substrate. The total thickness of the substrate 110e may be approximately 0.122 mm. In other embodiments not shown, the substrate reflective layer may further include a second reflective layer 1122 located between the circuit layer 111 and the substrate light-shielding layer 113. The substrate assembly 100e of this embodiment has similar effects to the aforementioned embodiments, and will not be described again here.

[0050] In summary, the substrate reflective layer of this invention is used to reflect the light emitted by the light-emitting components. By using the substrate reflective layer located between adjacent pads of the light-emitting components, the light reflection efficiency can be increased, allowing more light to be reflected to the light guide plate and providing sufficient light to the key components. Consequently, the orthographic projection of the key components onto the substrate is at least partially misaligned with the orthographic projection of the multiple light-emitting components onto the substrate, reducing the number of light-emitting components and thus lowering the cost of the keyboard module.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A keyboard module, characterized in that, include: A substrate assembly includes a substrate, a light guide plate, and multiple light-emitting components. The light guide plate includes multiple openings, and the multiple light-emitting components are located within corresponding openings. The substrate includes a circuit layer and a substrate reflective layer. Each of the multiple light-emitting components includes multiple pads connected to the circuit layer. A portion of the substrate reflective layer is located between adjacent pads. A button assembly is connected to the base plate assembly.

2. The keyboard module according to claim 1, characterized in that, The substrate assembly includes a back plate, the plurality of light-emitting components are located between the substrate and the back plate, the button assembly is connected to the back plate, and the extension of the back plate has a plurality of openings, the orthographic projection of the plurality of openings onto the substrate is aligned with the orthographic projection of the corresponding plurality of light-emitting components onto the substrate.

3. The keyboard module according to claim 1, characterized in that, Each of the plurality of light-emitting components includes a light-emitting body and a component reflective layer. The light-emitting body includes a top surface and a bottom surface opposite to each other. The component reflective layer is connected to the top surface, and the plurality of pads are disposed on the bottom surface.

4. The keyboard module according to claim 1, characterized in that, The substrate assembly includes a cover plate, the cover plate includes a cover plate reflective layer, and the plurality of light-emitting components are located between the substrate and the cover plate reflective layer, and the light-emitting components are located between the cover plate reflective layer and the substrate reflective layer.

5. The keyboard module according to claim 4, characterized in that, The cover plate includes a cover plate body and a cover plate light-shielding layer. The cover plate reflective layer and the cover plate light-shielding layer are respectively disposed on opposite sides of the cover plate body. The cover plate reflective layer is located between the cover plate light-shielding layer and the substrate reflective layer.

6. The keyboard module according to claim 4, characterized in that, The cover plate includes a cover plate body and a cover plate light-shielding layer. The cover plate light-shielding layer is disposed on the cover plate body, and the cover plate reflective layer is disposed on the cover plate light-shielding layer. The cover plate reflective layer is located between the cover plate light-shielding layer and the substrate reflective layer.

7. The keyboard module according to claim 4, characterized in that, The cover plate includes a cover plate body and a cover plate light-shielding layer. The cover plate reflective layer is disposed on the cover plate body, and the cover plate light-shielding layer is disposed on the cover plate reflective layer. The cover plate reflective layer is located between the cover plate light-shielding layer and the substrate reflective layer.

8. The keyboard module according to claim 1, characterized in that, The substrate includes a substrate light-shielding layer, and the circuit layer is located between the substrate reflective layer and the substrate light-shielding layer.

9. The keyboard module according to claim 1, characterized in that, The substrate reflective layer includes a first reflective layer and a second reflective layer. The first reflective layer is disposed on the circuit layer and a portion of the first reflective layer is located between two adjacent pads among the plurality of pads. The circuit layer is located between the first reflective layer and the second reflective layer.

10. The keyboard module according to claim 9, characterized in that, The substrate reflective layer includes a third reflective layer, which is located between the first reflective layer and the circuit layer.

11. The keyboard module according to claim 1, characterized in that, The substrate reflective layer includes multiple aperture groups, and the multiple pads of each of the multiple light-emitting components pass through the corresponding aperture groups to connect to the circuit layer. The area of ​​each of the multiple aperture groups is smaller than the area of ​​the corresponding multiple openings.

12. The keyboard module according to claim 1, characterized in that, The circuit layer includes a circuit substrate, patterned circuits, and a fill layer. The patterned circuits are disposed on the circuit substrate and enclose multiple non-circuit areas. The fill layer is disposed on the multiple non-circuit areas.

13. The keyboard module according to claim 1, characterized in that, At least a portion of the orthographic projection of the button assembly onto the substrate is misaligned with the orthographic projection of the plurality of light-emitting components onto the substrate.

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